CN101418201A - Adhesive composite for flexible circuit board - Google Patents
Adhesive composite for flexible circuit board Download PDFInfo
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- CN101418201A CN101418201A CNA2007101653683A CN200710165368A CN101418201A CN 101418201 A CN101418201 A CN 101418201A CN A2007101653683 A CNA2007101653683 A CN A2007101653683A CN 200710165368 A CN200710165368 A CN 200710165368A CN 101418201 A CN101418201 A CN 101418201A
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Abstract
The invention relates to an adhesive composition for a flexible circuit board. The composition comprises thermosetting resin, thermoplastic resin, a curing agent and a solvent, wherein the thermosetting resin comprises bisphenol A epoxy resin, novolac epoxy resin and phosphorous epoxy resin; the thermoplastic resin is polyether imide; the curing agent is a mixture of liquid crystal amino and diaminodiphenylsulfone or a mixture of liquid crystal and diaminodiphenylmethane; and the liquid crystal amino is a compound with the structure. The adhesive composition has high flexibility and high-temperature resistance.
Description
Technical field
The present invention relates to a kind of adhesive compound that is used for flexible circuit board.
Background technology
In recent years, the development of information, communication industry has driven the high speed development of microelectronic industry, and is therefore also more and more higher to the requirement of flexible circuit board.A lot of important performance index all are that performance by tackiness agent is determined in the flexible circuit board, such as: the stripping strength between dielectric substrate and the tinsel, snappiness, chemical resistance, heat resistance, glue-line flowability etc.Therefore be used to protect the mulch film of flexible circuit board need have high cohesive strength, high insulation resistance, solvent resistance and the processibility of windowing, also need to have high thermal resistance, high-flexibility, halogen and flame retardant resistance in addition.By with curable adhesive coated to Kapton, stick the mulch film that separate-type paper or release film promptly become flexible circuit board behind the semicure.The material of tackiness agent mainly comprises material of main part and subsidiary material, and material of main part mainly contains thermoplastic resin and thermosetting resin, and subsidiary material mainly contain solidifying agent, softening agent, filler and solvent.
Along with development of electronic technology, electronics integrated also more and more higher requires material therefor to have high thermal resistance and very high snappiness simultaneously.
A kind of adhesive compound that is used for flexible print circuit board is disclosed among the JP200111415, said composition contains the Resins, epoxy that has two or more epoxide groups in (a) each molecule, (b) contain the nitrile rubber of carboxyl or contain the hydrogenated nitrile rubber of carboxyl, (c) imidazolium compounds and (d) organic carboxyl acid, and preferably contain (e) aromatic amine.This adhesive compound has the very cohesive strength of high reliability, and solder temperature resistance is 300 ℃.But the snappiness of said composition is relatively poor.
A kind of adhesive compound that is used for flexible printed circuit board is disclosed among the JP63112676, said composition contains acrylate copolymer, Resins, epoxy and aromatic amine, described acrylate copolymer is for to be formed by the acrylate of 60-90 weight %, the vinyl cyanide of 10-50 weight % and the methacrylic acid copolymerization of 2-10 weight %, Resins, epoxy adopts the Resins, epoxy that has two or more epoxide groups in molecule, bisphenol A epoxide resin for example, aromatic amine is diaminodiphenylsulfone(DDS) or diaminodiphenylmethane for example.Said composition has excellent adhesivity to Copper Foil and polyimide film, has solvent resistance, and solder temperature resistance can reach 320 ℃ of dipping baths 10 seconds, but the snappiness of said composition is relatively poor.
CN1900157A discloses a kind of flexible printed circuit coating film, comprise thermosetting resin, thermoplastic resin, solidifying agent and curing catalyst, described thermosetting resin is the mixture of multiple Resins, epoxy, and the weight part of each composition is respectively: thermosetting resin 80-150 part, thermoplastic resin 40-50 part, solidifying agent 3-7 part, curing catalyst 0.8-1.2 part, wherein, described thermosetting resin comprises bisphenol A epoxide resin and multiple functionality epoxide resin, described multiple functionality epoxide resin comprises novolac epoxy and polyfunctionality phosphorous epoxy resin, and weight part is: bisphenol A epoxide resin 70-95 part, novolac epoxy 0.1-30 part, polyfunctionality phosphorous epoxy resin 1-20 part.Described polyfunctionality phosphorous epoxy resin is an epoxy resin of phosphonitrile trimer, especially six glycidyl ether tripolyphosphazenes.Described thermoplastic resin is the acrylic rubber of band epoxy group(ing) and the two cross-linking types of tool.Described bisphenol A epoxide resin comprises lower molecular weight bisphenol A epoxide resin E-44 and high molecular solid bisphenol A epoxy resin E-20, and weight part is respectively E-4418-22 part, E-2050-75 part.This mulch film 300 rotating speed sinuousness of per minute 180 in 50 ℃ of environment are spent anti-bending more than 1,000 ten thousand times.But second-order transition temperature Tg is 90 ℃ only, and resistance to elevated temperatures is relatively poor.
