CN116120847A - Thin black multilayer conductive shielding adhesive tape and preparation method thereof - Google Patents
Thin black multilayer conductive shielding adhesive tape and preparation method thereof Download PDFInfo
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- CN116120847A CN116120847A CN202211524799.5A CN202211524799A CN116120847A CN 116120847 A CN116120847 A CN 116120847A CN 202211524799 A CN202211524799 A CN 202211524799A CN 116120847 A CN116120847 A CN 116120847A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J149/00—Adhesives based on homopolymers or copolymers of compounds having one or more carbon-to-carbon triple bonds; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a thin black multilayer conductive shielding adhesive tape and a preparation method thereof, and relates to the technical field of conductive shielding adhesive tapes.
Description
Technical Field
The invention relates to the technical field of conductive shielding adhesive tapes, in particular to a thin black multilayer conductive shielding adhesive tape and a preparation method thereof.
Background
In the concrete of the high-speed development of science and technology, various electronic products are layered endlessly, electronic products are already deep into the aspects of life of people, electromagnetic wave radiation is usually shielded by adopting electromagnetic shielding materials in the electronic products, and a conductive shielding tape still has a good shielding effect under the environment of dynamic friction and corrosion, so that the conductive shielding tape is widely applied to different industries, the conductive shielding tape consists of a conductive back adhesive and a conductive base material and is a complete conductor, and the conductive back adhesive and the conductive base material can be bonded with any metal surface to complete electric lap joint and gap electric closure, so that the electromagnetic shielding chamber, the joints of a shell and electronic equipment are sealed, cables are wound to shield, reliable grounding surfaces are provided, and electric contact is provided for surfaces which cannot be welded.
As disclosed in Chinese patent publication: a conductive shielding adhesive tape and a preparation method thereof, application number is: CN202111547729.7, the conductive shielding tape comprises a base material layer, a base coat layer and a conductive adhesive layer, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 60-80 parts of acrylic ester monomer, 10-30 parts of amination modified carbon conductive agent, 5-10 parts of diluting solvent and 0.1-1 part of initiator. The amination modified carbon-based conductive agent consists of 50-60 parts of epoxidation carbon-based conductive agent, 10-20 parts of amino modifier and 0.1-1 part of accelerator. The conductive adhesive layer adopts the amination modified carbon conductive agent to realize the electromagnetic shielding function, has good compatibility with high polymer resin on the basis of ensuring the functionalization of excellent conductivity and electromagnetic shielding property, and avoids the problems of poor compatibility and dispersibility, reduced mechanical property, easy agglomeration and the like caused by using a single filler. The conductive shielding adhesive tape prepared by the invention has the advantages of good conductive performance, excellent mechanical property, no agglomeration of conductive filler and the like.
However, in the above technical solution, since the conductive shielding tape is inevitably exposed to air for a long time during use, the guiding portion inside the conductive shielding tape is very easy to react with oxygen in air under the action of current, so that the conductivity efficiency is gradually reduced, and the conductive shielding effect of the conductive shielding tape is affected.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a thin black multilayer conductive shielding tape and a preparation method thereof, which solve the problems that in the technical scheme, the conductive shielding tape is inevitably exposed to air for a long time in use, so that a guiding part in the conductive shielding tape is easy to react with oxygen in the air under the action of current, the conductivity efficiency is gradually reduced, and the conductive shielding effect of the conductive shielding tape is affected.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the thin black multilayer conductive shielding adhesive tape comprises a conductive back adhesive and a conductive base material, wherein the conductive back adhesive is partially positioned between two conductive base materials, the conductive back adhesive is composed of 30-50 parts of prepolymer, 40-60 parts of curing agent (cross-linking agent), 20-40 parts of diluent, 10-30 parts of plasticizer, 10-30 parts of coupling agent, 20-60 parts of defoaming agent and 3-5 parts of metal powder, the conductive base material is composed of copper, nickel metal and fiber cloth, a black release film is arranged on one end surface of the conductive base material far away from the conductive back adhesive, and high-conductivity acrylic self-adhesive is arranged between the black release film and the conductive base material.
Preferably, the prepolymer contains epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene.
