CN116001116A - Multi-wire cutting slicing machine - Google Patents

Abstract

The application discloses a multi-wire cutting slicer, which comprises a multi-wire cutting unit, wherein the multi-wire cutting unit comprises at least two rotating rollers with axes arranged in parallel and cutting wires which are wound between the rotating rollers in a multi-turn parallel manner; the cleaning tank is positioned below the multi-wire cutting unit; at least part of cutting lines at the lower part of the multi-wire cutting unit are positioned in the cleaning tank and below the liquid level of the cleaning tank. According to the scheme, the liquid in the cleaning tank cleans the cutting line, so that the problems of reduction in cutting abrasive particle height and reduction in cutting edge density on the surface of the cutting line due to the fact that silicon chips are attached to the surface of the cutting line are avoided, and the cutting line is restored to better cutting capacity after passing through the cleaning tank, so that the cutting efficiency and the quality of the surface of the cutting line are guaranteed.

Description

Multi-wire cutting slicing machine

Technical Field

The invention relates to the technical field of photovoltaics, in particular to a multi-wire cutting slicing machine.

Background

With the increasing shortage of fossil energy and the enhancement of environmental awareness, photovoltaic power generation technology is becoming more and more widely used as a green and environmental protection technology capable of directly converting sunlight into electric energy.

At present, when the photovoltaic cell panel is produced, a silicon ingot or a silicon rod is required to be sliced to form a silicon wafer, and then processes such as texturing, diffusion, electrode preparation and the like are carried out on the silicon wafer. At present, a multi-wire cutting slicing machine is generally adopted to slice a silicon ingot or a silicon rod, the multi-wire cutting slicing machine is provided with more than two rotating rollers, a cutting wire is wound between the rotating rollers in a parallel winding mode, the cutting wire is driven to move at a high speed through the rotation of the rotating rollers, a plurality of cutting abrasive particles (such as diamond particles) are attached to the surface of the cutting wire, the cutting abrasive particles are rubbed with the silicon ingot or the silicon rod under the driving of the cutting wire, so that the purpose of cutting is achieved, and cutting liquid is supplied to a cutting position during cutting, so that the cutting wire at the cutting position and the silicon ingot or the silicon rod are cooled.

However, during the cutting process, due to the adhesion of the cutting fluid, the adhesion of high-temperature carbonization, and the like, the silicon chips generated by cutting adhere to the surface of the cutting line, and the silicon chips adhering to the surface of the cutting line can cause the height of the cutting edge of the cutting abrasive particles on the surface of the cutting line to be reduced and the density of the cutting edge to be reduced, so that the cutting capability is weakened, and the cutting efficiency is reduced.

Disclosure of Invention

In view of the foregoing drawbacks or shortcomings of the prior art, it is desirable to provide a multi-wire cutting slicer for solving the problem of reduced cutting efficiency caused by weakening of cutting ability due to adhesion of silicon chips to a cutting wire.

The invention provides a multi-wire cutting slicer, comprising:

the multi-wire cutting unit comprises at least two rotating rollers with axes arranged in parallel and cutting wires wound between the rotating rollers in a multi-turn parallel manner;

the cleaning tank is positioned below the multi-wire cutting unit;

at least part of cutting lines at the lower part of the multi-wire cutting unit are positioned in the cleaning tank and below the liquid level of the cleaning tank.

As an implementation manner, an ultrasonic generator is arranged in the cleaning tank.

As an implementation manner, the multi-wire cutting unit comprises three rotating rollers, the three rotating rollers are arranged in an inverted triangle, the cutting wire sequentially bypasses the three rotating rollers, and at least part of the cutting wire wound on the rotating roller positioned below among the three rotating rollers is positioned in the cleaning tank and below the liquid level of the cleaning tank.

As an implementation manner, the cleaning tank comprises a tank body, wherein guide pieces are respectively arranged on two opposite sides of an opening of the tank body, and each guide piece is connected with the wall of the tank body and extends upwards from the opening; the multi-wire cutting unit is positioned between the guide pieces at two opposite sides of the opening.

As an implementation manner, the flow guiding pieces on two opposite sides of the opening extend obliquely upwards in opposite directions.