Summary of the invention
The objective of the invention is to overcome the relatively poor defective of resistance to elevated temperatures of adhesive compound in the above-mentioned prior art, provide a kind of snappiness and high thermal resistance all very high adhesive compound that is used for flexible circuit board.
The invention provides a kind of adhesive compound that is used for flexible circuit board, said composition contains thermosetting resin, thermoplastic resin, solidifying agent and solvent, described thermosetting resin contains bisphenol A epoxide resin, novolac epoxy and phosphorous epoxy resin, wherein, described thermoplastic resin is a polyetherimide, described solidifying agent is the mixture of liquid crystal amine and diaminodiphenylsulfone(DDS) or the mixture of liquid crystal amine and diaminodiphenylmethane, and described liquid crystal amine is the compound with following structure:
The adhesive compound that is used for flexible circuit board provided by the invention, owing in solidifying agent, adopted liquid crystal amine, this solidifying agent has three aromatic ester groups, can improve the high thermal resistance of this adhesive compound, contain the long chain alkane base simultaneously, can improve the snappiness of this adhesive compound, and this solidifying agent possesses certain latent, can prolong the storage period of adhesive compound.Owing to adopted polyetherimide as thermoplastic resin, can strengthen the snappiness and the thermostability of this adhesive compound, have outstanding flame retardant resistance and the low rate of being fuming simultaneously.Therefore, adhesive compound provided by the invention has excellent flexibility, under the tension force of 4.9N with 175 times/minute back and forth the anti-bending of warpage can reach more than 9,000,000 times, and have excellent high thermal resistance, second-order transition temperature reaches more than 170 ℃.
Embodiment
The adhesive compound that is used for flexible circuit board provided by the invention contains thermosetting resin, thermoplastic resin, solidifying agent and solvent, described thermosetting resin contains bisphenol A epoxide resin, novolac epoxy and phosphorous epoxy resin, wherein, described thermoplastic resin is a polyetherimide, described solidifying agent is the mixture of liquid crystal amine and diaminodiphenylsulfone(DDS) or the mixture of liquid crystal amine and diaminodiphenylmethane, and described liquid crystal amine is the compound with following structure:
According to composition provided by the invention, the liquid crystal amine that adopts in solidifying agent has three aromatic ester groups, can improve the high thermal resistance of adhesive compound, contain the long chain alkane base simultaneously, can improve the snappiness of adhesive compound, anti-bending, and make solidifying agent possess certain latent, can prolong the storage period of adhesive compound.
According to composition provided by the invention, in the preferred case, based on the thermosetting resin of 100 weight parts, the content of described thermoplastic resin is the 10-20 weight part, and the content of described solidifying agent is the 15-25 weight part, and the content of described solvent is the 135-250 weight part.
According to composition provided by the invention, described polyetherimide is preferably the polymkeric substance with following structure:
Wherein, n is 1000-2000, and R is a phenylene, and structural formula is
4,4 '-the hexichol ether, structural formula is
Perhaps diphenyl sulfone, structural formula is
Polyetherimide can be selected the Ultem product of the GE company that is purchased for use.In adhesive compound of the present invention, adopt polyetherimide, but the snappiness of enhancing composition is anti-bending and thermostability, makes composition have outstanding flame retardant resistance and the low rate of being fuming simultaneously.
According to composition provided by the invention, under the preferable case, based on the gross weight of described solidifying agent, the content of liquid crystal amine is 20-95 weight %, and the content of diaminodiphenylsulfone(DDS) (DDS) or diaminodiphenylmethane (DDM) is 5-80 weight %.The curing system that obtains high heat resistance and have certain latent in the recombination energy of the liquid crystal amine of this proportional range and DDS or DDM.
According to composition provided by the invention, under the preferable case, in the thermosetting resin of 100 weight parts, the content of described bisphenol A epoxide resin is the 30-40 weight part, the content of described novolac epoxy is the 30-40 weight part, and the content of described phosphorous epoxy resin is the 10-20 weight part.