Preferably, the molar ratio between the epoxy resin, the phenolic resin, the polyimide, the polyurethane and the polyacetylene is 1:2:1:1:2.
Preferably, the main oxime structure and substituents of the epoxy resin are adjusted for heat resistance, and the hydrogen structure of the polyacetylene is replaced by sulfur.
Preferably, the diluents are classified into reactive diluents and non-reactive diluents.
Preferably, the ratio of the reactive diluent to the non-reactive diluent is 2:1.
Preferably, the metal powder is one of gold, silver, copper, and nickel.
Preferably, the metal powder has a nano-scale spherical structure.
Preferably, the fiber cloth is heat-resistant polyethylene fiber cloth, and after the heat-resistant polyethylene fiber cloth is subjected to front treatment, an electroplated metal coating is applied, and the metal coating is high-conductivity copper and nickel metal.
The preparation method of the thin black multilayer conductive shielding adhesive tape is characterized by comprising the following steps of:
step one: placing epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene into a heating container according to the molar ratio of 1:2:1:1:2, then adding metal powder, and then heating the heating container to ensure that the internal temperature of the heating container is between 150 and 180 ℃ and heating is carried out for 10 to 30 minutes.
Step two: the diluent and coupling agent are added to the heated vessel, waiting for 30-50 minutes, and then the non-reactive diluent in the heated vessel is removed.
Step three: adding a curing agent (cross-linking agent), a plasticizer and an antifoaming agent into a heating container, stirring for 10-30 minutes, then placing the heating container in a cool place, and standing for 1-3 hours.
Step four: and horizontally placing a black release film, then doctor-coating high-conductivity acrylic self-adhesive on one surface of the black release film through a doctor-blade device, then horizontally placing heat-resistant polyethylene fiber cloth, then doctor-coating the heat-resistant polyethylene fiber cloth on two surfaces of the heat-resistant polyethylene fiber cloth obtained in the third step with the high-conductivity acrylic self-adhesive through a doctor-blade device, then placing copper and nickel metals on two surfaces of the heat-resistant polyethylene fiber cloth coated with the conductive back adhesive to form a conductive substrate, aligning the conductive substrate with the black release film, placing the conductive substrate on one surface of the black release film coated with the high-conductivity acrylic self-adhesive, then doctor-coating the high-conductivity acrylic self-adhesive on the other surface of the conductive substrate, and then placing the black release film on one surface of the conductive substrate coated with the high-conductivity acrylic self-adhesive to form a tape substrate.
Step five: and (3) placing the adhesive tape substrate obtained in the step four into an extruder, fully heating and pressing the conductive substrate, the conductive back adhesive and the high-conductivity acrylic self-adhesive by using the extruder, and then uniformly scraping and coating the bottom adhesive on the bottom of the pressed thin black multilayer conductive shielding adhesive tape.
The invention provides a thin black multilayer conductive shielding adhesive tape and a preparation method thereof. The device comprises the following
The beneficial effects are that:
(1) According to the invention, sulfur is used for replacing the hydrogen structure of the polyacetylene, so that the polyacetylene is more stable in the air, the polyacetylene is difficult to oxidize, and the conductivity of the polyacetylene is always in a stable state, so that the conductive shielding adhesive tape can always have good conductivity.
(2) According to the invention, the conductive back glue forms a molecular skeleton of the conductive paste through the curing agent, the conductive filler particles form channels, and the coupling agent and the plasticizer are used for improving the dispersibility of the conductive filler in the resin matrix, so that the flexibility and the adhesive strength of the adhesive layer are increased.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Wherein, 1, a black release film; 2. a conductive substrate; 3. conductive back glue; 4. high-conductivity acrylic self-adhesive.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
the embodiment of the invention provides a thin black multilayer conductive shielding adhesive tape, which comprises a conductive back adhesive and conductive base materials, wherein the conductive back adhesive is partially positioned between two conductive base materials, the conductive back adhesive is composed of 30 parts of prepolymer, 40 parts of curing agent (cross-linking agent), 20 parts of diluent, 10 parts of plasticizer, 10 parts of coupling agent, 20 parts of defoaming agent and 3 parts of metal powder, the conductive base materials are composed of copper, nickel metal and fiber cloth, a black release film is arranged on one end surface of the conductive base materials, far away from the conductive back adhesive, and high-conductivity acrylic self-adhesive is arranged between the black release film and the conductive base materials.