As an implementation manner, a plurality of overflow holes are formed in the groove wall of the groove body, and each overflow hole penetrates through the groove wall and is arranged close to the opening.

As an implementation manner, each overflow hole is disposed on a groove wall correspondingly connected to each flow guiding member, and is at least arranged in a row.

As an implementation manner, a lifting driving mechanism is arranged below the groove body and is used for driving the groove body to move in the vertical direction;

the opening of the groove body is provided with an arc groove at a position different from the position where each flow guide piece is arranged, and the end part of the rotating roller positioned below among the three rotating rollers arranged in an inverted triangle is positioned in the arc groove.

As an implementation manner, a converging groove is arranged below the groove body, and the projection boundary of the converging groove is larger than the projection boundary of the groove body in the vertical projection direction.

As an implementation manner, the ultrasonic generator is disposed at the bottom of the cleaning tank.

According to the scheme, due to the fact that the cleaning tank is arranged, at least part of the cutting line at the lower part of the multi-wire cutting unit is located in the cleaning tank and below the liquid level of the cleaning tank, then in the cutting process, when the cutting line moves to the cleaning tank, liquid in the cleaning tank can clean the cutting line so as to wash away silicon chips attached to the surface of the cutting line, the problems that the height of cutting abrasive particles on the surface of the cutting line is reduced and the density of the cutting edges is reduced due to the fact that the silicon chips are attached to the surface of the cutting line are avoided, and after the cutting line passes through the cleaning tank, the cutting capability is restored to be better so as to ensure the cutting efficiency and the quality of the sliced surface. In addition, since the cutting ability is recovered after the cutting line is cleaned, the line consumption of the cutting line can also be reduced.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:

fig. 1 is a top view of a multi-wire cutting slicer provided in accordance with a first embodiment of the present invention;

FIG. 2 is a front view of FIG. 1;

fig. 3 is a front view of a multi-wire cutting slicer provided in accordance with a second embodiment of the present invention;

fig. 4 is a front view of a multi-wire cutting slicer provided by a third embodiment of the present invention;

fig. 5 is a front view of a multi-wire cutting slicer provided by a fourth embodiment of the present invention;

fig. 6 is a perspective view of a cleaning tank according to an embodiment of the present invention;

fig. 7 is a front view of a multi-wire cutting slicer provided by a fifth embodiment of the present invention;

FIG. 8 is a top view of FIG. 7;

fig. 9 isbase:Sub>A sectional view ofbase:Sub>A-base:Sub>A of fig. 8.

Reference numerals illustrate:

a rotating roller-1;

a cleaning tank-2; an overflow aperture-21; an arc-shaped groove-22; a tank body-23; a flow guide member-24;

an ultrasonic generator-3;

cutting line-4;

a reversing wheel-5;

a cutting chamber-6;

a lifting driving mechanism-7; a rotation shaft 71; a connecting rod-72; screw-73; a hand wheel-74;

a machine body-8;

sink-9.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the invention are shown in the drawings.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1-2, an embodiment of the present invention provides a multi-wire cutting slicer, comprising:

the multi-wire cutting unit comprises at least two rotating rollers 1 with axes arranged in parallel and cutting wires 4 which are wound between the rotating rollers 1 in a multi-turn parallel manner; for example, but not limited to, in this example, two rotating rollers 1 having axes parallel to each other are provided, and the cutting wire 4 is led out from the payout roller (payout direction in the drawing) and wound between the two rotating rollers 1 in a multi-turn parallel manner, and then wound on the take-up roller (take-up direction in the drawing). The cutting line 4 is driven to move by the rotation of the winding roller and/or the rotating roller 1 serving as a driving roller, and a workpiece (such as a silicon ingot, a silicon rod and the like) is cut by the cutting line 4 in a straight line state between the two rotating rollers 1 to form a sheet-shaped component (such as a silicon wafer). In this example, taking 6 turns as an example, each turn is parallel to each other so as to cut out sheet-like components with uniform thickness, the spacing between adjacent turns can be the same so as to cut out a plurality of sheet-like components with the same thickness at the same time, and in this example, four sheet-like components (such as silicon wafers) with the same thickness can be cut out at the same time; of course, the spacing between adjacent turns may also be varied to cut multiple sheets of varying thickness simultaneously.