According to composition provided by the invention, in the preferred case, described thermosetting resin also contains cycloaliphatic epoxy resin, and the oxirane value of described cycloaliphatic epoxy resin is 0.2-0.85mol/100g; In the thermosetting resin of 100 weight parts, the content of described cycloaliphatic epoxy resin is the 10-20 weight part.Adopt cycloaliphatic epoxy resin can further improve the high thermal resistance of adhesive compound, the while can increase the wetting property of adhesive compound.Described cycloaliphatic epoxy resin preferably adopts two-(3,4 epoxycyclohexyl) adipic acid ester and/or 3,4 epoxycyclohexyls-3,4 epoxycyclohexyl manthanoate.
According to composition provided by the invention, described bisphenol A epoxide resin is preferably bisphenol A diglycidyl ether, and oxirane value is 0.1-1mol/100g.The trade mark of selectable bisphenol A diglycidyl ether comprises one or more among E-56, E-20, E-12 and the E-55.The amount of substance (being mole number) of the epoxy group(ing) that is contained in the Resins, epoxy of " oxirane value " described herein expression 100 grams.
According to composition provided by the invention, the oxirane value of preferred described novolac epoxy is 0.30-0.60mol/100g.The trade mark of selectable novolac epoxy is one or more among F-51, F-44, F-48 and the F-46.
According to composition provided by the invention, adopt phosphorous epoxy resin can improve the flame retardant resistance of adhesive compound.Described phosphorous epoxy resin is preferably tripolyphosphazene, more preferably six glycidyl ether tripolyphosphazenes.
According to composition provided by the invention, described solvent can be the various solvents that can be used for adhesive compound, for example one or more in toluene, acetone, butanone, N-V-Pyrol RC and the N,N-DIMETHYLACETAMIDE.Wherein, the mixed solvent of preferred butanone and N,N-DIMETHYLACETAMIDE, owing to the boiling point of two kinds of solvents has certain difference, solvent evaporates too soon or too slow influences the volatilization of internal solvent during for fear of semicure, and preferably their weight ratio is 1:1.
According to composition provided by the invention, in the preferred case, described composition also contains filler, adopts filler can improve flame retardant resistance, thermotolerance, low-shrinkage and the adhesivity of composition in composition.Based on the thermosetting resin of 100 weight parts, the content of described filler is the 10-20 weight part.Described filler can be selected the various fillers that can be used for adhesive compound for use, and for example average particulate diameter is one or more in mica powder, asbestos powder, aluminium hydroxide, silicon-dioxide, aluminum oxide and the magnesium hydroxide of 20-100 nanometer.
The preparation method of adhesive compound of the present invention is as follows:
Polyetherimide joined in the mixed solvent to stir make the polyetherimide amine solvent, add bisphenol A type epoxy resin and cycloaliphatic epoxy resin then respectively, under 110-130 ℃ temperature, stirring reaction two hours obtains glue; In addition filler is added in the mixed solvent and to make the filler dissolving in ultra-sonic dispersion 10-30 minute, join then in the above-mentioned glue that obtains, add phosphorous epoxy resin and novolac epoxy more respectively, stir after 0.5-2 hour, add liquid crystal amine and DDS or liquid crystal amine and the DDM that is dissolved in fully in the mixed solvent again, continue to stir 0.5-2 hour, it is 20-60% that the interpolation mixed solvent makes the weight content of mixed solution solid substance, can obtain tackiness agent.
Mode below by embodiment is described in further detail to the present invention.
Embodiment 1
With 12 weight part polyetherimides (U.S. GE company, PEI 1000) join to stir in 15 weight parts N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) and make the polyetherimide amine solvent, add 40 weight part bisphenol A-type E-20 Resins, epoxy (Jinan Resins, epoxy factories then respectively, E-20), under 120 ℃ temperature, stirring reaction 2 hours obtains glue.
The middle ultra-sonic dispersion of N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) that in addition 10 weight part magnesium hydroxides (average particulate diameter is 40 nanometers) is dissolved in 35 weight parts joins after 20 minutes in the above-mentioned glue that obtains, add 20 weight parts, six glycidyl ether tripolyphosphazene (Guangzhou Hong Chang more respectively, 589K75), 40 weight part novolac epoxy F-51 (Jinan Resins, epoxy factories, F-51), stirred 1 hour, add 8 weight part liquid crystal amine (morning twilight chemical institute) and 17 weight part diaminodiphenylsulfone(DDS)s (DDS) (occasion chemical industry company limited is praised in Shanghai) in the N,N-DIMETHYLACETAMIDE/butanone mixed solvent that is dissolved in 40 weight parts fully then, continue to stir 1 hour, it is 60% that the above-mentioned mixed solvent that adds 85 weight parts makes the weight content of mixed solution solid substance, can obtain tackiness agent.
