TWI682187B - Carrier device capable of detecting light-emitting element - Google Patents
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Abstract
本發明提供一種可檢測發光元件之載具裝置,其係設置互相平行之第一、第二側凹槽載具,每一凹槽載具中設有至少一電性迴路及複數凹槽,並在凹槽內設置分別與該電性迴路對應連接之極性接口;將複數發光元件放置於凹槽中,並與任一側凹槽載具中之極性接口電性連接,當供電模組提供之電力透過電性迴路輸送到極性接口,便可點亮凹槽中之發光元件。由於第一、第二側凹槽載具上下相接,且凹槽的位置互相對應,因此當發光元件鋪設於凹槽載具上時,不論發光元件的電性接點是朝上或朝下,皆可與任一側的極性接口導通,減少擺放發光元件的時間並提高檢測的效率。The invention provides a carrier device capable of detecting a light-emitting element, which is provided with first and second side groove carriers parallel to each other, each groove carrier is provided with at least one electrical circuit and a plurality of grooves, and Set the polarity interfaces respectively corresponding to the electrical circuit in the groove; place a plurality of light-emitting elements in the groove and electrically connect with the polarity interface in the groove carrier on either side, when the power supply module provides Power is transmitted to the polar interface through the electrical circuit, which can light up the light-emitting element in the groove. Since the first and second side groove carriers are connected up and down, and the positions of the grooves correspond to each other, when the light emitting element is laid on the groove carrier, regardless of whether the electrical contact of the light emitting element is upward or downward , Can be connected to the polar interface on either side, reducing the time to place the light emitting element and improving the detection efficiency.
Description
本發明係有關一種檢測裝置,特別是指一種可檢測發光元件之載具裝置。The invention relates to a detection device, in particular to a carrier device capable of detecting light-emitting elements.
隨著積體電路的發展趨向微型化,使積體電路的體積被製作的愈來愈小,目前半導體體積已被逐漸縮小到5奈米(nm),甚至在進行3奈米製程的研發,換言之,晶粒愈來愈小,晶粒檢測也相對變得更為困難。As the development of integrated circuits tends to be miniaturized, the volume of integrated circuits has been made smaller and smaller. At present, the volume of semiconductors has been gradually reduced to 5 nanometers (nm), and even research and development of 3 nanometer processes are in progress. In other words, as the grains get smaller and smaller, the grain detection becomes relatively more difficult.
在晶粒檢測時,除了檢測檢測晶粒表面是否有磨損或缺陷之外,更須檢測晶粒是否可被使用,以發光二極體晶粒檢測而言,習知之發光體晶粒檢測為探針(Probe)接觸發光二極體晶粒,以提供發光二極體電能,藉此判斷發光二極體晶粒是否能藉由電能發光。In the inspection of crystal grains, in addition to detecting whether the surface of the crystal grain is worn or defective, it is also necessary to detect whether the crystal grain can be used. The probe contacts the light-emitting diode die to provide light-emitting diode power, thereby determining whether the light-emitting diode die can emit light by the power.
但隨著晶粒逐漸被製作的更小,在使用探針進行晶粒檢測時,容易產生以下兩種問題:1、目前發光二極體晶粒的晶方(Die)尺寸已小於10um以下,這種尺寸已屆探針之物理極限,探針雖可達1um,但極易損壞,控制不易,量測變異大;2、由於晶粒微小化,使晶圓上晶粒可產生的數量越來越多,導致探針偵測的晶粒變得更多,及對位、檢測速度慢,當然磨損的程度也相對變得更快速,令探針使用壽命縮短。However, as the grains are gradually made smaller, the following two problems are prone to occur when using probes for grain detection: 1. The crystal size of the light-emitting diode grains is currently less than 10um, This size has reached the physical limit of the probe. Although the probe can reach 1um, it is very easy to damage, difficult to control, and the measurement variation is large; 2. Due to the miniaturization of the grain, the number of grains on the wafer can be generated more The more it comes, the more the grains detected by the probe become more, and the alignment and detection speed are slower. Of course, the degree of wear becomes relatively faster, which shortens the service life of the probe.
