CN116008767A - Non-contact characteristic item testing equipment and method for semiconductor photoelectric device - Google Patents

Abstract

The invention discloses a non-contact characteristic item testing device and a non-contact characteristic item testing method for a semiconductor photoelectric device, wherein the non-contact characteristic item testing device comprises a plurality of testing areas for parallel testing, each testing area comprises a plurality of testing devices and a plurality of shorting devices, each shorting device comprises an insulated clamp and an inductance coil which is fixed below the clamp and is connected with the clamp in an insulating way, a conductor is fixed in the clamp, the inductance coils of the shorting devices are connected in series and connected with a pulse power supply to form a first closed loop, a piece to be tested is clamped in the clamp, an electrode of the piece to be tested is contacted with the conductor to form a second closed loop, and the luminous surface of the piece to be tested faces the light receiving direction of the testing device; the invention has the advantages that: the device has simple structure and low cost, and a plurality of test areas can be tested in parallel, so that the test efficiency is greatly improved.

Description

Non-contact characteristic item testing equipment and method for semiconductor photoelectric device

Technical Field

The invention relates to the field of integrated circuit testing, in particular to non-contact characteristic item testing equipment and method for a semiconductor photoelectric device.

Background

The semiconductor photoelectric device refers to a novel semiconductor device which relates two physical quantities of light and electricity and converts the light and the electricity into each other. A semiconductor laser is one of semiconductor optoelectronic devices, and the semiconductor optoelectronic device will be described in detail by taking the semiconductor laser as an example. The semiconductor laser has the characteristics of small volume, light weight, high efficiency, wide band range, long service life, low price and the like, which are incomparable with other lasers. These characteristics of semiconductor lasers make it widely used in various fields such as communication, soldering, ranging, printing, scanning, illumination, medical treatment, monitoring, and the like.

The criteria for evaluating the performance of a semiconductor laser are determined by the values of its individual characteristic parameters. The characteristic parameters of the semiconductor laser include both optical characteristics and electrical characteristics. Optical characteristics such as laser wavelength, laser spectral linewidth, far-field and near-field distribution of the laser, etc. Electrical characteristics such as lasing threshold current, current density, laser V-I characteristics, series resistance, differential resistance, power efficiency, external quantum efficiency, etc. of the laser. Before the semiconductor laser is used, a user needs to know and examine various parameters of the semiconductor laser so as to ensure that the semiconductor laser can achieve a good effect in the use process.

For the research of semiconductor laser parameter testing systems, newport corporation, keithley corporation, ilxlight wave corporation and Telops corporation in canada in the united states all have related testing systems, and the main characteristics of the system are that the system adopts a modularized design, and an automatic or semi-automatic test, which has high intelligent degree and high precision, but expensive testing equipment.

Meanwhile, the characteristic test of the semiconductor laser is mainly in a contact mode, and the core content of the method is that a laser driver is used for conducting related parameter tests through contact and energization of a probe and a semiconductor laser electrode. The non-contact test method has been proposed to be widely applied to testing related devices such as LEDs, and the devices to be tested can be electrified through an inductance effect, so that the device and the method for non-contact photoelectric detection of an LED chip are more efficient and convenient, for example, a device and a method for non-contact photoelectric detection of an LED chip are disclosed in chinese patent publication No. CN112858864a, but the test method disclosed in the patent application can only test a single device to be tested, and cannot test a plurality of devices to be tested in parallel for different test items, so that the test efficiency is low.

Disclosure of Invention

The invention aims to solve the technical problems of high cost and low test efficiency of the semiconductor photoelectric device test equipment in the prior art.

The invention solves the technical problems by the following technical means: the utility model provides a semiconductor photoelectric device non-contact characteristic divides item test equipment, includes the test area of a plurality of parallel tests, every the test area includes a plurality of testing arrangement and a plurality of shorting device, shorting device includes insulating anchor clamps and fixes the inductor that is connected with it insulation below the anchor clamps, and the anchor clamps internal fixation has the electric conductor, and the inductor of a plurality of shorting devices establishes ties and is connected with pulse power source and form first closed circuit, awaits measuring the piece joint to in the anchor clamps and its electrode and electric conductor contact form the second closed circuit, and the light emitting area of awaiting measuring the piece is just to test device's light receiving direction.