Embodiment 2
12 weight part polyetherimides are joined middle stirring of 15 weight parts N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) make the polyetherimide amine solvent, add 30 weight part bisphenol A-type E-55 Resins, epoxy (Jinan Resins, epoxy factories then respectively, E-55), 20 weight parts two-(3, the 4-epoxycyclohexyl) adipic acid ester, under 120 ℃ temperature, stirring reaction 2 hours.
The middle ultra-sonic dispersion of N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) that in addition 10 weight part magnesium hydroxides (average particulate diameter is 20 nanometers) is dissolved in 35 weight parts joins after 20 minutes in the above-mentioned glue that obtains, add 20 weight parts, six glycidyl ether tripolyphosphazenes more respectively, 30 weight part novolac epoxy F-44 (DOW Chemical, F-44), stir after 1 hour, add 5 weight part liquid crystal amine and 20 weight part diaminodiphenylsulfone(DDS)s (DDS) in the N,N-DIMETHYLACETAMIDE/butanone mixed solvent that is dissolved in 40 weight parts fully then, continue to stir 1 hour, it is 60% that the above-mentioned mixed solvent that adds 45 weight parts makes the weight content of mixed solution solid substance, can obtain tackiness agent.
Embodiment 3
15 weight part polyetherimides are joined middle stirring of 15 weight parts N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) make the polyetherimide amine solvent, add 40 weight part bisphenol A-type E-56 Resins, epoxy (Jinan Resins, epoxy factories then respectively, E-56), 10 weight parts 3,4 epoxycyclohexyls-3,4 epoxycyclohexyl manthanoate (extensively joining Tianjin chemical industry company limited), under 120 ℃ temperature, stirring reaction 2 hours.
The middle ultra-sonic dispersion of N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) that in addition 10 weight part magnesium hydroxides (average particulate diameter is 100 nanometers) is dissolved in 35 weight parts joins after 20 minutes in the above-mentioned glue that obtains, add 10 weight parts, six glycidyl ether tripolyphosphazenes more respectively, 40 weight part novolac epoxy F-48 (DOW Chemical, F-48), stir after 1 hour, add 10 weight part liquid crystal amine and 15 weight part diaminodiphenylmethane (DDM) (occasion chemical industry company limited is praised in Shanghai) in the N,N-DIMETHYLACETAMIDE/butanone mixed solvent that is dissolved in 40 weight parts fully then, continue to stir 1 hour, it is 40% that the above-mentioned mixed solvent that adds 135 weight parts makes the weight content of mixed solution solid substance, can obtain tackiness agent.
Embodiment 4
18 weight part polyetherimides are joined middle stirring of 15 weight parts N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) make the polyetherimide amine solvent, add 35 weight part bisphenol A-type E-12 Resins, epoxy, 15 weight parts two-(3 then respectively, the 4-epoxycyclohexyl) adipic acid ester, under 120 ℃ temperature, stirring reaction 2 hours.
The middle ultra-sonic dispersion of N,N-DIMETHYLACETAMIDE/butanone mixed solvent (weight ratio is 1:1) that in addition 20 weight part magnesium hydroxides (average particulate diameter is 70 nanometers) is dissolved in 35 weight parts joins after 20 minutes in the above-mentioned glue that obtains, add 15 weight parts, six glycidyl ether tripolyphosphazenes more respectively, 35 weight part novolac epoxy F-46 (DOW Chemical, F-46), stir after 1 hour, add 14 weight part liquid crystal amine and 11 weight part diaminodiphenylsulfone(DDS)s (DDS) in the N,N-DIMETHYLACETAMIDE/butanone mixed solvent that is dissolved in 40 weight parts fully then, continue to stir 1 hour, it is 40% that the above-mentioned mixed solvent that adds 154.5 weight parts makes the weight content of mixed solution solid substance, can obtain tackiness agent.
Comparative Examples 1
Prepare adhesive compound according to embodiment 2 described methods, different is to use acrylic rubber EP-4051 to replace polyetherimide as thermoplastic resin.