因此,本發明即提出一種可檢測發光元件之載具裝置,有效解決上述該等問題,具體架構及其實施方式將詳述於下:Therefore, the present invention proposes a carrier device capable of detecting light-emitting elements, which effectively solves the above problems. The specific architecture and implementations thereof will be described in detail below:
本發明之主要目的在提供一種可檢測發光元件之載具裝置,其在上、下各設置一凹槽載具,不論發光元件與任一側凹槽載具的極性接口電性連接,皆可使發光元件發光,解決擺放方向影響發光元件檢測效率之問題。The main object of the present invention is to provide a carrier device capable of detecting a light emitting element, which is provided with a groove carrier on the top and the bottom, regardless of whether the light emitting element is electrically connected to the polar interface of the groove carrier on either side. Make the light emitting element emit light, and solve the problem that the placement direction affects the detection efficiency of the light emitting element.
本發明之另一目的在提供一種可檢測發光元件之載具裝置,其中之供電模組係透過程式化控制方法改變輸出電能的頻率、電壓、電流,以改變發光元件之亮度或其特徵值,以供電性或外觀檢測之用。Another object of the present invention is to provide a carrier device capable of detecting a light-emitting element, wherein the power supply module changes the frequency, voltage, and current of the output power through a programmed control method to change the brightness of the light-emitting element or its characteristic value, For power supply or visual inspection.
本發明之再一目的在提供一種可檢測發光元件之載具裝置,其電性迴路之佈局可為凹槽載具整體為一個檢測區域,或是設定一個或複數凹槽為一檢測區域,以在不同頻率、電壓、電流下使對應頻率之發光元件發光並進行檢測。Another object of the present invention is to provide a carrier device capable of detecting light-emitting elements. The layout of the electrical circuit may be that the groove carrier as a whole detection area, or one or more grooves are set as a detection area, to At different frequencies, voltages, and currents, the light-emitting elements of corresponding frequencies are illuminated and detected.
本發明之又一目的在提供一種可檢測發光元件之載具裝置,其分別在第一、第二側凹槽載具上設置對位標誌,以使二者可準確對接壓合。Another object of the present invention is to provide a carrier device capable of detecting light-emitting elements, which is provided with alignment marks on the first and second side groove carriers, so that the two can be accurately butted and pressed together.
為達上述目的,本發明提供一種可檢測發光元件之載具裝置,包括:一第一側凹槽載具,其中設有至少一第一電性迴路及複數第一側凹槽,並在該等第一側凹槽內設置分別與該第一電性迴路對應連接之至少一第一極性接口;一第二側凹槽載具,與該第一側凹槽載具平行,其中設有至少一第二電性迴路及複數第二側凹槽,並在該等凹槽內設置分別與該第二電性迴路對應連接之至少一第二極性接口,且該等第二側凹槽係與該等第一側凹槽相對設置;複數發光元件,放置於該等第一側凹槽或第二側凹槽中,並與該第一極性接口或第二極性接口電性連接;以及一第一電力接收模組及一第二電力接收模組,分別設於該第一、第二側凹槽載具上,用以接收一供電模組之電力,透過該第一、第二電性迴路將電力輸送到第一、第二極性接口,以點亮該第一、第二側凹槽中之該等發光元件。To achieve the above object, the present invention provides a carrier device capable of detecting a light-emitting element, including: a first side groove carrier in which at least one first electrical circuit and a plurality of first side grooves are provided, and At least one first polarity interface respectively corresponding to the first electrical circuit is provided in the first side groove; a second side groove carrier parallel to the first side groove carrier, in which at least A second electrical circuit and a plurality of second side grooves, and at least one second polarity interface respectively corresponding to the second electrical circuit is provided in the grooves, and the second side grooves are connected with The first side grooves are arranged oppositely; a plurality of light emitting elements are placed in the first side grooves or the second side grooves, and are electrically connected to the first polarity interface or the second polarity interface; and a first A power receiving module and a second power receiving module are respectively provided on the first and second side groove carriers to receive power from a power supply module through the first and second electrical circuits Power is transmitted to the first and second polar interfaces to light up the light emitting elements in the first and second side grooves.
