CN116097440A - 一种发光面板及其制备方法、电子设备 - Google Patents
一种发光面板及其制备方法、电子设备 Download PDFInfo
- Publication number
- CN116097440A CN116097440A CN202080104659.5A CN202080104659A CN116097440A CN 116097440 A CN116097440 A CN 116097440A CN 202080104659 A CN202080104659 A CN 202080104659A CN 116097440 A CN116097440 A CN 116097440A
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- electrode
- led
- light
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 241
- 239000000758 substrate Substances 0.000 claims abstract description 241
- 238000004519 manufacturing process Methods 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 52
- 238000000059 patterning Methods 0.000 claims abstract description 35
- 239000010408 film Substances 0.000 claims description 158
- 239000010409 thin film Substances 0.000 claims description 59
- 239000013078 crystal Substances 0.000 claims description 45
- 238000009826 distribution Methods 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 25
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
一种发光面板(01)及其制备方法、电子设备，涉及显示技术领域，用于改善制作发光面板(01)的过程中转移LED芯片次数多以及LED芯片易损伤的问题。该发光面板(01)的制备方法包括：将发光二极管LED外延薄膜(8)转移至目标基板(1)上；LED外延薄膜(8)包括依次层叠设置的第一半导体薄膜(81)、发光薄膜(82)和第二半导体薄膜(83)；第一半导体薄膜(81)和第二半导体薄膜(83)的掺杂类型不同；对LED外延薄膜(8)进行构图，形成多个LED晶粒(2)；LED晶粒(2)包括依次层叠设置在目标基板(1)上的第一半导体层(21)、发光层(22)和第二半导体层(23)。可以用于制作micro LED显示面板。
Description
PCT国内申请，说明书已公开。
Claims (16)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/114866 WO2022052058A1 (zh) | 2020-09-11 | 2020-09-11 | 一种发光面板及其制备方法、电子设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116097440A true CN116097440A (zh) | 2023-05-09 |
| CN116097440A8 CN116097440A8 (zh) | 2023-06-27 |
Family
ID=80632604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080104659.5A Pending CN116097440A (zh) | 2020-09-11 | 2020-09-11 | 一种发光面板及其制备方法、电子设备 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116097440A (zh) |
| WO (1) | WO2022052058A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116864598A (zh) * | 2023-07-20 | 2023-10-10 | 深圳市思坦科技有限公司 | 发光芯片、制备方法及显示装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300919B (zh) * | 2018-10-15 | 2020-09-29 | 上海天马微电子有限公司 | Micro LED显示基板及其制作方法、显示装置 |
| KR102114406B1 (ko) * | 2018-11-02 | 2020-06-17 | 한국광기술원 | 마이크로 led 용 플렉서블 기판 및 기판 제조방법 |
| CN109545731B (zh) * | 2018-11-20 | 2021-12-28 | 合肥京东方显示技术有限公司 | 转移头及其制备方法、转移方法、转移装置 |
| CN109742200A (zh) * | 2019-01-11 | 2019-05-10 | 京东方科技集团股份有限公司 | 一种显示面板的制备方法、显示面板及显示装置 |
| CN110047785B (zh) * | 2019-04-24 | 2020-11-10 | 京东方科技集团股份有限公司 | Micro LED巨量转移方法及其封装结构、显示装置 |
| CN109994579B (zh) * | 2019-04-30 | 2020-12-25 | 成都辰显光电有限公司 | 微型led显示面板的制备方法和微型led显示面板 |
| CN110911537B (zh) * | 2019-11-29 | 2021-12-28 | 东莞市中晶半导体科技有限公司 | 共阴极led芯片及其制作方法 |
-
2020
- 2020-09-11 CN CN202080104659.5A patent/CN116097440A/zh active Pending
- 2020-09-11 WO PCT/CN2020/114866 patent/WO2022052058A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN116097440A8 (zh) | 2023-06-27 |
| WO2022052058A1 (zh) | 2022-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CI02 | Correction of invention patent application | ||
| CI02 | Correction of invention patent application |
Correction item: PCT international application to national stage day Correct: 2023.01.28 False: 2023.01.17 Number: 19-01 Page: The title page Volume: 39 Correction item: PCT international application to national stage day Correct: 2023.01.28 False: 2023.01.17 Number: 19-01 Volume: 39 |