Comparative Examples 2
Prepare adhesive compound according to embodiment 2 described methods, different is, does not use liquid crystal amine, only uses the DDS solidifying agent of 25 weight parts.
Performance test
1, preparation mulch film
With 100 microns coating devices (Western Regions Mechatronic Systems company limited) adhesive compound is coated on polyimide (PI) film; then; respectively heat under 100 ℃, 120 ℃ and 150 ℃ of three kinds of temperature respectively and desolventized small drum for marking time coating oven dry back in 10 minutes and use the separate-type paper insulation blocking, promptly obtaining thick is 40 microns mulch film sample.
The copper coin of mulch film sample and etching is carried out light face hot pressing under following hot pressing condition:
Pre-pressing: be to carry out 20 seconds under 0 the condition at 180 ℃ temperature and pressure P;
The moulding pressing: at 180 ℃ temperature and pressure P is 120Kgf/cm
2Condition under pressing 90 seconds;
Slaking: under 180 ℃ temperature, kept 90 minutes.
2, the second-order transition temperature of test mulch film
Adopt dynamic mechanical analysis method (DMC), instrument: thermomechanical analyzer; Operational condition: powdered sample, N
2Under the atmosphere, temperature rise rate is 20 ℃/min, and the temperature scanning scope is 20-350 ℃.
3, test anti-tin-welding:
Resulting mulch film is determined the test film of 25mm * 25mm, merge slaking by the method and the Copper Foil hot pressing of above-mentioned hot pressing after, baking 1 hour under 135 ± 10 ℃ temperature in advance with 330 ± 5 ℃ probe temperature, was floated tin 30 seconds in tin lead stove.
Criterion of acceptability is: the no foaming in surface, expansion and stratified unusual phenomenon.
4, the anti-bending of test mulch film:
Is 0.38mm with the above-mentioned mulch film that makes with warpage curvature of face radius, width is not more than 19mm, the gap of warpage face should be slightly larger than sample thickness, but the sample thickness 0.25mm in the time of should not compressing greater than nothing, angle: 135 ± 5 °, under 4.9N tension force, do 175 times/min warpage back and forth, the warpage number of times when measuring sample appearance broken string.
5, test stripping strength
Sample after the pressing that makes is as stated above determined the test film of 10mm * 250mm, carry out 90 ° of rotary type drawing epiphragmas tests with the pull speed of 50mm/min.
Testing standard is 〉=3.4N/cm (being that mulch film can not separate fully with polyimide (PI) film).
6, the excessive glue amount of test:
Determine the mulch film test film of 102mm * 102mm, and on this test film, get out 4 holes that diameter is 2.0mm, 2.0mm, 3.0mm and 3.0mm respectively, then after the method and Copper Foil hot pressing according to above-mentioned hot pressing, measure the glue deviation of overflowing down at metaloscope (Guilin City step special opticinstrument company limited).
Qualified standard is :≤0.2mm.
7, test solvent resistance:
Resulting mulch film is determined the test film of 25mm * 25mm, immerse in three kinds of medicines of 23 ± 5 ℃, keep 5min ± 30sec, observe to have or not with appearance method and bubble and layering.
Three kinds of medicines product respectively are: the hydrochloric acid of 2mol/L, the aqueous sodium hydroxide solution of 2mol/L and 2-propyl alcohol.The standard of passing through is that mulch film does not have foaming and layering.
8, test flame retardant resistance:
Resulting mulch film is carried out the test of flame retardant resistance according to the UL94 standard.
Respectively resulting adhesive compound among embodiment 1-3 and the Comparative Examples 1-2 is tested according to above-mentioned performance test methods, the results are shown in Table 1 for gained.
Table 1
| Over-all properties | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Comparative Examples 1 | Comparative Examples 1 |
| Second-order transition temperature (℃) | 166 | 168 | 170 | 178 | 125 | 110 |
| Anti-tin-welding | By | By | By | By | By | By |
| Bending property (ten thousand times) | 900 | More than 1000 | More than 1000 | More than 1000 | 700 | 800 |
| Stripping strength (N/cm) | 9.76 | 10.98 | 9.96 | 11.20 | 6.80 | 7.20 |
| Excessive glue amount (mm) | 0.06 | 0.05 | 0.06 | 0.07 | 0.08 | 0.10 |
| Anti-solvent | By | By | By | By | By | By |
| Flame retardant resistance | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
As can be seen from Table 1, adopt the prepared mulch film of adhesive compound provided by the invention, snappiness and high thermal resistance are all very high, have very high stripping strength and flame retardant resistance simultaneously, and halogen, compliance with environmental protection requirements.
