CN116007418A - Graphite temperature-equalizing plate and preparation method thereof - Google Patents
Graphite temperature-equalizing plate and preparation method thereof Download PDFInfo
- Publication number
- CN116007418A CN116007418A CN202211731876.4A CN202211731876A CN116007418A CN 116007418 A CN116007418 A CN 116007418A CN 202211731876 A CN202211731876 A CN 202211731876A CN 116007418 A CN116007418 A CN 116007418A
- Authority
- CN
- China
- Prior art keywords
- graphite
- plate
- groove
- heat pipe
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 281
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 194
- 239000010439 graphite Substances 0.000 title claims abstract description 194
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 claims abstract description 10
- 238000006557 surface reaction Methods 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 95
- 229910021389 graphene Inorganic materials 0.000 claims description 87
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 50
- 239000010949 copper Substances 0.000 claims description 50
- 239000011248 coating agent Substances 0.000 claims description 32
- 238000000576 coating method Methods 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 229920006335 epoxy glue Polymers 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 9
- 229910021382 natural graphite Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 230000009257 reactivity Effects 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 238000004021 metal welding Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000013329 compounding Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 35
- 238000005240 physical vapour deposition Methods 0.000 description 26
- 238000012360 testing method Methods 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000004080 punching Methods 0.000 description 11
- 238000001035 drying Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a graphite temperature-equalizing plate and a preparation method thereof, wherein the graphite temperature-equalizing plate comprises a graphite plate, a flat heat pipe, a treatment layer and a connecting layer, at least one groove is formed in the graphite plate, the groove is used for placing the flat heat pipe, the treatment layer covers the inner surface of the groove and/or the outer surface of the graphite plate and is used for improving the surface reaction activity of the graphite plate, and the connecting layer is used for connecting the graphite plate and the flat heat pipe. The invention solves the problem of compounding graphite and metal.
Description
Technical Field
The invention relates to the technical field of heat dissipation materials, in particular to a graphite temperature equalizing plate and a preparation method thereof.
Background
In recent years, the rapid development of electronic technology has been advanced, and electronic devices have been advanced in the direction of high speed, high frequency and intensive miniaturization of integrated circuits, with a concomitant rapid increase in the amount of heat generated by electronic devices per unit volume. Taking a 5G smart phone as an example, the operation capability of the 5G chip is at least 5 times higher than that of the existing 4G chip, and the power consumption is about 2.5 times higher. The high integration of electronic devices presents higher performance requirements and challenges to heat dissipation processing techniques. The traditional heat dissipation materials at present comprise:
the metal foil has heat conductivity coefficient of 100-500 and density of 8.9g/cm, and copper is widely used as heat dissipation material 3 ；
The heat conduction coefficient of the natural graphite, the artificial graphite and the graphene heat conduction film is 100-1800W/m.K, and the density is 1-2.2g/cm 3 The density is far lower than that of metal;
the heat pipe and the VC (Vapor Chambers) temperature-equalizing plate have extremely high heat conductivity without extra energy, are environment-friendly heat dissipation technologies, have equivalent heat conductivity coefficients as high as 5000-20000W/m.K, are mainly made of metals such as copper, iron and the like, have high density and heavier mass, and have the defects of difficult arrangement of a capillary structure, reduced capillary force and the like, so that the thickness of the heat pipe and the temperature-equalizing plate is only 0.3mm at the minimum.
With the development of industry, high power and integration trend, and higher requirements are put on the weight and performance of heat dissipation materials, so that the traditional heat dissipation materials and modes have become more and more difficult to meet the requirements of light weight and efficient heat dissipation.
Disclosure of Invention
Aiming at one or more of the problems in the prior art, the invention provides a graphite uniform temperature plate, which comprises a graphite plate, a flat heat pipe, a treatment layer and a connecting layer, wherein at least one groove is formed in the graphite plate, the groove is used for placing the flat heat pipe, the treatment layer covers the inner surface of the groove and/or the outer surface of the graphite plate and is used for improving the surface reactivity of the graphite plate, and the connecting layer is used for connecting the graphite plate and the flat heat pipe.
According to one aspect of the invention, the upper cover is further comprised of an upper cover covering at least the groove opening of the upper surface of the graphite plate.
According to one aspect of the invention, the upper cover is made of copper, aluminum, graphene, artificial graphite or natural graphite.
According to an aspect of the present invention, the thickness of the upper cover is 5 to 100 μm, and further preferably, the thickness of the upper cover is 10 μm.
According to one aspect of the invention, a lower cover is also included, the lower cover covering at least the slot opening below the graphite plate.
According to one aspect of the invention, the lower cover is made of copper, aluminum, graphene, artificial graphite or natural graphite.
According to an aspect of the present invention, the thickness of the lower cover is 5 to 100 μm, and further preferably, the thickness of the lower cover is 10 μm.
The upper cover and the lower cover mainly play a role in protection and further play a role in soaking in the whole plane. If too thick, the entire assembly is too heavy due to the high metal density; if too thin, the processing difficulty is great and the soaking effect is poor. The upper cover and the lower cover are preferably made of metal materials such as copper, aluminum and the like, and the metal materials have high strength and can play a certain supporting role.
According to one aspect of the invention, the graphite plate is made of natural graphite sheets, graphene or artificial graphite films.
According to one aspect of the invention, the graphite sheet is a natural graphite sheet, an artificial graphite sheet, or a graphene sheet.
According to one aspect of the invention, the graphite sheet is a graphene heat conducting sheet. The thermal conductivity of the natural graphite flake and the artificial graphite flake is low and only about 100-800, and the thermal conductivity of the graphene thermal conductivity flake is between 1000-18000, so that the thermal conductivity of the graphite temperature-uniforming plate is improved.