Depending on the direction of the cutting line 4, a reversing wheel 5 can be provided in the path of travel of the cutting line 4 in order to change the direction of the cutting line 4. In addition, a tension wheel can be arranged in the action path of the cutting line 4 so as to enable the cutting line 4 to be in a tension state, thereby improving the cutting quality.

And the cleaning tank 2 is positioned below the multi-wire cutting unit.

At least part of the cutting line 4 at the lower part of the multi-wire cutting unit is positioned in the cleaning tank 2 and below the liquid level of the cleaning tank 2, so that when the cutting line 4 passes through the cleaning tank 2, the liquid in the cleaning tank 2 cleans the cutting line 4, and silicon scraps are peeled off from the cutting line 4 to restore the cutting capability of the cutting line 4.

According to the scheme, due to the fact that the cleaning tank 2 is arranged, at least part of the cutting line 4 at the lower part of the multi-wire cutting unit is located in the cleaning tank 2 and below the liquid level of the cleaning tank 2, then in the cutting process, when the cutting line 4 moves to the cleaning tank 2, liquid in the cleaning tank 2 can clean the cutting line 4 so as to wash away silicon chips attached to the surface of the cutting line 4, the problems of reduction in cutting grain cutting edge height and cutting edge density on the surface of the cutting line 4 caused by the silicon chips attached to the surface of the cutting line 4 are avoided, and the cutting line 4 is enabled to recover to the cutting capacity of the best after passing through the cleaning tank 2 so as to ensure the cutting efficiency and the quality of the sliced surface. In addition, since the cutting ability is recovered after the dicing line 4 is cleaned, the line consumption of the dicing line 4 can also be reduced.

In addition, because the cleaning tank is located below the multi-wire cutting unit, correspondingly, the cutting wire of the multi-wire cutting unit can not pass through the tank wall of the cleaning tank 2, and therefore, a wire passing hole (tank) is not required to be arranged on the tank wall of the cleaning tank 2, friction possibly existing on the cutting wire by the tank wall is avoided, abrasion of the cutting wire is reduced, and the service life of the cutting wire is prolonged. Meanwhile, as no wire passing holes (grooves) are needed to be arranged on the groove wall of the cleaning groove, the processing complexity of the cleaning groove is reduced, and no matter in the initial maintenance or the subsequent maintenance, the cutting wire 4 does not need to pass through the wire passing holes (grooves) when the cutting wire 4 is wound on the rotating roller 1, but the cutting wire 4 is directly wound between the rotating rollers 1, so that the installation difficulty and the labor intensity of the subsequent maintenance are reduced.

As an implementation manner, in order to improve the cleaning capability of the cutting line 4, an ultrasonic generator 3 is disposed in the cleaning tank 2; the ultrasonic generator 3 emits ultrasonic waves when in operation, and peels off the silicon chips from the cutting line 4 by cavitation, acceleration and direct flow of the ultrasonic waves in the liquid of the cleaning tank 2 to restore the cutting ability of the cutting line 4. Wherein, the ultrasonic generator 3 adopts the ultrasonic generator 3 with adjustable frequency.

As an achievable way, see also fig. 3, in this example, the multi-wire cutting unit comprises three said rotating rollers 1, the three said rotating rollers 1 being arranged in an inverted triangle. The inverted triangle arrangement means that, among the three rotating rollers 1, two are located above and one is located below. The cutting line 4 sequentially bypasses the three rotating rollers 1, and at least part of the cutting line 4 wound on the rotating rollers 1 positioned below the three rotating rollers 1 is positioned in the cleaning tank 2 and below the liquid surface of the cleaning tank 2. The three rotating rollers 1 are arranged in an inverted triangle, a workbench is arranged between the three rotating rollers 1, a workpiece is placed on the workbench and moves along with the workbench to cut and feed, and a cutting line 4 between the two rotating rollers 1 above cuts the workpiece. By adopting the way that the three rotating rollers 1 are arranged in the inverted triangle, the distance between the rotating rollers 1 can be adjusted without increasing the diameter of the rotating rollers 1, so that the cutter is suitable for cutting larger workpieces.

