CN116059533B - Active heat dissipation electrode slice and electrode device - Google Patents
Active heat dissipation electrode slice and electrode device Download PDFInfo
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- CN116059533B CN116059533B CN202310138717.1A CN202310138717A CN116059533B CN 116059533 B CN116059533 B CN 116059533B CN 202310138717 A CN202310138717 A CN 202310138717A CN 116059533 B CN116059533 B CN 116059533B
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/36014—External stimulators, e.g. with patch electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention belongs to the technical field of medical equipment, and particularly relates to an active heat-dissipating electrode slice, which comprises: a support member (1), a heat conducting member (2), at least one set of thermocouples (3) and an electrode (5); the supporting component (1) is arranged opposite to the heat conducting component (2); the support component (1) is used for arranging the thermocouple (3) and the electrode (5), and the thermocouple (3) is arranged in an insulating way with the electrode (5); the at least one group of thermocouples (3) is used for conducting the heat generated by the electrodes (5) to the heat conducting component (2); the heat conducting component (2) is used for conducting out heat. By using the electrode device, the defects that the electrode plate is difficult to dissipate heat and skin is burnt or allergic reaction is caused by long-time wearing of the electrode (5) and/or heating of the electrode device can be solved, and better wearing comfort and better curative effect are provided.
Description
Technical Field
The invention belongs to the technical field of medical equipment, and particularly relates to an active heat-dissipating electrode slice and an electrode device.
Background
This section is intended to provide a background or context to the embodiments of the invention that are recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
At present, the electrode plate is a consumable material matched with an instrument for transmitting an electric field or current to a human body, has the effect of physical therapy as the name implies, has the advantages of disposability, practicability, sanitation and the like, is widely applied to industries such as medical treatment, physiotherapy and the like, and has various innovations in product forms and pasting modes.
In the prior art, the electrode plate is generally circular, the generated heat is easy to gather, and the heat dissipation efficiency is low. In addition, through the heat conduction surface that contacts with skin and the heat dissipation surface that is connected with the heat conduction surface on the support piece of electrode slice, through the diffusion of the mode of physical heat conduction to external world or heat dissipation surface, ensure skin surface tissue and not lead to the damage because of the high temperature. However, the physical passive form has limited heat dissipation function, and can not effectively and rapidly reduce the temperature of the skin surface, and the possibility that heat dissipation generated by too rapid temperature rise of the heat conducting surface is not timely, so that the skin is burned still exists.
Therefore, the problem that the electrode sheet is worn for a long time and causes skin burn or anaphylactic reaction is urgent to be solved.
Disclosure of Invention
Aiming at the problems in the prior art, an active heat-dissipating electrode slice and an electrode device are provided, and the active heat-dissipating electrode slice provided by the invention can at least solve the problems.
In order to solve the technical problems, the present invention provides an active heat dissipation electrode slice, comprising:
a support member, a thermally conductive member, at least one set of thermocouples and electrodes;
the supporting component is arranged opposite to the heat conducting component;
the support component is used for arranging the thermocouple and the electrode, and the thermocouple is arranged in an insulating way with the electrode;
the at least one group of thermocouples is used for conducting heat generated by the electrodes to the heat conducting component;
the heat conducting component is used for conducting heat out.
In an alternative embodiment, the thermocouple comprises an N-type semiconductor element and a P-type semiconductor element, the N-type semiconductor element and/or the P-type semiconductor element are distributed between the supporting component and the heat conducting component, and heat generated by the electrode is conducted to the heat conducting component through the N-type semiconductor element and/or the P-type semiconductor element. In an alternative embodiment, the thermocouple comprises an N-type semiconductor element and a P-type semiconductor element which are combined with each other, and the N-type semiconductor element and the P-type semiconductor element are electrically connected; the thermocouple (or NP semiconductor module) is composed of a P-type semiconductor element and an N-type semiconductor element, which are also called N-junction and P-junction, by which heat generated from an electrode is conducted to the heat conductive member using the peltier effect.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet comprising a plurality of sets of said thermocouples; the thermocouples are uniformly distributed on the supporting component.
The thermocouples are spirally distributed with the central part of the supporting part as the center. The end outside the spiral mode is also called a start end, namely, the end far away from the temperature control module along the spiral arrangement, and the end inside the spiral mode is also called a tail end, and the tail end is positioned at the center of the supporting part. Along the spiral arrangement direction, each thermocouple is distributed with the next adjacent thermocouple at equal intervals. In an alternative embodiment, each of said thermocouples is not equally spaced from the adjacent next thermocouple, preferably from the outside to the inside in a spiral arrangement, said thermocouple distribution being progressively denser or progressively thinner.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet, wherein a plurality of groups of thermocouples form a spiral space; the electrode is a spiral metal sheet arranged opposite to the spiral space; the electrode is arranged on the supporting part and is positioned in the spiral space, and the electrode and the thermocouple arranged in a spiral shape form double-spiral arrangement; the electrode is not in contact with the thermocouple. Preferably, when the supporting component is a supporting sheet and the conductive component is a conductive sheet, the electrodes are arranged on the surface of the supporting sheet facing the conductive sheet in a spiral manner, and the electrodes do not intersect or are tangential to the thermocouples arranged in the spiral manner, i.e. no electrical connection exists between the electrodes and the thermocouples to avoid short circuits; preferably, the electrode is arranged insulated from the thermocouple. According to the invention, through the structural design of double-spiral distribution of the electrode and the thermocouple, better heat dissipation of the electrode is realized compared with a round electrode plate.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet, wherein the thermocouple comprises an N-type semiconductor element and a P-type semiconductor element which are electrically connected with each other; the N-type semiconductor element is electrically connected with the P-type semiconductor element. The active heat dissipation electrode slice also comprises a heat conduction component. In an alternative embodiment, a plurality of groups of thermocouples are arranged between the supporting component and the heat conducting component in a spiral mode, and the supporting component and the heat conducting component are oppositely arranged; preferably, the thermocouples in spiral arrangement are in reverse staggered arrangement in sequence and contact with each other and are arranged between the supporting component and the heat conducting component; the setting mode includes connection modes such as paste, joint, and the like, and the skilled artisan can just lay multiunit thermocouple spiral mode between supporting part and heat conduction part with the connection mode known in the prior art as required, at least one set of thermocouple is used for with the heat conduction of electrode production extremely heat conduction part to make things convenient for high efficiency to give off heat into the sky.