According to one aspect of the present invention, the graphite sheet is a single-layer structure or a multi-layer stacked structure. The multilayer stacked structure can prepare thicker modules, and the equivalent heat conductivity coefficient can be higher. The single-layer structure has a poor heat dissipation effect if the thickness of the heat pipe is very thick or very thin because the thickness of the current heat pipe is limited (only a plurality of heat pipes with different sizes are fixed on the market). The graphite can be prepared into different thicknesses, and can also be compounded with a plurality of layers of heat pipes to form a sandwich structure. According to one aspect of the present invention, the thickness of the graphite sheet is 0.1 to 10mm, preferably, the thickness of the graphite sheet is 0.3 to 1mm. If the graphite sheet is too thin, the overall module assembly is weak (because graphite is still too soft compared to metal); if the graphite sheet is too thick, the overall thermal conductivity is affected by the lower longitudinal thermal conductivity of graphite (only about 10W/m-K, compared to values above 1000 for the planar thermal conductivity of graphite), and if it is too thick, the weight is increased.
According to one aspect of the invention, the flat plate heat pipe comprises a vacuum cavity structure and a capillary wick arranged inside the vacuum cavity structure.
According to one aspect of the invention, the vacuum chamber structure is a flattened cylindrical heat pipe; preferably, the vacuum cavity structure is a vacuum cavity with upper and lower plates welded.
According to one aspect of the invention, the thickness of the flat heat pipe is 0.1-10 mm.
According to one aspect of the invention, the area of the grooves is 5% to 90% of the total graphite sheet area, preferably the area of the grooves is 15% to 30% of the total graphite sheet area.
According to one aspect of the invention, the treatment layer is a metal layer, preferably the composition of the metal layer is one or more combinations of silver, nickel, copper, titanium, tin, indium, bismuth, zinc, zirconium and chromium.
According to one aspect of the invention, the treatment layer is an epoxy glue or a conductive glue.
According to one aspect of the invention, the conductive adhesive is graphite adhesive, and the bonding property with the graphite plate is enhanced.
According to one aspect of the invention, the thickness of the treatment layer is 1 μm to 50 μm, preferably the thickness of the treatment layer is 5 μm. The bonding strength of the graphite and the flat heat pipe is insufficient when the treatment layer is too thin, and the bonding strength of the graphite and the flat heat pipe is too thick, so that the contact thermal resistance between the graphite and the flat heat pipe can be increased, and the heat dissipation effect of the whole assembly is affected
According to one aspect of the invention, the raw material of the connection layer is solder paste, and the solder paste comprises one or more of low-temperature solder paste, high-temperature solder paste and metal welding powder.
According to one aspect of the invention, the raw material of the connecting layer is epoxy glue or conductive glue.
According to one aspect of the invention, the conductive adhesive is graphite adhesive, and the bonding property with the graphite plate is enhanced.
According to another aspect of the present invention, there is provided a method for preparing a graphite uniform temperature plate, comprising:
at least one groove is formed in the graphite plate;
and fixing the flat heat pipe in the groove.
According to another aspect of the present invention, the step of fixing the flat heat pipe in the groove further includes:
and covering the grooved surface of the graphite plate with a cover body, wherein the cover body at least covers the opening of the groove.
According to another aspect of the invention, the cover comprises an upper cover or/and a lower cover.
According to another aspect of the invention, the cover body is covered on the grooved surface of the graphite plate through epoxy glue or conductive glue or solder.
According to another aspect of the present invention, the step of fixing the flat heat pipe in the groove further includes:
and carrying out surface treatment on the grooved graphite plate.
According to another aspect of the present invention, the step of surface-treating the grooved graphite sheet includes:
a PVD process is used to deposit a metal layer on the inner surfaces of the grooves of the graphite sheet and/or on the entire outer surface of the graphite sheet.
Physical Vapor Deposition (PVD) is the process of vaporizing a target material (metal) into an atomic or ionic metal and then depositing the metal onto a substrate to form a metal layer. PVD is a process that uses physical vapor methods such as sputtering, evaporation, etc., to condense and form a coating on a substrate in a vacuum environment. The plated film has the advantages of high hardness and strength, good thermal stability, good wear resistance, stable chemical property, low friction coefficient, compact tissue structure and the like.
According to another aspect of the invention, the first layer of the metal target used in PVD is titanium and the second layer is copper, reducing cost and making copper less susceptible to oxidation.
According to another aspect of the present invention, the step of surface-treating the grooved graphite sheet includes:
and uniformly coating the inner surface of the groove of the graphite plate and/or the outer surface of the whole graphite plate with epoxy glue or conductive glue.
According to another aspect of the present invention, the step of fixing the flat heat pipe in the groove includes:
coating solder on the inner surface of each groove of the graphite plate; preferably, the coating mode is one or more of manual coating, mechanical arm coating and coating machine coating; preferably, the thickness of the solder is 2 μm to 20 μm, more preferably 10 μm;
and placing the flat heat pipe in a groove, placing the whole body in a welding furnace for heating and welding treatment, and taking out after cooling.
According to another aspect of the present invention, the step of fixing the flat heat pipe in the groove includes:
uniformly coating epoxy glue or conductive glue on the inner surface of each groove of the graphite plate; preferably, the thickness of the epoxy glue or the conductive glue is 2-100 μm, more preferably 10 μm;
and placing the flat heat pipe in a groove, placing the whole in a heating furnace for heat treatment, cooling and taking out.
Because the solder is mainly a metal component, only a very thin layer is needed to achieve the effect of welding stability; the bond strength of the paste with graphite is much lower than that of metal at the same thickness, and thus a thicker paste layer is required. The connection layer is less than 2 μm or more than 100 μm, which is not beneficial to the connection of the graphite plate and the heat pipe, even the graphite plate and the heat pipe fall off, so that a finished product cannot be formed.
The graphite temperature equalizing plate combines the characteristic of high heat conductivity of the flat heat pipe with the characteristic of light weight of the graphite plate to form the temperature equalizing plate with both light weight and high heat conductivity, and can be widely applied to heat dissipation of electronic components.
