CN116153385A - Power consumption measuring method - Google Patents
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- CN116153385A CN116153385A CN202310433676.9A CN202310433676A CN116153385A CN 116153385 A CN116153385 A CN 116153385A CN 202310433676 A CN202310433676 A CN 202310433676A CN 116153385 A CN116153385 A CN 116153385A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/133—Arrangements for measuring electric power or power factor by using digital technique
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/06—Arrangements for measuring electric power or power factor by measuring current and voltage
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The disclosure relates to a power consumption measurement method, which relates to the technical field of semiconductor production and manufacture and can be applied to the scene of monitoring power consumption data of a semiconductor chip. The method comprises the following steps: acquiring at least one power supply line of the power management integrated circuit connected to the chip to be monitored, and determining a series resistance value of a series sampling resistor connected in series with each power supply line; determining a resistance voltage value acting on each series sampling resistor; determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value; and determining chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines. The power supply circuit can be used for carrying out current monitoring on the power supply circuit connected to the chip to be monitored without using an external current instrument, and chip power consumption data are obtained through calculation according to the monitored circuit current value and the resistance voltage value.
Description
Technical Field
The disclosure relates to the technical field of semiconductor production and manufacturing, and in particular relates to a power consumption measuring method.
Background
The power consumption is one of important indexes for measuring the quality of a chip, and along with the development of a semiconductor process, the circuit integration level of a digital chip is higher and higher. However, the improvement of the circuit integration level leads to the rapid increase of the power consumption of the chip, so that the performance of the chip is affected, therefore, the power consumption data of the chip can be monitored in real time in the production and manufacturing process of the chip, and the change rule of the performance of the chip is counted through the data fluctuation of the power consumption data of the chip.
In testing the power consumption of a dynamic random access memory (Dynamic Random Access Memory, DRAM) of a mobile device such as a mobile phone, it is currently required to connect a sampling resistor to a power rail (power rail) used by the DRAM, and to connect a current meter to perform current monitoring of the DRAM.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The disclosure aims to provide a power consumption measurement method, and further overcome the problems of huge equipment and complicated process used in the power consumption measurement process caused by the fact that an external current instrument is required to be used for current monitoring in a related chip power consumption measurement scheme at least to a certain extent.
Other features and advantages of the present disclosure will be apparent from the following detailed description, or may be learned in part by the practice of the invention.
According to a first aspect of the present disclosure, there is provided a power consumption measurement method including: acquiring at least one power supply line of a power management integrated circuit connected to a chip to be monitored, and determining a series resistance value of a series sampling resistor connected in series with each power supply line; determining a resistance voltage value acting on each series sampling resistor, wherein the resistance voltage value is determined based on a line power supply voltage value and a detection point voltage value of the power supply management integrated circuit on the power supply line; determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value; and determining chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines.
In an exemplary embodiment of the present disclosure, the determining a resistance voltage value acting on each of the series sampled resistors includes: acquiring a line power supply voltage value of the power supply management integrated circuit acting on each power supply line; determining a voltage detection point corresponding to each power supply line, and acquiring a detection point voltage value determined based on the voltage detection point; and determining the resistance voltage value according to the line power supply voltage value and the detection point voltage value.
In an exemplary embodiment of the present disclosure, the acquiring the detection point voltage value determined based on the voltage detection point includes: acquiring a multipurpose pin interface provided by the power management integrated circuit; switching the multipurpose pin interface from an initial mode to an analog-digital conversion mode to obtain an analog-digital conversion interface; and acquiring the detection point voltage value corresponding to the voltage detection point based on the analog-digital conversion interface.
In an exemplary embodiment of the present disclosure, the obtaining, based on the analog-to-digital conversion interface, the detection point voltage value corresponding to the voltage detection point includes: acquiring the number of lines connected to the power supply lines of the chip to be monitored, and configuring a corresponding number of analog-digital conversion interfaces based on the number of lines; and switching the chip to be monitored into a test mode, and determining the voltage value of the detection point based on the analog-digital conversion interface in the test mode.
In one exemplary embodiment of the present disclosure, the power supply lines include a core power supply line, an input power supply line, and an output power supply line.
In an exemplary embodiment of the present disclosure, the determining a line current value corresponding to each of the power supply lines based on the resistance voltage value and the series resistance value includes: determining an analog-digital conversion channel matched with the power supply line based on the resistance voltage value; based on the analog-digital conversion channel, the resistance voltage value is sent to a data conversion output module; and the data conversion output module performs current calculation on the resistance voltage value and the series resistance value to obtain the line current value.
In an exemplary embodiment of the present disclosure, the determining chip power consumption data corresponding to the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines includes: multiplying the resistance voltage value of each power supply line with the line current value to obtain a line power consumption value corresponding to each power supply line; and carrying out summation operation on the line power consumption values of all the power supply lines to obtain the chip power consumption data of the chip to be monitored.
In an exemplary embodiment of the present disclosure, the method further comprises: acquiring power consumption related data associated with the chip power consumption data, and sending the chip power consumption data and the power consumption related data to a data display module; and displaying the chip power consumption data and the power consumption related data in real time through the data display module.
In one exemplary embodiment of the present disclosure, the power consumption related data includes any one or more of the resistance voltage value, the line current value, and the series resistance value of the power supply line connected to the chip to be monitored.
In an exemplary embodiment of the present disclosure, the method further comprises: transmitting the chip power consumption data and the power consumption related data to a data storage device; determining at least one power consumption attribute column contained in each of the chip power consumption data and the power consumption related data; and based on the power consumption attribute column, respectively storing the chip power consumption data and the power consumption related data into the data storage device.