In an alternative embodiment, the invention provides an active heat dissipation electrode slice, a temperature sensor module is arranged on the electrode slice, preferably, a temperature control module is arranged in the center of the electrode device, the temperature sensor module collects the temperature of an electrode and sends the temperature to the temperature control module, and the temperature control module adjusts the temperature according to the collected temperature. Preferably, the temperature sensor module collects the temperature of the electrode and/or the temperature of the electrode device and/or the temperature of the supporting component and/or the temperature of the heat conducting component and/or the temperature of the temperature control module and sends the temperature to the temperature control module, and the temperature control module adjusts the temperature of the electrode device according to the collected temperature. Preferably, the temperature sensor module collects the temperatures of the electrode and/or the electrode device and/or the supporting component, processes the temperatures to obtain processed temperature values, for example, takes the maximum temperature value as the processed temperature value, sends the processed temperature value to the temperature control module, and the temperature control module adjusts the temperature of the electrode device according to the collected temperature.
In an alternative embodiment, the invention provides an active heat-dissipating electrode plate, each thermocouple in spiral arrangement is arranged in a reverse staggered mode in sequence, each thermocouple is connected in series, and the direction from an N-type semiconductor element to a P-type semiconductor element is the direction of the thermocouple.
In an alternative embodiment, the present invention provides an active heat dissipating electrode sheet, wherein heat is transferred from the support member to the thermally conductive member by the plurality of thermocouples, or wherein heat is transferred from the electrode to the thermally conductive member by the plurality of thermocouples. Preferably, the supporting component is a ceramic supporting plate, and has the functions of isolating current and conducting heat rapidly; the heat conduction component is a good conductor supporting sheet or a ceramic supporting sheet for heat transfer and has the function of rapid heat conduction.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet, the electrode being adhered to the skin by the support member.
By adopting the electrode device in the above technical scheme, when current passes through the thermocouple (i.e., NP semiconductor module) on the electrode device according to the peltier effect, one junction dissipates heat and the other junction absorbs heat. When the current direction is from N to P, the thermocouple absorbs heat at one side of the electrode sheet or electrode and lowers the temperature of the electrode sheet or electrode; when the current direction is from P to N, the thermocouple releases heat to the electrode sheet or electrode side and increases the temperature of the electrode sheet. Therefore, scalp heat is actively transmitted to the other side of the electrode plate from one side, the temperature of the electrode plate contacting the skin surface is rapidly reduced, skin burn and anaphylactic reaction are avoided, adverse reactions caused by long-time sticking of the electrode plate or the electrode are reduced, and better wearing comfort and better physiotherapy effect are realized.
In an alternative embodiment, the present invention provides an electrode device for controlling an active heat dissipating electrode sheet, comprising:
the active heat dissipation electrode slice is the active heat dissipation electrode slice according to any embodiment of the invention;
the host is electrically connected with the temperature control module of the electrode plate;
the signal source is connected with the electrode;
and the power supply is electrically connected with part or all of the thermocouples. And the power supply module is electrically connected with at least one NP semiconductor module and is used for supplying power to the NP semiconductor modules.
In an alternative embodiment, the invention provides an electrode device for controlling the active heat dissipation electrode plate, and thermocouples located at the outer end of the spiral arrangement (i.e. near the start of the spiral arrangement) and at the central end of the spiral arrangement (i.e. near the end of the spiral arrangement) are respectively electrically connected with the power supply. One end of the outer side of the spiral mode is a starting end, one end of the inner side of the spiral mode is a tail end, the first thermocouple is located close to the starting end, and the last thermocouple is located close to the tail end. Preferably, the N-type semiconductor and the P-type semiconductor of the adjacent NP semiconductor modules are opposite in vertical positions, and the conductive wires are arranged on the supporting member and the heat conducting member, so that the N-node of each NP semiconductor module along the spiral direction is electrically connected with the P-node in turn, and the P-node of the adjacent NP semiconductor module is electrically connected with the N-node in turn. So that the plurality of NP semiconductor modules are connected in series by wires. In an alternative embodiment, the N node and the P node are separately disposed, and the N node and the P node are respectively located between the support member and the heat conductive member that are disposed opposite to each other. Preferably, the N-node and the P-node are respectively and alternately arranged between the supporting member and the heat conducting member, current or voltage flows in from the side of the N-node of the thermocouple contacted with the heat conducting member, flows out from the side of the N-node contacted with the supporting member, flows in the side of the next P-node contacted with the supporting member through the wire positioned on the supporting member, flows out from the side of the P-node contacted with the heat conducting member, and then repeatedly circulates the process, flows in the side of the next N-node contacted with the heat conducting member through the wire positioned on the heat conducting member, and so on, flows through all the N-node and the P-node in sequence, thereby realizing the series connection of all the N-node and the P-node. In an alternative embodiment, current or voltage flows in from one side of the N node of the thermocouple, flows in from the N node to the P node, and flows out from one side of the P node. In an alternative embodiment, the direction from N to the P junction is the direction of the thermocouple. The first thermocouple at the initial end of the spiral arrangement is arranged on the supporting component, the first thermocouple is electrically connected with the adjacent second thermocouple along the spiral arrangement direction through a wire, the second thermocouple is electrically connected with the adjacent third thermocouple along the spiral arrangement direction through a wire, and the like until the first thermocouple is electrically connected to the last thermocouple, so that the series connection of all thermocouples is realized.