The preparation method of the thin black multilayer conductive shielding adhesive tape comprises the following steps:
step one: epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene are placed into a heating container according to the molar ratio of 1:2:1:1:2, then metal powder is added, and the heating container is heated, so that the internal temperature of the heating container is 150 ℃ and the heating time is 10 minutes.
Step two: the diluent and coupling agent were added to the heated vessel, waiting for 30 minutes, and then the non-reactive diluent in the heated vessel was removed.
Step three: the curing agent (cross-linking agent), plasticizer, defoamer were added to the heating vessel and stirred for 10 minutes, then the heating vessel was placed in the shade and left to stand for 1 hour.
Step four: and horizontally placing a black release film, then doctor-coating high-conductivity acrylic self-adhesive on one surface of the black release film through a doctor-blade device, then horizontally placing heat-resistant polyethylene fiber cloth, then doctor-coating the heat-resistant polyethylene fiber cloth on two surfaces of the heat-resistant polyethylene fiber cloth obtained in the third step with the high-conductivity acrylic self-adhesive through a doctor-blade device, then placing copper and nickel metals on two surfaces of the heat-resistant polyethylene fiber cloth coated with the conductive back adhesive to form a conductive substrate, aligning the conductive substrate with the black release film, placing the conductive substrate on one surface of the black release film coated with the high-conductivity acrylic self-adhesive, then doctor-coating the high-conductivity acrylic self-adhesive on the other surface of the conductive substrate, and then placing the black release film on one surface of the conductive substrate coated with the high-conductivity acrylic self-adhesive to form a tape substrate.
Step five: and (3) placing the adhesive tape substrate obtained in the step four into an extruder, fully heating and pressing the conductive substrate, the conductive back adhesive and the high-conductivity acrylic self-adhesive by using the extruder, and then uniformly scraping and coating the bottom adhesive on the bottom of the pressed thin black multilayer conductive shielding adhesive tape.
Example 2: the embodiment of the invention provides a thin black multilayer conductive shielding adhesive tape, which comprises a conductive back adhesive and conductive base materials, wherein the conductive back adhesive is partially positioned between two conductive base materials, the conductive back adhesive is composed of 40 parts of prepolymer, 50 parts of curing agent (cross-linking agent), 30 parts of diluent, 20 parts of plasticizer, 20 parts of coupling agent, 40 parts of defoaming agent and 45 parts of metal powder, the conductive base materials are composed of copper, nickel metal and fiber cloth, a black release film is arranged on one end surface of the conductive base materials far away from the conductive back adhesive, and high-conductivity acrylic self-adhesive is arranged between the black release film and the conductive base materials.
The preparation method of the thin black multilayer conductive shielding adhesive tape comprises the following steps:
step one: epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene are placed into a heating container according to the molar ratio of 1:2:1:1:2, then metal powder is added, and the heating container is heated, so that the internal temperature of the heating container is 165 ℃, and the heating time is 20 minutes.
Step two: the diluent and coupling agent were added to the heated vessel, waiting for 40 minutes, and then the non-reactive diluent in the heated vessel was removed.
Step three: the curing agent (cross-linking agent), plasticizer, defoamer were added to the heating vessel and stirred for 20 minutes, then the heating vessel was placed in the shade and left to stand for 2 hours.
Step four: and horizontally placing a black release film, then doctor-coating high-conductivity acrylic self-adhesive on one surface of the black release film through a doctor-blade device, then horizontally placing heat-resistant polyethylene fiber cloth, then doctor-coating the heat-resistant polyethylene fiber cloth on two surfaces of the heat-resistant polyethylene fiber cloth obtained in the third step with the high-conductivity acrylic self-adhesive through a doctor-blade device, then placing copper and nickel metals on two surfaces of the heat-resistant polyethylene fiber cloth coated with the conductive back adhesive to form a conductive substrate, aligning the conductive substrate with the black release film, placing the conductive substrate on one surface of the black release film coated with the high-conductivity acrylic self-adhesive, then doctor-coating the high-conductivity acrylic self-adhesive on the other surface of the conductive substrate, and then placing the black release film on one surface of the conductive substrate coated with the high-conductivity acrylic self-adhesive to form a tape substrate.