根據本發明之實施例,該第一、第二側凹槽載具上更包括複數限流電阻,其分別連接每一該等發光元件。除此之外,更包括一微控制器及一交流轉直流變壓器,該交流轉直流變壓器與該第一、第二電性迴路及該微控制器電性連接,將通過該第一、第二電性迴路之交流電轉換成直流電,且該微控制器與該等限流電阻電性連接,以蒐集該等發光元件發光之電性資料。According to an embodiment of the present invention, the first and second side groove carriers further include a plurality of current limiting resistors, which are respectively connected to each of the light emitting elements. In addition, it also includes a microcontroller and an AC to DC transformer. The AC to DC transformer is electrically connected to the first and second electrical circuits and the microcontroller, and will pass through the first and second The alternating current of the electrical circuit is converted into direct current, and the microcontroller is electrically connected to the current-limiting resistors to collect electrical data of the light-emitting elements emitting light.
根據本發明之實施例,該等發光元件係利用一治具或以磁力、風力、振動等方式擺放至該等第一側凹槽或第二側凹槽中。According to an embodiment of the present invention, the light-emitting elements are placed in the first side grooves or the second side grooves using a fixture or magnetic force, wind force, vibration, etc.
根據本發明之實施例,該供電模組可對輸出之電能進行程式化控制,以改變電能之頻率、電壓、電流,進而改變該等發光元件之亮度或特徵值。According to an embodiment of the present invention, the power supply module can programmatically control the output electric energy to change the frequency, voltage, and current of the electric energy, and then change the brightness or characteristic value of the light-emitting elements.
根據本發明之實施例,該第一、第二電性迴路之佈局係分別將該等第一、第二側凹槽區分成複數檢測區域,利用程式化控制使該等檢測區域中之至少一者或全部導通電力,以點亮該等發光元件。According to an embodiment of the present invention, the layout of the first and second electrical loops is to divide the first and second side grooves into a plurality of detection areas, respectively, and at least one of the detection areas is programmed using programmed control Or all of them are turned on to light up the light-emitting elements.
根據本發明之實施例,該供電模組係利用交流電源以接觸式方式對該第一、第二側凹槽載具供電,或是以電磁感應原理以非接觸式方式對該第一、第二側凹槽載具供電。According to an embodiment of the present invention, the power supply module uses AC power to contact the first and second side groove carriers in a contact manner, or uses the electromagnetic induction principle to contact the first and second The two-sided groove carrier supplies power.
根據本發明之實施例,當以非接觸式方式供電時,該第一、第二電性迴路包括至少一感應線圈,更可包括至少一電感或電容,以增強電力接收功能。According to an embodiment of the present invention, when power is supplied in a non-contact manner, the first and second electrical circuits include at least one induction coil, and may further include at least one inductor or capacitor to enhance the power receiving function.
根據本發明之實施例,該第一、第二電性迴路可分別設於該第一、第二電力接收模組中,以增強電力接收功能。According to an embodiment of the present invention, the first and second electrical loops can be respectively provided in the first and second power receiving modules to enhance the power receiving function.
根據本發明之實施例,該第一、第二側凹槽載具上更分別設有至少一對位標誌,以供該等第一、第二側凹槽精準對位壓合。此對位標誌為圖像式或光學式標記,透過攝像裝置或光學比對方式進行對位。According to an embodiment of the present invention, the first and second side groove carriers are further provided with at least one pair of alignment marks, respectively, for the first and second side grooves to be accurately aligned and pressed. The alignment mark is an image-type or optical-type mark, which is aligned through a camera device or an optical comparison method.
本發明提供一種可檢測發光元件之載具裝置,分別在發光元件的上下兩側皆設置凹槽載具,故不論發光元件之擺放方向為正或反,皆可與上方或下方的任一凹槽載具電性連接並導通發光,達到減少發光元件擺放時間、提升檢測發光元件效率之目的。The invention provides a carrier device capable of detecting a light-emitting element, and groove carriers are provided on the upper and lower sides of the light-emitting element respectively, so whether the light-emitting element is placed in a positive or reverse direction, it can The groove carrier is electrically connected and turned on to emit light, so as to reduce the placement time of the light emitting element and improve the efficiency of detecting the light emitting element.