In another alternative embodiment, the present invention provides an active heat dissipation electrode device, where the N-type semiconductor element or the P-type semiconductor element of each of the thermocouples is electrically connected to one pole of the power supply (such as the positive pole or the negative pole of the power supply), and the P-type semiconductor element or the N-type semiconductor element of each of the thermocouples is electrically connected to the other pole of the power supply (such as the negative pole or the positive pole of the power supply). The thermocouples are arranged in a spiral manner in sequence in the same direction, and are arranged on the surface of the supporting component, preferably, one side, in contact with the supporting component, of each thermocouple is electrically connected with one pole of the power supply through a wire, and one side, in contact with the heat conducting component, of each thermocouple is electrically connected with the other pole of the power supply through a wire. Preferably, the N-type semiconductor and the P-type semiconductor of the adjacent NP semiconductor modules are located at the same vertical position, and the portion of the NP semiconductor modules close to the support member is the N-type semiconductor, and the portion far away from the support member is the P-type semiconductor. Wires are arranged on the supporting component and the heat conducting component, so that N nodes of adjacent NP semiconductor modules along the spiral direction are electrically connected with the N nodes in sequence, P nodes of the adjacent NP semiconductor modules are electrically connected with the P nodes in sequence, and the NP semiconductor modules are connected in parallel through the wires. In this embodiment, the adjacent NP semiconductor modules may all be one of N-type semiconductors or P-type semiconductors.
One of the advantages of the embodiment is that the above components such as the lead wire on the supporting sheet, the NP semiconductor module sensor, the temperature control module and the like are packaged into the active heat dissipation electrode slice, the electrode device is used for controlling the active heat dissipation electrode slice to form a closed loop, the electrode device is attached to the head of a human body to realize active cooling, the temperature is constant through an integration algorithm, the use comfort of a user is greatly improved, adverse reactions caused by attaching the electrode slice or the electrode for a long time are reduced, and better wearing comfort and better curative effect are realized; meanwhile, the temperature of the electrode device attached to the epidermis is controllable through the active heat dissipation electrode device provided by the invention, so that the problems that the electrode plate or the electrode is attached to the epidermis and the attachment is not firm or even falls off due to the sweating of the scalp with overhigh temperature are solved. And the heat generated by the electrode can be more fully conducted away by the thermocouple through the spiral distribution of the electrode plate and the thermocouple. The electrode plate can solve the problems that the heat dissipation of the electrode plate is difficult, burn or anaphylactic reaction and the like occur to the skin due to long-time wearing of the electrode (5) and/or heating of the electrode device, and better wearing comfort and better curative effect are provided.
Other advantages of the present invention will be explained in more detail in connection with the following description and accompanying drawings.
It should be understood that the foregoing description is only an overview of the technical solutions of the present invention, so that the technical means of the present invention may be more clearly understood and implemented in accordance with the content of the specification. The following specific embodiments of the present invention are described in detail to make the above and other objects, features and advantages of the present invention more comprehensible.
Drawings
The advantages and benefits described herein, as well as other advantages and benefits, will become apparent to those of ordinary skill in the art upon reading the following detailed description of the exemplary embodiments. The drawings are only for purposes of illustrating exemplary embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic illustration of an active heat dissipation electrode structure package according to an embodiment of the present invention;
FIG. 2 is a side view of an active heat spreader electrode package according to yet another embodiment of the present invention;
FIG. 3 is a schematic view of the structure of the connection of the components on a support member according to yet another embodiment of the present invention;
FIG. 4 is a side view of the structure of the connection of the components on the support member according to yet another embodiment of the present invention;
FIG. 5 is a schematic illustration of the structure of the connection of the components on a thermally conductive member according to yet another embodiment of the present application;
FIG. 6 is a schematic circuit diagram of a temperature control module in an active heat dissipation electrode sheet according to an embodiment of the present application;
fig. 7 is a logic block diagram of an active heat dissipation electrode device according to an embodiment of the present application.
In the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
Wherein the symbols in the drawings are briefly described as follows:
the electrode plate comprises a support part 1, a heat conduction part 2, a pair of thermocouples (or NP semiconductor modules) synthesized by NP semiconductor materials 3, a temperature control module 4 and an electrode 5.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In describing embodiments of the present application, it will be understood that terms, such as "comprises" or "comprising," and the like, are intended to indicate the presence of features, numbers, steps, acts, components, portions, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility of one or more other features, numbers, steps, acts, components, portions, or combinations thereof being present.
Unless otherwise indicated, "/" means or, e.g., A/B may represent A or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone.
The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
All code in the present application is exemplary and variations will occur to those skilled in the art depending upon the programming language used, the specific needs and personal habits, etc., without departing from the spirit of the application.
As described above, the traditional scheme mainly ensures that the skin surface tissue is not damaged due to overhigh temperature by the diffusion of the heat conducting surface contacted with the skin and the heat radiating surface connected with the heat conducting surface on the supporting sheet of the electrode sheet in a physical heat conducting mode to the outside or the heat radiating surface. However, the conventional scheme has the following problems: the heat dissipation function of the physical passive form is limited, the temperature of the skin surface cannot be effectively and rapidly reduced, and the possibility that the heat dissipation is not timely and the skin is burnt due to the fact that the temperature of the heat conducting surface is excessively rapidly increased still exists.
