CN217484401U - Transient current acquisition circuit and MCU low-power consumption test system - Google Patents
Transient current acquisition circuit and MCU low-power consumption test system Download PDFInfo
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- CN217484401U CN217484401U CN202221182824.1U CN202221182824U CN217484401U CN 217484401 U CN217484401 U CN 217484401U CN 202221182824 U CN202221182824 U CN 202221182824U CN 217484401 U CN217484401 U CN 217484401U
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Abstract
The embodiment of the application provides a transient current acquisition circuit and MCU low-power consumption test system, transient current acquisition circuit includes: the device comprises a power supply, a precision resistor, a chip to be tested, an analog-to-digital conversion circuit and a data processing circuit; the power output end of the power supply is electrically connected with the first end of the precision resistor, and the second end of the precision resistor is electrically connected with the power input end of the chip to be tested; the signal output end of the tested chip is electrically connected with the signal input end of the analog-to-digital conversion circuit; a first voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a first end of the precision resistor, and a second voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a second end of the precision resistor; the data output end of the analog-to-digital conversion circuit is electrically connected with the data input end of the data processing circuit; the data processing circuit is used for determining the transient current of the tested chip according to the first voltage and the second voltage. By adopting the technical scheme provided by the embodiment of the application, the testing efficiency and the accuracy of the transient current of the tested chip can be improved.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a transient current acquisition circuit and an MCU low-power consumption test system.
Background
In the research, design and production links of an integrated circuit, the transient current of the integrated circuit is generally required to be tested. However, the existing measuring instruments (for example, multimeters, oscilloscopes, etc.) generally do not have a function of directly measuring the transient current, and when the measuring instruments are used, a user needs to set up a testing system, and then the transient current is obtained through conversion, so that the efficiency is low. In addition, the transient current of the integrated circuit is usually small, and the accuracy of the transient current obtained by the method is usually poor.
SUMMERY OF THE UTILITY MODEL
The application provides a transient current acquisition circuit and MCU low-power consumption test system to it is lower to do benefit to set up test system through the user among the solution prior art and measures transient current efficiency, and the relatively poor problem of accuracy.
In a first aspect, an embodiment of the present application provides a transient current collecting circuit, including: the device comprises a power supply, a precision resistor, a chip to be tested, an analog-to-digital conversion circuit and a data processing circuit;
the power output end of the power supply is electrically connected with the first end of the precision resistor, the second end of the precision resistor is electrically connected with the power input end of the chip to be tested, and the power output end of the power supply is used for outputting the power supply;
the signal output end of the chip to be tested is electrically connected with the signal input end of the analog-to-digital conversion circuit, and the signal output end of the chip to be tested is used for outputting a sampling starting signal and a sampling ending signal;
a first voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a first end of the precision resistor, the first voltage sampling end of the analog-to-digital conversion circuit is used for collecting a first voltage, a second voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a second end of the precision resistor, and the second voltage sampling end of the analog-to-digital conversion circuit is used for collecting a second voltage;
the data output end of the analog-to-digital conversion circuit is electrically connected with the data input end of the data processing circuit, and the data output end of the analog-to-digital conversion circuit is used for outputting the first voltage and the second voltage;
the data processing circuit is used for determining the transient current of the chip to be tested according to the first voltage and the second voltage.
In one possible implementation manner, the method further includes:
and the output device is electrically connected with the data output end of the data processing circuit and is used for outputting the transient current.
In a possible implementation manner, the voltage acquisition end of the power supply is electrically connected to the power input end of the chip to be tested, and the voltage acquisition end of the power supply is used for acquiring a third voltage, where the third voltage is a voltage of the power input end of the chip to be tested.
In a possible implementation manner, the power supply is configured to adjust a voltage value output by a power supply output terminal of the power supply according to the third voltage.
In a possible implementation manner, the chip under test includes a Serial Peripheral Interface (SPI) module, and the chip under test is configured to output a start sampling signal and an end sampling signal through a signal output end when the SPI module operates.
In a possible implementation manner, the chip under test includes an analog-to-digital converter ADC, and the chip under test is configured to output a start sampling signal and an end sampling signal through a signal output terminal when the ADC is in operation.