The technical scheme provided by the disclosure can comprise the following beneficial effects:
according to the power consumption measuring method in the exemplary embodiment of the disclosure, a resistance voltage value of a series sampling resistor in a power supply line connected to a chip to be monitored is determined based on a power management integrated circuit, a line current value is calculated according to the series resistance value and the resistance voltage value of the power supply line, current monitoring can be performed without using an external current instrument, and chip power consumption data is calculated according to the obtained line current value and the resistance voltage value.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort. In the drawings:
fig. 1 schematically shows a flowchart of a power consumption measurement method according to an exemplary embodiment of the present disclosure.
Fig. 2 schematically illustrates a block diagram of connections between a plurality of components in a power consumption measurement method according to an exemplary embodiment of the present disclosure.
Fig. 3 schematically illustrates a circuit diagram employed to determine a resistance voltage value according to an exemplary embodiment of the present disclosure.
Fig. 4 schematically illustrates a schematic diagram of displaying chip power consumption data by a data display module according to an exemplary embodiment of the present disclosure.
Fig. 5 schematically illustrates a block diagram of a power consumption measurement apparatus according to an exemplary embodiment of the present disclosure.
Fig. 6 schematically illustrates a block diagram of an electronic device according to an exemplary embodiment of the present disclosure.
Fig. 7 schematically illustrates a schematic diagram of a computer-readable storage medium according to an exemplary embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and thus a repetitive description thereof will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the disclosed aspects may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known structures, methods, devices, implementations, materials, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.
The block diagrams depicted in the figures are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, or in one or more software-hardened modules, or in different networks and/or processor devices and/or microcontroller devices.
In the process of testing the power consumption of the DRAM of mobile devices such as mobile phones, in some related schemes, a sampling resistor is connected to a power rail (power rail) used by the DRAM, and a current instrument is connected to the outside to monitor the current of the DRAM. However, in the current monitoring process, the external current instrument and equipment used are huge, and the current monitoring process is complicated, so that the power consumption measurement efficiency of the chip is low.
Based on this, in the present exemplary embodiment, a power consumption measurement method is provided first, and the power consumption measurement method of the present disclosure may be implemented using a server, and the method described in the present disclosure may also be implemented using a terminal device, where the terminal described in the present disclosure may include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a personal digital assistant (Personal Digital Assistant, PDA), and a fixed terminal such as a desktop computer. Fig. 1 schematically illustrates a schematic diagram of a power consumption measurement method flow according to some embodiments of the present disclosure. Referring to fig. 1, the power consumption measurement method may include the steps of:
Step S110, at least one power supply line of the power management integrated circuit connected to the chip to be monitored is obtained, and the serial resistance value of the serial sampling resistor connected in series with each power supply line is determined.
According to some example embodiments of the present disclosure, the chip to be monitored may be a semiconductor chip currently connected to a power consumption measurement device for chip power consumption measurement. A Power Management Integrated Circuit (PMIC) may be an integrated circuit for voltage conversion, voltage regulation, and battery Management, and may be used to manage Power devices in a host system, which is commonly used for mobile phones and various mobile terminal devices. For example, in this embodiment, the power management integrated circuit may be used to provide power to the chip to be monitored. The power supply line may be a power supply line in which the power management integrated circuit is connected to the chip to be monitored to ensure that the chip to be monitored works normally. The series sampling resistor may be a sampling resistor connected in series in the power supply line. The series resistance value may be a resistance value of a series sampling resistor connected to the power supply line, and may be represented by Rs.
When the DRAM monitors power consumption, a chip to be monitored may be determined, for example, a chip in an electronic product such as a mobile phone or a computer is used as the chip to be monitored. In order to ensure the normal operation of the chip to be monitored, the power management integrated circuit may provide one or more power supply lines for supplying power to the chip to be monitored.
In the process of monitoring the power consumption of the chip to be monitored, for the power supply line connected to the chip to be monitored, a corresponding sampling resistor can be connected in series to each power supply line and used as a serial sampling resistor corresponding to the power supply line. For each series sampling resistor connected to the power supply line, each has a respective corresponding sampling resistor value, e.g., the operator concerned may series sampling resistors of different (or the same) resistance values for different power supply lines. After the connection of the series sampling resistors is completed, the sampling resistance value of the series sampling resistor can be used as the series resistance value of the power supply line, so that the series resistance value can be used as a data base for calculating the line current value.
In step S120, a resistance voltage value acting on each series sampling resistor is determined, where the resistance voltage value is determined based on the line supply voltage value and the detection point voltage value of the power management integrated circuit on the power supply line.
According to some exemplary embodiments of the present disclosure, the resistance voltage value may be a voltage value applied across a series sampling resistor in each power supply line, which may be represented by U.
The monitoring of the DRAM power consumption may be performed based on a power management integrated circuit PMIC inside the measuring device. When voltage measurement is performed based on the PMIC of the chip to be monitored, a line power supply voltage value provided by the PMIC on a certain power supply circuit can be obtained; and setting the measuring equipment of the chip to be monitored to be in a power consumption test scene, and measuring the voltage of the chip to be monitored through a specific interface on the PMIC to obtain a detection point voltage value corresponding to the voltage detection point on each power supply line. The difference between the line supply voltage value and the detection point voltage value on the line is used as the resistance voltage value acting on the series sampling resistor.
Step S130, determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value.