To at least partially address one or more of the above problems, as well as other potential problems, example embodiments of the present disclosure propose an active heat-dissipating electrode sheet. In the scheme, a closed loop is formed by a lead wire, an NP semiconductor module, a sensor and a temperature control module on the supporting plate, the electrode device controls the active heat dissipation electrode plate through a power supply and a main control center, and when current passes through a thermocouple (namely the NP semiconductor module) on the electrode plate according to the Peltier effect, one node dissipates heat and the other node absorbs heat. Preferably, the master control center can be realized through electronic equipment such as a host, a mobile phone, a notebook computer, a tablet personal computer, a server and the like. In this way, by when the current direction is from the N node to the P node, the electrode sheet or electrode temperature drops and absorbs heat; when the current flow direction is from P to N, the temperature of the electrode slice or the electrode rises and releases heat, the heat of the electrode slice or the electrode can be actively transmitted from one surface contacting the skin to the other surface contacting the outside, the temperature of the electrode slice and/or the electrode device contacting the skin surface can be rapidly reduced, even the state of making the skin feel comfortable is reached and maintained, and skin burn and anaphylactic reaction are avoided. The temperature is constant better through the temperature control system and the spiral NP semiconductor module, and the use comfort of a user is greatly improved, so that adverse reactions caused by long-time sticking of the electrode plates and/or the electrode devices are reduced, and better wearing comfort and better curative effect are realized.
The invention will be described in detail below with reference to the drawings in connection with embodiments.
Referring first to fig. 1 and 2, a schematic structural diagram of an active heat-dissipating electrode package in which an exemplary implementation according to the present disclosure may be used is schematically illustrated. The active heat dissipation electrode plates are usually used in pairs, electrodes of each active heat dissipation electrode plate respectively receive positive and negative voltages of a signal source, and electric fields are generated between different pairs of electrode plates and act on focus areas, but for simplicity and clarity, the structure and control of one active heat dissipation electrode plate are described as an example.
As shown in fig. 1 and 2, the present invention provides an active heat dissipation electrode sheet, including: a support member (1), a heat conducting member (2), at least one set of thermocouples (3) and an electrode (5); the supporting component (1) is arranged opposite to the heat conducting component (2); the support component (1) is used for arranging the thermocouple (3) and the electrode (5), the thermocouple (3) is also called as an NP semiconductor module, and the thermocouple (3) is arranged in an insulating way with the electrode (5); in one embodiment, the thermocouple (3) comprises an N-type semiconductor element and a P-type semiconductor element which are combined with each other, and the N-type semiconductor element and the P-type semiconductor element are electrically connected to form a group of thermocouples; in another embodiment, the thermocouple (3) comprises an N-type semiconductor element and a P-type semiconductor element which are separately arranged; the N-type semiconductor element and the P-type semiconductor element are electrically connected through a wire; wherein the N-type semiconductor element and the P-type semiconductor element are also referred to as an N-junction and a P-junction, and the individual N-junction or P-junction is also referred to as a set of thermocouples. In another embodiment, the copper plating layers on the support member (1) and the heat conductive member (2) for the electrical connection of the N-junction and the P-junction are also called wires, for example, the ferrous metal layers in the electrode sheets in fig. 3 to 5 are also called wires. The at least one group of thermocouples (3) is used for conducting the heat generated by the electrodes (5) to the heat conducting component (2); the heat conducting component (2) is used for conducting out heat. The plurality of NP semiconductor modules are arranged on the supporting part (1) in a spiral mode in series or in parallel, and in an alternative embodiment, the thermocouple comprises N-type semiconductor elements and P-type semiconductor elements, the N-type semiconductor elements and/or the P-type semiconductor elements are distributed between the supporting part (1) and the heat conducting part (2), and heat generated by the electrode (5) is conducted to the heat conducting part (2) through the N-type semiconductor elements and/or the P-type semiconductor elements. In an alternative embodiment, the thermocouple includes an N-type semiconductor element and a P-type semiconductor element bonded to each other. Four wires A, B, C and D are led out of the packaged electrode plate, the thermocouples (3) which are arranged in a spiral mode are respectively connected with the positive electrode and the negative electrode of the power supply through the wires A and the wires D, the electrodes (5) receive the output voltage of the signal source through the wires B, and the temperature control module (4) reports temperature data to the host through the wires C. In an embodiment, the temperature control module (4) may be in communication connection with the master control center through a wireless module, where the wireless module includes a bluetooth module, a WiFi module, a Zigbee module, a 3G module, a 4G module, a 5G module, and the invention is not limited thereto.
In an alternative embodiment, the present invention provides an active heat-dissipating electrode sheet, the active heat-dissipating electrode sheet further comprising a thermally conductive member; the thermocouple (3) is arranged between the supporting component (1) and the heat conducting component (2). Preferably, the supporting component (1) on the electrode plate is a ceramic supporting plate, has good dielectric property, and can also play a supporting role on the thermocouple (3) and the electrode (5). The heat conduction component (2) is a good conductor supporting sheet or a ceramic supporting sheet for heat transfer; the thermocouple (3) guides heat from the support member (1) or the electrode (5) to the heat conducting member (2), and the heat conducting member (2) radiates the heat into the air. Preferably, the supporting member (1) and the heat conducting member (2) have any shape such as a circular shape, a square shape, or the like. Preferably, the supporting member (1) and the heat conducting member (2) are sheet-shaped, block-shaped, or the like, and the supporting member (1) and the heat conducting member (2) may be realized by a supporting sheet.
In an alternative embodiment, the plurality of groups of thermocouples (3) are arranged between the supporting component (1) and the heat conducting component (2) in a spiral manner, namely, the supporting component (1) and the heat conducting component (2) are oppositely arranged; preferably, the thermocouples (3) which are arranged in a spiral way are arranged in a staggered way in sequence and are contacted and arranged on the supporting component (1) (or the supporting component) or the heat conducting component (2) (or the heat conducting component); the connection arrangement mode comprises a mode of pasting, welding, clamping or the like, and a person skilled in the art can adopt a connection mode known in the prior art to arrange a plurality of groups of thermocouples (3) between the supporting component (1) and the heat conducting component (2) in a spiral mode according to requirements. In an alternative embodiment, the invention provides an active heat dissipation electrode sheet, as shown in fig. 3, the electrode sheet further comprises an electrode (5), the electrode (5) is arranged on the surface of the supporting component (1) facing the heat conduction component (2) in a spiral manner, and the electrode (5) does not intersect or are tangential to the thermocouple (3) arranged in the spiral manner, i.e. no electrical connection or insulation exists between the electrode and the thermocouple.