As an implementation manner, referring to fig. 4, the cleaning tank 2 includes a tank body 23, where the tank body 23 may be, for example and without limitation, a rectangular structure, and made of metal, plastic, etc., and two opposite sides of an opening of the tank body 23 are respectively provided with a flow guiding member 24, for example and without limitation, the flow guiding members 24 may be plate-shaped members, and each flow guiding member 24 is connected with a tank wall of the tank body 23 and extends upward from the opening; the multi-wire cutting unit is located between the flow guides 24 on opposite sides of the opening. Generally, during cutting, in order to protect the cutting line 4 from breakage due to overheating, a cutting liquid is supplied to a cutting position; the diversion pieces 24 are respectively arranged on two opposite sides of the groove body 23 to divert the cutting fluid flowing down from the cutting position, so that the cutting fluid is prevented from splashing and dripping outside the device, and the pollution of the working space is caused.

As an implementation manner, referring to fig. 5, in this example, the flow guiding members 24 on opposite sides of the opening extend obliquely upward in opposite directions, that is, the distance between the upper ends of the two flow guiding members 24 is greater than the distance between the lower ends, and with this structure, the size of the tank 23 can be reduced compared with the case where the two flow guiding members 24 are vertically arranged.

As an implementation manner, referring to fig. 6, a plurality of overflow holes 21 are provided on the groove wall of the groove body 23, and each overflow hole 21 penetrates through the groove wall and is disposed near the opening. In the cutting operation process, cutting fluid can continuously flow into the groove body 23 downwards from the cutting position, and through setting the overflow hole 21 at the opening part of the groove body 23, on the one hand, surplus cutting fluid can be discharged, on the other hand, the ultrasonic cleaning of the cutting line 4 can be prevented from being carried out due to the fact that the liquid level in the groove body 23 is too low.

As an implementation manner, each overflow hole 21 is disposed on a groove wall correspondingly connected to each flow guiding member 24, and is at least arranged in a row. In this example, the overflow apertures 21 are arranged in a row on the wall of the trough 23.

As an implementation manner, at least referring to fig. 4 or fig. 5, a lifting driving mechanism 7 is disposed below the tank 23, and the lifting driving mechanism 7 is used for driving the tank 23 to move in a vertical direction so as to adjust a position between the cutting line 4 and the liquid level, so that the cutting line 4 at the lower part of the multi-wire cutting unit can be completely immersed in the liquid for ultrasonic cleaning; the opening of the groove body 23 is provided with an arc groove 22 at a position different from the position where each flow guiding piece 24 is arranged, and among the three rotating rollers 1 arranged in an inverted triangle, the end part of the rotating roller 1 positioned below is positioned in the arc groove 22. By providing the arc-shaped groove 22 at the opening of the groove body 23 at a position different from the position where each of the guide members 24 is provided, the arc-shaped groove 22 provides a space for avoiding the occurrence of interference between the components for mounting the rotating roller 1 located below when the groove body 23 is adjusted up and down.

The lifting drive mechanism 7 may be a screw mechanism, an X-shaped rod mechanism, a pneumatic cylinder, a hydraulic cylinder, or the like. In this example, an X-shaped rod mechanism is adopted, which comprises a plurality of connecting rods 72 hinged in a crossing manner, the positions of the connecting rods 72 crossing each other are hinged through rotating shafts 71, two rotating shafts 71 are screwed with a screw rod 73, the end part of the screw rod 73 is fixedly connected with a hand wheel 74, the screw rod 73 can be driven to rotate by rotating the hand wheel 74, and the height of the X-shaped rod mechanism is adjusted by clockwise and anticlockwise rotation of the screw rod 73 so as to control the position of the groove 23 in the vertical direction.

As an implementation manner, referring to fig. 7 to 9, a converging slot 9 is disposed below the slot body 23, and a projection boundary of the converging slot 9 is larger than a projection boundary of the slot body 23 in a vertical projection direction. By arranging the converging groove 9 below the groove body 23, the liquid overflowed from the groove body 23 is collected, so that the collected liquid is deposited and filtered for recycling.