Step five: and (3) placing the adhesive tape substrate obtained in the step four into an extruder, fully heating and pressing the conductive substrate, the conductive back adhesive and the high-conductivity acrylic self-adhesive by using the extruder, and then uniformly scraping and coating the bottom adhesive on the bottom of the pressed thin black multilayer conductive shielding adhesive tape.
Example 3: the embodiment of the invention provides a thin black multilayer conductive shielding adhesive tape, which comprises a conductive back adhesive and conductive base materials, wherein the conductive back adhesive is partially positioned between two conductive base materials, the conductive back adhesive is composed of 50 parts of prepolymer, 60 parts of curing agent (cross-linking agent), 40 parts of diluent, 30 parts of plasticizer, 30 parts of coupling agent, 60 parts of defoaming agent and 5 parts of metal powder, the conductive base materials are composed of copper, nickel metal and fiber cloth, a black release film is arranged on one end surface of the conductive base materials, far away from the conductive back adhesive, and high-conductivity acrylic self-adhesive is arranged between the black release film and the conductive base materials.
The preparation method of the thin black multilayer conductive shielding adhesive tape comprises the following steps:
step one: epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene are put into a heating container according to the molar ratio of 1:2:1:1:2, then metal powder is added, and the heating container is heated, so that the internal temperature of the heating container is 180 ℃ and the heating time is 30 minutes.
Step two: the diluent and coupling agent were added to the heated vessel, waiting for 50 minutes, and then the non-reactive diluent in the heated vessel was removed.
Step three: the curing agent (cross-linking agent), plasticizer, defoamer were added to the heating vessel, stirred for 30 minutes, then the heating vessel was placed in the shade and left to stand for 3 hours.
Step four: and horizontally placing a black release film, then doctor-coating high-conductivity acrylic self-adhesive on one surface of the black release film through a doctor-blade device, then horizontally placing heat-resistant polyethylene fiber cloth, then doctor-coating the heat-resistant polyethylene fiber cloth on two surfaces of the heat-resistant polyethylene fiber cloth obtained in the third step with the high-conductivity acrylic self-adhesive through a doctor-blade device, then placing copper and nickel metals on two surfaces of the heat-resistant polyethylene fiber cloth coated with the conductive back adhesive to form a conductive substrate, aligning the conductive substrate with the black release film, placing the conductive substrate on one surface of the black release film coated with the high-conductivity acrylic self-adhesive, then doctor-coating the high-conductivity acrylic self-adhesive on the other surface of the conductive substrate, and then placing the black release film on one surface of the conductive substrate coated with the high-conductivity acrylic self-adhesive to form a tape substrate.
Step five: and (3) placing the adhesive tape substrate obtained in the step four into an extruder, fully heating and pressing the conductive substrate, the conductive back adhesive and the high-conductivity acrylic self-adhesive by using the extruder, and then uniformly scraping and coating the bottom adhesive on the bottom of the pressed thin black multilayer conductive shielding adhesive tape.
It should be understood that the foregoing examples of the present invention are merely illustrative of the present invention and not limiting of the embodiments of the present invention, and that various other changes and modifications can be made by those skilled in the art based on the above description, and it is not intended to be exhaustive of all of the embodiments, and all obvious changes and modifications that come within the scope of the invention are defined by the following claims.
Claims (10)
1. The utility model provides a thin black multilayer conductive shielding sticky tape, includes conductive back glue and conductive substrate, its characterized in that: the conductive back adhesive part is positioned between two conductive base materials, the conductive back adhesive is composed of 30-50 parts of prepolymer, 40-60 parts of curing agent (cross-linking agent), 20-40 parts of diluent, 10-30 parts of plasticizer, 10-30 parts of coupling agent, 20-60 parts of defoamer and 3-5 parts of metal powder, the conductive base materials are composed of copper, nickel metal and fiber cloth, a black release film is arranged on one end surface of the conductive base materials far away from the conductive back adhesive, and high-conductivity acrylic self-adhesive is arranged between the black release film and the conductive base materials.