Preferably, an electrode (5) is arranged between each circle of the plurality of thermocouples (3) in a spiral arrangement, namely, the electrode (5) is also arranged on the supporting component (1) of the electrode plate in a spiral mode, the electrode (5) and the thermocouples (3) in a spiral arrangement form a double-spiral arrangement, and the electrode (5) is not contacted with the thermocouples (3) so as to avoid short circuit between the electrode (5) and the thermocouples (3). According to the invention, through the structural design of double-helix distribution of the electrode and the thermocouple, better heat dissipation of the electrode is realized.
Preferably, the supporting member (1) is a ceramic supporting plate and is welded with the thermocouple (3); the electrode sheet transfers heat between the support member (1) and the heat conducting member (2) by means of the plurality of thermocouples (3).
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet comprising a plurality of groups of thermocouples (3); the thermocouple groups (3) are uniformly distributed on the surface of the supporting component (1). Preferably, the plurality of groups of thermocouples (3) are spirally arranged around the center of the supporting member (1). The outer end of the spiral mode is also called a start end, namely, one end far away from the temperature control module (4) in two ends of the spiral arrangement, and the inner end of the spiral mode is also called a tail end, and the tail end is positioned at the central part of the supporting part (1), namely, one end near to the temperature control module (4) in two ends of the spiral arrangement. Along the spiral arrangement direction, each thermocouple (3) is distributed with the next adjacent thermocouple (3) at equal intervals. Preferably, the temperature control module is a temperature control chip. In an alternative embodiment, each thermocouple (3) is distributed at unequal intervals from the adjacent next thermocouple (3), preferably from outside to inside along the spiral arrangement direction, and the thermocouple (3) is distributed gradually becoming dense or gradually becoming sparse. Preferably, the thermocouple (3) and the electrode (5) may be further arranged between the supporting member (1) and the heat conducting member in various patterns such as an arcuate pattern, an array pattern, etc., so long as the thermocouple is ensured to be capable of transferring heat on the electrode (5) side as much as possible and the electrode (5) does not cause a short circuit of the thermocouple.
In an embodiment, the direction from N to P node in the thermocouple (3) is the direction of the thermocouple (3). The thermocouples (3) which are spirally arranged are sequentially and reversely staggered from outside to inside (namely from the starting end to the tail end) along the spiral direction, and a plurality of groups of thermocouples (3) are sequentially connected in series to form a heat conducting unit. In one embodiment, the reverse staggering is: starting from the first thermocouple (3), the adjacent N nodes and the adjacent P nodes on the surface of the supporting component are electrically connected through conductors on the supporting component (1), and the adjacent P nodes and the adjacent N nodes on the surface of the heat conducting component are electrically connected through conductors on the heat conducting component (2), so that the thermocouples (3) are mutually connected in series. In an embodiment, a first thermocouple (3) at the start of the spiral arrangement is arranged on the supporting component (1), a wire A is electrically connected with one side of the first thermocouple (3) at the start of the spiral arrangement facing the supporting component, current flows through the first thermocouple (3) at the start of the spiral arrangement to one side of the first thermocouple (3) at the start of the spiral arrangement closest to the heat conducting component, one side of the first thermocouple (3) at the start of the spiral arrangement closest to the heat conducting component is electrically connected with one side of an adjacent next thermocouple (3) at the heat conducting component along the spiral arrangement direction through a conductor, current flows through the next thermocouple (3) at the side of the adjacent thermocouple (3) closest to the supporting component, one side of the adjacent thermocouple (3) closest to the supporting component is electrically connected with one side of an adjacent next thermocouple (3) at the support component along the spiral arrangement direction through a conductor, and so on until all thermocouples (3) are electrically connected with one side of the next thermocouple (3) closest to the heat conducting component through a conductor, and a wire P is electrically connected with a junction between adjacent wires (3) and a junction (P) in series connection respectively, and a junction (P) is realized. In another alternative embodiment, lead a is connected to the negative pole of the power supply and lead B is connected to the positive pole of the power supply. In another alternative embodiment, wire A is connected to the positive pole of the power supply and wire B is connected to the negative pole of the power supply.
In another preferred embodiment, the thermocouples (3) which are spirally arranged are sequentially arranged in the same direction, and a plurality of groups of heat conducting units are arranged on the supporting component (1) in parallel. Preferably, the thermocouples arranged in a spiral manner are sequentially arranged in the same direction, the first surfaces of the thermocouples are in contact with the supporting component, the first surfaces of the thermocouples are electrically connected with one pole of the power supply through wires, and the second surfaces of the thermocouples are electrically connected with the other pole of the power supply through wires. Preferably, the N-type semiconductor and the P-type semiconductor of the adjacent NP semiconductor modules are located at the same vertical position, and the portion of the NP semiconductor modules close to the support member is the N-type semiconductor, and the portion far away from the support member is the P-type semiconductor. Wires are arranged on the supporting component and the heat conducting component, so that N nodes of adjacent NP semiconductor modules along the spiral direction are electrically connected with the N nodes in sequence, P nodes of the adjacent NP semiconductor modules are electrically connected with the P nodes in sequence, and the NP semiconductor modules are connected in parallel through the wires.