As an implementation manner, the multi-wire cutting slicing machine further comprises a cutting fluid supply pipe, wherein the cutting fluid supply pipe is positioned above the multi-wire cutting unit, a plurality of liquid outlets are formed in the cutting fluid supply pipe, and each liquid outlet is arranged towards the cutting wire 4 of the multi-wire cutting unit. The cutting fluid supply pipe is used for supplying cutting fluid to the cutting line 4 through each liquid outlet so as to conduct cutting during cutting and protect the cutting line 4. The type of the cutting fluid is not limited here.

As an implementation manner, the ultrasonic generator 3 is disposed at the bottom of the cleaning tank 2, so that a sufficient space and liquid above the ultrasonic generator can perform ultrasonic cleaning on the cutting line 4.

The structure of the multi-wire cutting slicer and its operation principle will be described in detail with one example.

As shown in fig. 5 to 9, the multi-wire cutting slicer of this example includes a body 8, a cutting chamber 6 is provided in the body 8, and a multi-wire cutting unit, a cleaning bath 2, and a lifting drive mechanism 7 are provided in the cutting chamber 6.

The multi-wire cutting unit comprises three rotating rollers 1, wherein the three rotating rollers 1 are arranged in an inverted triangle, namely, two of the three rotating rollers 1 are positioned above and one of the three rotating rollers is positioned below. A cutting line 4 is led out from the paying-off roll (in the drawing, the paying-off direction) and wound between the three rotating rolls 1 in a multi-turn parallel manner, that is, the cutting line 4 sequentially bypasses the three rotating rolls 1 and is wound in a plurality of turns, and the turns are parallel to each other and then wound on the winding roll (in the drawing, the winding direction). In order to control the course of the cutting line 4, a reversing wheel 5 may be provided in the path of travel of the cutting line 4 before the cutting line 4 is wound onto the turning roll 1 and after the cutting line 4 is wound off the turning roll, in order to change the course of the cutting line 4. The cutting line 4 is driven to move by the rotation of the winding roller and/or the rotating roller 1 serving as a driving roller, and a workpiece (such as a silicon ingot, a silicon rod and the like) is cut by the cutting line 4 in a straight line state between the two rotating rollers 1 above to form a sheet-shaped component (such as a silicon wafer).

The cleaning tank 2 is arranged below the multi-wire cutting unit, at least part of the lower part of the rotating roller 1 below the multi-wire cutting unit is positioned in the cleaning tank 2, and correspondingly, the cutting wire 4 positioned at the lower part of the rotating roller 1 is positioned in the cleaning tank 2 and below the liquid level of the cleaning tank 2. An ultrasonic generator 3 is arranged in the cleaning tank 2; the ultrasonic generator 3 emits ultrasonic waves when in operation, and peels off the silicon scraps from the cutting line 4 through cavitation, acceleration and direct flow action of the ultrasonic waves in the liquid of the cleaning tank 2 so as to restore the cutting capability of the cutting line 4 and complete ultrasonic cleaning of the cutting line 4.

In order to perform cutting and protect the cutting line 4 in the cutting process, the cutting line 4 is prevented from being too high in temperature and short, a cutting liquid supply pipe is arranged above the multi-wire cutting unit, a plurality of liquid outlets are arranged on the cutting liquid supply pipe, and each liquid outlet is arranged towards the cutting line 4 of the multi-wire cutting unit and used for supplying cutting liquid to a cutting position in the cutting process.

In order to prevent the cutting fluid from splashing, guide pieces 24 are respectively arranged at two opposite sides of the opening of the tank body 23 of the cleaning tank 2, for example, but not limited to, the guide pieces 24 can be plate-shaped components, and each guide piece 24 is connected with the tank wall of the tank body 23 and extends upwards from the opening; each rotating roller 1 of the multi-wire cutting unit is located between two guide members 24. The two guide members 24 extend obliquely upwards in opposite directions, that is, the distance between the upper ends of the two guide members 24 is greater than the distance between the lower ends, and by adopting the structure, compared with the vertical arrangement of the two guide members 24, the size of the groove body 23 can be reduced.

The tank wall of the tank body 23 is provided with a plurality of overflow holes 21, each overflow hole 21 penetrates through the tank wall, and the overflow holes 21 are arranged in a row on the tank wall at a position close to the opening. In the cutting operation process, cutting fluid can continuously flow into the groove body 23 downwards from the cutting position, and through setting the overflow hole 21 at the opening part of the groove body 23, on the one hand, surplus cutting fluid can be discharged, on the other hand, the ultrasonic cleaning of the cutting line 4 can be prevented from being carried out due to the fact that the liquid level in the groove body 23 is too low.