The beneficial effects are that: the testing device provided by the invention has the advantages that the structure is simple, the cost is low, the inductance effect is generated between the second closed loop and the inductance coil in the first closed loop, the excitation current lights the to-be-tested piece, the non-contact test is realized, a plurality of parallel test areas are arranged, the test areas comprise a plurality of testing devices and a plurality of short-circuit devices, each testing area can test a plurality of to-be-tested pieces, and a plurality of testing areas can be tested in parallel, so that the testing efficiency is greatly improved.

Further, the non-contact characteristic item testing equipment for the semiconductor photoelectric device further comprises a transferring mechanism for transferring the to-be-tested piece to the testing area, the transferring mechanism comprises a conveying belt and a plurality of mechanical arms, the testing areas of the parallel tests are located on the same side of the conveying belt, and the mechanical arms are located on the other side of the conveying belt opposite to the testing areas respectively.

Furthermore, a feeding area and a discharging area are arranged on the conveyor belt, the to-be-measured piece is uploaded to the conveyor belt from the feeding area, the to-be-measured piece is placed in the clamp by the mechanical arm after being conveyed to the position of the to-be-measured area, and the to-be-measured piece is taken down by the mechanical arm and placed back onto the conveyor belt after the test is completed, and the to-be-measured piece is conveyed to the discharging area by the conveyor belt.

Further, the test area comprises a rotary table rotating at a preset speed along the axial direction during test and a ring which is concentric with the rotary table and is fixed, wherein a plurality of test devices are fixed on the edge of the rotary table, and a plurality of short-circuit devices are fixed on the ring.

Furthermore, the light emitting surface of the to-be-tested piece points to the circle center along the diameter direction of the circular ring and corresponds to the light receiving direction of the testing device.

Further, the clamp is provided with a groove with the same outer diameter as the to-be-detected piece, the inner wall of one side opposite to the notch of the groove is fixedly connected with the conductor, the side of the electrode of the to-be-detected piece faces the groove, the to-be-detected piece is clamped into the groove, and the electrode of the to-be-detected piece contacts with the conductor.

Further, the to-be-measured piece is one of a semiconductor laser, an LED chip, a light pipe, a photocell, a photodiode and a phototransistor.

The invention also provides a method for the non-contact characteristic item testing equipment of the semiconductor photoelectric device, wherein the inductance coil in the second closed loop and the inductance coil in the first closed loop generate a mutual inductance effect, the excitation current lights the piece to be tested, the emitted light of the piece to be tested is detected by the testing device so as to carry out optical testing on the piece to be tested, and the testing device stores the optical parameters of the piece to be tested after the testing is completed.

Further, the number calculation process of the to-be-tested pieces in the test areas of the parallel tests is as follows:

setting the test time corresponding to the test item i as Ti, wherein the test time corresponding to all the test items is respectively T1, T2, T3, T4, T5, … … and Tn, and T1 is more than or equal to T2 and less than or equal to T3 and less than or equal to T4 and less than or equal to T5 and less than or equal to … …; expanding all test times to be integers according to the power number of 10, namely expanding T1, T2, T3, T4, T5, … … and Tn to be T1', T2', T3', T4', T5', … … and Tn', wherein T1', T2', T3', T4', T5', … … and Tn' are integers; and calculating the least common multiple of the sequences T1', T2', T3', T4', T5', … … and Tn', and marking as Q, wherein the value Q is the number of the to-be-tested pieces tested in one-time parallel test.

Still further, the test area includes the carousel of rotating with preset speed along the axial during the test and with the concentric setting of carousel and stationary ring, a plurality of testing arrangement of edge-fixed of carousel, fixed a plurality of shorting devices on the ring, testing arrangement's quantity calculation process is:

the greatest common divisor of the sequences T1', T2', T3', T4', T5', … …, tn ' is calculated and denoted as P, dividing the sequences T1', T2', T3', T4', T5', … … and Tn ' by P, respectively, to obtain sequences T1', T2', T3', T4", T5", … …, tn "; the number Mi of the testing devices on the turntable corresponding to the test item i is as follows: mi=Ti ";

the time taken for each test zone to complete the testing of Q devices under test is t=q× (Ti/Mi), and it is apparent that the time taken for each test zone to complete the testing of Q devices under test is equal.