The invention solves the problem of compounding graphite and metal, and the combination of graphite and metal can not be realized by adopting conventional electroplating and chemical plating due to different linear expansion coefficients and good stability of the graphite. If the graphite plate and the flat heat pipe are not connected together by using the connecting layer, a gap is formed in the middle of the graphite plate and the flat heat pipe, and air is arranged in the gap, so that contact thermal resistance is large, and the whole radiating effect is influenced. If the graphite plate does not have a treatment layer, graphite is easy to fall off powder and cannot be used. According to the invention, the grooved graphite plate is subjected to surface treatment, so that the surface reaction activity of the graphite plate is improved, the strength of the graphite plate is improved, and the graphite plate and the flat heat pipe are connected through the connecting layer, thereby being beneficial to the combination of graphite and metal.
In the preparation method of the graphite temperature-equalizing plate, the method for connecting the graphite with the flat heat pipe adopts glue connection or welding, thereby effectively reducing contact thermal resistance and realizing high heat conductivity of the graphite temperature-equalizing plate
Conventional flat heat pipes are made of copper or stainless steel and other metal materials, and have a density of more than 5g/cm 3 The method comprises the steps of carrying out a first treatment on the surface of the While the density of graphite is less than or equal to 2.26g/cm 3 The cutting is easy, and the overall performance is not affected after the cutting is finished; the heat conductivity coefficient of the graphite temperature-uniforming plate can be more than or equal to 3000W/(m.K), and the density is less than or equal to 4g/cm 3 The heat conduction can be kept high and the weight can be reduced.
The conventional flat heat pipe can only realize point-to-point heat conduction (between two ends), and the graphite plate is added in the width direction of the flat heat pipe, so that the heat dissipation effect in the width direction can be further achieved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of one embodiment of a graphite isopipe of the present invention;
FIG. 2 is a physical view of one embodiment of a graphite isopipe of the present invention;
FIG. 3 is a schematic view of a second embodiment of a graphite isopipe in accordance with the present invention;
FIG. 4 is a schematic view of a third embodiment of a graphite isopipe in accordance with the present invention;
fig. 5 is a physical view of a third embodiment of the graphite isopipe of the present invention.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. They are, of course, merely examples and are not intended to limit the invention. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Fig. 1 is a schematic view of an embodiment of a graphite temperature equalizing plate according to the present invention, and fig. 2 is a physical diagram of an embodiment of a graphite temperature equalizing plate according to the present invention, as shown in fig. 1 and 2, the graphite temperature equalizing plate includes a graphite plate 1, a flat heat pipe 2, a treatment layer (not shown) and a connection layer (not shown), a groove is formed on the graphite plate, the groove is used for placing the flat heat pipe, the treatment layer covers the inner surface of the groove and/or the outer surface of the graphite plate, and is used for improving the surface reactivity of the graphite plate, and the connection layer is used for connecting the graphite plate and the flat heat pipe.
Fig. 3 is a schematic diagram of a second embodiment of the graphite uniform temperature plate according to the present invention, as shown in fig. 3, wherein the graphite uniform Wen Bandan ink plate 1, the flat heat pipe 2, the treatment layer (not shown) and the connection layer (not shown) are formed on the graphite plate, and a plurality of grooves (for example, 3 grooves) are formed on the graphite plate, and the grooves are used for placing the flat heat pipe.
Fig. 4 is a schematic view of a third embodiment of the graphite temperature-equalizing plate according to the present invention, and fig. 5 is a physical diagram of the third embodiment of the graphite temperature-equalizing plate according to the present invention, where, as shown in fig. 4 and 5, the graphite temperature-equalizing plate includes an upper cover 3, a graphite plate 1, a flat heat pipe 2, a lower cover 4, a treatment layer (not shown), and a connection layer (not shown), at least one groove is formed on the graphite plate, the groove is used for placing the flat heat pipe, the upper cover is used for covering one surface of the groove of the graphite plate, and the lower cover is used for covering the other surface of the groove of the graphite plate.
The grooves in the embodiments may be through grooves or not, and the thickness of the flat heat pipe may be smaller than the depth of the grooves (0.2-0.5 mm), if the thickness of the flat heat pipe is too much, the whole module is soft and not easy to use due to insufficient strength of graphite; the thickness of the graphite plate is much higher than that of the heat pipe, so that the overall weight is increased; the heat dissipation effect, the weight and other various influences should be comprehensively considered by the flat heat pipe and the graphite plate thickness.
Three examples of graphite isoplates are given above, but the invention is not limited thereto and any combination of the individual components may be used.
The invention also provides a preparation method of the graphite temperature equalizing plate, and in a preferred embodiment, the preparation method comprises the following steps:
step S1, slotting a graphite plate, wherein the area of the slotting is 5-90% of the whole graphite plate area, and is preferably 15-30%; the slotting mode is one or more of mechanical punching and laser punching;
step S2, carrying out surface treatment on the grooved graphite plate to form a graphite plate with a treatment layer, wherein the step comprises the following steps: depositing a metal layer on the inner surface of the groove and the outer surface of the graphite plate; or coating epoxy glue or conductive glue on the inner surface of the groove or the outer surface of the graphite plate;
and S3, connecting the graphite plate subjected to surface treatment and the flat heat pipe.
In one embodiment, step S3 includes:
coating a solder layer on the treatment layer of each groove of the graphite plate, wherein the thickness of the solder layer is 2-20 mu m, preferably 10 mu m; the coating mode is one or more of manual coating, mechanical arm coating and coating machine coating, the solder is soldering paste, and the soldering paste is one or more of low-temperature soldering paste, high-temperature soldering paste and metal soldering powder;
then placing the flat heat pipe in a groove for fixing, finally placing the whole body in a welding furnace for heating and welding treatment, cooling and taking out to obtain the graphite uniform temperature plate
In one embodiment, step S3 includes:
uniformly coating epoxy glue or conductive glue on the treatment layer of each groove of the graphite plate, wherein the thickness is 2-100 mu m, preferably 10 mu m;
then placing the flat heat pipe in a groove, fixing by using a tooling fixture, finally, integrally placing the flat heat pipe in a heating furnace for heat treatment, cooling and taking out the flat heat pipe to obtain a graphite uniform temperature plate;
the invention solves the problem of compounding graphite and metal, and the combination of graphite and metal can not be realized by adopting conventional electroplating and chemical plating due to different linear expansion coefficients and good stability of the graphite. The optimal bonding of graphite to metal can only be achieved by means of special welding, special PVD (titanium as the first layer of the metal target for PVD), gluing (special glue, such as graphite glue) according to the invention.