More preferably, the connection relationship may be that the N node and the P node of the adjacent thermocouple (3) far from the supporting component (1) are electrically connected through the electrode on the heat conducting component (2), or may be that the N node of the adjacent thermocouple (3) far from the supporting component (1) is electrically connected through the electrode on the heat conducting component (2). The connection mode of the invention to the NP semiconductors can be series connection or parallel connection.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet, wherein a plurality of groups of thermocouples (3) form a spiral space; the electrode (5) is a spiral metal sheet arranged opposite to the spiral space; the electrode (5) is mounted on the support member (1) and is located in the spiral space; the electrode (5) is not in contact with the thermocouple (3). Preferably, the electrodes are arranged in a spiral manner on the surface of the support part facing the heat conducting part, and the electrodes do not intersect or are tangential to the thermocouples (3) arranged in a spiral manner, i.e. they are insulated or are not electrically connected to each other to avoid a short circuit.
In an alternative embodiment, the invention provides an active heat-dissipating electrode sheet on which the electrode (5) is adhered to the skin by the support member (1).
As shown in fig. 1, when a current passes through the thermocouple (3) (i.e., NP semiconductor module) according to the peltier effect, one of the junctions radiates heat and the other junction absorbs heat. When the current direction is from N to P, the temperature drops and absorbs heat; when the current direction is from P to N, the temperature rises and heat is dissipated. Thereby effecting transfer of heat from one side of the electrode sheet adjacent to the skin from that side to the other side of the electrode sheet.
In an optional embodiment, the electrode sheet is further integrated with a temperature acquisition module, which can acquire the temperature of the electrode sheet or the skin surface layer in real time, the temperature sensor module can acquire the temperature of the electrode (5) and/or the temperature of the electrode sheet and/or the temperature of the supporting component (1) and/or the temperature of the heat conducting component (2) and/or the temperature of the temperature control module and/or the temperature of the skin surface layer, and transmit the acquired temperature to the temperature control module (4), preferably, the temperature control module can record different modules and the corresponding temperatures thereof, or the temperature control module can calculate the real-time temperature of one electrode sheet according to the temperature of one or more electrode sheet assemblies and/or the temperature of the skin surface layer, and the temperature sensor module can acquire temperature data in real time and also can acquire temperature data according to a preset period or preset time. The temperature control module is arranged in the center of the electrode device, the temperature control module (4) is integrated with a control module and a temperature acquisition module, preferably, the control module is a controller, and the temperature acquisition module is a temperature acquisition sensor. The controller can realize temperature adjustment according to the temperature of the electrode (5) and/or the temperature of the electrode plate and/or the temperature of the supporting component (1) and/or the temperature of the heat conducting component (2) and/or the temperature of the temperature control module and/or the temperature of the skin surface layer, which are acquired by the temperature sensor, the temperature control module (4) controls the current passing through the thermocouple (3) according to the acquired temperature, so that the supporting component (1) or the electrode (5) is subjected to temperature adjustment, the skin is prevented from being burnt at high temperature, the skin allergy reaction is reduced, and the state that the skin feels comfortable is reached and kept. Preferably, the temperature control module can be implemented by a temperature control chip, and the temperature control module can control the thermocouple (3) (namely the NP semiconductor module or the NP module or the N node or the P node) to execute temperature adjustment according to the temperature acquired in real time and a preset program therein, and one surface close to the supporting part (1) is transmitted to the other surface contacting the outside, namely the surface close to the heat conducting part (2), so that the electrode (5) is attached to the head or the skin of a human body to realize active cooling, thereby reducing adverse reaction caused by long-time attaching of the electrode (5) and/or the electrode sheet, and realizing better wearing comfort and better treatment effect. The main control center can also control the voltage of the electrode plate, cut off or conduct according to the reported temperature data, the temperature sensor and the temperature control chip can be integrated into a whole or arranged separately, and the temperature sensor and the temperature control chip can be flexibly selected and arranged according to the prior art and the actual design requirement by a person skilled in the art.
Referring to fig. 2, there is shown a side view of the active heat dissipation electrode package provided by the present invention, from which it is known that the supporting member (1) and the heat conduction member (2) are disposed opposite to each other, and the plurality of thermocouples (3) are contact-connected between the supporting member (1) and the heat conduction member (2). The support component (1) and the heat conduction component (2) are oppositely arranged to form a packaging structure, and the thermocouple (3) and the electrode are wrapped in the packaging structure space.
In an alternative embodiment, as shown in fig. 3 and fig. 4, which are connection diagrams of components of an embodiment of an active heat dissipation electrode slice provided by the present invention, according to the embodiment shown in the fig. 3, the thermocouple (3), the temperature control module (4), the electrode (5) and the connection circuit form a closed loop, the NP semiconductor establishes a series connection relationship with the electrode on the supporting component (1) and the heat conducting component (2), and according to the principle of the peltier effect, when current flows from the P node to the N node, the temperature of the electrode (5) rises and releases heat, the heat of the electrode (5) can be actively transferred from one side contacting with the skin, namely, the side close to the supporting component (1), to the other side contacting with the outside, namely, the side close to the heat conducting component (2), so that the electrode (5) is attached to the head of a human body, thereby reducing adverse reactions caused by attaching the electrode (5) and/electrode slice for a long time, and realizing better wearing comfort and better therapeutic effects.
The invention part of the electrode slice realizes the improvement of the resin part at the back of the existing electrode slice, and the resin part of the existing electrode slice is replaced by the partial encapsulation of the refrigerating system, so the shape thickness of the electrode slice is not greatly changed, the temperature control of the electrode slice can be realized, the practicability is strong, and the expansibility is high.
Fig. 5 shows a schematic view of the structure of connection of each assembly in an embodiment of the present invention on the heat conducting member (2), a schematic view of the positions of the plurality of thermocouples (3) contacting and connected to the heat conducting member (2) when the supporting member (1) and the heat conducting member (2) are disposed opposite to each other, and a connection relationship between the wires on the heat conducting member (2) and the thermocouples (3) in a serial connection.