The invention has the advantages that:

(1) The testing device provided by the invention has the advantages that the structure is simple, the cost is low, the inductance effect is generated between the second closed loop and the inductance coil in the first closed loop, the excitation current lights the to-be-tested piece, the non-contact test is realized, a plurality of parallel test areas are arranged, the test areas comprise a plurality of testing devices and a plurality of short-circuit devices, each testing area can test a plurality of to-be-tested pieces, and a plurality of testing areas can be tested in parallel, so that the testing efficiency is greatly improved.

(2) In the actual test, the actual test time of each test item is equal to the test time of the longest test item, namely the actual test time of each test item is influenced by the longest condition, and in order to avoid the influence, the invention calculates the number of the to-be-tested pieces in the test areas and the number of the test devices through a plurality of parallel tests, thereby placing different numbers of the test devices on the corresponding turntable according to the test time of each test item, circularly testing the same number of the to-be-tested pieces, achieving the consistent average test time of each test item, reducing or even eliminating the waiting time among different test items in the parallel test process, and realizing the parallel and simultaneous detection of different test items.

Drawings

Fig. 1 is a schematic structural diagram of a non-contact characteristic component testing apparatus for a semiconductor photoelectric device according to embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of a fixture in a non-contact characteristic component testing apparatus for a semiconductor optoelectronic device according to embodiment 1 of the present invention.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Example 1

As shown in fig. 1, a non-contact characteristic item testing apparatus for semiconductor photoelectric devices includes a plurality of test areas 10 for parallel testing and a transfer mechanism 20 for transferring a part 30 to be tested to the test areas 10. The part 30 to be measured is one of a semiconductor laser, an LED chip, a light pipe, a photocell, a photodiode, and a phototransistor.

With continued reference to fig. 1, each of the test areas 10 includes a turntable 101 rotating at a preset speed along an axial direction during testing, and a ring 102 concentric with the turntable 101 and fixed, wherein a plurality of test devices 103 are fixed on an edge of the turntable 101, and a plurality of shorting devices 104 are fixed on the ring 102. Referring to fig. 2, the shorting device 104 includes an insulating fixture 1041, the fixture 1041 is provided with a groove having the same outer diameter as the to-be-tested piece 30, an inner wall of one side opposite to the notch of the groove is fixedly connected with a conductive body 1042, the side of the electrode 301 of the to-be-tested piece 30 faces the groove, the to-be-tested piece 30 is clamped into the groove and the electrode 301 contacts with the conductive body 1042, and the conductive body 1042 is a metal strip or other conductive structures. An insulating tube 1043 is fixedly connected below the clamp 1041, and an inductance coil 1044 is arranged in the insulating tube 1043. The inductance coils 1044 of the shorting devices 104 are connected in series and connected with a pulse power source to form a first closed loop, the to-be-tested piece 30 is clamped into the clamp 1041, and the electrode 301 of the to-be-tested piece contacts the conductor 1042 to form a second closed loop, and the light emitting surface of the to-be-tested piece 30 points to the circle center along the diameter direction of the circular ring 102 and corresponds to the light receiving direction of the testing device 103. The inductance coil 1044 in the second closed loop and the first closed loop generates a mutual inductance effect, excites current, lights the to-be-measured member 30, and light emitted by the to-be-measured member 30 is detected by the testing device 103 so as to perform optical testing on the to-be-measured member 30, and after the testing is completed, the testing device 103 stores optical parameters of the to-be-measured member 30.