In one embodiment, the preparation method of each embodiment further includes:
the upper cover and the lower cover are connected with the graphite temperature equalizing plate processed in the step S3 by epoxy glue or conductive glue or solder.
PVD and solder may also be used for the upper and lower covers, but at a high cost. If deposition is performed, welding and deposition are required after the deposition is completed.
In order to demonstrate the beneficial effects of the present invention, the following specific examples were carried out:
example 1
A groove (the slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is laser drilling; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a layer of 0.5 mu m titanium and a layer of 5 mu m copper are attached to the outer surface of the grooved graphene heat conducting sheet, and the substrate of the graphite temperature equalizing plate is obtained. Then placing a flat heat pipe with the length of 118mm and the width of 9mm in a graphene heat conducting sheet groove, and repeating the twoThe whole assembly is fixed by using a fixture, and a layer of low-temperature solder (Sn 64Bi35Ag 1) is manually coated at the joint of the substrate and the flat heat pipe, wherein the thickness is 10 mu m; finally, the whole body is placed in a welding furnace for heating and welding treatment, and is taken out after being cooled to room temperature, so that the graphene temperature-equalizing plate (shown in fig. 2) containing one heat pipe can be obtained, and the total thickness is 0.62mm. Through test, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite uniform temperature plate is 3300W/(m.K), and the density is 2.65g/cm 3 。
Comparative example 1
Through testing, the graphene heat-conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6mm has the equivalent heat conductivity coefficient of 1350W/(m.K) and the density of 2.12g/cm 3 。
Compared with comparative example 1, the graphene heat-conducting sheet of comparative example 1 has no grooves, no heating pipe and an equivalent heat conductivity coefficient far lower than that of example 1.
Example 2
A groove (the slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is laser drilling; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a layer of 0.5 mu m titanium and a layer of 5 mu m copper are attached to the outer surface of the grooved graphene heat conducting sheet, and the substrate of the graphite temperature equalizing plate is obtained. Then placing a flat heat pipe with the length of 118mm and the width of 9mm in a graphene heat-conducting sheet groove, fixing the whole of the two composites by using a fixture, and manually coating a layer of epoxy glue at the joint of the substrate and the flat heat pipe, wherein the thickness is 10 mu m; and finally, the whole body is placed in a welding furnace for heating and welding treatment, and is taken out after being cooled to room temperature, so that the graphene temperature-equalizing plate containing one heat pipe can be obtained, and the total thickness is 0.62mm. Through test, the tensile strength of the joint of the heat pipe and the graphene is 0.8Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 3000W/(m.K), and the density is 2.61g/cm 3 。
Example 3
A groove (the slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is laser drilling; then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting strip,the substrate of the graphite temperature uniformity plate was obtained by attaching a layer of 0.5 μm titanium and a layer of 5 μm copper to the outer surface thereof. Then placing a flat heat pipe with the length of 118mm and the width of 9mm in a graphene heat conducting fin groove, fixing the whole of the two composites by using a fixture, and manually coating a layer of high-temperature soldering paste at the joint of the substrate and the flat heat pipe, wherein the thickness is 10 mu m; and finally, the whole body is placed in a welding furnace for heating and welding treatment, and is taken out after being cooled to room temperature, so that the graphene temperature-equalizing plate containing one heat pipe can be obtained, and the total thickness is 0.62mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 5.2Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 3600W/(m.K), and the density is 2.68g/cm 3 。
Compared with the embodiment 1, the embodiment 2 and the embodiment 3, the tensile strength of the joint of the heat pipe and the graphene in the graphite temperature equalizing plate is different from each other in different connecting layer materials: the tensile strength of the joint of the heat pipe and the graphene in the three graphite temperature-uniforming plates coated with the high-temperature soldering paste, the low-temperature soldering paste and the epoxy adhesive respectively is reduced in sequence, and the material of the connecting layer can be reasonably selected according to application scenes with different tensile strength requirements.
Comparative example 2
A copper sheet with the length of 160mm, the width of 60mm and the thickness of 0.6mm is provided with a groove with the length of 120mm and the width of 10mm (the slotting rate is 12.5 percent) in the middle; the slotting mode is laser drilling; and then PVD (physical vapor deposition) treatment is carried out on the grooved copper sheet, so that a layer of 0.5 mu m titanium and a layer of 5 mu m copper are attached to the outer surface of the copper sheet, and the substrate of the copper temperature equalizing plate is obtained. Then placing a flat heat pipe with the length of 118mm and the width of 9mm in a copper sheet groove, fixing the whole of the two by using a fixture, and manually coating a layer of low-temperature solder (Sn 64Bi35Ag 1) at the joint of the substrate and the flat heat pipe, wherein the thickness is 10 mu m; and finally, the whole body is placed in a welding furnace for heating and welding treatment, and is taken out after being cooled to room temperature, so that the copper temperature-equalizing plate containing one heat pipe can be obtained, and the total thickness is 0.62mm. Through test, the tensile strength of the joint of the heat pipe and the copper sheet is 7.8Mpa, the equivalent heat conductivity coefficient of the copper temperature equalizing plate is 2150W/(m.K), and the density is 5.21g/cm 3 。
Example 1 compared to comparative example 2, comparative example 2 uses the same size copper, example 1 has an equivalent thermal conductivity much higher than comparative example 2 and a density much lower than comparative example 2; the scheme of the embodiment 1 has better heat conduction performance and lighter texture, and is suitable for a high heat conduction and light heat dissipation scene.
