CN115885017B - 热塑性树脂组合物、部件及其制造方法以及热塑性树脂组合物的导电性表达方法 - Google Patents

热塑性树脂组合物、部件及其制造方法以及热塑性树脂组合物的导电性表达方法 Download PDF

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Publication number
CN115885017B
CN115885017B CN202180046675.8A CN202180046675A CN115885017B CN 115885017 B CN115885017 B CN 115885017B CN 202180046675 A CN202180046675 A CN 202180046675A CN 115885017 B CN115885017 B CN 115885017B
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thermoplastic resin
resin composition
mass
parts
resin
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Chinese (zh)
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CN115885017A (zh
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神田裕基
门间智宏
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Polyplastics Co Ltd
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Polyplastics Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00Compositions of polyacetals; Compositions of derivatives of polyacetals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180046675.8A 2020-06-30 2021-05-31 热塑性树脂组合物、部件及其制造方法以及热塑性树脂组合物的导电性表达方法 Active CN115885017B (zh)

Applications Claiming Priority (3)

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JP2020112469 2020-06-30
JP2020-112469 2020-06-30
PCT/JP2021/020683 WO2022004235A1 (ja) 2020-06-30 2021-05-31 熱可塑性樹脂組成物、部材及びその製造方法、並びに熱可塑性樹脂組成物の導電性発現方法

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CN115885017A CN115885017A (zh) 2023-03-31
CN115885017B true CN115885017B (zh) 2024-08-23

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JP (1) JP7510504B2 (enrdf_load_stackoverflow)
CN (1) CN115885017B (enrdf_load_stackoverflow)
WO (1) WO2022004235A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7658726B2 (ja) * 2020-07-10 2025-04-08 ポリプラスチックス株式会社 熱可塑性樹脂組成物及び部材、並びに熱可塑性樹脂組成物からなる部材の製造方法及び機械強度の向上方法
WO2022075107A1 (ja) * 2020-10-09 2022-04-14 ポリプラスチックス株式会社 ポリアセタール樹脂組成物及び自動車部品
CN116783245A (zh) * 2020-12-23 2023-09-19 宝理塑料株式会社 聚缩醛树脂组合物以及燃料接触体
EP4585653A1 (en) * 2022-09-08 2025-07-16 DIC Corporation Conductive resin composition, master batch, molded body, and production methods therefor
WO2024083686A1 (en) * 2022-10-17 2024-04-25 Dsm Ip Assets B.V. Electrically conductive polymer composition, process for preparation and moulding, and articles made thereof

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US5591382A (en) * 1993-03-31 1997-01-07 Hyperion Catalysis International Inc. High strength conductive polymers
JP2007112885A (ja) 2005-10-19 2007-05-10 Bussan Nanotech Research Institute Inc 熱可塑性エラストマー組成物
JP2007119647A (ja) 2005-10-28 2007-05-17 Bussan Nanotech Research Institute Inc 複合材料
KR100706651B1 (ko) * 2006-12-22 2007-04-13 제일모직주식회사 전기 전도성 열가소성 수지 조성물 및 플라스틱 성형품
JP5596336B2 (ja) 2009-12-24 2014-09-24 ポリプラスチックス株式会社 ポリアセタール樹脂組成物の製造方法
JP2012140482A (ja) 2010-12-28 2012-07-26 Hodogaya Chem Co Ltd ポリアセタール樹脂/カーボンナノチューブ導電性樹脂複合材料
JP5616943B2 (ja) * 2012-02-21 2014-10-29 大日精化工業株式会社 導電性樹脂組成物の製造方法及び導電性樹脂組成物
JP5489184B2 (ja) 2012-04-18 2014-05-14 テックワン株式会社 分岐型炭素繊維、分岐型炭素繊維製造方法、前記分岐型炭素繊維を有する材
KR101654405B1 (ko) 2013-12-06 2016-09-05 주식회사 엘지화학 기계적 물성이 개선된 복합재 및 이를 함유하는 성형품
KR102376598B1 (ko) * 2017-02-28 2022-03-21 미쓰이 가가쿠 가부시키가이샤 도전성 수지 조성물, 그의 제조 방법 및 그로부터 얻어지는 성형체
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碳纳米管改性热塑性抗静电复合材料的制备和性能研究;常艺;《中国优秀硕士论文全文数据库 工程科技I辑》;摘要及正文第22-29页 *

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WO2022004235A1 (ja) 2022-01-06
CN115885017A (zh) 2023-03-31
JP7510504B2 (ja) 2024-07-03

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