With continued reference to fig. 1, the transfer mechanism 20 includes a conveyor belt 201 and a plurality of mechanical arms 202, where the conveyor belt 201 is connected by four segments to form a rectangular structure, and is transported in a clockwise direction. The multiple test areas 10 for parallel testing are located on the same side of the conveyor belt 201, and multiple mechanical arms 202 are respectively located on the other side of the conveyor belt 201 opposite to the test areas 10. The conveyor belt 201 is provided with a feeding area 2011 and a discharging area 2012, the to-be-measured piece 30 is uploaded to the conveyor belt 201 from the feeding area 2011, the mechanical arm 202 places the to-be-measured piece 30 into the clamp 1041 after the to-be-measured piece 30 is conveyed to the position of the to-be-measured area, after the test is completed, the mechanical arm 202 takes the to-be-measured piece 30 back to the conveyor belt 201, and the conveyor belt 201 conveys the to-be-measured piece 30 to the discharging area 2012.

The working process of the invention is as follows:

after the test device 103 runs, the conveyor belt 201 runs at a fixed speed, one side of the conveyor belt 201 is sequentially provided with a test area i (i=1, 2 and 3 … …, the test area i is composed of a turntable 101, a fixed concentric circular ring 102, mi test devices 103 positioned on the periphery of the turntable 101 and Q short-circuiting devices 104 positioned on the circular ring 102, the test devices 103 run simultaneously and rotate along with the turntable 101 at a corresponding speed, the light receiving direction of the test devices 103 points to the circular ring 102 along the diameter of the turntable 101, the Q short-circuiting devices 104 on each circular ring 102 are connected in series and connected with a pulse power supply to form a first closed loop, when the laser runs near the test area 101, a mechanical arm grabs Q lasers and respectively places the Q lasers on the corresponding short-circuiting devices 104, as shown in FIG. 2, the lasers are horizontally clamped into a laser fixture 1041, the 2 electrodes 301 are contacted with the metal strip of the shorting device 104 to form a second closed loop, and generate a mutual inductance effect with the inductance coil 1044 in the first closed loop, so as to excite current, light the laser, the light emitting surface of the laser points to the center of a circle along the diameter direction of the circular ring 102 and corresponds to the light receiving direction of the testing device 103, each turntable 101 is static in different testing time according to the test items, the test is finished and then rotates to the next test point, the test of Q lasers is completed in sequence, the mechanical arm 202 grabs the Q lasers completing the test item 1 and returns to the conveyor belt 201, and meanwhile, the test area 10 completing the previous round of test continuously receives the next batch of lasers to be tested conveyed on the conveyor belt 201 to perform a new round of test.

Example 2

Based on the test equipment provided in the embodiment 1, the invention also provides a method for the non-contact characteristic item test equipment of the semiconductor photoelectric device. The inductance coil 1044 in the second closed loop and the first closed loop generate a mutual inductance effect, the exciting current lights the to-be-tested piece 30, the emitted light of the to-be-tested piece 30 is detected by the testing device 103, so that the to-be-tested piece 30 is optically tested, and the testing device 103 stores the optical parameters of the to-be-tested piece 30 after the testing is completed. In actual test, the actual test time of each test item is equal to the test time of the longest test item because the test time of different test items is different, i.e. the actual test time of each test item is influenced by the longest condition. Thus, there is a need for improvements in the above methods.

In order to meet the requirements that each laser meets the corresponding optimal test time in different test items and maintain the continuity of the whole test system, the invention sorts the test items according to the test time, arranges the test items with short test time in front and the test items with long test time in back, and sets the test time corresponding to the test items as T1, T2, T3, T4, T5, … … and Tn respectively, wherein T1 is more than or equal to T2 and less than or equal to T3 and less than or equal to T4 and T5 is more than or equal to … … and less than or equal to Tn.

In actual testing, the conveyor belt 201 conveys the semiconductor lasers to the vicinity of the test items to be tested, and then the mechanical arms 202 place the lasers in the corresponding shorting devices 104, and the process is the placement time of the lasers, so that the placement time can be optimized according to the number of lasers to be placed and the number of the configuration mechanical arms 202.

The basic idea of the above is to achieve the goal that the test time of a single test item is equal to the product of the parallel test numbers by increasing the parallel test numbers of the test items with long test time. The following describes in detail how this goal is achieved by counting the number of pieces 30 to be tested and the number of test devices 103.

The number calculation process of the to-be-tested pieces 30 in the test areas 10 for the plurality of parallel tests is as follows:

setting the test time corresponding to the test item i as Ti, wherein the test time corresponding to all the test items is respectively T1, T2, T3, T4, T5, … … and Tn, and T1 is more than or equal to T2 and less than or equal to T3 and less than or equal to T4 and less than or equal to T5 and less than or equal to … …; all test times are expanded to integers by powers of 10, i.e., T1, T2, T3, T4, T5, … …, tn are expanded to T1', T2', T3', T4', T5', … …, tn', and T1', T2', T3', T4', T5', … …, tn' are integers, such as expanding test time sequences 0.1, 0.2, 0.3 to 1, 2, 3. The least common multiple of the sequences T1', T2', T3', T4', T5', … …, tn' is calculated and is denoted as Q, and the value Q is the number of the to-be-tested pieces 30 tested in one-time parallel test.

The number calculation process of the test device 103 is as follows:

the greatest common divisor of the sequences T1', T2', T3', T4', T5', … …, tn ' is calculated and denoted as P, dividing the sequences T1', T2', T3', T4', T5', … … and Tn ' by P, respectively, to obtain sequences T1', T2', T3', T4", T5", … …, tn "; the number Mi of the test devices 103 on the turntable 101 corresponding to the test item i is: mi=Ti. Obviously Mi must be an integer. The time taken for each test zone to complete the testing of Q devices under test is t=q× (Ti/Mi), and it is apparent that the time taken for each test zone to complete the testing of Q devices under test is equal. In actual testing, if the number of test devices 103 on a single turntable 101 is too large, the control system is too complex, and the single turntable 101 can be equally split into multiple turntables 101 for processing.

The above method will be described below with specific examples assuming that the laser test system is composed of 3 test items, the test time of test item 1 is 0.1ms, the test time of test item 2 is 0.2ms, and the test time of test item 3 is 0.3ms.

First, the test time sequences 0.1, 0.2 and 0.3 are expanded to 1, 2 and 3, the least common multiple is calculated to obtain Q=6, and the greatest common divisor P=1. Namely, 6 lasers can be tested at a time, 6 laser shorting devices 104 are uniformly arranged on concentric rings of each test area 10, the number of the test devices 103 on the turntable 101 of the test item 1 is 1, the test devices 103 test the to-be-tested piece 30 at the current position of the to-be-tested piece 30, and after the test is completed, the turntable 101 rotates to switch the to-be-tested piece 30 to the next position, so that the test is completed in 6 times; the number of the test devices 103 on the turntable 101 of the test item 2 is 2, the two pieces 30 to be tested can be tested simultaneously by working at the same time, and after the test is finished, the turntable 101 rotates to test the next two pieces 30 to be tested, so that the test is finished in 3 times; test item 3 the number of test devices 103 on the turntable 101 is 3, and each work can test three pieces 30 to be tested, after the test is completed, the turntable 101 rotates to test the next three pieces 30 to be tested, so that the test is completed in 2 times. In summary, the test time for a batch of 6 lasers to complete each test item is the same, and theoretically, there is no waiting time between different test items.

Through the technical scheme, the invention provides a device and a method for carrying out non-contact characteristic item parallel test on a semiconductor laser, and the semiconductor laser is driven through the mutual inductance effect so as to carry out non-contact characteristic test on the laser; the system design makes the test time of each test item (the number of single test lasers/the number of test devices 103) equal, and reduces or even eliminates the waiting time of the parallel test of the sub-items. The greatest advantage of the testing device 103 is that the sub-item testing device 103 is designed based on a non-contact principle, and an optimized testing method ensures that each testing item can be completed within the respective optimal testing time, so that the influence of the testing time is eliminated, and the testing efficiency is improved.

The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The utility model provides a semiconductor photoelectric device non-contact characteristic divides item test equipment, its characterized in that includes the test area of a plurality of parallel tests, every the test area includes a plurality of testing arrangement and a plurality of shorting device, shorting device includes insulating anchor clamps and fixes the inductor that is connected with it insulation below the anchor clamps, the anchor clamps internal fixation has the electric conductor, a plurality of shorting device's inductor establish ties and form first closed circuit with pulse power connection, the piece joint that awaits measuring in the anchor clamps and its electrode and electric conductor contact form the second closed circuit, the luminous surface of piece that awaits measuring just faces testing arrangement's light receiving direction.

2. The apparatus according to claim 1, further comprising a transfer mechanism for transferring the part to be tested to the test area, wherein the transfer mechanism comprises a conveyor belt and a plurality of mechanical arms, the plurality of parallel test areas are located on the same side of the conveyor belt, and the plurality of mechanical arms are located on the other side of the conveyor belt opposite to the test areas.

3. The device for testing the non-contact characteristic of the semiconductor photoelectric device according to claim 2, wherein the conveyor belt is provided with a feeding area and a discharging area, the piece to be tested is uploaded to the conveyor belt from the feeding area, the mechanical arm places the piece to be tested in the clamp after the piece to be tested is conveyed to the position where the area to be tested is located, the mechanical arm takes the piece to be tested back to the conveyor belt after the test is completed, and the conveyor belt conveys the piece to be tested to the discharging area.

4. The device for testing the non-contact characteristic of the semiconductor photoelectric device according to claim 1, wherein the testing area comprises a rotary table rotating at a preset speed along the axial direction during testing and a circular ring which is concentric with the rotary table and is fixed, a plurality of testing devices are fixed on the edge of the rotary table, and a plurality of shorting devices are fixed on the circular ring.

5. The non-contact characteristic item testing device for semiconductor optoelectronic devices according to claim 4, wherein the light emitting surface of the part to be tested is directed to the center of a circle along the diameter direction of the circular ring, corresponding to the light receiving direction of the testing device.

6. The device for testing the non-contact characteristic of the semiconductor photoelectric device according to claim 1, wherein the clamp is provided with a groove with the same outer diameter as the to-be-tested piece, the inner wall of one side opposite to the notch of the groove is fixedly connected with the conductor, the electrode of the to-be-tested piece is located towards the groove, the to-be-tested piece is clamped into the groove, and the electrode of the to-be-tested piece is in contact with the conductor.

7. The apparatus according to claim 1, wherein the device under test is one of a semiconductor laser, an LED chip, a light pipe, a photocell, a photodiode, and a phototransistor.

8. The method of claim 1-7, wherein the second closed loop and the inductor coil in the first closed loop generate mutual inductance effect, the exciting current lights the part to be tested, the emitted light of the part to be tested is detected by the testing device so as to perform optical testing on the part to be tested, and the testing device stores the optical parameters of the part to be tested after the testing is completed.

9. The method of claim 8, wherein the number of the to-be-tested pieces in the test areas of the plurality of parallel tests is calculated by:

setting the test time corresponding to the test item i as Ti, wherein the test time corresponding to all the test items is respectively T1, T2, T3, T4, T5, … … and Tn, and T1 is more than or equal to T2 and less than or equal to T3 and less than or equal to T4 and less than or equal to T5 and less than or equal to … …; expanding all test times to be integers according to the power number of 10, namely expanding T1, T2, T3, T4, T5, … … and Tn to be T1', T2', T3', T4', T5', … … and Tn', wherein T1', T2', T3', T4', T5', … … and Tn' are integers; and calculating the least common multiple of the sequences T1', T2', T3', T4', T5', … … and Tn', and marking as Q, wherein the value Q is the number of the to-be-tested pieces tested in one-time parallel test.

10. The method of claim 9, wherein the test area comprises a turntable rotating at a preset speed along an axial direction during test and a ring which is concentric with the turntable and is fixed, a plurality of test devices are fixed on the edge of the turntable, a plurality of short-circuit devices are fixed on the ring, and the number of the test devices is calculated as follows:

the greatest common divisor of the sequences T1', T2', T3', T4', T5', … …, tn ' is calculated and denoted as P, dividing the sequences T1', T2', T3', T4', T5', … … and Tn ' by P, respectively, to obtain sequences T1', T2', T3', T4", T5", … …, tn "; the number Mi of the testing devices on the turntable corresponding to the test item i is as follows: mi=Ti ";

the time taken for each test area to complete the testing of Q devices under test is t=q× (Ti/Mi), and the time taken for each test area to complete the testing of Q devices under test is equal.

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