In a possible implementation manner, the chip under test includes an oscillation circuit module, and the chip under test is configured to output a start sampling signal and an end sampling signal through a signal output terminal when the oscillation circuit module is in operation.
In a possible implementation manner, the chip under test includes a micro control unit MCU.
In a second aspect, an embodiment of the present application provides an MCU low power consumption test system, including: a Micro Control Unit (MCU) chip and the transient current acquisition circuit of any one of the first aspect; and the signal input end of the MCU chip is connected with the signal output end of the chip to be tested, and the signal output end of the MCU chip is connected with the signal input end of the digital-to-analog conversion circuit.
In a possible implementation manner, the MCU chip is configured to send a start sampling signal and an end sampling signal to the analog-to-digital conversion circuit when it is determined that current detection is required.
By adopting the transient current acquisition circuit and the MCU low-power-consumption test system provided by the embodiment of the application, the test efficiency and accuracy of the transient current of the tested chip can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a block diagram of a transient current acquisition circuit according to an embodiment of the present disclosure.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of associative relationship that describes an associated object, meaning that three types of relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The tested chip related to the embodiment of the application refers to a chip with an internal operation program, and the tested chip can be various types of chips. The transient current collected by the transient current collecting circuit is the transient current of the chip to be tested. For example, when a Serial Peripheral Interface (SPI) module, an Analog-to-Digital Converter (ADC), an oscillator module, and other modules inside a chip under test operate, transient current is generated, which is usually small, usually from a few microamperes to a few milliamperes, and has a very short current time. In order to facilitate testing of the transient current of the chip, an embodiment of the present application provides a transient current collecting circuit, which is described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a block diagram of a transient current collecting circuit according to an embodiment of the present disclosure is shown. As shown in fig. 1, the transient current collecting circuit includes a power supply 101, a precision resistor 102, a chip under test 103, an analog-to-digital conversion circuit 104, and a data processing circuit 105. The power supply 101 comprises a power supply output end and a voltage acquisition end, the power supply output end is electrically connected with a first end (the left side of the precision resistor 102 shown in fig. 1) of the precision resistor 102, a second end (the right side of the precision resistor 102 shown in fig. 1) of the precision resistor 102 is electrically connected with a power supply input end of the tested chip 103, and the power supply output end of the power supply 101 is used for outputting a power supply, so that the power supply is supplied to the tested chip 103 through the precision resistor 102. The precision resistor 102 is a resistor with high precision, low temperature drift and high reliability, the lowest temperature drift of the resistor can be 1PPM, and the highest precision of the resistor can be 0.01%. Since transient currents are typically small, the use of precision resistor 102 may improve the accuracy of the transient current test.
In addition, a voltage collecting terminal of the power supply 101 is electrically connected to a power supply input terminal of the chip under test 103, and the voltage collecting terminal of the power supply 101 is used for collecting a voltage (hereinafter referred to as a third voltage) of the power supply input terminal of the chip under test 103. The voltage may be determined whether the voltage of the power input terminal of the chip 103 under test reaches the working voltage of the chip 103 under test according to the magnitude of the collected third voltage, and if the voltage does not reach the working voltage of the chip 103 under test, the supply voltage value of the power supply 101 is adjusted, so that the voltage of the power input terminal of the chip 103 under test may reach the working voltage of the chip 103 under test.
The signal output end of the tested chip 103 is electrically connected with the signal input end of the analog-to-digital conversion circuit 104. The signal output end of the chip under test 103 is used for sending a start sampling signal and an end sampling signal to the analog-to-digital conversion circuit 104, and further informing the analog-to-digital conversion circuit 104 to start sampling and end sampling. For example, if the transient current of the SPI module during operation needs to be measured, a start sampling signal and an end sampling signal are sent to the analog-to-digital conversion circuit 104 during the operation of the SPI module; if the transient current of the analog-to-digital converter ADC during working needs to be measured, a sampling start signal and a sampling end signal are sent to the analog-to-digital conversion circuit 104 during the working of the analog-to-digital converter ADC; if the transient current of the oscillation circuit module during operation needs to be measured, a start sampling signal and an end sampling signal are sent to the analog-to-digital conversion circuit 104 during the operation of the oscillation circuit module. Specifically, the start sampling signal and the end sampling signal may be a rising edge from low to high or a falling edge from high to low, or a specially divided pulse, and the specific form of the embodiment of the present application is not limited.