In an alternative embodiment, the support member (1) uses a dielectric ceramic; and/or the heat conductive member 2 uses a dielectric ceramic.
The dielectric ceramic can be KTN-potassium tantalate (KTa 1-xNbxO 3), PMNT (lead magnesium niobate-lead titanate) or the like, and the dielectric constants of the dielectric ceramic and the PMNT are more than 1000.
It is understood that other dielectric materials may be used for the supporting member (1) and the heat conducting member (2);
it will be appreciated that the thermally conductive member (2) is formed from a highly thermally conductive dielectric material, such as a highly thermally conductive dielectric ceramic.
In an alternative embodiment, the present invention provides an electrode device for controlling an active heat dissipating electrode sheet, comprising:
the active heat dissipation electrode slice is the active heat dissipation electrode slice according to any embodiment of the invention;
the signal source is connected with the electrode (5) of the active heat-radiating electrode slice and provides a voltage signal for the electrode (5); the method comprises the steps of,
and the power supply is electrically connected with part or all of the thermocouples (3). The power supply module is electrically connected with at least one thermocouple (3) and is used for supplying power to the thermocouples (3). The power supply is electrically connected with part of the thermocouples (3), wherein the thermocouples (3) which are far away from the temperature control module (4) and are positioned at the starting ends of the spiral arrangement on the electrode plates are electrically connected with the power supply module, and the thermocouples (3) which are close to the temperature control module (4) and are positioned at the tail ends of the spiral arrangement are electrically connected with the power supply module. The power supply is electrically connected with all the thermocouples (3), wherein one side, close to the supporting component, of each thermocouple (3) is electrically connected with one pole of the power supply through a wire, and one side, close to the heat conducting component, of each thermocouple (3) is electrically connected with the other pole of the power supply through a wire. In an alternative embodiment, the invention provides a device for controlling an active heat dissipation electrode slice, the device further comprises a host, the host is electrically connected with a temperature control module (4) of the electrode slice, and the temperature control module (4) is the temperature control module (4) of the active heat dissipation electrode slice in any embodiment of the invention. As shown IN fig. 6, fig. 6 shows a circuit structure of a temperature control module (4) IN an active heat dissipation electrode (5), wherein U1 is a temperature control chip for automatically adjusting temperature control, a target temperature is acquired through an R6 position, the target temperature is set through a 24 pin (IN 2P) of U1, the temperature of the chip is adjusted according to a set stable driving refrigeration heating couple group, and the chip is balanced after reaching the target temperature.
In an alternative embodiment, the invention provides a device for controlling an active heat-dissipating electrode sheet, the device further comprising a signal source connected to an electrode (5) of the active heat-dissipating electrode sheet. As shown in fig. 7, the active heat dissipation electrode device according to the present invention comprises a logic block diagram for realizing the functions of the active heat dissipation electrode device, wherein a host, a signal source and a power supply form a main control center, a temperature sensor collects the temperature of the skin surface layer, and then transmits the collected temperature data to a temperature control chip, the temperature control chip reports the temperature data to the main control center, and the temperature control chip can control the current direction and the magnitude of a thermocouple (3) to absorb or release heat, so that the temperature of the skin surface layer is reduced or increased, the skin is not burned, and even the comfortable state of the skin is reached and maintained. In another embodiment, the combination of one or more of the host computer, the signal source and the power supply constitutes a main control center, the temperature sensor collects the temperature of the skin surface layer, then the collected temperature data is transmitted to the temperature control chip, the temperature control chip is in communication connection with the main control center, the temperature control chip reports the temperature data to the main control center, the host computer in the main control center directly controls the current direction and the size of the thermocouple (3) through the power supply or indirectly controls the current direction and the size of the thermocouple (3) through the temperature control chip, absorbs or emits heat, so that the temperature of the skin surface layer is reduced or increased, the skin is not burned, and even the state that the skin feels comfortable is reached and kept, so that the temperature regulation of the temperature control module (4) according to the collected temperature is realized.
According to the integrated temperature control system of the active heat dissipation electrode device, when the temperature sensor on the electrode plate detects that the temperature of the surface layer of the scalp rises, the refrigeration function is started, heat is taken away, the temperature is closed after the temperature is reduced, the constant temperature is realized through an integrated algorithm, and the use comfort of a user is greatly improved.
Meanwhile, the temperature of the electrode sheet attached to the epidermis is controllable, and the problems that the electrode sheet and/or the electrode device are attached to the epidermis and are not firmly attached or even fall off due to sweating of the scalp with overhigh temperature are solved.
In addition, the temperature control chip can report the acquired temperature data sent by the temperature sensor to a main control center (or a host), the host also comprises a signal generator, and an electric field generated by the signal generator in the host acts on the electrode (5), so that the electrode (5) heats to improve the temperature of the skin surface layer, and discomfort in the wearing process is relieved.
The target temperature for the temperature adjustment is close to the body temperature of the human body, and the threshold value is preferably 36-38 degrees celsius, more preferably 37 degrees celsius.
In an alternative embodiment, the electrode device for controlling the active heat dissipation electrode piece further comprises a signal generating device, and the signal generating device is electrically connected with the active heat dissipation electrode pieces; in one embodiment, the signal generating device is electrically connected with at least two active heat dissipation electrode plates; the signal generating device generates an alternating electric field; the two active heat radiation electrode plates are respectively connected with two output ends of the signal generating device; and the signal generating device sends out alternating electric fields to the two active heat dissipation electrode plates. Further, the two active heat-dissipation electrode plates form an electrode plate pair, the electrode plate pair is attached to two corresponding positions of a human body, an alternating electric field is formed between the two active heat-dissipation electrode plates, and the alternating electric field penetrates through tumor tissues in the human body to influence the tumor tissues and prevent the growth of the tumor tissues.
In an alternative embodiment, a plurality of the active heat dissipation electrode plates are connected with the non-woven fabric, and the active heat dissipation electrode plates are arranged on the non-woven fabric in an array manner to form an electrode array; two output ends of the signal generating device can be respectively and electrically connected with a group of electrode arrays, and alternating signals are output to the electrode arrays; the two electrode arrays are respectively attached to a first position and a second position of a human body, and the first position and the second position are two opposite positions on the human body; an alternating electric field is formed between the two electrode arrays; the alternating electric field passes through tumor tissue inside the human body to affect the tumor tissue and prevent the tumor tissue from growing.
In the description of the present specification, reference to the terms "some possible embodiments," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. When the term "part or all" is used to modify an object, part of the term means that one, two, three, or any number of various embodiments of the object can be selected, and therefore, part can also be replaced with "at least one" to all refer to the case where all the object is selected, and any of the foregoing cases can partially or fully solve the technical problem of the present application. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
With respect to the method flow diagrams of embodiments of the application, certain operations are described as distinct steps performed in a certain order. Such a flowchart is illustrative and not limiting. Some steps described herein may be grouped together and performed in a single operation, may be partitioned into multiple sub-steps, and may be performed in an order different than that shown herein. The various steps illustrated in the flowcharts may be implemented in any manner by any circuit structure and/or tangible mechanism (e.g., by software running on a computer device, hardware (e.g., processor or chip implemented logic functions), etc., and/or any combination thereof).
The embodiments of the present application are described in a progressive manner, and the same and similar parts of the embodiments are all referred to each other, and each embodiment is mainly described in the differences from the other embodiments. In particular, for apparatus, devices and/or computer readable storage medium embodiments, the description thereof is simplified as it is substantially similar to method embodiments, as relevant may be found in part in the description of method embodiments.
While the spirit and principles of the present invention have been described with reference to several particular embodiments, it is to be understood that the invention is not limited to the specific embodiments disclosed nor does it imply that features in the various aspects are not useful in combination, nor are they intended to be useful in any way, such as for convenience of description. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (11)
1. An active heat dissipation electrode sheet, comprising:
a support member (1), a heat conducting member (2), at least one set of thermocouples (3) and an electrode (5);
the supporting component (1) is arranged opposite to the heat conducting component (2);
the support component (1) is used for arranging the thermocouple (3) and the electrode (5), and the thermocouple (3) is arranged in an insulating way with the electrode (5);
the active heat-dissipation electrode plate comprises a plurality of groups of thermocouples (3); the thermocouples (3) are uniformly distributed on the supporting component (1), wherein the thermocouples (3) are spirally distributed by taking the central part of the supporting component (1) as the center;
a plurality of groups of thermocouples (3) which are spirally arranged and distributed form a spiral space; the electrode (5) is a spiral metal sheet arranged opposite to the spiral space; the electrode (5) is mounted on the support member (1) and is located in the spiral space;
The at least one group of thermocouples (3) is used for conducting the heat generated by the electrodes (5) to the heat conducting component (2);
the heat conducting component (2) is used for conducting out heat.
2. Active heat-dissipating electrode sheet according to claim 1, characterized in that the thermocouple (3) comprises an N-type semiconductor element and a P-type semiconductor element combined with each other; the N-type semiconductor element is electrically connected with the P-type semiconductor element.
3. The active heat-dissipating electrode sheet of any of claims 1-2, wherein: at least one temperature sensor module is arranged on the electrode plate, the temperature sensor module collects the temperature of the electrode (5) and/or the temperature of the supporting component (1) and/or the temperature of the heat conducting component (2) and/or the temperature of the temperature control module (4) or the combination of any one or more temperatures, the collected temperature or the combination of the temperatures is sent to the temperature control module (4), and the temperature control module (4) carries out temperature regulation according to the collected temperature.
4. The active heat-dissipating electrode sheet of any of claims 1-2, wherein,
the thermocouples (3) which are spirally arranged are sequentially and reversely staggered, and the thermocouples (3) are mutually connected in series.
5. Active heat-dissipating electrode sheet according to claim 4, characterized in that the support member (1) is a support sheet and the heat-conducting member (2) is a heat-conducting sheet.
6. The active heat-dissipating electrode sheet of claim 5 wherein,
the supporting component (1) is a ceramic supporting plate, and the heat conducting component (2) is a good conductor supporting plate or a ceramic supporting plate for heat transfer.
7. Active heat-dissipating electrode sheet according to claim 6, characterized in that the electrode (5) is adhered to the skin by the support member (1).
8. The active heat-dissipating electrode sheet of claim 4 wherein,
the support member (1) uses a dielectric ceramic; and/or the number of the groups of groups,
the heat conductive member (2) uses a dielectric ceramic.
9. An electrode device for controlling an active heat dissipating electrode sheet, comprising:
an active heat-dissipating electrode sheet according to any one of claims 1 to 8;
the host is electrically connected with the temperature control module (4) of the electrode plate;
a signal source connected to the electrode (5); the method comprises the steps of,
and the power supply is electrically connected with part or all of the thermocouples (3).
10. The electrode assembly for controlling an active heat dissipating electrode sheet of claim 9,
thermocouples (3) positioned at the outer ends of the spiral arrangement and the central ends of the spiral arrangement are respectively and electrically connected with the power supply.
11. The electrode assembly for controlling an active heat dissipating electrode sheet of claim 9,
the N-type semiconductor element or the P-type semiconductor element of each thermocouple (3) is electrically connected with one pole of the power supply, and the P-type semiconductor element or the N-type semiconductor element of each thermocouple (3) is electrically connected with the other pole of the power supply.
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