According to some exemplary embodiments of the present disclosure, the line current value may be an amount of power passing through any cross section of the power supply line per unit time, and in this embodiment, the line current value may be a current value flowing through the series sampling resistor, which may be represented by I.
After obtaining the resistance voltage value and the series resistance value of each power supply line, the line current value corresponding to each power supply line connected to the chip to be monitored, that is, the line current value i=u/Rs, can be calculated respectively according to ohm's law.
And step S140, determining chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines.
According to some exemplary embodiments of the present disclosure, the chip power consumption data may be data related to the energy consumed in operation by all power supply lines connected to the chip to be monitored.
After obtaining the resistance voltage value of the series sampling resistor in each power supply line connected to the chip to be monitored and the line current value of each power supply line, calculating to obtain the power consumption value corresponding to each power supply line according to the resistance voltage value and the line current value of each power supply line based on a power calculation formula, and adding the power consumption values in each power supply line to finally determine the chip power consumption data corresponding to the chip to be monitored.
According to the power consumption measuring method in the present exemplary embodiment, a resistance voltage value of a series sampling resistor in a power supply line connected to a chip to be monitored is determined based on a power management integrated circuit, a line current value is calculated according to the series resistance value and the resistance voltage value of the power supply line, current monitoring can be performed without using an external current instrument, and chip power consumption data is calculated according to the obtained line current value and the resistance voltage value.
Next, a power consumption measurement method in the present exemplary embodiment will be further described.
In one exemplary embodiment of the present disclosure, for step S120, determining a resistance voltage value acting on each series sampled resistor includes: acquiring a line power supply voltage value of a power supply management integrated circuit acting on each power supply line; determining a voltage detection point corresponding to each power supply line, and acquiring a detection point voltage value determined based on the voltage detection point; and determining a resistance voltage value according to the line power supply voltage value and the detection point voltage value.
The power supply voltage value may be a voltage value provided by the power management integrated circuit to the power supply line. The voltage detection point may be a detection position set in the power supply line and used for acquiring a voltage value, and the voltage detection point is used for measuring the voltage value of the power supply after the power supply flows through the series sampling resistor in the power supply line. The detection point voltage value may be a voltage value measured in the power supply line via a sampling interface provided by the power management integrated circuit.
Referring to fig. 2, fig. 2 schematically illustrates a block diagram of connections between a plurality of components in a power consumption measurement method according to an exemplary embodiment of the present disclosure. In performing power consumption monitoring on the chip to be monitored, the chip to be monitored may be placed in the chip carrier 210, and the power management integrated circuit 220 may provide a plurality of power supply lines for the chip to be monitored placed in the chip carrier 210.
To determine the line current value in each power line, the resistance voltage value acting across the series sampled resistor in the power line may be determined first, and in particular, referring to fig. 3, fig. 3 schematically illustrates a circuit diagram employed to determine the resistance voltage value according to an exemplary embodiment of the present disclosure. The power management integrated circuit 220 may provide a power supply for each power supply line, determine a line power supply voltage value VDD of the power management integrated circuit 220 applied to each power supply line, and in addition, may configure a voltage detection point at an entrance where the power supply line is connected to a chip to be monitored, and obtain a detection point voltage value of each voltage detection point through a multipurpose pin interface (Multi Purpose Pin, MPP) provided by the power management integrated circuit 220.
After the line supply voltage value and the detection point voltage value are obtained, the difference between the line supply voltage value and the detection point voltage value can be used as a resistance voltage value acting on a series sampling resistor in the supply line. Through the steps, the resistance voltage values acting on the two ends of the series sampling resistor can be obtained, and the obtained resistance voltage values are used as a data base for calculating the line current value of the power supply line.
In one exemplary embodiment of the present disclosure, obtaining a detection point voltage value determined based on a voltage detection point includes: acquiring a multipurpose pin interface provided by a power management integrated circuit; switching the multipurpose pin interface from an initial mode to an analog-digital conversion mode to obtain an analog-digital conversion interface; and acquiring a detection point voltage value corresponding to the voltage detection point based on the analog-digital conversion interface.
The multipurpose pin interface (Multi Purpose Pin, MPP) may be a pin interface of a power management integrated circuit, and the MPP interface may be used as a power source, a General-purpose input/output (GPIO), an Analog-to-digital converter (ADC), a pulse width modulation (Pulse Width Modulation, PWM), and the like. The initial mode may be a default mode corresponding to the multi-purpose pin interface. The analog-to-digital conversion mode may be an operation mode for converting a continuous signal in the DRAM into a digital signal. The analog to digital conversion interface may be a multi-purpose pin interface in analog to digital conversion mode.
In measuring the resistance voltage value of the chip to be monitored, the voltage monitoring may be performed based on the power management integrated circuit, and with continued reference to fig. 2, the power management integrated circuit 220 in fig. 2 provides some interfaces with configurable functions, such as a multi-purpose pin interface, i.e., an MPP interface, through which the voltage monitoring is performed. After the MPP interface is obtained, performing mode switching operation on the MPP interface, and switching the MPP interface from an initial mode to an analog-digital conversion mode (ADC mode) to serve as the analog-digital conversion interface. Because the analog-digital conversion interface is in the ADC mode, the analog-digital conversion interface can convert the analog signals in the DRAM into digital signals, and voltage data corresponding to the voltage detection points are obtained through the analog-digital conversion interface and used as detection point voltage values. Based on the above processing steps, the detection point voltage value of the voltage detection point can be directly obtained through the specific pin interface of the measuring device, so that the resistance voltage value acting on two ends of the series sampling resistor can be calculated based on the detection point voltage value.
In some other exemplary embodiments of the present disclosure, the voltage detection operation may be further performed based on the GPIO interface of the power management integrated circuit to obtain the detected point voltage value of the voltage detection point, and the specific interface of the PMIC used in the voltage measurement is not limited in any way.
In an exemplary embodiment of the present disclosure, acquiring a detection point voltage value corresponding to a voltage detection point based on an analog-to-digital conversion interface includes: acquiring the number of lines connected to a power supply line of a chip to be monitored, and configuring a corresponding number of analog-digital conversion interfaces based on the number of lines; and switching the chip to be monitored into a test mode, and determining a voltage value of a detection point based on the analog-digital conversion interface in the test mode.
The power supply line may be a line connected to the chip to be monitored and providing a power supply thereto. The number of lines may be the number of power supply lines connected to the chip to be monitored. The test mode may be an operation mode in which the chip to be monitored is in a power consumption measurement.
To ensure proper operation of the chip to be monitored, one or more power supply lines may be provided thereto and the provided power supply lines may be connected to the chip to be monitored. When the voltage value is measured through the ADC interface, the number of lines connected to the power supply line of the chip to be monitored may be obtained, for example, the number of lines may be 1, 2, 3, etc., and the number of lines of the power supply line may be preconfigured according to actual requirements.
After the number of the lines is determined, a corresponding number of analog-digital conversion interfaces can be configured based on the number of the lines, namely, a corresponding analog-digital conversion interface is configured for each power supply line, and the configured analog-digital conversion interfaces are connected with the power supply lines. Before voltage monitoring, the chip to be monitored may be switched from an initial mode to a test mode, and a voltage detection point corresponding to each power supply line connected to the chip to be monitored is determined, for example, with continued reference to fig. 3, a connection between the adc interface and the power supply line may be a voltage detection point corresponding to the power supply line. The voltage value of the detection point of the voltage detection point can be acquired through the ADC interface so as to calculate the corresponding resistance voltage value of each power supply line later.
In one exemplary embodiment of the present disclosure, the power supply lines include a core power supply line, an input power supply line, and an output power supply line.
The core power line may be a circuit connected to the chip to be monitored and providing a core power supply thereto. The input power line may be a circuit that is connected to the chip to be monitored and provides an input power supply thereto. The output power supply line may be a circuit that is connected to the chip to be monitored and provides an output power supply thereto.
With continued reference to fig. 2, in general, to ensure proper operation of the DRAM, the DRAM may be provided with three power rails (power rail), including a core power rail, an input power rail, and an output power rail, etc. For example, the Core power supply lines (Core power supply lines) may include VDD1 and VDD2, where VDD generally represents the positive of a unipolar device for powering the DRAM Core, VDD1 and VDD2 identifying voltages of different voltage magnitudes or isolated from each other, respectively. In addition, the power supply circuit connected to the chip to be monitored further comprises a VDDQ (Q quality), wherein the VDDQ circuit comprises an Input power supply circuit and an Output power supply circuit, and the Input power supply circuit and the Output power supply circuit are power supplies for supplying power to an Input buffer and an Output buffer (I/O buffer). After determining the power supply lines connected to the chip to be monitored, a sampling resistor may be connected in series for each power supply line to perform subsequent current calculation operations based on the sampling resistor.
It should be noted that, in other exemplary embodiments of the present disclosure, other types of power supply lines may also be provided for the chip to be monitored, and the specific type of the power supply line is not limited in this disclosure.
With continued reference to fig. 2, the chip carrier 210 in fig. 2 is used for placing a chip to be monitored, and a plurality of power supply lines, such as VDD1, VDD2, VDDQ and other power supply lines in fig. 2, may be connected between the chip to be monitored and the power management integrated circuit 220 of the measurement device, where each power supply line is connected in series with a corresponding serial sampling resistor. Each of the three MPP ports of the PMIC of the metrology apparatus is configured in an initial mode to an ADC mode, and the analog-to-digital conversion interface (i.e., MPP interface) 221 of the ADC mode may detect the voltage data of its input port. And respectively connecting the three ADC interfaces to sampling resistor circuits of three power supply lines to obtain serial resistance values connected in series in each power supply line.
For sampling resistors connected in series in a power supply line, a suitable resistance value needs to be selected, and the resistance value is in a specified numerical range. In the series circuit, the voltage division values of the series sampling resistors in the circuit are different due to different resistance values, and the voltage division values corresponding to the series sampling resistors are larger as the series resistance values are larger, the series resistance values and the voltage division values corresponding to the series sampling resistors are in a proportional relation, and the current values corresponding to the series sampling resistors are smaller in phase difference. In an actual power consumption test scene, the resistance value of the series sampling resistor is basically in the range of 50-200 milliohms.
In one exemplary embodiment of the present disclosure, for step S130, determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value includes: determining an analog-digital conversion channel matched with the power supply circuit based on the resistance voltage value; based on the analog-digital conversion channel, transmitting the resistance voltage value to a data conversion output module; and the data conversion output module performs current calculation on the resistance voltage value and the series resistance value to obtain a line current value.
Wherein the analog-to-digital conversion channel may be a specific channel for converting an analog signal into a digital signal. The data conversion output module may be an output device that converts a digital signal into a specific data value. The current calculation may be a calculation process of calculating a line current value of the power supply line.
After the resistor voltage value of a certain power supply line is obtained, an analog-digital conversion Channel matched with the resistor voltage value can be determined, with continued reference to fig. 2, a plurality of analog-digital conversion channels are connected between the power management integrated circuit 220 and the data conversion output module 230, and different analog-digital conversion channels have different measuring ranges, for example, one MPP (configured as an ADC mode) can correspond to a plurality of analog-digital conversion channels (ADC channels), and the measuring range of each ADC Channel can be different, for example, the measuring range of some ADC channels is 0V-0.8V, and the measuring range of other ADC channels is 0V-1.8V. In the process of outputting voltage data, an ADC Channel with a proper measuring range is generally required to be selected.
After selecting the analog-digital conversion channel matched with the power supply line, the obtained resistance voltage value can be sent to the data conversion output module 230 through the corresponding analog-digital conversion channel; and the data conversion output module 230 performs current calculation on the resistance voltage value and the series resistance value based on ohm law to obtain a line current value corresponding to the power supply line. Specifically, a sampling resistor (i.e., a line resistor) connected in series in each power supply line is Rs, and voltages U across the line resistor Rs are measured by an ADC interface. According to ohm's law, the line current i=u/Rs is obtained, and an external current instrument is not required to be used for measuring the line current value passing through the power supply line.
In an exemplary embodiment of the present disclosure, for step S140, determining chip power consumption data corresponding to a chip to be monitored according to a resistance voltage value and a line current value includes: multiplying the resistance voltage value and the line current value of each power supply line to obtain a line power consumption value corresponding to each power supply line; and carrying out summation operation on the line power consumption values of all the power supply lines to obtain chip power consumption data of the chip to be monitored.
The line power consumption value may be a power consumption value connected to each power supply line in the chip to be monitored.
After calculating the line current value corresponding to each power supply line, the line power consumption value corresponding to each power supply line may be calculated by the data conversion output module 230 according to the power calculation formula. And multiplying the calculated line current value by the resistance voltage value corresponding to each power supply line in the PMIC to obtain the power consumption data of the power supply line, namely a line power consumption value P, wherein P=UI. After the line power consumption values of all the power supply lines are obtained, the line power consumption values of all the power supply lines can be added to obtain chip power consumption data acting on the chip to be monitored. Through the calculation steps, the power consumption data corresponding to each power supply line can be obtained, the chip power consumption calculation process is simple, and the processing efficiency of power consumption monitoring can be improved.
In one exemplary embodiment of the present disclosure, power consumption related data associated with chip power consumption data is acquired, and the chip power consumption data and the power consumption related data are transmitted to a data display module; and displaying the chip power consumption data and the power consumption related data in real time through the data display module.
The power consumption related data may be other attribute data related to the power consumption of the chip. The data display module may be a device for presenting chip power consumption data of the chip to be monitored.
After obtaining the line power consumption value corresponding to each power supply line, the chip power consumption data may be determined together based on the line name of each power supply line and the corresponding line power consumption value. In addition, in order to facilitate observation of the correlation between the chip power consumption data and other attribute data, after the chip power consumption data is calculated, power consumption related data related to the chip power consumption data may be commonly transmitted to the data display module, for example, the chip power consumption is calculated based on the resistance voltage value and the line current value, and the resistance voltage value and the line current value may be used as the power consumption related data.
The data conversion output module 230 sends the chip power consumption data to the data display module 240, and the data display module can display the chip power consumption data of the chip to be monitored in the device screen in real time because the power consumption monitoring of the chip to be monitored by the measuring device is performed in real time. Referring to fig. 4, fig. 4 schematically illustrates a schematic diagram of displaying chip power consumption data by a data display module according to an exemplary embodiment of the present disclosure. As can be seen from fig. 4, the power consumption data related to the chip to be monitored are displayed on the screen of the data display module, including the power supply line name, the resistance voltage value, the series resistance value, the line current value, the chip power consumption value, and the like, so that the worker monitors the power consumption data change of the chip in real time.
In one exemplary embodiment of the present disclosure, the power consumption related data includes any one or a combination of a resistance voltage value, a line current value, a series resistance value of a power supply line of the chip to be monitored.
In order to comprehensively and clearly observe the power consumption data and the power consumption related data of all the chips to be monitored in the test mode, the resistance voltage values, the line current values, the series resistance values and the line power consumption values of all the power supply lines corresponding to the chips to be monitored can be sent to the data display module 240 through the data conversion output module 230, and a user can perform data display setting through the data display module 240 to select related data to be displayed on the data display module 240. For example, the resistance voltage value, the line current value, the series resistance value, and the line power consumption value may be displayed in real time in the screen of the data display module 240, or only the line power consumption value may be displayed in the screen of the data display module, so that a monitoring person may observe power consumption data that needs to be focused at present in real time.
In one exemplary embodiment of the present disclosure, chip power consumption data and power consumption related data are transmitted to a data storage device; determining at least one power consumption attribute column contained in each of the chip power consumption data and the power consumption related data; based on the power consumption attribute column, the chip power consumption data and the power consumption related data are respectively stored into the data storage device.
The data storage device may be a device for storing chip power consumption data and its related data, among other things. The power consumption attribute column may be a different attribute column corresponding to the chip power consumption data.
After the chip power consumption data is obtained, the chip power consumption data and the power consumption related data can be sent to the data storage device. Specifically, a corresponding power consumption data storage table may be preconfigured in the data storage device, where the power consumption data storage table includes one or more power consumption attribute columns related to the power consumption data of the chip. For example, the power consumption attribute column may include a default power consumption attribute column chip name, power supply line name, etc., and may include other optional power consumption attribute columns including, for example, any one or more of a resistor voltage value, a line current value, a series resistor value, and a line power consumption value.
Referring to table 1, table 1 schematically shows the manner of storing the chip power consumption data and the power consumption related data. After the chip power consumption data is sent to the data storage device, the chip power consumption data can be stored according to the data table format in table 1. And respectively storing the chip power consumption data and the power consumption related data into the data storage device so that a subsequent technician can acquire the chip power consumption data of different chip types from the data storage device and analyze the power consumption data of different chips.
TABLE 1 memory data corresponding to chip Power consumption data
In one exemplary embodiment of the present disclosure, the chip to be monitored is replaced with a second chip to be monitored, the second chip to be monitored being different from the chip type of the chip to be monitored; and performing power consumption measurement processing on the second chip to be monitored to obtain second chip power consumption data corresponding to the second chip to be monitored.
The second chip to be monitored may be another type of chip different from the chip to be monitored. The chip type can be a specific type obtained by classifying the chips according to specific functions and specific use scenes of the chips. The power consumption measurement process may be a process of measuring power consumption data of the second chip to be monitored. The second chip power consumption data may be corresponding power consumption data of the second chip to be monitored.
In the power consumption measurement method of the present disclosure, the measurement device further provides a function of replacing a chip, for example, the measurement device may be connected to a chip socket (DRAM socket), which is a device capable of replacing memory particles, and when the measurement device is connected to the DRAM socket, the memory particles currently being monitored may be replaced by the DRAM socket during chip power consumption monitoring.
Specifically, the second chip to be monitored may be obtained, the second chip to be monitored is adopted to replace the currently placed chip to be monitored of the DRAM socket, the second chip to be monitored is placed in the DRAM socket device, and the second chip to be monitored is different from the chip to be monitored in the above embodiment in chip types. After the second chip to be monitored is placed, the same power consumption measurement mode as the chip to be monitored can be adopted to monitor the power consumption of the chip to be monitored. The power consumption monitoring scheme of the second chip to be monitored is the same as that of the chip to be monitored, and the disclosure does not describe this again.
The DRAM socket device can be used for rapidly replacing the current monitored DRAM, so that the purpose of monitoring the chip power consumption of chips to be monitored of different chip types is achieved.
It should be noted that the terms "first", "second", and the like used in the present disclosure are only for distinguishing between chips to be monitored of different chip types, and should not be construed as limiting the present disclosure.
In summary, in the power consumption measurement method of the present disclosure, at least one power supply line of the power management integrated circuit connected to the chip to be monitored is obtained, and a series resistance value of a series sampling resistor connected in series to each power supply line is determined; determining a resistance voltage value acting on each series sampling resistor, wherein the resistance voltage value is determined based on a line power supply voltage value and a detection point voltage value of a power supply management integrated circuit in a power supply line; determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value; and determining chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines. On the one hand, the resistance voltage value of the series sampling resistor in the power supply line can be obtained through the ADC interface of the test equipment, the line current value is calculated according to the series resistance value connected in series on the power supply line, the process of externally connecting a current measuring instrument in the power consumption monitoring process can be omitted, and the measuring mode is simple. On the other hand, the chip power consumption data is sent to the data display module for real-time display, so that the real-time output of the power consumption of the DRAM module can be realized. On the other hand, the testing equipment can conveniently monitor the power consumption of various types of DRAMs under the condition that the DRAM socket is connected, and the purpose of monitoring the power consumption of different chip types is achieved.
It should be noted that although the steps of the method of the present invention are depicted in the drawings in a particular order, this does not require or imply that the steps must be performed in that particular order or that all of the illustrated steps be performed in order to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step to perform, and/or one step decomposed into multiple steps to perform, etc.
In addition, the present disclosure also provides a power consumption measurement apparatus, with continued reference to fig. 2, the power consumption measurement apparatus including: the chip carrier 210, the power management integrated circuit 220, and the data conversion output module 230.
Specifically, the chip carrier 210 is configured to place a chip to be monitored, where the chip to be monitored is connected to at least one power supply line; a power management integrated circuit 220 for providing an analog-to-digital conversion interface 221 and providing a power supply for the power supply lines, and connecting the analog-to-digital conversion interface with the corresponding power supply lines, respectively; acquiring a detection point voltage value of a power supply line through an analog-digital conversion interface, and a series resistance value of a series sampling resistor connected to the power supply line, wherein the power supply has a corresponding line power supply voltage value; the data conversion output module 230 is configured to determine a resistance voltage value based on the line power supply voltage value and the detection point voltage value, and determine a line current value corresponding to the power supply line based on the resistance voltage value and the series resistance value; and determining chip power consumption data of the chip to be monitored based on the resistance voltage values and the line current values of all the power supply lines. In addition, the power consumption measurement device further includes a data display module 240, configured to display the chip power consumption data in real time.
Based on the power consumption measuring equipment, in the process of measuring the power consumption data of the chip to be monitored, an external current instrument is not required for monitoring the power consumption, and meanwhile, the monitored chip power consumption data can be displayed in real time through the data display module, and the power consumption data is analyzed.
Further, in the present exemplary embodiment, there is also provided a power consumption measuring apparatus. Referring to fig. 5, the power consumption measuring apparatus 500 may include: a resistance determination module 510, a voltage determination module 520, a current determination module 530, and a power consumption determination module 540.
Specifically, the resistance determining module 510 is configured to obtain at least one power supply line of the power management integrated circuit connected to the chip to be monitored, and determine a series resistance value of a series sampling resistor connected in series to each power supply line; a voltage determining module 520, configured to determine a resistance voltage value acting on each of the series sampling resistors, where the resistance voltage value is determined based on a line supply voltage value and a detection point voltage value of the power management integrated circuit on the power supply line; a current determining module 530, configured to determine a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value; the power consumption determining module 540 is configured to determine chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines.
In one exemplary embodiment of the present disclosure, the voltage determination module 520 includes a voltage determination unit for: acquiring a line power supply voltage value of a power supply management integrated circuit acting on each power supply line; determining a voltage detection point corresponding to each power supply line, and acquiring a detection point voltage value determined based on the voltage detection point; and determining a resistance voltage value according to the line power supply voltage value and the detection point voltage value.
In one exemplary embodiment of the present disclosure, the voltage determination unit includes a detection point voltage determination unit for acquiring a multi-purpose pin interface provided by the power management integrated circuit; switching the multipurpose pin interface from an initial mode to an analog-digital conversion mode to obtain an analog-digital conversion interface; and acquiring a detection point voltage value corresponding to the voltage detection point based on the analog-digital conversion interface.
In an exemplary embodiment of the present disclosure, the voltage determining unit includes a voltage determining sub-unit for: acquiring the number of lines connected to a power supply line of a chip to be monitored, and configuring a corresponding number of analog-digital conversion interfaces based on the number of lines; and switching the chip to be monitored into a test mode, and determining a voltage value of a detection point based on the analog-digital conversion interface in the test mode.
In an exemplary embodiment of the present disclosure, the current determination module 530 includes a current determination unit for: determining an analog-digital conversion channel matched with the power supply circuit based on the resistance voltage value; based on the analog-digital conversion channel, transmitting the resistance voltage value to a data conversion output module; and the data conversion output module performs current calculation on the resistance voltage value and the series resistance value to obtain a line current value.
In one exemplary embodiment of the present disclosure, the chip power consumption data includes a line power consumption value; the power consumption determining module 540 includes a chip power consumption determining unit for: multiplying the resistance voltage value and the line current value of each power supply line to obtain a line power consumption value corresponding to each power supply line; and carrying out summation operation on the line power consumption values of all the power supply lines to obtain chip power consumption data of the chip to be monitored.
In one exemplary embodiment of the present disclosure, the power consumption measurement apparatus 500 further includes a power consumption data display module for: acquiring power consumption related data associated with the chip power consumption data, and transmitting the chip power consumption data and the power consumption related data to a data display module; and displaying the chip power consumption data and the power consumption related data in real time through the data display module.
In one exemplary embodiment of the present disclosure, the power consumption measurement apparatus 500 further includes a power consumption data storage module for: transmitting the chip power consumption data and the power consumption related data to the data storage device; determining at least one power consumption attribute column contained in each of the chip power consumption data and the power consumption related data; based on the power consumption attribute column, the chip power consumption data and the power consumption related data are respectively stored into the data storage device.
The specific details of the virtual modules of each power consumption measurement device are described in detail in the corresponding power consumption measurement method, so that they will not be described in detail here.
It should be noted that although several modules or units of the power consumption measuring apparatus are mentioned in the above detailed description, this division is not mandatory. Indeed, the features and functionality of two or more modules or units described above may be embodied in one module or unit in accordance with embodiments of the present disclosure. Conversely, the features and functions of one module or unit described above may be further divided into a plurality of modules or units to be embodied.
In addition, in an exemplary embodiment of the present disclosure, an electronic device capable of implementing the above method is also provided.
Those skilled in the art will appreciate that the various aspects of the invention may be implemented as a system, method, or program product. Accordingly, aspects of the invention may be embodied in the following forms, namely: an entirely hardware embodiment, an entirely software embodiment (including firmware, micro-code, etc.) or an embodiment combining hardware and software aspects may be referred to herein as a "circuit," module "or" system.
An electronic device 600 according to such an embodiment of the present disclosure is described below with reference to fig. 6. The electronic device 600 shown in fig. 6 is merely an example and should not be construed to limit the functionality and scope of use of embodiments of the present disclosure in any way.
As shown in fig. 6, the electronic device 600 is in the form of a general purpose computing device. Components of electronic device 600 may include, but are not limited to: the at least one processing unit 610, the at least one memory unit 620, a bus 630 connecting the different system components (including the memory unit 620 and the processing unit 610), a display unit 640.
Wherein the storage unit stores program code that is executable by the processing unit 610 such that the processing unit 610 performs steps according to various exemplary embodiments of the present disclosure described in the above-described "exemplary methods" section of the present specification.
The storage unit 620 may include readable media in the form of volatile storage units, such as Random Access Memory (RAM) 621 and/or cache memory 622, and may further include Read Only Memory (ROM) 623.
The storage unit 620 may include a program/utility 624 having a set (at least one) of program modules 625, such program modules 625 including, but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of which may include an implementation of a network environment.
The electronic device 600 may also communicate with one or more external devices 670 (e.g., keyboard, pointing device, bluetooth device, etc.), one or more devices that enable a user to interact with the electronic device 600, and/or any devices (e.g., routers, modems, etc.) that enable the electronic device 600 to communicate with one or more other computing devices. Such communication may occur through an input/output (I/O) interface 650. Also, electronic device 600 may communicate with one or more networks such as a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public network, such as the Internet, through network adapter 660. As shown, network adapter 660 communicates with other modules of electronic device 600 over bus 630. It should be appreciated that although not shown, other hardware and/or software modules may be used in connection with electronic device 600, including, but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, data backup storage systems, and the like.
From the above description of embodiments, those skilled in the art will readily appreciate that the example embodiments described herein may be implemented in software, or in combination with the necessary hardware. Thus, the technical solution according to the embodiments of the present disclosure may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (may be a CD-ROM, a U-disk, a mobile hard disk, etc.) or on a network, and includes several instructions to cause a computing device (may be a personal computer, a server, a terminal device, or a network device, etc.) to perform the method according to the embodiments of the present disclosure.
In an exemplary embodiment of the present disclosure, a computer-readable storage medium having stored thereon a program product capable of implementing the method described above in the present specification is also provided. In some possible embodiments, the various aspects of the invention may also be implemented in the form of a program product comprising program code for causing a terminal device to carry out the steps according to the various exemplary embodiments of the invention as described in the "exemplary methods" section of this specification, when said program product is run on the terminal device.
Referring to fig. 7, a program product 700 for implementing the above-described method according to an embodiment of the present invention is described, which may employ a portable compact disc read only memory (CD-ROM) and include program code, and may be run on a terminal device, such as a personal computer. However, the program product of the present invention is not limited thereto, and in this document, a readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium can be, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium would include the following: an electrical connection having one or more wires, a portable disk, a hard disk, random Access Memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
The computer readable signal medium may include a data signal propagated in baseband or as part of a carrier wave with readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A readable signal medium may also be any readable medium that is not a readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Program code embodied on a readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
Program code for carrying out operations of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device, partly on a remote computing device, or entirely on the remote computing device or server. In the case of remote computing devices, the remote computing device may be connected to the user computing device through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computing device (e.g., connected via the Internet using an Internet service provider).
Furthermore, the above-described drawings are only schematic illustrations of processes included in the method according to the exemplary embodiment of the present invention, and are not intended to be limiting. It will be readily appreciated that the processes shown in the above figures do not indicate or limit the temporal order of these processes. In addition, it is also readily understood that these processes may be performed synchronously or asynchronously, for example, among a plurality of modules.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. A method of measuring power consumption, the method comprising:
Acquiring at least one power supply line of a power management integrated circuit connected to a chip to be monitored, and determining a series resistance value of a series sampling resistor connected in series with each power supply line;
determining a resistance voltage value acting on each series sampling resistor, wherein the resistance voltage value is determined based on a line power supply voltage value and a detection point voltage value of the power supply management integrated circuit on the power supply line;
determining a line current value corresponding to each power supply line based on the resistance voltage value and the series resistance value;
and determining chip power consumption data of the chip to be monitored according to the resistance voltage values and the line current values of all the power supply lines.
2. The method of claim 1, wherein said determining a resistance voltage value applied to each of said series sampled resistors comprises:
acquiring a line power supply voltage value of the power supply management integrated circuit acting on each power supply line;
determining a voltage detection point corresponding to each power supply line, and acquiring a detection point voltage value determined based on the voltage detection point;
and determining the resistance voltage value according to the line power supply voltage value and the detection point voltage value.
3. The method of claim 2, wherein the acquiring the detection point voltage value determined based on the voltage detection point comprises:
acquiring a multipurpose pin interface provided by the power management integrated circuit;
switching the multipurpose pin interface from an initial mode to an analog-digital conversion mode to obtain an analog-digital conversion interface;
and acquiring the detection point voltage value corresponding to the voltage detection point based on the analog-digital conversion interface.
4. The method of claim 3, wherein the obtaining, based on the analog-to-digital conversion interface, the detection point voltage value corresponding to the voltage detection point comprises:
acquiring the number of lines connected to the power supply lines of the chip to be monitored, and configuring a corresponding number of analog-digital conversion interfaces based on the number of lines;
and switching the chip to be monitored into a test mode, and determining the voltage value of the detection point based on the analog-digital conversion interface in the test mode.
5. The method of any one of claims 1 or 2 or 4, wherein the power supply lines include a core power supply line, an input power supply line, and an output power supply line.
6. The method of claim 1, wherein the determining a line current value for each of the power supply lines based on the resistance voltage value and the series resistance value comprises:
determining an analog-digital conversion channel matched with the power supply line based on the resistance voltage value;
based on the analog-digital conversion channel, the resistance voltage value is sent to a data conversion output module;
and the data conversion output module performs current calculation on the resistance voltage value and the series resistance value to obtain the line current value.
7. The method of claim 1, wherein determining chip power consumption data of the chip to be monitored based on the resistance voltage values and the line current values of all the power supply lines comprises:
multiplying the resistance voltage value of each power supply line with the line current value to obtain a line power consumption value corresponding to each power supply line;
and carrying out summation operation on the line power consumption values of all the power supply lines to obtain the chip power consumption data of the chip to be monitored.
8. The method according to claim 1, wherein the method further comprises:
Acquiring power consumption related data associated with the chip power consumption data, and sending the chip power consumption data and the power consumption related data to a data display module;
and displaying the chip power consumption data and the power consumption related data in real time through the data display module.
9. The method of claim 8, wherein the power consumption related data includes a combination of any one or more of the resistance voltage value, the line current value, and the series resistance value of the power supply line connected to the chip to be monitored.
10. The method according to claim 1 or 8, characterized in that the method further comprises:
transmitting the chip power consumption data and the power consumption related data to a data storage device;
determining at least one power consumption attribute column contained in each of the chip power consumption data and the power consumption related data;
and based on the power consumption attribute column, respectively storing the chip power consumption data and the power consumption related data into the data storage device.
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