請同時參考第1圖及第2圖,第1圖為本發明可檢測發光元件之載具裝置之方塊圖,第2圖則為本發明一第一實施例之示意圖。如圖所示,該可檢測發光元件之載具裝置包括一第一側凹槽載具10及一第二側凹槽載具20,於第2圖中可看出此二凹槽載具10、20為上下互相平行。於第一側凹槽載具10中設有至少一第一電性迴路12及複數第一側凹槽14,並在第一側凹槽14內設置分別與第一電性迴路12對應連接之至少一第一極性接口16;第二側凹槽載具20與第一側凹槽載具10之結構相同,故其中亦設有至少一第二電性迴路22及複數第二側凹槽24,並在第二側凹槽24內設置分別與第二電性迴路22對應連接之至少一第二極性接口26;將複數發光元件40放置於第一側凹槽14或第二側凹槽24中,且發光元件40的電極42與第一極性接口16或第二極性接口26電性連接,此發光元件40為發光二極體、迷你發光二極體(Mini LED)、微型發光二極體(Micro LED),因此電極42為P型半導體和N型半導體。在第一、第二側凹槽載具10、20上分別設有一第一電力接收模組18及一第二電力接收模組28,用以接收一供電模組30所提供之電力,當第一、第二電力接收模組18、28接收到電力後,分別透過第一、第二電性迴路12、22將電力輸送到第一、第二極性接口16、26,以點亮第一、第二側凹槽14、24中之發光元件40。Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 is a block diagram of a carrier device capable of detecting light-emitting elements of the present invention, and FIG. 2 is a schematic diagram of a first embodiment of the present invention. As shown in the figure, the carrier device capable of detecting the light-emitting element includes a first
須注意的是,第二側凹槽24係與第一側凹槽14相對設置,第二側凹槽24朝上,第一側凹槽14朝下,如此發光元件40可同時嵌設於第二側凹槽24係與第一側凹槽14中,惟發光元件40的電極42僅與其中一側凹槽的極性接口16或26電性連接。It should be noted that the
發光元件40係利用一治具(圖中未示)或以磁力、風力、振動等方式擺放至第一側凹槽14或第二側凹槽24中,且電極42之P型半導體和N型半導體並不限制在左邊或右邊,只要能與第一電性迴路12或第二電性迴路22相接,便能使發光元件40發光。第一、第二凹槽載具10、20為固態材質或可撓性材質,其上之第一、第二側凹槽14、24之形狀為方形、圓形或多邊形,但第一、第二側凹槽14、24之形狀在本發明中並不以此為限。The light-emitting
由於發光元件40有微小化趨勢,故第一、第二側凹槽14、24也極小,第一、第二側凹槽載具10、20需要精準對位才能使上下之第一、第二側凹槽14、24準確壓合,而第一、第二側凹槽載具10、20之移動與壓合係透過自動化設備、由程式控制完成,故本發明在第一、第二側凹槽載具10、20上更分別設有至少一對位標誌36,以供第一、第二側凹槽14、24精準對位壓合,此對位標誌36為圖像式或光學式標記,透過攝像裝置或光學比對方式進行對位。Since the
第一、第二電性迴路12、22係透過濺鍍、電鍍、蝕刻、打線方式將導電材質佈局至第一、第二凹槽載具10、20之表面或內部所形成,導電材質為氧化銦錫(ITO)、鋁、銅等。The first and second
本發明中,供電模組30與第一、第二側電力接收模組18、28之間的供電模式包含接觸式及非接觸式兩種實施態樣,第2圖所示之第一實施例係為接觸式供電模式,直接對第一、第二側凹槽載具10、20供應交流電,因此在此實施例中,供電模組30為插頭,而第3圖所示之第二實施例則是藉由電磁感應原理以非接觸式方式對第一、第二側凹槽載具10、20供電,以下詳述。In the present invention, the power supply mode between the
請參考第3圖,供電模組30為一個無線電訊號發送器,發出無線電訊號給第一、第二電力接收模組18、28,該第一、第二電力接收模組18、28接收到無線電訊號後,利用電磁感應原理(如電磁耦合、電磁共振等)將無線電訊號轉換成電能,提供給第一、第二電性迴路12、22,第一、第二電性迴路12、22再將電力輸送到第一、第二極性接口16、26,以點亮第一、第二側凹槽14、24中之發光元件40。本發明中,供電模組30為無線電訊號發送器時,係可對輸出之電能進行程式化控制,以改變電能之頻率、電壓、電流,進而改變發光元件40之亮度或特徵值。第一、第二電性迴路12、22包括至少一感應線圈(圖中未示),可為單圈或多圈之電性迴路,並可置於第一、第二凹槽載具10、20之任一側,且在第一、第二電性迴路12、22中更可包括至少一電感或電容(圖中未示),以增強電力接收功能,或是直接將第一、第二電性迴路12、22分別設於第一、第二電力接收模組18、28中,由於電性迴路和電力接收模組之間的距離縮短,電磁感應變強,故可增強電力接收功能。Please refer to FIG. 3, the
在本發明之實施例中,第一、第二電性迴路12、22之佈局係分別將第一、第二側凹槽14、24區分成複數檢測區域,每一個檢測區域對應一個電性迴路,利用程式化控制使這些檢測區域中的其中一個導通電力,以點亮該檢測區域中的發光元件40;或是使至少二個檢測區域導通電力,點亮這些檢測區域中的發光元件40;亦或使全部的檢測區域皆導通電力,讓所有的發光元件40都被點亮。舉例而言,若將第一、第二側凹槽14、24分成設定當輸入30、40、50、60Hz電流時會點亮發光元件40的四個檢測區域,則在第一、第二側凹槽14、24上會分別包含四個第一、第二電性迴路12、22,以對應四個檢測區域,當程式化控制輸入40Hz的電流時,對應的檢測區域中的發光元件40會被點亮,其他檢測區域中的發光元件則無反應,如此可檢測發光元件40在對應頻率下是否有發光、及檢查其輝度、色度、亮度等特徵。In the embodiment of the present invention, the layout of the first and second
本發明中發光元件彼此之間為串聯或並聯,如第4圖至第6圖所示,其分別為本發明可檢測發光元件之載具裝置不同實施例之電路圖。以第一側凹槽載具為例,在第4圖中第一電性迴路12與發光元件40為並聯,通過第一電性迴路12的電力為交流電,每一個發光元件40更連接一電流調整二極體(current-limiting diodes)32;第5圖中第一電性迴路12與發光元件40為並聯,每一個發光元件40更連接一限流電阻(current-limiting resistor)34,且限流電阻34連接一微控制器44,微控制器44另連接一交流轉直流變壓器46,由於通過第一電性迴路12的電流為交流電,但限流電阻34只能通過直流電,故通過第一電性迴路12的交流電會經過交流轉直流變壓器46,轉換成直流電後才提供給限流電阻34做測試之用,微控制器44再透過限流電阻34蒐集發光元件40檢測後之電性資料,並將所蒐集之發光元件40的電性資料透過藍芽、Wi-Fi等無線訊號傳輸之方式傳送給第3圖之無線電訊號發送器,達到非接觸式檢測之功能;第6圖中第一電性迴路12與發光元件40為串聯,通過第一電性迴路12的電力為交流電,並連接一電流調整二極體32。In the present invention, the light-emitting elements are connected in series or parallel to each other, as shown in FIGS. 4 to 6, which are circuit diagrams of different embodiments of the carrier device capable of detecting the light-emitting elements of the present invention. Taking the first side groove carrier as an example, in FIG. 4, the first
綜上所述,本發明之可檢測發光元件之載具裝置係在上、下各設置一凹槽載具,二者不但互相平行,且其上之凹槽更相對設置,不論發光元件之電極與任一側凹槽載具的極性接口電性連接,皆可使發光元件發光,解決擺放方向影響發光元件檢測效率之問題,加快發光元件擺放速率。此外,本發明之凹槽載具更包括接觸式和非接觸式兩種供電方式,以非接觸式供電時還可藉由程式化控制方法改變輸出電能的頻率、電壓、電流,進而改變發光元件之亮度或其特徵值,以供電性或外觀檢測之用。In summary, the carrier device for detecting light-emitting elements of the present invention is provided with a groove carrier on the upper and lower sides, the two are not only parallel to each other, but the grooves on the two are more oppositely arranged, regardless of the electrode of the light-emitting element The electrical connection with the polar interface of the groove carrier on either side can make the light emitting element emit light, solve the problem that the placement direction affects the detection efficiency of the light emitting element, and speed up the placement rate of the light emitting element. In addition, the groove carrier of the present invention further includes two contact and non-contact power supply modes. When the non-contact power supply is used, the frequency, voltage, and current of the output power can also be changed by a programmed control method, thereby changing the light-emitting element The brightness or its characteristic value is used for power supply or appearance inspection.