Example 4
3 grooves (the slotting rate is 90%) with the length of 180mm and the width of 20mm are formed in the middle of a graphene heat conducting sheet with the length of 200mm, the width of 60mm and the thickness of 0.4 mm; the slotting mode is mechanical punching; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a 10 mu m copper layer is attached to the outer surface of the graphene heat conducting sheet, and a substrate of the graphite temperature equalizing plate is obtained. Then three heat pipes with lengths of 178mm and widths of 19mm are placed in 3 grooves of the graphene heat conducting sheet, the whole of the two heat pipes is fixed by using a fixture, and a layer of Sn64Bi35Ag1 is manually coated at the joint of the substrate and the heat pipes, wherein the thickness of the Sn64Bi35Ag1 is 10 mu m; and finally, drying the whole body in an oven for 2 hours, cooling to room temperature, and taking out to obtain the graphene temperature-equalizing plate containing 3 heat pipes, wherein the total thickness is 0.45mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 3.28Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 6800W/(m.K), and the density is 3.45g/cm 3 。
Example 5
2 grooves (the slotting rate is 60%) with the length of 180mm and the width of 20mm are formed in the middle of a graphene heat conducting sheet with the length of 200mm, the width of 60mm and the thickness of 0.4 mm; the slotting mode is mechanical punching; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a 10 mu m copper layer is attached to the outer surface of the graphene heat conducting sheet, and a substrate of the graphite temperature equalizing plate is obtained. Then two heat pipes with lengths of 178mm and widths of 19mm are placed in 2 grooves of a graphene heat conducting sheet, the whole of the two heat pipes is fixed by using a fixture, and a layer of Sn64Bi35Ag1 is manually coated at the joint of a substrate and the heat pipes, wherein the thickness of the Sn64Bi35Ag1 is 10 mu m; and finally, drying the whole body in an oven for 2 hours, cooling to room temperature, and taking out to obtain the graphene temperature-equalizing plate containing 2 heat pipes, wherein the total thickness is 0.45mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 3.28Mpa, the equivalent heat conductivity coefficient of the graphite temperature equalizing plate is 5300W/(m.K), and the density is 2.98g/cm 3 。
Example 6
A graphene heat conduction sheet with the length of 200mm, the width of 60mm and the thickness of 0.4mm is provided with 1 groove with the length of 180mm and the width of 20mm (slotting rate of 30 percent) in the middle; the grooving mode is mechanical beatingA hole; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a 10 mu m copper layer is attached to the outer surface of the graphene heat conducting sheet, and a substrate of the graphite temperature equalizing plate is obtained. Then, placing 1 heat pipe with the length of 178mm and the width of 19mm in 1 groove of the graphene heat conducting sheet, fixing the whole of the two composites by using a fixture, and manually coating a layer of Sn64Bi35Ag1 at the joint of the substrate and the heat pipe, wherein the thickness is 10 mu m; and finally, drying the whole body in an oven for 2 hours, cooling to room temperature, and taking out to obtain the graphene temperature-equalizing plate containing 1 heat pipe, wherein the total thickness is 0.45mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 3.28Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 3800W/(m.K), and the density is 2.68g/cm 3 。
Compared with the embodiment 4, the embodiment 5 and the embodiment 6, the equivalent heat conductivity coefficients of the graphite temperature homogenizing plate are greatly different in different slotting rates and heat pipe numbers: the equivalent heat conductivity coefficients of three graphite temperature equalizing plates with the number of the heat pipes of 3, 2 and 1 are sequentially reduced; the density difference is large: the densities of the three graphite temperature equalizing plates with the number of the heat pipes of 3, 2 and 1 are sequentially reduced; the proper slotting rate and the number of the heat pipes can be selected according to different requirements.
Example 7
3 grooves (the slotting rate is 90%) with the length of 180mm and the width of 20mm are formed in the middle of a graphene heat conducting sheet with the length of 200mm, the width of 60mm and the thickness of 0.4 mm; the slotting mode is mechanical punching; and then PVD (physical vapor deposition) treatment is carried out on the grooved graphene heat conducting sheet, so that a 10 mu m copper layer is attached to the outer surface of the graphene heat conducting sheet, and a substrate of the graphite temperature equalizing plate is obtained. Then three heat pipes with lengths of 178mm and widths of 19mm are placed in 3 grooves of the graphene heat conducting sheet, the whole of the two heat pipes is fixed by using a fixture, and a layer of epoxy glue is manually coated at the joint of the substrate and the heat pipes, wherein the thickness of the epoxy glue is 10 mu m; and finally, drying the whole body in an oven for 2 hours, cooling to room temperature, and taking out to obtain the graphene temperature-equalizing plate containing 3 heat pipes, wherein the total thickness is 0.45mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 0.8Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 6800W/(m.K), and the density is 3.43g/cm 3 。
Compared with example 7, example 4 has different connection layer materials, and different tensile strength at the joint of the heat pipe and the graphene in the graphite temperature equalizing plate: the tensile strength of the joint of the heat pipe and the graphene in the two graphite temperature-uniforming plates respectively coated with the low-temperature soldering paste and the epoxy adhesive is sequentially reduced, the equivalent heat conductivity coefficient and the density difference are not large, and the material of the connecting layer can be reasonably selected according to application scenes with different tensile strength requirements.