A first voltage UA sampling end of the analog-to-digital conversion circuit 104 is electrically connected with a first end of the precision resistor 102, and a second voltage UB sampling end of the analog-to-digital conversion circuit 104 is electrically connected with a second end of the precision resistor 102. A first voltage UA sampling end of the analog-to-digital conversion circuit 104 is used for acquiring a first voltage UA, and a second voltage UB sampling end of the analog-to-digital conversion circuit 104 is used for acquiring a second voltage UB. When the analog-to-digital conversion circuit 104 receives a sampling start signal, the first voltage UA sampling end and the second voltage UB sampling end start to collect the first voltage UA and the second voltage UB at two sides of the precision resistor 102, respectively, and when the analog-to-digital conversion circuit 104 receives a sampling stop signal, the first voltage UA sampling end and the second voltage UB sampling end stop collecting the first voltage UA and the second voltage UB at two sides of the precision resistor 102.
The data output end of the analog-to-digital conversion circuit 104 is electrically connected with the data input end of the data processing circuit 105, and after the analog-to-digital conversion circuit 104 completes sampling of the first voltage UA and the second voltage UB, the first voltage UA and the second voltage UB are sent to the data processing circuit 105, so that the data processing circuit 105 further completes data processing. Since the resistance of the precision resistor 102 is known, the data processing circuit 105 can determine the transient current of the chip 103 to be tested according to the first voltage UA, the second voltage UB and the resistance of the precision resistor 102 after obtaining the first voltage UA and the second voltage UB.
In order to improve the accuracy of the measurement, a plurality of sampling values of the first voltage UA and the second voltage UB may exist, and a data processing method of the plurality of sampling values will be described below.
Setting the resistance value of the precision resistor 102 as R, the transient current of the chip 103 to be tested as Ix, the first voltages UA1 and UA2 … UAn sampled by the analog-to-digital conversion circuit 104, and the second voltages UB1 and UB2 … UBn, respectively, and after acquiring the above values, calculating the voltages as follows:
and UAx is (UA1+ UA2+ … + UAn)/n, the sampled values of UA1 and UA2 … UAn which are more than 1.15 × UAx and less than 0.85UAx are removed to obtain UA1 and UA2 … UAm, and then UA' x is calculated as (UA1+ UA2+ … + UAm)/m.
Similarly, UBx is (UB1+ UB2+ … + UBn)/n, the sampled values of more than 1.15 × UBx and less than 0.85UBx in the UBs 1 and 2 … UBn are removed to obtain the UBs 1 and the UBs 2 … UBp, and then the UB' x is calculated as (UB1+ UB2+ … + UBm)/p.
Further, the transient current Ix ═ (UA 'x-UB' x)/R can be obtained.
It should be noted that the above calculation method is only one possible implementation manner listed in the embodiment of the present application, and a person skilled in the art may adopt other calculation methods according to actual needs, and the embodiment of the present application does not specifically limit this.
In a possible implementation manner, the transient current collecting circuit further includes an output device 106, the output device 106 is electrically connected to the data output end of the data processing circuit 105, and when the data processing circuit 105 completes data processing and obtains the transient current, the transient current can be sent to the output device 106 and output by the output device 106, so that a user can know the transient current. That is, the output device 106 is a user interaction device, which may be a display screen or a voice output module, and the like, and this is not limited in this embodiment.
In a possible implementation manner, the chip under test 103 is an MCU, that is, the transient current of the MCU is measured. Of course, the chip under test 103 may also be other types of chips, and this embodiment of the present application does not specifically limit this.
By adopting the transient current acquisition circuit provided by the embodiment of the application, the test efficiency and accuracy of the transient current of the tested chip can be improved.
Corresponding to the embodiment, the application also provides an MCU low power consumption test system, which comprises a micro control unit MCU chip and the transient current acquisition circuit of the embodiment. The signal input end of the MCU chip is connected with the signal output end of the chip to be tested, and the signal output end of the MCU chip is connected with the signal input end of the digital-to-analog conversion circuit. In a specific implementation, the MCU chip is configured to send a start sampling signal and an end sampling signal to the analog-to-digital conversion circuit when it is determined that current detection is required.
By adopting the transient current acquisition system provided by the embodiment of the application, the test efficiency and accuracy of the transient current of the tested chip can be improved.
It should be noted that, the transient current collecting circuit in the embodiment of the present application may refer to the description in the above embodiment, and for brevity, the description is not repeated herein.
In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, and means that there may be three relationships, for example, a and/or B, and may mean that a exists alone, a and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.
Those of ordinary skill in the art will appreciate that the various elements and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or combinations of electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
It can be clearly understood by those skilled in the art that, for convenience and simplicity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, any function, if implemented in the form of a software functional unit and sold or used as a separate product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
The above description is only an embodiment of the present application, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present disclosure, and all of them should be covered by the protection scope of the present application. The protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A transient current acquisition circuit, comprising: the device comprises a power supply, a precision resistor, a chip to be tested, an analog-to-digital conversion circuit and a data processing circuit;
the power supply output end of the power supply is electrically connected with the first end of the precision resistor, the second end of the precision resistor is electrically connected with the power supply input end of the chip to be tested, and the power supply output end of the power supply is used for outputting the power supply; the signal output end of the tested chip is electrically connected with the signal input end of the analog-to-digital conversion circuit, and the signal output end of the tested chip is used for outputting a sampling starting signal and a sampling ending signal;
a first voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a first end of the precision resistor, the first voltage sampling end of the analog-to-digital conversion circuit is used for collecting a first voltage, a second voltage sampling end of the analog-to-digital conversion circuit is electrically connected with a second end of the precision resistor, and the second voltage sampling end of the analog-to-digital conversion circuit is used for collecting a second voltage;
the data output end of the analog-to-digital conversion circuit is electrically connected with the data input end of the data processing circuit, and the data output end of the analog-to-digital conversion circuit is used for outputting the first voltage and the second voltage;
the data processing circuit is used for determining the transient current of the tested chip according to the first voltage and the second voltage.
2. The transient current collection circuit of claim 1, further comprising:
and the output device is electrically connected with the data output end of the data processing circuit and is used for outputting the transient current.
3. The transient current collection circuit of claim 1, wherein the voltage collection terminal of the power supply is electrically connected to the power input terminal of the dut, and the voltage collection terminal of the power supply is configured to collect a third voltage, and the third voltage is a voltage at the power input terminal of the dut.
4. The transient current collection circuit of claim 3, wherein said power supply is configured to adjust a voltage value output by a power supply output of said power supply according to said third voltage.
5. The transient current collection circuit of claim 1, wherein said chip under test comprises a Serial Peripheral Interface (SPI) module, and said chip under test is configured to output a start sampling signal and an end sampling signal via a signal output terminal when said SPI module is in operation.
6. The transient current collection circuit of claim 1, wherein the chip under test comprises an analog-to-digital converter (ADC), and the chip under test is configured to output a start sampling signal and an end sampling signal via signal output terminals when the ADC is in operation.
7. The transient current collection circuit of claim 1, wherein the chip under test comprises an oscillation circuit module, and the chip under test is configured to output a start sampling signal and an end sampling signal through a signal output terminal when the oscillation circuit module is in operation.
8. The transient current collection circuit of claim 1, wherein said chip under test comprises a Micro Control Unit (MCU).
9. An MCU low power consumption test system, comprising: a Micro Control Unit (MCU) chip and the transient current acquisition circuit of any one of claims 1 to 8; and the signal input end of the MCU chip is connected with the signal output end of the chip to be tested, and the signal output end of the MCU chip is connected with the signal input end of the digital-to-analog conversion circuit.
10. The MCU low power consumption test system of claim 9, wherein the MCU chip is configured to send a start sampling signal and an end sampling signal to the analog-to-digital conversion circuit when it is determined that current detection is required.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153385A (en) * | 2023-04-21 | 2023-05-23 | 长鑫存储技术有限公司 | Power consumption measuring method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153385A (en) * | 2023-04-21 | 2023-05-23 | 长鑫存储技术有限公司 | Power consumption measuring method |
| CN116153385B (en) * | 2023-04-21 | 2023-09-19 | 长鑫存储技术有限公司 | Power consumption measuring method |
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