In order to adjust the position of the trough body 23 relative to the rotating roller 1 below, a lifting driving mechanism 7 is arranged below the trough body 23, the lifting driving mechanism 7 adopts an X-shaped rod mechanism, the X-shaped rod mechanism comprises a plurality of connecting rods 72 which are hinged in a crossing manner, the positions of the connecting rods 72 which are hinged in a crossing manner are hinged through rotating shafts 71, two rotating shafts 71 are screwed with a screw rod 73, the end part of the screw rod 73 is fixedly connected with a hand wheel 74, the screw rod 73 can be driven to rotate through rotating the hand wheel 74, and the height of the X-shaped rod mechanism is adjusted through clockwise and anticlockwise rotation of the screw rod 73 so as to control the position of the trough body 23 in the vertical direction. In order to prevent interference between the rotating roller 1 below and the groove body 23, an arc-shaped groove 22 is provided at the opening of the groove body 23 at a position different from the position at which each of the guide pieces 24 is provided.

In addition, a converging groove 9 is provided below the groove body 23, and the projected boundary of the converging groove 9 is larger than the projected boundary of the groove body 23 in the vertical projection direction. By arranging the converging groove 9 below the groove body 23, the liquid overflowed from the groove body 23 is collected, so that the collected liquid is deposited and filtered for recycling. The lifting driving mechanism 7 is arranged at the bottom of the reflux groove.

It is to be understood that the above references to the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are for convenience in describing the present invention and simplifying the description only, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.

Claims (10)

1. A multi-wire cutting slicer, comprising:

the multi-wire cutting unit comprises at least two rotating rollers with axes arranged in parallel and cutting wires wound between the rotating rollers in a multi-turn parallel manner;

the cleaning tank is positioned below the multi-wire cutting unit;

at least part of cutting lines at the lower part of the multi-wire cutting unit are positioned in the cleaning tank and below the liquid level of the cleaning tank.

2. The multi-wire cutting slicer of claim 1, wherein an ultrasonic generator is disposed within the cleaning tank.

3. The multi-wire cutting slicer according to claim 1 or 2, wherein the multi-wire cutting unit comprises three rotating rollers, the three rotating rollers are arranged in an inverted triangle, the cutting wire sequentially bypasses the three rotating rollers, and at least part of the cutting wire wound on the rotating roller positioned below among the three rotating rollers is positioned in the cleaning tank and is positioned below the liquid surface of the cleaning tank.

4. The multi-wire cutting slicer of claim 3 wherein the cleaning tank includes a tank body, wherein two opposite sides of an opening of the tank body are respectively provided with a flow guiding member, each flow guiding member is connected with a tank wall of the tank body and extends upwards from the opening; the multi-wire cutting unit is positioned between the guide pieces at two opposite sides of the opening.

5. The multi-wire cutting slicer of claim 4 wherein said flow guides on opposite sides of said opening extend obliquely upward in opposite directions.

6. The multi-wire cutting slicer of claim 5, wherein a plurality of overflow apertures are provided in a wall of the trough body, each of the overflow apertures extending through the trough wall and being positioned adjacent the opening.

7. The multi-wire cutting slicer of claim 6, wherein each of the overflow apertures is disposed on a slot wall correspondingly connected to each of the flow guides and is arranged in at least one row.

8. The multi-wire cutting slicer of claim 4, wherein a lift drive mechanism is disposed below the trough body, the lift drive mechanism being configured to drive the trough body to move in a vertical direction;

the opening of the groove body is provided with an arc groove at a position different from the position where each flow guide piece is arranged, and the end part of the rotating roller positioned below among the three rotating rollers arranged in an inverted triangle is positioned in the arc groove.

9. The multi-wire cutting slicer of claim 6, wherein a sink is disposed below the channel, and wherein a projected boundary of the sink is greater than a projected boundary of the channel in a vertical projection direction.

10. The multi-wire cutting slicer of claim 2, wherein the ultrasonic generator is disposed at a bottom of the wash tank.

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