唯以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化或修飾,均應包括於本發明之申請專利範圍內。The above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, any changes or modifications based on the features and spirit described in the application scope of the present invention should be included in the patent application scope of the present invention.
10‧‧‧第一側凹槽載具10‧‧‧The first side groove carrier
12‧‧‧第一電性迴路12‧‧‧First electrical circuit
14‧‧‧第一側凹槽14‧‧‧The first side groove
16‧‧‧第一極性接口16‧‧‧First polarity interface
18‧‧‧第一電力接收模組18‧‧‧The first power receiving module
20‧‧‧第二側凹槽載具20‧‧‧Second side groove carrier
22‧‧‧第二電性迴路22‧‧‧Second electrical circuit
24‧‧‧第二側凹槽24‧‧‧Second side groove
26‧‧‧第二極性接口26‧‧‧Second Polarity Interface
28‧‧‧第二電力接收模組28‧‧‧The second power receiving module
30‧‧‧供電模組30‧‧‧Power supply module
32‧‧‧電流調整二極體32‧‧‧Current adjustment diode
34‧‧‧限流電阻34‧‧‧Current limiting resistor
36‧‧‧對位標誌36‧‧‧Alignment mark
40‧‧‧發光元件40‧‧‧Lighting element
42‧‧‧電極42‧‧‧electrode
44‧‧‧微控制器44‧‧‧Microcontroller
46‧‧‧交流轉直流變壓器46‧‧‧AC to DC transformer
第1圖為本發明可檢測發光元件之載具裝置之方塊圖。 第2圖為本發明可檢測發光元件之載具裝置之一第一實施例之示意圖。 第3圖為本發明可檢測發光元件之載具裝置之一第二實施例之示意圖。 第4圖至第6圖分別為本發明可檢測發光元件之載具裝置不同實施例之電路圖。 FIG. 1 is a block diagram of a carrier device capable of detecting light-emitting elements of the present invention. FIG. 2 is a schematic diagram of a first embodiment of a carrier device capable of detecting light-emitting elements of the present invention. FIG. 3 is a schematic diagram of a second embodiment of a carrier device capable of detecting light-emitting elements of the present invention. 4 to 6 are circuit diagrams of different embodiments of the carrier device capable of detecting light-emitting elements of the present invention.
10‧‧‧第一側凹槽載具 10‧‧‧The first side groove carrier
12‧‧‧第一電性迴路 12‧‧‧First electrical circuit
14‧‧‧第一側凹槽 14‧‧‧The first side groove
16‧‧‧第一極性接口 16‧‧‧First polarity interface
18‧‧‧第一電力接收模組 18‧‧‧The first power receiving module
20‧‧‧第二側凹槽載具 20‧‧‧Second side groove carrier
22‧‧‧第二電性迴路 22‧‧‧Second electrical circuit
24‧‧‧第二側凹槽 24‧‧‧Second side groove
26‧‧‧第二極性接口 26‧‧‧Second Polarity Interface
28‧‧‧第二電力接收模組 28‧‧‧The second power receiving module
30‧‧‧供電模組 30‧‧‧Power supply module
40‧‧‧發光元件 40‧‧‧Lighting element
Claims (16)
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