Comparative example 3
3 grooves (the slotting rate is 90%) with the length of 180mm and the width of 20mm are formed in the middle of a copper sheet with the length of 200mm, the width of 60mm and the thickness of 0.4 mm; the slotting mode is mechanical punching; and then PVD (physical vapor deposition) treatment is carried out on the grooved copper sheet, so that a 10 mu m copper layer is attached to the outer surface of the copper sheet, and the substrate of the copper temperature equalizing plate is obtained. Then three heat pipes with the length of 178mm and the width of 19mm are placed in 3 grooves of a copper sheet, the whole of the two heat pipes is fixed by using a fixture, and a layer of Sn64Bi35Ag1 with the thickness of 10 mu m is manually coated at the joint of the substrate and the heat pipes; and finally, drying the whole body in an oven for 2 hours, cooling to room temperature, and taking out to obtain the copper temperature-equalizing plate containing 3 heat pipes, wherein the total thickness is 0.45mm. Through test, the tensile strength of the joint of the heat pipe and the copper sheet is 7.8Mpa, the equivalent heat conductivity coefficient of the copper temperature equalizing plate is 4300W/(m.K), and the density is 4.62g/cm 3 。
Example 4 compared to comparative example 3, comparative example 3 uses the same size copper, example 4 has an equivalent thermal conductivity higher than comparative example 3 and a density much lower than comparative example 3; compared with the embodiment, the scheme of the embodiment 4 has better heat conduction performance and lighter texture, and is suitable for a high heat conduction and light heat dissipation scene.
Example 8
1 groove (slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is mechanical punching; and then depositing a layer of titanium with the thickness of 0.5 mu m and a layer of copper with the thickness of 5 mu m on the surface of the grooved graphene heat conducting sheet, thereby obtaining the substrate of the graphite temperature equalizing plate. Then placing 1 heat pipe with length of 118mm and width of 9mm in a groove of a graphene heat conducting sheet, manually coating a layer of low-temperature solder at the joint of the substrate and the heat pipe, covering two copper sheets with thickness of 10 μm on the substrate, and fixing the whole composite by using a fixture; finally, the wholeAnd (5) drying in an oven, cooling, and taking out to obtain the graphene temperature-equalizing plate comprising the upper cover, the lower cover and the heat pipe, wherein the total thickness is 0.68mm. Through test, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite temperature-uniforming plate is 3500W/(m.K), and the density is 2.85g/cm 3 。
Example 9
1 groove (slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is mechanical punching; and then depositing a layer of titanium with the thickness of 0.5 mu m and a layer of copper with the thickness of 5 mu m on the surface of the grooved graphene heat conducting sheet, thereby obtaining the substrate of the graphite temperature equalizing plate. Then placing 1 heat pipe with length of 118mm and width of 9mm in a groove of a graphene heat conducting sheet, manually coating a layer of low-temperature solder at the joint of the substrate and the heat pipe, covering two aluminum sheets with thickness of 10 μm on the substrate, and fixing the whole composite by using a fixture; and finally, the whole body is placed in an oven for drying, and is taken out after being cooled, so that the graphene temperature-equalizing plate comprising the upper cover, the lower cover and the heat pipe can be obtained, and the total thickness is 0.68mm. Through tests, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 3100W/(m.K), and the density is 2.53g/cm 3 。
Example 10
1 groove (slotting rate is 12.5%) with the length of 120mm and the width of 10mm is formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is mechanical punching; and then depositing a layer of titanium with the thickness of 0.5 mu m and a layer of copper with the thickness of 5 mu m on the surface of the grooved graphene heat conducting sheet, thereby obtaining the substrate of the graphite temperature equalizing plate. Then placing 1 heat pipe with length of 118mm and width of 9mm in a groove of a graphene heat conducting sheet, manually coating a layer of low-temperature solder at the joint of a substrate and the heat pipe, covering two graphene sheets with thickness of 10 μm on the substrate, and fixing the whole composite by using a fixture; and finally, the whole body is placed in an oven for drying, and is taken out after being cooled, so that the graphene temperature-equalizing plate comprising the upper cover, the lower cover and the heat pipe can be obtained, and the total thickness is 0.68mm. Through testing, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 3800W/(m.K), and the density is 2.45g/cm 3 。
Example 8 compared with example 9 and example 10, the equivalent thermal conductivity and density of the graphite isopipe are greatly different from the materials of the upper and lower covers: the equivalent heat conductivity coefficients of the three graphite temperature equalizing plates respectively made of graphene, copper and aluminum are sequentially reduced; the density difference is large: the equivalent heat conductivity coefficients of the three graphite temperature equalizing plates of copper, aluminum and graphene are respectively reduced in sequence, wherein the graphene material is adopted as the upper cover and the lower cover in the embodiment 10, the equivalent heat conductivity coefficients are higher, the density is lower, and the heat dissipation device is suitable for high heat conduction and light heat dissipation scenes.
Example 11
2 grooves (25% of slotting rate) with the length of 120mm and the width of 10mm are formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is mechanical punching; and then depositing a layer of titanium with the thickness of 0.5 mu m and a layer of copper with the thickness of 5 mu m on the surface of the grooved graphene heat conducting sheet, thereby obtaining the substrate of the graphite temperature equalizing plate. Then 2 heat pipes with the length of 118mm and the width of 9mm are placed in a groove of a graphene heat conducting sheet, a layer of low-temperature solder is manually coated at the joint of a substrate and the heat pipes, the thickness is 10 mu m, then two copper sheets with the thickness of 10 mu m are covered on the substrate, and the whole composite is fixed by using a fixture; and finally, the whole body is placed in an oven for drying, and is taken out after being cooled, so that the graphene temperature-equalizing plate comprising the upper cover, the lower cover and the heat pipe can be obtained, and the total thickness is 0.68mm. Through test, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 4300W/(m.K), and the density is 2.91g/cm 3 。
Example 12
3 grooves (the slotting rate is 37.5%) with the length of 120mm and the width of 10mm are formed in the middle of a graphene heat conducting sheet with the length of 160mm, the width of 60mm and the thickness of 0.6 mm; the slotting mode is mechanical punching; and then depositing a layer of titanium with the thickness of 0.5 mu m and a layer of copper with the thickness of 5 mu m on the surface of the grooved graphene heat conducting sheet, thereby obtaining the substrate of the graphite temperature equalizing plate. Then 3 heat pipes with the length of 118mm and the width of 9mm are placed in the grooves of the graphene heat conducting sheets, a layer of low-temperature solder is manually coated at the joint of the substrate and the heat pipes, the thickness is 10 mu m, then two copper sheets with the thickness of 10 mu m are covered on the substrate, and the whole composite is usedFixing a tool; and finally, the whole body is placed in an oven for drying, and is taken out after being cooled, so that the graphene temperature-equalizing plate comprising the upper cover, the lower cover and the heat pipe can be obtained, and the total thickness is 0.68mm. Through test, the tensile strength of the joint of the heat pipe and the graphene is 3.5Mpa, the equivalent heat conductivity of the graphite temperature equalizing plate is 5800W/(m.K), and the density is 3.35g/cm 3 。
Compared with the embodiment 11 and the embodiment 12, the equivalent heat conductivity coefficients of the graphite temperature homogenizing plate are greatly different from each other due to different slotting rates and the number of heat pipes: the equivalent heat conductivity coefficients of three graphite temperature equalizing plates with the number of the heat pipes of 3, 2 and 1 are sequentially reduced; the density difference is large: the densities of the three graphite temperature equalizing plates with the number of the heat pipes of 3, 2 and 1 are sequentially reduced; the proper slotting rate and the number of the heat pipes can be selected according to different requirements.