2. The thin black multilayer conductive shielding tape of claim 1, wherein: the prepolymer contains epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene.
3. A thin black multilayer conductive shielding tape according to claim 2, wherein: the molar ratio of the epoxy resin to the phenolic resin to the polyimide to the polyurethane to the polyacetylene is 1:2:1:1:2.
4. A thin black multilayer conductive shielding tape according to claim 3, wherein: the main oxime structure and substituents of the epoxy resin are adjusted for heat resistance, and the hydrogen structure of the polyacetylene is replaced by sulfur.
5. The thin black multilayer conductive shielding tape of claim 1, wherein: the diluents are classified into reactive diluents and non-reactive diluents.
6. The thin black multilayer conductive shielding tape of claim 5, wherein: the ratio of the reactive diluent to the non-reactive diluent is 2:1.
7. The thin black multilayer conductive shielding tape of claim 1, wherein: the metal powder is one of gold, silver, copper and nickel.
8. The thin black multilayer conductive shielding tape of claim 7, wherein: the metal powder is in a nano-scale spherical structure.
9. The thin black multilayer conductive shielding tape of claim 1, wherein: the fiber cloth is heat-resistant poly-acetate fiber cloth, and is subjected to electroplating metal coating after the heat-resistant poly-acetate fiber cloth is subjected to front treatment, wherein the metal coating is high-conductivity copper and nickel metal.
10. The preparation method of the thin black multilayer conductive shielding adhesive tape is characterized by comprising the following steps of:
step one: placing epoxy resin, phenolic resin, polyimide, polyurethane and polyacetylene into a heating container according to the molar ratio of 1:2:1:1:2, then adding metal powder, and then heating the heating container to ensure that the internal temperature of the heating container is between 150 and 180 ℃ and heating is carried out for 10 to 30 minutes.
Step two: the diluent and coupling agent are added to the heated vessel, waiting for 30-50 minutes, and then the non-reactive diluent in the heated vessel is removed.
Step three: adding a curing agent (cross-linking agent), a plasticizer and an antifoaming agent into a heating container, stirring for 10-30 minutes, then placing the heating container in a cool place, and standing for 1-3 hours.
Step four: and horizontally placing a black release film, then doctor-coating high-conductivity acrylic self-adhesive on one surface of the black release film through a doctor-blade device, then horizontally placing heat-resistant polyethylene fiber cloth, then doctor-coating the heat-resistant polyethylene fiber cloth on two surfaces of the heat-resistant polyethylene fiber cloth obtained in the third step with the high-conductivity acrylic self-adhesive through a doctor-blade device, then placing copper and nickel metals on two surfaces of the heat-resistant polyethylene fiber cloth coated with the conductive back adhesive to form a conductive substrate, aligning the conductive substrate with the black release film, placing the conductive substrate on one surface of the black release film coated with the high-conductivity acrylic self-adhesive, then doctor-coating the high-conductivity acrylic self-adhesive on the other surface of the conductive substrate, and then placing the black release film on one surface of the conductive substrate coated with the high-conductivity acrylic self-adhesive to form a tape substrate.
Step five: and (3) placing the adhesive tape substrate obtained in the step four into an extruder, fully heating and pressing the conductive substrate, the conductive back adhesive and the high-conductivity acrylic self-adhesive by using the extruder, and then uniformly scraping and coating the bottom adhesive on the bottom of the pressed thin black multilayer conductive shielding adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211524799.5A CN116120847A (en) | 2022-11-30 | 2022-11-30 | Thin black multilayer conductive shielding adhesive tape and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211524799.5A CN116120847A (en) | 2022-11-30 | 2022-11-30 | Thin black multilayer conductive shielding adhesive tape and preparation method thereof |
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| Publication Number | Publication Date |
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| CN116120847A true CN116120847A (en) | 2023-05-16 |
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| CN202211524799.5A Pending CN116120847A (en) | 2022-11-30 | 2022-11-30 | Thin black multilayer conductive shielding adhesive tape and preparation method thereof |
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| CN (1) | CN116120847A (en) |
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- 2022-11-30 CN CN202211524799.5A patent/CN116120847A/en active Pending
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