Claims (10)
1, a kind of adhesive compound that is used for flexible circuit board, said composition contains thermosetting resin, thermoplastic resin, solidifying agent and solvent, described thermosetting resin contains bisphenol A epoxide resin, novolac epoxy and phosphorous epoxy resin, it is characterized in that, described thermoplastic resin is a polyetherimide, described solidifying agent is the mixture of liquid crystal amine and diaminodiphenylsulfone(DDS) or the mixture of liquid crystal amine and diaminodiphenylmethane, and described liquid crystal amine is the compound with following structure:
2, composition according to claim 1, wherein, based on the thermosetting resin of 100 weight parts, the content of described thermoplastic resin is the 10-20 weight part, and the content of described solidifying agent is the 15-25 weight part, and the content of described solvent is the 135-250 weight part.
3, composition according to claim 1 and 2, wherein, described polyetherimide is the polymkeric substance with following structure:
Wherein, n is 1000-2000, R be phenylene, 4,4 '-hexichol ether or diphenyl sulfone.
4, composition according to claim 1 and 2, wherein, based on the gross weight of described solidifying agent, the content of liquid crystal amine is 20-95 weight %, the content of diaminodiphenylsulfone(DDS) or diaminodiphenylmethane is 5-80 weight %.
5, composition according to claim 1 and 2, wherein, in the thermosetting resin of 100 weight parts, the content of described bisphenol A epoxide resin is the 30-40 weight part, the content of described novolac epoxy is the 30-40 weight part, and the content of described phosphorous epoxy resin is the 10-20 weight part.
6, composition according to claim 5, wherein, described thermosetting resin also contains cycloaliphatic epoxy resin, and the oxirane value of described cycloaliphatic epoxy resin is 0.2-0.85mol/100g; In the thermosetting resin of 100 weight parts, the content of described cycloaliphatic epoxy resin is the 10-20 weight part.
7, composition according to claim 6, wherein, described cycloaliphatic epoxy resin is two-(3,4 epoxycyclohexyl) adipic acid ester and/or 3,4 epoxycyclohexyls-3,4 epoxycyclohexyl manthanoate.
8, composition according to claim 1, wherein, the oxirane value of described bisphenol A epoxide resin is 0.1-1mol/100g, and the oxirane value of described novolac epoxy is 0.30-0.60mol/100g, and described phosphorous epoxy resin is a tripolyphosphazene.
9, composition according to claim 1, wherein, described solvent is one or more in toluene, acetone, butanone, N-V-Pyrol RC and the N,N-DIMETHYLACETAMIDE.
10, composition according to claim 1, wherein, described composition also contains filler, and thermosetting resin based on 100 weight parts, the content of described filler is the 10-20 weight part, and described filler is that average particulate diameter is one or more in mica powder, asbestos powder, aluminium hydroxide, silicon-dioxide, aluminum oxide and the magnesium hydroxide of 20-100 nanometer.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103409041A (en) * | 2012-06-04 | 2013-11-27 | 华烁科技股份有限公司 | Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate |
| CN103834337A (en) * | 2014-03-21 | 2014-06-04 | 南京林业大学 | Method for converting ordinary phenolic resin into quick-curing wood structure adhesive |
| CN109096979A (en) * | 2018-08-15 | 2018-12-28 | 南昌正业科技有限公司 | A kind of adhesive and a kind of flexibility coat copper plate with high glass-transition temperature |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134693A (en) * | 2002-10-15 | 2004-04-30 | Toppan Printing Co Ltd | Manufacturing method of multilayer printed circuit board |
| CN100532449C (en) * | 2006-03-20 | 2009-08-26 | 深圳市丹邦投资有限公司 | Flexible printed circuit coating film and its preparing method |
-
2007
- 2007-10-26 CN CN2007101653683A patent/CN101418201B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103409041A (en) * | 2012-06-04 | 2013-11-27 | 华烁科技股份有限公司 | Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate |
| CN103834337A (en) * | 2014-03-21 | 2014-06-04 | 南京林业大学 | Method for converting ordinary phenolic resin into quick-curing wood structure adhesive |
| CN109096979A (en) * | 2018-08-15 | 2018-12-28 | 南昌正业科技有限公司 | A kind of adhesive and a kind of flexibility coat copper plate with high glass-transition temperature |
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| CN101418201B (en) | 2012-05-23 |
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