The materials and test results employed in the above examples are shown in tables 1 and 2 below:
TABLE 1
TABLE 2
According to the tensile strength testing method, with reference to GB/T1040.3-2006, a special cutting die and a die cutting tool are adopted to prepare a strip sample 150mm 10mm, a stretching clamp is used for clamping, and a universal tensile machine is adopted to test the tensile strength of a joint, so that the stretching speed is 10mm/min.
The foregoing is a preferred embodiment of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a graphite samming board, its characterized in that includes graphite board, dull and stereotyped heat pipe, treatment layer and tie coat, at least one groove has been seted up on the graphite board, the groove is used for placing dull and stereotyped heat pipe, the treatment layer covers at the internal surface in groove and/or graphite board surface for promote the surface reactivity of graphite board, the tie coat is used for connecting graphite board and dull and stereotyped heat pipe.
2. Graphite temperature-homogenizing plate according to claim 1, characterized in that the treatment layer is a metal layer, preferably the composition of the metal layer is one or a combination of more of silver, nickel, copper, titanium, tin, indium, bismuth, zinc, zirconium and chromium;
preferably, the treatment layer is epoxy glue or conductive glue;
preferably, the thickness of the treatment layer is 1 μm to 50 μm, and further preferably, the thickness of the treatment layer is 5 μm;
preferably, the raw material of the connecting layer is solder paste, and the solder paste comprises one or more of low-temperature solder paste, high-temperature solder paste and metal welding powder;
preferably, the raw material of the connecting layer is epoxy glue or conductive glue.
3. The graphite temperature uniformity plate according to claim 1, further comprising an upper cover covering at least a groove opening of an upper surface of the graphite plate; preferably, the upper cover is made of copper, aluminum, graphene, artificial graphite or natural graphite; preferably, the thickness of the upper cover is 5-100 μm, and more preferably, the thickness of the upper cover is 10 μm; and/or
The lower cover at least covers the groove opening below the graphite plate, and preferably, the lower cover is made of copper, aluminum, graphene, artificial graphite or natural graphite; preferably, the thickness of the lower cover is 5-100 μm, and more preferably, the thickness of the lower cover is 10 μm.
4. The graphite temperature equalization plate according to claim 1, wherein the graphite plate is made of natural graphite sheet, graphene or artificial graphite film, and further preferably, the graphite plate is a graphene heat conducting sheet; preferably, the graphite plate is of a single-layer structure or a multi-layer stacked structure;
preferably, the thickness of the graphite plate is 0.1-10 mm, and more preferably, the thickness of the graphite plate is 0.3-1 mm;
preferably, the area of the grooves is 5% to 90% of the entire graphite sheet area, preferably the area of the grooves is 15% to 30% of the entire graphite sheet area.
5. The graphite temperature equalization plate of claim 1, wherein said flat heat pipe comprises a vacuum chamber structure and a capillary wick disposed within the vacuum chamber structure; preferably, the vacuum cavity structure is a flattened cylindrical heat pipe; preferably, the vacuum cavity structure is a vacuum cavity with upper and lower plates welded; preferably, the thickness of the flat heat pipe is 0.1-10 mm.
6. The preparation method of the graphite uniform temperature plate is characterized by comprising the following steps:
at least one groove is formed in the graphite plate;
carrying out surface treatment on the grooved graphite plate, so as to improve the surface reaction activity of the graphite plate and the strength of the graphite plate;
and fixing the flat heat pipe in the groove.
7. The method of manufacturing according to claim 6, wherein the step of fixing the flat heat pipe in the groove further comprises:
covering a cover body on the grooved surface of the graphite plate, wherein the cover body at least covers the opening of the groove;
preferably, the cover body comprises an upper cover or/and a lower cover;
preferably, the cover body is covered on the grooved surface of the graphite plate through epoxy glue or conductive glue or solder.
8. The method of claim 6, wherein the step of surface treating the grooved graphite sheet comprises:
depositing a metal layer on the inner surface of a groove of the graphite plate and/or the outer surface of the whole graphite plate by adopting a PVD method, wherein the first layer of a metal target used for PVD is preferably titanium, and the second layer is preferably copper;
preferably, the step of surface-treating the grooved graphite sheet includes:
and uniformly coating the inner surface of the groove of the graphite plate and/or the outer surface of the whole graphite plate with epoxy glue or conductive glue.
