CN108761187A - A kind of substrate current test method, system and terminal device - Google Patents
A kind of substrate current test method, system and terminal device Download PDFInfo
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- CN108761187A CN108761187A CN201810573482.8A CN201810573482A CN108761187A CN 108761187 A CN108761187 A CN 108761187A CN 201810573482 A CN201810573482 A CN 201810573482A CN 108761187 A CN108761187 A CN 108761187A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
Abstract
The application is suitable for field of terminal technology, a kind of substrate current test method, system and terminal device are provided, applied to electric terminal, the electric terminal includes power supply system, MIPI D-PHY and at least one load, and the MIPI D-PHY are connected between the current output terminal of the power supply system and the current input terminal of the load；The substrate current test method includes：Detect whether the electric terminal is in sleep state or standby mode；When the electric terminal is in sleep state or standby mode, controls the power supply system and stop being that the MIPI D-PHY power, to eliminate the leakage current between the MIPI D-PHY and power ground；Stop being after the MIPI D-PHY power, to obtain the substrate current of the load in the power supply system.The embodiment of the present application can eliminate the leakage current between MIPI D-PHY and power ground, so as to which the stability of electric terminal is effectively ensured, and then effectively obtain the substrate current of load, realize the test to supporting substrate electric current.
Description
Technical field
The application belongs to a kind of field of terminal technology more particularly to substrate current test method, system and terminal device.
Background technology
Before the manufacture of the electric terminals such as mobile phone, tablet computer, personal digital assistant, it usually needs power consumption analysis is carried out,
It is whether qualified to detect electric terminal.Whether substrate current of the electric terminal under standby mode or sleep state increases, and is point
Analyse the important indicator of electric terminal power consumption.Test substrate electric current usually requires to disassemble each component of electric terminal successively, until
The remaining minimum component (low pressure difference linear voltage regulator of usually only remaining power management chip and corresponding that can realize basic function
Load), with the electric current that each component of determination is consumed, lead to the increased component of substrate current to test out.
However, in the prior art when controlling electric terminal in standby mode or sleep state, it can be by electric terminal
MIPI (Mobile Industry Processor Interface, mobile industry processor interface) D-PHY (Physical, object
Manage layer) interface close, with leading to the power input line opposed power of MIPI D-PHY exist half high voltage, to generate leak electricity
Electric current seriously affects the stability of electric terminal.
Invention content
In view of this, the embodiment of the present application provides a kind of substrate current test method, system and terminal device, to solve
It, can be by the interface of the MIPID-PHY of electric terminal in the prior art when controlling electric terminal in standby mode or sleep state
It closes, there are half high voltages with leading to the power input line opposed power of MIPI D-PHY, to generate leakage current, serious shadow
The problem of ringing the stability of electric terminal.
The first aspect of the embodiment of the present application provides a kind of substrate current test method, is applied to electric terminal, described
Electric terminal includes power supply system, MIPI D-PHY and at least one load, and the MIPI D-PHY are connected to the power supply system
Between the current output terminal of system and the current input terminal of the load；
The substrate current test method includes：
Detect whether the electric terminal is in sleep state or standby mode；
When the electric terminal is in sleep state or standby mode, controls the power supply system and stop being the MIPI
D-PHY powers, to eliminate the leakage current between the MIPI D-PHY and power ground；
Stop being after the MIPI D-PHY power, to obtain the substrate current of the load in the power supply system.
The embodiment of the present application second aspect provides a kind of substrate current test system, is applied to electric terminal, the electronics
Terminal includes power supply system, MIPI D-PHY and at least one load, and the MIPI D-PHY are connected to the power supply system
Between current output terminal and the current input terminal of the load；
The substrate current tests system：
Detection module, for detecting whether the electric terminal is in sleep state or standby mode；
Control module, for when the electric terminal is in sleep state or standby mode, controlling the power supply system
Stop being that the MIPI D-PHY power, to eliminate the leakage current between the MIPI D-PHY and power ground；
Acquisition module, for stopping being after the MIPI D-PHY power, to obtain the load in the power supply system
Substrate current.
The embodiment of the present application third aspect provides a kind of terminal device, including memory, processor and is stored in described
In memory and the computer program that can run on the processor, the processor are realized when executing the computer program
The step of above method.
The embodiment of the present application fourth aspect provides a kind of computer readable storage medium, the computer readable storage medium
The step of being stored with computer program, the above method realized when the computer program is executed by processor.
The embodiment of the present application is by when electric terminal is in sleep state or standby mode, controlling the power supply of electric terminal
System stops being MIPI D-PHY power supplies, to eliminate the leakage current between MIPI D-PHY and power ground, so as to effective
Ensure the stability of electric terminal, and then effectively obtain the substrate current of load, realizes the test to supporting substrate electric current.
Description of the drawings
It in order to more clearly explain the technical solutions in the embodiments of the present application, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only some of the application
Embodiment for those of ordinary skill in the art without having to pay creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the structural schematic diagram for the electric terminal that the embodiment of the present application one provides；
Fig. 2 is the flow diagram for the substrate current test method that the embodiment of the present application one provides；
Fig. 3 is the structural schematic diagram of electric terminal and substrate current test circuit that the embodiment of the present application two provides；
Fig. 4 is the structural schematic diagram of electric terminal and substrate current test circuit that the embodiment of the present application three provides；
Fig. 5 is the structural schematic diagram of electric terminal and substrate current test circuit that the embodiment of the present application four provides；
Fig. 6 is the structural schematic diagram of electric terminal and substrate current test circuit that the embodiment of the present application five provides；
Fig. 7 is the structural schematic diagram of electric terminal and substrate current test circuit that the embodiment of the present application six provides；
Fig. 8 is the structural schematic diagram for the substrate current test system that the embodiment of the present application seven provides；
Fig. 9 is the structural schematic diagram for the terminal device that the embodiment of the present application eight provides.
Specific implementation mode
In being described below, for illustration and not for limitation, it is proposed that such as tool of particular system structure, technology etc
Body details, so as to provide a thorough understanding of the present application embodiment.However, it will be clear to one skilled in the art that there is no these specific
The application can also be realized in the other embodiments of details.In other situations, it omits to well-known system, device, electricity
The detailed description of road and method, so as not to obscure the description of the present application with unnecessary details.
In order to illustrate technical solution described herein, illustrated below by specific embodiment.
Embodiment one
The present embodiment provides a kind of substrate current test methods, are applied to electric terminal.
In a particular application, electric terminal can be mobile phone, tablet computer, personal digital assistant, Intelligent bracelet, notebook
Computer etc., including power supply system and power management chip need to detect the base under sleep state or standby mode before manufacture
Bottom electric current is to analyze the arbitrary electric terminal of power consumption.
As shown in Figure 1, the present embodiment provides a kind of electric terminals 100 comprising power supply system 10, MIPI D-PHY20 and
It is at least one load (illustratively shown in Fig. 1 K load, be expressed as load 31, load 32 ..., load
3i ... load 3K；Wherein, wherein K >=i >=1 and K and i are integer), MIPI D-PHY20 are connected to the electricity of power supply system 10
It flows between output end and the current input terminal each loaded, the K current output terminal of MIPI D-PHY20 is corresponding in turn to K and bears
It carries.
In a particular application, power supply system may include power supply and the power management chip (Power being connect with power supply
Management Integrated Circuits, PMIC) and power conversion module, power management chip may include low voltage difference
Linear voltage regulator (Low Dropout Regulator, LDO) and/or DC (Direct Current)/DC converters, power supply turn
It can be low pressure difference linear voltage regulator or DC/DC converters to change the mold block.
In a particular application, load can be the function mould for the arbitrary power consumption being connect with MIPI D-PHY in electric terminal
Block, such as photographing module, display module, radio frequency/baseband module etc..Load can directly be supplied by the power supply of power supply system
The load of electricity, can also be to be powered indirectly by low pressure difference linear voltage regulator or DC/DC converters by the power supply of power supply system
Load can also be by the load of the power management chip power supply of power supply system.
As shown in Fig. 2, being based on electric terminal 100 shown in FIG. 1, the substrate current test method includes：
Step S201, detects whether the electric terminal is in sleep state or standby mode.
In a particular application, the working condition of electric terminal is the processor (being typically baseband processor) by electric terminal
It controls, therefore, can detect whether electric terminal is in sleep state or standby mode by the processor of electric terminal,
The other-end equipment with data processing function that can also be connect by the processor communication with electric terminal detects.Its
His terminal device can be PC (Personal Computer, personal computer) client, tablet computer, laptop or
Person's dedicated treatment facility, server etc. have data processing function and itself have human-computer interaction function or can connect display
The equipment of the human-computer interactions device such as screen, mouse, keyboard.
Step S202 controls the power supply system and stops when the electric terminal is in sleep state or standby mode
It powers for the MIPI D-PHY, to eliminate the leakage current between the MIPI D-PHY and power ground；
Step S203 stops being after the MIPI D-PHY power, to obtain the base of the load in the power supply system
Bottom electric current.
In a particular application, the substrate current test method can specifically be executed by the processor of electric terminal,
It can be executed by the other-end equipment.
In one embodiment, after step S203, further include：
Whether the substrate current for detecting the load is more than the substrate current threshold value of the load；
When the substrate current of the load is more than the substrate current threshold value of the load, the load is debugged；
Return to step S203, when the substrate current of the load is less than or equal to the substrate current threshold value of the load
Until.
Embodiment two
The mode of existing test substrate electric current usually requires to disassemble each component of electric terminal successively, until being left energy
Enough realize that the minimum component of basic function causes substrate current to increase with the electric current that each component of determination is consumed to test out
Big component.This mode needs the component disassembled more, time-consuming and laborious, inefficiency, and can be to the circuit of electric terminal
Plate causes a degree of damage.
As shown in figure 3, the present embodiment provides a kind of substrate current tests applied to the electric terminal 100 in embodiment one
Circuit 200 comprising K divider resistance (be illustratively expressed as in Fig. 3 divider resistance R201, divider resistance R202 ...,
Divider resistance R20i ..., divider resistance R20K), i-th of divider resistance 20i is serially connected in i-th of electric current of MIPI D-PHY20
Between output end and the current input terminal of i-th of load 3i, the both ends 20i of i-th of divider resistance respectively draws a voltage tester
The double-end voltage test points of point, each divider resistance are expressed as U201 and U201 ', U202 and U202 ' ...,
U20i and U20i ' ..., U20K and U20K '.
In a particular application, the quantity of K by tested electric terminal with the reality of the MIPI D-PHY loads connecting
Quantity determines.
In the present embodiment, the structure based on electric terminal 100 and substrate current test circuit 200 shown in Fig. 3 is implemented
Step S203 in example one includes：
The substrate current of the load is obtained by substrate current test circuit.
In the present embodiment, the substrate current of the load is obtained by the substrate current test circuit, including：
Obtain the resistance value of the voltage value and i-th of divider resistance of the voltage test points at i-th of divider resistance both ends；
According to the resistance value of the voltage value of the voltage test points at i-th of divider resistance both ends and i-th of divider resistance, calculate logical
Cross the electric current of i-th of divider resistance；Wherein, the substrate current of i-th of load is equal to by the electric current of i-th of divider resistance.
In the present embodiment, according to the voltage value of the voltage test points at i-th of divider resistance both ends and i-th of divider resistance
Resistance value, calculate and by the formula of the electric current of i-th of divider resistance be：
The voltage difference of the voltage test points at the substrate current of i-th of load=i-th divider resistance both ends/i-th of partial pressure
The resistance value of resistance.
In a particular application, the resistance value of each divider resistance is known determining value, and the voltage of voltage test points can be with
It can be detected with the voltage measuring apparatus of test voltage by multimeter, voltmeter etc., the resistance value of different divider resistance can be with
It is identical to can also be different, the resistance of respective resistance values can be selected as divider resistance according to actual needs.
In a particular application, all divider resistances can select resistance error, thermal stability (temperature coefficient), distribution ginseng
The indices such as number (distribution capacity and distributed inductance) reach the precision resistance of certain standard, for example, the precision resistance of 100R.
In one embodiment, in order to realize to the substrate current of load it is accurate test, reduce test error, partial pressure electricity
Resistance can select rheostat, by changing the resistance value of divider resistance, divider resistance both ends when testing the resistance value difference of divider resistance
Voltage test points voltage and calculate voltage difference, then take the average value for the voltage difference being repeatedly calculated, and according to voltage
The substrate current of the corresponding load of divider resistance is calculated in the average value and Ohm's law of difference, accurate from that can obtain
Substrate current；Wherein, the resistance value of average value/divider resistance of substrate current=voltage difference of the corresponding load of divider resistance.
The present embodiment is by providing a kind of substrate circuit test circuit including at least one divider resistance, in electric terminal
MIPI D-PHY current output terminal and the current input terminal of corresponding load between connect a divider resistance, and dividing
A voltage test points are respectively drawn at the both ends of resistance, so as to judge corresponding load by detecting the voltage of voltage test points
Substrate current it is whether bigger than normal, can effectively improve testing current efficiency, and ensure the integrality of the circuit board of electric terminal.
Embodiment three
As shown in figure 4, in the present embodiment, power supply system 10 includes power management chip 11, power management chip 11 wraps
Include low pressure difference linear voltage regulator (Low Dropout Regulator, LDO) 111, the electric current of low pressure difference linear voltage regulator 111
Output end is connect with MIPI D-PHY20, and low pressure difference linear voltage regulator 111 corresponds to M partial pressure electricity in the K divider resistance
M load in resistance and described K load；
Wherein, K >=M >=1 and M are integer.
As shown in figure 4, illustratively showing that the M divider resistance is the preceding M partial pressure electricity in the K divider resistance
Resistance, the M load are the preceding M load in described K load.
In a particular application, the quantity of M is by steady by the low pressure difference linearity of power management chip in tested electric terminal
The actual quantity of the load of transformer power-supply determines.
The load to the power management chip power supply by the power management chip in electric terminal may be implemented in the present embodiment
Substrate current detection, can effectively improve testing current efficiency, and ensure the integrality of the circuit board of electric terminal.
Example IV
As shown in figure 5, in the present embodiment, the power supply system 10 in embodiment two or embodiment three includes power management core
Piece 11, power management chip 11 include DC/DC converters 112, current output terminal and the MIPI D- of DC/DC converters 112
PHY20 connections, DC/DC converters 112 correspond to the N in N number of divider resistance and the K load in the K divider resistance
A load；
Wherein, K >=N >=1 and N are integer.
Fig. 5 illustratively shows the case where the present embodiment is realized on the basis of embodiment three.
As shown in figure 5, illustratively showing that N number of divider resistance is N number of partial pressure electricity after the M divider resistance
Resistance；N number of load is N number of load after described M load.
In a particular application, the quantity of N is by steady by the low pressure difference linearity of power management chip in tested electric terminal
The actual quantity of the load of transformer power-supply determines.
The load to the DC/DC converters power supply by the power management chip in electric terminal may be implemented in the present embodiment
The detection of substrate current can effectively improve testing current efficiency, and ensure the integrality of the circuit board of electric terminal.
Embodiment five
As shown in fig. 6, in the present embodiment, the power supply system 10 in embodiment two, embodiment three or example IV includes
The current output terminal of power supply 12, power supply 12 is connect with MIPI D-PHY20, and power supply 20 corresponds to the m in the K divider resistance
M load in divider resistance and the K load；
Wherein, K >=m >=1 and m are integer.
When the present embodiment, which is based on embodiment three or example IV, to be realized, the current output terminal of power supply 12 also with power management
The current input terminal of chip 11 connects.
Fig. 6 illustratively shows the case where the present embodiment is realized on the basis of example IV.
As shown in fig. 6, illustratively showing that the m divider resistance is m partial pressure electricity after N number of divider resistance
Resistance；The m load is m load after N number of load.
In a particular application, power supply be specifically as follows be directly connected to power supply adaptor DC power-supply circuit can also be can
Rechargeable battery circuit.
In a particular application, the quantity of m is by the actual number for the load directly powered by power supply in tested electric terminal
Amount determines.
The detection of the substrate current of the load to directly being powered by the power supply of electric terminal may be implemented in the present embodiment, can be with
Testing current efficiency is effectively improved, and ensures the integrality of the circuit board of electric terminal.
Embodiment six
As shown in fig. 7, in the present embodiment, the power supply system 10 in embodiment two, embodiment three or example IV includes
Power supply 12 and power conversion module 13；
The current output terminal of power supply 12 is connect with the current input terminal of power conversion module 13, the electricity of power conversion module 13
Stream output end is connect with MIPI D-PHY20, and power conversion module 13 corresponds to n divider resistance and the institute stated in K divider resistance
State n load in K load；
Wherein, K >=n >=1 and n are integer.
Fig. 7 illustratively shows the case where the present embodiment is realized on the basis of embodiment five.
As shown in fig. 7, illustratively showing that the n divider resistance is n partial pressure electricity after the m divider resistance
Resistance；The n load is n load after described m load.
In a particular application, the power conversion module is low pressure difference linear voltage regulator or DC/DC converters.
In a particular application, the quantity of n in tested electric terminal by the power conversion module being connect with power supply by being supplied
The actual quantity of the load of electricity determines.
The detection of the substrate current of the load to the power conversion module power supply by electric terminal may be implemented in the present embodiment,
Testing current efficiency is can effectively improve, and ensures the integrality of the circuit board of electric terminal.
Embodiment seven
As shown in figure 8, the present embodiment provides a kind of substrate currents to test system 300, Application Example one to embodiment
Electric terminal in any of six, for the corresponding step for executing embodiment one or the substrate current test method in embodiment two
Suddenly, the substrate current test system 300 includes：
Detection module 301, for detecting whether the electric terminal is in sleep state or standby mode；
Control module 302, for when the electric terminal is in sleep state or standby mode, controlling the power supply system
System stops being that the MIPI D-PHY power, to eliminate the leakage current between the MIPI D-PHY and power ground；
Acquisition module 303, for stopping being to obtain described negative after the MIPI D-PHY power in the power supply system
The substrate current of load.
In a particular application, substrate current test system specifically can by electric terminal processor or by it is described its
The software program system of his terminal device operation.
In one embodiment, the substrate current test system further includes：
Whether current detection module, the substrate current for detecting the load are more than the substrate current threshold of the load
Value；
Debugging module is used to, when the substrate current of the load is more than the substrate current threshold value of the load, debug institute
State load；
Module is returned, acquisition module 303 is returned, until the substrate current of the load is less than or equal to the base of the load
Until when the current threshold of bottom.
In one embodiment, acquisition module 303 is specifically used for obtaining the load by substrate current test circuit
Substrate current.
In one embodiment, the substrate current of the load is obtained by the substrate current test circuit, including：
Obtain the resistance value of the voltage value and i-th of divider resistance of the voltage test points at i-th of divider resistance both ends；
According to the resistance value of the voltage value of the voltage test points at i-th of divider resistance both ends and i-th of divider resistance, calculate logical
Cross the electric current of i-th of divider resistance；Wherein, the substrate current of i-th of load is equal to by the electric current of i-th of divider resistance.
The embodiment of the present application is by when electric terminal is in sleep state or standby mode, controlling the power supply of electric terminal
System stops being MIPI D-PHY power supplies, to eliminate the leakage current between MIPI D-PHY and power ground, so as to effective
Ensure the stability of electric terminal, and then effectively obtain the substrate current of load, realizes the test to supporting substrate electric current.
Embodiment eight
As shown in figure 9, the present embodiment provides a kind of terminal devices 400 comprising：Processor 401, memory 402 and
It is stored in the computer program 403 that can be run in the memory 402 and on the processor 401, such as substrate current is surveyed
Try program.The processor 401 realizes above-mentioned each substrate current test method embodiment when executing the computer program 403
In step, such as step S201 to S203 shown in FIG. 1.Alternatively, the processor 401 executes the computer program 403
The function of each module in the above-mentioned each device embodiments of Shi Shixian, for example, module 301 to 303 shown in Fig. 8 function.
Illustratively, the computer program 403 can be divided into one or more modules, one or more of
Module is stored in the memory 402, and is executed by the processor 401, to complete the present invention.It is one or more of
Module can complete the series of computation machine program instruction section of specific function, and the instruction segment is for describing the computer
Implementation procedure of the program 403 in the terminal device 400.For example, the computer program 403 can be divided into detection mould
Block, control module, acquisition module, each module concrete function are as follows：
Detection module, for detecting whether the electric terminal is in sleep state or standby mode；
Control module, for when the electric terminal is in sleep state or standby mode, controlling the power supply system
Stop being that the MIPI D-PHY power, to eliminate the leakage current between the MIPI D-PHY and power ground；
Acquisition module, for stopping being after the MIPI D-PHY power, to obtain the load in the power supply system
Substrate current.
The terminal device 400 can be that the calculating such as desktop PC, notebook, palm PC and cloud server are set
It is standby.The terminal device may include, but be not limited only to, processor 401, memory 402.It will be understood by those skilled in the art that
Fig. 9 is only the example of terminal device 400, does not constitute the restriction to terminal device 400, may include more or more than illustrating
Few component either combines certain components or different components, such as the terminal device can also be set including input and output
Standby, network access equipment, bus etc..
Alleged processor 401 can be central processing unit (Central Processing Unit, CPU), can also be
Other general processors, digital signal processor (Digital Signal Processor, DSP), application-specific integrated circuit
(Application Specific Integrated Circuit, ASIC), ready-made programmable gate array (Field-
Programmable Gate Array, FPGA) either other programmable logic device, discrete gate or transistor logic,
Discrete hardware components etc..General processor can be microprocessor or the processor can also be any conventional processor
Deng.
The memory 402 can be the internal storage unit of the terminal device 400, such as terminal device 400 is hard
Disk or memory.The memory 402 can also be the External memory equipment of the terminal device 400, such as the terminal device
The plug-in type hard disk being equipped on 400, intelligent memory card (Smart Media Card, SMC), secure digital (Secure
Digital, SD) card, flash card (Flash Card) etc..Further, the memory 402 can also both include the terminal
The internal storage unit of equipment 400 also includes External memory equipment.The memory 402 for store the computer program with
And other programs needed for the terminal device and data.The memory 402 can be also used for temporarily storing and export
Or the data that will be exported.
It is apparent to those skilled in the art that for convenience of description and succinctly, only with above-mentioned each work(
Can unit, module division progress for example, in practical application, can be as needed and by above-mentioned function distribution by different
Functional unit, module are completed, i.e., the internal structure of described device are divided into different functional units or module, more than completion
The all or part of function of description.Each functional unit, module in embodiment can be integrated in a processing unit, also may be used
It, can also be above-mentioned integrated during two or more units are integrated in one unit to be that each unit physically exists alone
The form that hardware had both may be used in unit is realized, can also be realized in the form of SFU software functional unit.In addition, each function list
Member, the specific name of module are also only to facilitate mutually distinguish, the protection domain being not intended to limit this application.Above system
The specific work process of middle unit, module, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in detail or remembers in some embodiment
The part of load may refer to the associated description of other embodiments.
Those of ordinary skill in the art may realize that lists described in conjunction with the examples disclosed in the embodiments of the present disclosure
Member and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually
It is implemented in hardware or software, depends on the specific application and design constraint of technical solution.Professional technician
Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed
The scope of the present invention.
In embodiment provided by the present invention, it should be understood that disclosed device/terminal device and method, it can be with
It realizes by another way.For example, device described above/terminal device embodiment is only schematical, for example, institute
The division of module or unit is stated, only a kind of division of logic function, formula that in actual implementation, there may be another division manner, such as
Multiple units or component can be combined or can be integrated into another system, or some features can be ignored or not executed.Separately
A bit, shown or discussed mutual coupling or direct-coupling or communication connection can be by some interfaces, device
Or INDIRECT COUPLING or the communication connection of unit, can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, it can also
It is that each unit physically exists alone, it can also be during two or more units be integrated in one unit.Above-mentioned integrated list
The form that hardware had both may be used in member is realized, can also be realized in the form of SFU software functional unit.
If the integrated module is realized in the form of SFU software functional unit and sells or use as independent product
When, it can be stored in a computer read/write memory medium.Based on this understanding, the present invention realizes above-described embodiment side
All or part of flow in method can also instruct relevant hardware to complete, the computer by computer program
Program can be stored in a computer readable storage medium, and the computer program is when being executed by processor, it can be achieved that above-mentioned each
The step of a embodiment of the method.Wherein, the computer program includes computer program code, the computer program code
Can be source code form, object identification code form, executable file or certain intermediate forms etc..The computer-readable medium can
To include：Can carry the computer program code any entity or device, recording medium, USB flash disk, mobile hard disk, magnetic disc,
CD, computer storage, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random
Access Memory), electric carrier signal, telecommunication signal and software distribution medium etc..It should be noted that the computer
The content that readable medium includes can carry out increase and decrease appropriate according to legislation in jurisdiction and the requirement of patent practice, such as
In certain jurisdictions, according to legislation and patent practice, computer-readable medium is including being electric carrier signal and telecommunications letter
Number.
Embodiment described above is merely illustrative of the technical solution of the present invention, rather than its limitations；Although with reference to aforementioned reality
Applying example, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to aforementioned each
Technical solution recorded in embodiment is modified or equivalent replacement of some of the technical features；And these are changed
Or replace, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution should all
It is included within protection scope of the present invention.
Claims (10)
1. a kind of substrate current test method, which is characterized in that be applied to electric terminal, the electric terminal includes that power supply is
System, MIPI D-PHY and at least one load, the MIPI D-PHY are connected to current output terminal and the institute of the power supply system
Between the current input terminal for stating load；
The substrate current test method includes：
Detect whether the electric terminal is in sleep state or standby mode；
When the electric terminal is in sleep state or standby mode, controls the power supply system and stop being the MIPI D-
PHY powers, to eliminate the leakage current between the MIPI D-PHY and power ground；
Stop being after the MIPI D-PHY power, to obtain the substrate current of the load in the power supply system.
2. substrate current test method as described in claim 1, which is characterized in that obtain the substrate current of the load, wrap
It includes：
The substrate current of the load is obtained by substrate current test circuit；
The K current output terminal of the MIPI D-PHY corresponds to K load of the electric terminal；
The substrate current test circuit includes K divider resistance, and i-th of divider resistance is serially connected in the of the MIPI D-PHY
Between the current input terminal of i-th of load of i current output terminal and the electric terminal, the both ends of i-th of divider resistance are each
Draw a voltage test points；
Wherein, K >=i >=1 and K and i are integer.
3. substrate current test method as claimed in claim 2, which is characterized in that obtained by the substrate current test circuit
The substrate current of the load is taken, including：
Obtain the resistance value of the voltage value and i-th of divider resistance of the voltage test points at i-th of divider resistance both ends；
According to the resistance value of the voltage value of the voltage test points at i-th of divider resistance both ends and i-th of divider resistance, calculate by the
The electric current of i divider resistance；Wherein, the substrate current of i-th of load is equal to by the electric current of i-th of divider resistance.
4. substrate current test method as claimed in claim 3, which is characterized in that according to the electricity at i-th of divider resistance both ends
The resistance value of the voltage value and i-th of divider resistance of pressure test point, calculating are by the formula of the electric current of i-th of divider resistance：
Voltage difference/i-th of divider resistance of the voltage test points at the substrate current of i-th of load=i-th divider resistance both ends
Resistance value.
5. such as Claims 1-4 any one of them substrate current test method, which is characterized in that the power supply system includes
Power management chip, the power management chip include low pressure difference linear voltage regulator；
The current output terminal of the low pressure difference linear voltage regulator is connect with the MIPI D-PHY, the low pressure difference linear voltage regulator
M load in M divider resistance and the K load in the corresponding K divider resistance；
Wherein, K >=M >=1 and M are integer.
6. such as Claims 1-4 any one of them substrate current test method, which is characterized in that the power supply system includes
Power management chip, the power management chip include DC/DC converters；
The current output terminal of the DC/DC converters is connect with the MIPI D-PHY, and the DC/DC converters correspond to the K
N number of load in N number of divider resistance and the K load in a divider resistance；
Wherein, K >=N >=1 and N are integer.
7. such as Claims 1-4 any one of them substrate current test method, which is characterized in that the power supply system includes
Power supply；
The current output terminal of the power supply is connect with the MIPI D-PHY, and the power supply corresponds to the m in the K divider resistance
M load in a divider resistance and the K load；
Wherein, K >=m >=1 and m are integer.
8. such as Claims 1-4 any one of them substrate current test method, which is characterized in that the power supply system includes
Power supply and power conversion module；
The current output terminal of the power supply is connect with the current input terminal of the power conversion module, the power conversion module
Current output terminal is connect with the MIPI D-PHY, and the power conversion module corresponds to the n partial pressure electricity stated in K divider resistance
N load in resistance and described K load；
Wherein, K >=n >=1 and n are integer.
9. a kind of substrate current tests system, which is characterized in that be applied to electric terminal, the electric terminal includes that power supply is
System, MIPI D-PHY and at least one load, the MIPI D-PHY are connected to current output terminal and the institute of the power supply system
Between the current input terminal for stating load；
The substrate current tests system：
Detection module, for detecting whether the electric terminal is in sleep state or standby mode；
Control module stops for when the electric terminal is in sleep state or standby mode, controlling the power supply system
It powers for the MIPI D-PHY, to eliminate the leakage current between the MIPI D-PHY and power ground；
Acquisition module, for stopping being after the MIPI D-PHY power, to obtain the base of the load in the power supply system
Bottom electric current.
10. a kind of terminal device, including memory, processor and it is stored in the memory and can be on the processor
The computer program of operation, which is characterized in that the processor realizes such as claim 1 to 8 when executing the computer program
The step of any one the method.
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