9. The method of manufacturing according to claim 6, wherein the step of fixing the flat heat pipe in the groove comprises:
coating solder on the inner surface of each groove of the graphite plate; preferably, the coating mode is one or more of manual coating, mechanical arm coating and coating machine coating; preferably, the thickness of the solder is 2 μm to 20 μm, more preferably 10 μm;
and placing the flat heat pipe in a groove, placing the whole body in a welding furnace for heating and welding treatment, and taking out after cooling.
10. The method of manufacturing according to claim 6, wherein the step of fixing the flat heat pipe in the groove comprises:
uniformly coating epoxy glue or conductive glue on the inner surface of each groove of the graphite plate; preferably, the thickness of the epoxy glue or the conductive glue is 2-100 μm, more preferably 10 μm;
and placing the flat heat pipe in a groove, placing the whole in a heating furnace for heat treatment, cooling and taking out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211731876.4A CN116007418A (en) | 2022-12-30 | 2022-12-30 | Graphite temperature-equalizing plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211731876.4A CN116007418A (en) | 2022-12-30 | 2022-12-30 | Graphite temperature-equalizing plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116007418A true CN116007418A (en) | 2023-04-25 |
Family
ID=86024800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211731876.4A Pending CN116007418A (en) | 2022-12-30 | 2022-12-30 | Graphite temperature-equalizing plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116007418A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006013217A (en) * | 2004-06-28 | 2006-01-12 | Furukawa Electric Co Ltd:The | Heatsink using carbon graphite |
| CN108925108A (en) * | 2018-07-13 | 2018-11-30 | 深圳烯创技术有限公司 | The conductive structure and its manufacturing method of aluminium alloy are inlayed in a kind of graphene-based composite substrate |
| CN110511729A (en) * | 2019-09-02 | 2019-11-29 | 常州富烯科技股份有限公司 | A kind of high thermal conductivity piece and preparation method thereof |
| CN213811893U (en) * | 2020-11-27 | 2021-07-27 | 江西宁新新材料股份有限公司 | Special graphite heat pipe |
| CN114061348A (en) * | 2021-11-23 | 2022-02-18 | 广东墨睿科技有限公司 | Vapor chamber and preparation method thereof |
| CN114071979A (en) * | 2021-12-16 | 2022-02-18 | 成都四威高科技产业园有限公司 | Multilayer high-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
| CN217217226U (en) * | 2021-08-11 | 2022-08-16 | 荣耀终端有限公司 | Vapor chamber and electronic apparatus |
-
2022
- 2022-12-30 CN CN202211731876.4A patent/CN116007418A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006013217A (en) * | 2004-06-28 | 2006-01-12 | Furukawa Electric Co Ltd:The | Heatsink using carbon graphite |
| CN108925108A (en) * | 2018-07-13 | 2018-11-30 | 深圳烯创技术有限公司 | The conductive structure and its manufacturing method of aluminium alloy are inlayed in a kind of graphene-based composite substrate |
| CN110511729A (en) * | 2019-09-02 | 2019-11-29 | 常州富烯科技股份有限公司 | A kind of high thermal conductivity piece and preparation method thereof |
| CN213811893U (en) * | 2020-11-27 | 2021-07-27 | 江西宁新新材料股份有限公司 | Special graphite heat pipe |
| CN217217226U (en) * | 2021-08-11 | 2022-08-16 | 荣耀终端有限公司 | Vapor chamber and electronic apparatus |
| CN114061348A (en) * | 2021-11-23 | 2022-02-18 | 广东墨睿科技有限公司 | Vapor chamber and preparation method thereof |
| CN114071979A (en) * | 2021-12-16 | 2022-02-18 | 成都四威高科技产业园有限公司 | Multilayer high-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109930125B (en) | Magnetron sputtering coating method for diamond-aluminum composite material | |
| CN110744875A (en) | High-thermal-conductivity composite graphite radiating fin and preparation method thereof | |
| CN106847767A (en) | A kind of graphite Copper Foil heat sink compound | |
| CN109136848B (en) | Method for connecting aluminum nitride ceramic plate and metal based on PVD (physical vapor deposition) deposition method | |
| CN210157469U (en) | Metal-based copper-clad laminate | |
| CN109137035B (en) | Preparation method of aluminum-based copper-clad plate | |
| CN101204860A (en) | Aluminum foil belt of compound metal and preparation method and uses | |
| TWI787554B (en) | Carbonaceous member with metal layer, and thermal conduction plate | |
| CN112760082A (en) | High-thermal-conductivity graphene film and preparation method thereof | |
| TWI504767B (en) | Sputtering target - support plate joint and its manufacturing method | |
| CN101710493B (en) | Graphite radiating module and manufacturing process thereof | |
| CN110435255A (en) | Insulating layer, metal-based copper-clad plate | |
| JP7320862B2 (en) | Membrane and manufacturing process | |
| CN105848450A (en) | Manufacturing method of composite lightweight flexible high thermal conduction carbon/metal connection member | |
| CN113758325B (en) | VC radiator with built-in copper/diamond sintered liquid suction core and preparation method thereof | |
| CN116007418A (en) | Graphite temperature-equalizing plate and preparation method thereof | |
| CN102740591A (en) | Double-sided aluminum base circuit board with super-high thermal conductivity and preparation method thereof | |
| CN111823664B (en) | Graphite composite radiating fin and preparation method thereof | |
| CN202931664U (en) | Double-faced aluminium circuit board with ultrahigh heat conductivity | |
| CN108155162A (en) | A kind of three-dimensional high heat conduction highly exothermic of no glue laminating and preparation method thereof | |
| CN107642767A (en) | L ED heat dissipation substrate surface adhesive-free super-heat-conduction composite coating, L ED heat dissipation substrate and preparation method thereof | |
| CN101508889A (en) | Aluminium plating plumbago heat-conducting fin and method of preparing the same | |
| CN101445385A (en) | Method for combing graphite plate with metal | |
| CN210579458U (en) | Metal-based copper-clad laminate | |
| CN115674803B (en) | Substrate, graphene metal composite heat dissipation material and preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |