CN115821214A

CN115821214A - Tool jig and jig assembly for film forming

Info

Publication number: CN115821214A
Application number: CN202310015685.6A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: New Meguiar Suzhou Semiconductor Technology Co ltd
Current assignee: New Meguiar Suzhou Semiconductor Technology Co ltd
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-03-21
Anticipated expiration: 2043-01-06
Also published as: CN115821214B

Abstract

The invention provides a tool jig for film forming and a jig assembly. The jig is used for supporting and carrying a substrate and comprises a carrier, a bottom gasket and a peripheral gasket. The carrier comprises a frame body and a bottom support, the bottom support is arranged in the frame body and positioned at the lower part of the frame body, and the bottom support is provided with a window; the lower end face of the bottom gasket is attached to the bottom support, the upper end face of the bottom gasket and the inner circumferential surface of the bottom gasket are intersected on an upper edge line, the upper edge line is higher than other areas of the upper end face of the bottom gasket, a groove is formed in the upper end face of the bottom gasket, and the groove wall of the groove extends to an upper edge line; the peripheral gasket is arranged on the inner peripheral wall of the frame body; when the substrate is loaded on the carrier, the substrate is accommodated in a space formed by the bottom gasket and the peripheral gasket, the lower surface of the substrate is in sealing fit with the upper edge line, and the part of the lower surface of the substrate exposed to the window forms an evaporation area. The invention can improve the quality of the coating of the substrate.

Description

Tool jig and jig assembly for film forming

Technical Field

The invention relates to the technical field of physical vapor deposition, in particular to a tool jig for film forming and a jig assembly.

Background

The vapor deposition is a process method which adopts a certain heating evaporation mode to evaporate and gasify the film material under the vacuum condition, and the particles fly to the surface of the substrate to be condensed into a film, has the advantages of simple film forming mode, high film purity and compactness, unique film structure and performance and the like, and is widely applied to industrial production. During vapor deposition, the substrate is supported from the edge by the carrier, and the surface to be vapor deposited is exposed. Loading and unloading are typically performed manually or by a robot that places the substrate into or removes the substrate from the carrier.

For brittle substrates with large mass, the substrate and the carrier are easy to rub and collide with each other, thereby causing damage. In the prior art, generally, a gasket is arranged on the surface of the carrier contacting with the substrate to prevent collision. However, this solution is not ideal and is characterized by:

1. because the evaporation is performed under a high-temperature condition, the gasket is required to be ensured to be free of pollution at the high temperature, materials such as PEEK (Poly-ether-ketone) and PTFE (polytetrafluoroethylene) are generally selected, a gap exists between the gasket and the substrate, the film material can be evaporated to the contact surface of the gasket and the substrate, and a film is formed at the part which does not need to be coated;

2. for a substrate with large mass, no buffer exists during putting in and taking out, friction is easy to occur between the substrate and a gasket, and the substrate is difficult to take out after film evaporation is completed.

Disclosure of Invention

The present invention provides a tool fixture and a fixture assembly for forming a thin film, which can solve some or all of the problems of the prior art.

The first aspect of the present disclosure provides a tool jig for film forming for holding a substrate, the tool jig includes:

the carrier comprises a frame body and a bottom support, the bottom support is arranged in the frame body and is positioned at the lower part of the frame body, and the bottom support is provided with a window;

the bottom gasket is placed on the bottom support, the upper end face of the bottom gasket and the inner peripheral surface of the bottom gasket are intersected on an upper edge line, the upper edge line is higher than other areas of the upper end face of the bottom gasket, a groove is formed in the upper end face of the bottom gasket, and the groove wall of the groove extends to the upper edge line;

the peripheral surface gasket is arranged on the inner peripheral wall of the frame body;

when the substrate is loaded on the carrier, the substrate is accommodated in a space formed by the bottom gasket and the peripheral gasket, the lower surface of the substrate is in sealing fit with the upper edge line, and the part of the lower surface of the substrate exposed to the window forms an evaporation area.

The utility model provides a frock tool for film shaping, through set up the recess on the bottom surface packing ring, make the cell wall of recess extend to the last sideline of bottom surface packing ring, because the last sideline is higher than other parts of bottom surface packing ring, when the base plate is placed in the bottom surface packing ring, the last sideline contacts with the base plate earlier, the bottom surface packing ring warp under the action of gravity of base plate, the setting of recess has increased the deformation space of bottom surface packing ring, make the top sideline can compress tightly sealed with the base plate, prevent that the coating material from spilling over to the contact surface of base plate and bottom surface packing ring, avoid forming the film at the part that the base plate does not need the coating film, promote product quality.

Optionally, the inner circumferential surface of the bottom gasket is inclined from the lower end surface of the bottom gasket to the upper end surface of the bottom gasket, and an included angle between the inner circumferential surface of the bottom gasket and the upper end surface of the bottom gasket is an acute angle. Set up the inner peripheral surface slope of collet, reduce the collet to the stopping of coating by vaporization material, can make coating by vaporization material pass through the window deposit on the base plate more easily.

Optionally, a protrusion is arranged on one side, located on the window, of the upper surface of the bottom support, and surrounds the window, and the protrusion is used for supporting the bottom gasket.

Optionally, a boss is arranged on the lower end face of the bottom gasket, the boss surrounds the inner circumferential surface of the bottom gasket, and the outer circumferential surface of the boss is attached to the inner circumferential surface of the bottom support. The boss is used for the location when the bottom surface packing ring is placed at the carrier.

Optionally, the circumferential gasket is surrounded by a strip gasket, and two ends of the strip gasket are inclined planes matched with each other. Compare in closed annular packing ring, this global packing ring is installed through the end butt joint, and its easy operation is convenient to can compensate the size change that the packing ring expend with heat and contract with cold and arouse, improve the degree of adaptability of global packing ring and carrier.

Optionally, the carrier further includes a connection lug and a hanging piece, the connection lug is disposed on the upper portion of the frame body, and the hanging piece is connected with the connection lug. The jig is arranged in the film steaming cavity through the hanging piece.

Optionally, a plurality of centrally symmetrical threaded holes are formed in the frame body, and the threaded holes are matched with the jackscrews to adjust the coaxiality of the substrate and the carrier. The coaxiality between the base plate and the carrier can be adjusted by pushing the base plate through the external part penetrating into the threaded hole.

The second aspect of the disclosure provides a jig assembly for film forming, which comprises a feeding and discharging auxiliary part and the jig assembly for film forming of the first aspect, wherein the feeding and discharging auxiliary part comprises a mounting plate and a plurality of pin shafts arranged on the mounting plate, and the lower ends of the pin shafts are connected with the mounting plate; the bottom support is provided with first through holes for the pin shafts to penetrate through, and the first through holes correspond to the pin shafts one to one. The utility model provides a tool assembly for film forming, go up unloading auxiliary member on the basis of above-mentioned tool assembly for film forming collocation, through making the round pin axle on the mounting panel pass the first through-hole on the carrier, utilize the flexible pad on round pin axle top to lift the base plate, place the base plate on the carrier or ejecting carrier, the base plate is placed and is taken out the process and can be simplified, and intensity of labour has been reduced, and place and take out in-process base plate and supported the carrier, with packing ring friction and collision when avoiding the product to go up the unloading, reduce the damage of unloading in-process, do benefit to and promote the product yield.

Optionally, the bottom gasket is provided with second through holes for the pin shafts to pass through, and the second through holes correspond to the pin shafts one to one; the bottom support is further provided with a plugging piece used for plugging the first through hole, and the plugging piece is detachably connected with the first through hole. Establish the second through-hole on the bottom surface packing ring, the round pin axle can pass first through-hole and second through-hole with base plate jack-up or put down, when needs coating by vaporization, utilize shutoff piece shutoff second through-hole, prevent to plate the material and get into bottom surface packing ring and base plate contact site, after the coating by vaporization finishes, lift off the shutoff piece, adopt the mode that the round pin axle passed first through-hole and second through-hole with the good base plate of coating by vaporization ejecting equally, accomplish the separation of base plate and carrier.

Optionally, the second through hole is communicated with the groove. The groove is formed in the upper end face of the bottom gasket, gas can be contained in the groove to enable the substrate to be tightly attached to the upper edge line of the bottom gasket in the process of placing the substrate on the bottom gasket, the groove is further formed to be connected with the second through hole, the gas can overflow from the second through hole through the groove, a gas gap between the substrate and the bottom gasket at the attaching position is eliminated, the sealing performance between the upper edge line and the substrate is improved, and the coating materials are prevented from overflowing.

The implementation of the scheme has the following beneficial effects:

1. the groove on the bottom gasket extends to the upper edge line, the upper edge line is higher than other parts of the bottom gasket, the bottom gasket deforms under the action of gravity of the substrate after the substrate is placed, the upper edge line and the substrate are tightly pressed, the plating material is prevented from overflowing, and the plating quality is guaranteed.

2. The groove can contain air, so that the air is prevented from being retained on the contact surface of the bottom gasket and the substrate, and the bottom gasket is ensured to be tightly attached to the substrate.

3. The feeding and discharging auxiliary piece is arranged, so that the friction collision between the product and the bottom washer and the peripheral face washer during feeding and discharging of the product is further avoided, the damage in the feeding and discharging process is reduced, and the labor intensity is reduced.

4. The second through-hole intercommunication recess on the bottom surface packing ring, when placing the base plate, the air can be discharged from the second through-hole through the recess, promotes the laminating degree of bottom surface packing ring and base plate.

Drawings

Fig. 1 is an exploded view of a tooling fixture for film formation according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a tool fixture for film forming provided in the embodiment of the present disclosure;

fig. 3 is a schematic cross-sectional structure view of a tool fixture for film formation according to an embodiment of the disclosure;

FIG. 4 is an enlarged view of the portion V of FIG. 3;

FIG. 5 is an enlarged view of a portion of FIG. 4;

FIG. 6 is a schematic view of one construction of a bottom gasket;

FIG. 7 is a schematic view of one construction of a bottom gasket;

FIG. 8 is a schematic cross-sectional view of the bottom gasket of FIG. 7;

FIG. 9 is an enlarged view of section VII of FIG. 8;

FIG. 10 is a schematic view of a peripheral gasket;

fig. 11 is an exploded view of a jig assembly for film formation according to an embodiment of the present disclosure.

In the figure:

100 carriers, 101 frame bodies, 102 bottom supports, 103 windows, 104 upper surfaces of the bottom supports, 105 bulges, 106 first through holes, 107 connecting lugs, 108 connecting holes, 109 gaps, 110 threaded holes,

200 bottom gasket, 201 bottom gasket lower end surface, 202 bottom gasket upper end surface, 203 bottom gasket inner surface, 204 upper edge line, 205 groove, 206 boss, 207 boss inner surface, 208 boss outer surface, 209 lower edge line, 210 second through hole, 211 bottom gasket outer surface,

300 peripheral gasket, 301 peripheral gasket outer peripheral surface, 302 peripheral gasket inner peripheral surface, 303 first end, 304 second end, 305 first end, 306 second end,

400 substrate, 401 the outer peripheral surface of the substrate, 402 the lower surface of the substrate,

500 hanging pieces, 501 hanging hooks, 502 locating pins, 503 pin rods, 504 pin covers,

600 go up unloading auxiliary member, 601 mounting panel, 602 round pin axle, 603 flexblepads.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are used only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have specific orientations, be constructed in specific orientations, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

Example one

Referring to fig. 1, the tooling fixture for film forming according to the present embodiment is used to support a substrate 400, and includes a carrier 100, a bottom gasket 200, and a peripheral gasket 300. The carrier 100 includes a frame 101 and a bottom base 102, the bottom base 102 is disposed in the frame 101 and is located at a lower portion of the frame 101, wherein the frame 101 and the bottom base 102 may be integrally formed, or may be assembled, and in this embodiment, are integrally formed. The shoe 102 is provided with a window 103 for exposing the surface to be plated of the substrate 400. The lower end surface 201 of the bottom gasket is attached to the shoe 102, the upper end surface 202 of the bottom gasket intersects with the inner circumferential surface 203 of the bottom gasket at an upper edge line 204, the upper edge line 204 is higher than other areas of the upper end surface 202 of the bottom gasket, the upper end surface 202 of the bottom gasket is provided with a groove 205, the groove 205 surrounds the inner circumferential surface 203 of the bottom gasket, and the groove wall of the groove 205 extends to the upper edge line 204. The peripheral gasket 300 is provided in the housing 101, and an outer peripheral surface 301 of the peripheral gasket is bonded to the housing 101. When the substrate 400 is mounted on the carrier 100, the outer peripheral surface 401 of the substrate is in close contact with the inner peripheral surface 302 of the peripheral gasket, the lower surface 402 of the substrate is in sealing contact with the upper edge 204 of the bottom gasket 200, and the portion of the lower surface 402 of the substrate exposed to the window 103 forms a vapor deposition region.

One or more grooves 205 may be formed on the bottom gasket 200 to ensure that the bottom gasket 200 can deform enough to ensure sealing after the substrate 400 is placed. Specifically, the grooves 205 may be distributed along the circumferential direction of the bottom gasket 200, and when only one groove is provided, the groove 205 may be a closed or non-closed annular groove distributed along the circumferential direction of the bottom gasket 200, and when a plurality of grooves 205 are provided, the plurality of grooves are spaced apart along the circumferential direction of the bottom gasket 200.

The peripheral gasket 300 is used to prevent the outer peripheral surface of the substrate from contacting the inner peripheral surface of the carrier, and the peripheral gasket 300 may be placed on the bottom gasket 200 or may surround the outer periphery of the bottom gasket 200.

In the embodiment, the groove 205 is formed in the bottom gasket 200, so that the groove wall of the groove 205 extends to the upper edge line 204 of the bottom gasket 200, and since the upper edge line 204 is higher than other parts of the bottom gasket 200, when the substrate 400 is placed on the bottom gasket 200, the upper edge line 204 is firstly contacted with the substrate 400, and the bottom gasket 200 deforms under the action of gravity of the substrate 400, so that the upper edge line 204 can be pressed and sealed with the substrate 400, the plating material is prevented from overflowing to the contact surface between the substrate 400 and the bottom gasket 200, a thin film is prevented from being formed on the part of the substrate 400 where the plating is not needed, and the product quality is improved. The groove 205 provides more deformation allowance for the bottom gasket 200, which can improve the sealing effect between the bottom gasket 200 and the upper edge 204, and the groove 205 can contain a small amount of air to prevent the air from being trapped on the contact surface between the bottom gasket 200 and the substrate 400 to form a gap.

In one possible implementation, referring to fig. 5, the inner circumferential surface 203 of the bottom gasket is inclined from the lower end surface 201 of the bottom gasket to the upper end surface 202 of the bottom gasket, and the included angle between the inner circumferential surface 203 of the bottom gasket and the upper end surface 202 of the bottom gasket is an acute angle. The upper surface 104 of the shoe is provided with a protrusion 105, the protrusion 105 surrounds the window 103, the lower end surface 201 of the bottom washer is attached to the upper surface 104 of the shoe, and the inner peripheral surface 203 of the bottom washer is attached to the protrusion 105. The inner peripheral surface 203 of the bottom gasket can be supported by the protrusion 105 on the upper surface of the bottom support 102, the upper edge line 204 of the bottom gasket 200 is always higher than other parts of the upper end surface 202 of the bottom gasket, when the substrate 400 is placed on the bottom gasket 200, the bottom gasket 200 is located between the bottom support 102 and the substrate 400, the inner annular surface of the bottom gasket 200 is supported by the protrusion 105, and the upper edge line 204 of the bottom gasket 200 is deformed by the extrusion of the substrate 400 as the highest point of the upper end surface of the bottom gasket 200, so as to be hermetically attached to the substrate 400. In the process that the base plate 400 presses the bottom gasket 200 to deform the bottom gasket 200, the groove 205 can contain a small amount of air, so that the air is prevented from being trapped between the base plate 400 and the upper end face of the bottom gasket 200 to form a gap, and the sealing performance between the upper edge line 204 and the base plate 400 is improved. When the air receiving amount needs to be increased, the volume of the groove 205 may be increased, for example, the depth or width of the groove 205 may be increased while ensuring the strength of the floor gasket 200, or even the thickness of the floor gasket 200 may be increased.

In another possible implementation, referring to fig. 9, the inner circumferential surface 203 of the bottom gasket is inclined from the lower end surface 201 of the bottom gasket to the upper end surface 202 of the bottom gasket, and the included angle between the inner circumferential surface 203 of the bottom gasket and the upper end surface 202 of the bottom gasket is an acute angle. The lower end surface 201 of the bottom washer is provided with a boss 206, the boss 206 surrounds the inner circumferential surface 203 of the bottom washer, the inner circumferential surface 207 of the boss is connected with the inner circumferential surface 203 of the bottom washer, the outer circumferential surface 208 of the boss is attached to the inner circumferential surface of the shoe 102, and the lower end surface 201 of the bottom washer is attached to the upper surface 104 of the shoe. The boss 206 is of unitary construction with the bottom gasket 200. The lower end surface of the bottom gasket 200 is provided with a boss 206, and when the bottom gasket 200 is placed on the carrier 100, the boss 206 is attached to the carrier 100 to play a role in quick positioning, so that the efficiency of installing the bottom gasket 200 on the carrier is improved. Further, the inner circumferential surface 207 of the boss intersects the outer circumferential surface 208 of the boss at a lower line 209, and both the inner circumferential surface 203 of the bottom gasket and the inner circumferential surface 207 of the boss are located within a plane defined by the lower line 209 and the upper line 204.

In a possible implementation manner, a first chamfer is provided between the outer peripheral surface 211 of the bottom gasket and the lower end surface 201 of the bottom gasket, and the first chamfer may be a straight chamfer or a curved chamfer. When the bottom gasket 200 is mounted on the carrier 100, the first chamfer can guide the bottom gasket 200 to smoothly enter the frame 101, thereby improving the convenience of mounting the bottom gasket 200.

Further, the inner circumferential surface of the shoe 102 slopes from the lower surface of the shoe 102 to the upper surface 104 of the shoe, and the included angle formed between the inner circumferential surface of the shoe 102 and the upper surface 104 of the shoe is an acute angle. As can be seen from the above, the portion of the lower surface 402 of the substrate exposed to the window 103 of the base plate 102 is the evaporation region, and the inner circumferential surface of the base plate 102 is disposed in an inclined manner, so that the blocking of the evaporation material by the base plate 102 is reduced, and the evaporation material can be more easily deposited on the substrate 400 through the window 103.

In a possible implementation manner, the circumferential gasket 300 is formed by surrounding a strip-shaped gasket, and two ends of the strip-shaped gasket are inclined planes matched with each other. Specifically, referring to fig. 10, the circumferential gasket 300 includes a first end 303, a second end 304, a first end 305, and a second end 306; the first end face 305 is opposite to the second end face 306, the first end face 303 connects the first end face 305 with the second end face 306 and forms an acute angle with the first end face 305, the second end face 304 connects the first end face 305 with the second end face 306 and forms an acute angle with the second end face 306, and the first end face 303 is in butt joint with the second end face 304. Wherein the first end face 305 and the second end face 306 are parallel to each other. In the present embodiment, the circumferential gasket 300 is mounted on the carrier 100 in a manner that the two ends are butted against each other, so that the degree of adhesion between the circumferential gasket 300 and the frame 101 and the substrate 400 can be improved, and more space is provided for adjusting the size of the circumferential gasket 300. Even global packing ring takes place expend with heat and contract with cold because of the temperature difference reason, this structure still is applicable to the global protection of base plate to, install global packing ring with the end butt joint mode, its easy operation is convenient, and is efficient.

In a possible implementation manner, the second end face 306 of the circumferential gasket 300 is in contact with the upper end face 202 of the bottom gasket, a second chamfer is provided between the first end face 305 of the circumferential gasket 300 and the inner circumferential face 302 of the circumferential gasket, and the outer circumferential face 401 of the substrate can smoothly enter the circumferential gasket 300 along the second chamfer of the circumferential gasket 300 in the process that the substrate 400 is placed on the circumferential gasket 300 from top to bottom. Wherein, the second chamfer can be a straight chamfer or a curved chamfer.

Referring to fig. 1, in a possible implementation manner, a plurality of central symmetric threaded holes 110 are formed in a frame 101, and the threaded holes 110 cooperate with a jackscrew to adjust the coaxiality between the substrate 400 and the carrier 100. The threaded hole can be matched with a jackscrew for use, so that the position of the adjustable substrate is pushed, and the concentricity of the adjustable substrate and the jackscrew is adjusted.

The carrier 100 further comprises a connecting ear 107 and a hanging piece 500, wherein the connecting ear 107 is arranged at the upper part of the frame body 101, and the hanging piece 500 is connected with the connecting ear 107. The jig provided by the embodiment can be installed in the film steaming cavity through the hanger 500. Referring to fig. 1, in a possible implementation manner, a connection hole 108 and a notch 109 communicating with the connection hole 108 are provided on the connection lug 107; the pendant 500 comprises a hook 501 and a positioning pin 502, the positioning pin 502 comprises a pin rod 503 and a pin cover 504, the pin rod 503 is connected with the pin cover 504 and the hook 501, the pin rod 503 can enter or exit the connecting hole 108 from the notch 109, and the pin cover 504 and the hook 501 can block the connecting lug 107 from being separated from the pin rod 503. In this embodiment, the cooperation can be dismantled with engaging lug 107 to locating pin 502, and the dismouting is convenient, and it is more convenient to use.

The material of the carrier 100 may be 7075 aluminum alloy, 6061 aluminum alloy, 304 stainless steel, or other metal alloy materials with high temperature resistance and high carrying capacity. The material of the bottom gasket 200 and the peripheral gasket 300 may be plastic suitable for a high-temperature vacuum plasma environment, such as PEEK or PTFE. The film forming tool provided by the embodiment can be used for evaporating Si and SiO on disc-shaped and ceramic products ₂ 、SiN、YbF ₃ 、TiO ₂ 、Y ₂ O ₃ And the film can also be used for coating operation of other materials (such as glass and metal) and other shapes (such as square and special-shaped).

The feeding and discharging process of the embodiment is as follows: during feeding, the carrier 100 is located on a platform or the ground outside the film evaporation cavity, the bottom gasket 200 and the peripheral gasket 300 are located on the carrier 100, the substrate 400 is moved to the position right above the bottom gasket 200 through a manual or mechanical arm and is gradually placed downwards, the peripheral gasket 300 plays a role in protection in the process until a workpiece is placed on the bottom gasket 200, the gravity of the substrate 400 enables the upper line 204 of the inner peripheral surface of the bottom gasket to be in close contact with the lower surface of the substrate 400, and air retained in the two contact surfaces is extruded into the groove 205. Then, the carrier 100 is lifted by the lifting appliance into the film steaming cavity, and is hung by the hook 501 at a fixed position in the film steaming cavity. During blanking, the carrier 100 is moved out to the platform or the ground by the lifting tool, and the workpiece is taken out manually or by a mechanical arm.

Example two

Referring to fig. 11, the jig assembly includes a feeding auxiliary member and the jig assembly for film forming of the above embodiment, the feeding auxiliary member 600 includes a mounting plate 601 and a plurality of pins 602 disposed on the mounting plate 601, the lower ends of the pins 602 are connected to the mounting plate 601, and the upper ends of the pins 602 are provided with flexible pads 603; the bottom support 102 is provided with first through holes 106 for the pin shafts 602 to pass through, and the first through holes 106 are in one-to-one correspondence with the pin shafts 602. The bottom gasket 200 is provided with second through holes 210 for the pin shafts 602 to pass through, the second through holes 210 correspond to the pin shafts 602 one by one, and the second through holes 210 are communicated with the grooves 205; the bottom support 102 is further provided with a blocking piece for blocking the first through hole 106, and the blocking piece is detachably connected with the first through hole 106. The plugging member may be a plating-proof material adhered to the first through hole 106, for example, an aluminum foil with a double-sided high temperature adhesive is used for plugging, or a plug made of a high temperature resistant material.

The feeding and discharging process of the embodiment is as follows: the mounting plate 601 is placed on the lifting table, the position of the carrier 100 is fixed, when the substrate 400 is placed, the mounting plate 601 drives the pin shaft 602 to ascend, after the pin shaft 602 sequentially passes through the first through hole 106 on the bottom support 102 and the second through hole 210 on the bottom gasket 200, the flexible pad 603 at the upper end of the pin shaft 602 is in contact with the lower end face of the substrate 400; then, the mounting plate 601 slowly descends, the substrate 400 is placed on the bottom gasket 200, the mounting plate 601 continuously descends and returns to the lifting table, the pin shaft 602 is separated from the carrier 100 at the moment, then the blocking piece is used for blocking the first through hole 106 on the bottom support 102, then the hoisting mechanism transfers the carrier 100, the substrate 400 and the like to the coating chamber through the hook 501, after coating is completed, the carrier 100 and the substrate 400 move to the upper part of the auxiliary component under the driving of the hoisting mechanism, the blocking piece is taken down, and the first through hole 106 and the second through hole 210 of the pin shaft 602 are ejected out of the substrate 400.

The utility model provides a tool assembly for film forming, collocation goes up unloading auxiliary member 600 on the basis of the tool assembly for film forming of embodiment one, through making round pin axle 602 on the mounting panel 601 pass first through-hole 106 on the carrier 100 and second through-hole 210 on the bottom surface packing ring 200, utilize the flexible pad 603 at round pin axle 602 top to lift the base plate 400, place base plate 400 on carrier 100 or ejecting carrier 100, the base plate 400 is placed and is taken out the process and can be simplified, labor intensity is reduced, and place and take out in-process base plate 400 and be held in the palm, avoid the product go up unloading in-process with packing ring friction collision, reduce the damage of going up unloading in-process, do benefit to and promote the product yield. And, the pin 602 is communicated with the second through hole 210 of the bottom gasket 200, which facilitates the discharge of air when the substrate 400 is placed.

EXAMPLE III

The present embodiment provides a jig assembly for film formation, which is different from the jig assembly for film formation of the second embodiment in that: the second through-holes 210 in the bottom washer 200 are eliminated and the number of pins 602 is increased, correspondingly increasing the number of first through-holes 106 in the shoe 102. The pin shafts 602 act directly on the bottom washer 200, increasing the number of pins enables the bottom washer 200 to bear the weight of the base plate 400, and since the base plate 400 is heavy, if the number of pin shafts 602 is small, the bottom washer 200 is easily deformed and broken when being stressed. In this embodiment, since the bottom gasket 200 has no through hole, it is not necessary to seal the first through hole 106 of the carrier 100.

The feeding and discharging process of the embodiment is as follows: during feeding, the carrier 100 is located on a platform or the ground outside the film steaming cavity, the bottom gasket 200 and the peripheral gasket 300 are located on the carrier 100, the pin shaft 602 upwards jacks up the bottom gasket 200, the substrate 400 is moved to the position right above the bottom gasket 200 through a manual or mechanical arm and gradually placed downwards, the peripheral gasket 300 plays a role in protection in the process until the substrate 400 is placed on the bottom gasket 200, the pin shaft 602 synchronously and slowly moves downwards until the bottom gasket 200 is completely contacted with the bottom of the carrier 100, the gravity of the substrate 400 enables the upper line 204 of the bottom gasket to be tightly contacted with the bottom of the substrate 400, and air retained in the two contact surfaces is extruded into the groove 205. Then, the carrier 100 is hoisted into the film steaming cavity by the hoisting tool, and is hung at a fixed position in the film steaming cavity by the hook 501. During blanking, the carrier 100 is moved out of the upper blanking auxiliary assembly by the lifting appliance, the pin shaft 602 abuts against the bottom gasket 200, the substrate 400 is jacked up along with the bottom gasket 200 in the process of placing the lifting appliance, and the workpiece is taken out manually or by a mechanical arm.

The utility model provides a tool assembly for film forming, on the basis of above-mentioned tool assembly for film forming with the unloading auxiliary member 600 of collocation, through making round pin axle 602 on the mounting panel 601 pass the first through-hole 106 on the carrier 100, utilize the flexible pad 603 at round pin axle 602 top to lift base plate 400, place base plate 400 on carrier 100 or ejecting carrier 100, base plate 400 is placed and is taken out the process and can be simplified, labor intensity is reduced, and place and take out in-process base plate 400 by the support, when avoiding the product to go up unloading and the collision of gasket friction, reduce the damage of going up the unloading in-process, do benefit to and promote the product yield.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements and substitutions will now be apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. The utility model provides a frock tool for film forming for ask and carry base plate (400), its characterized in that, frock tool includes:

the carrier (100) comprises a frame body (101) and a bottom support (102), the bottom support (102) is arranged in the frame body (101) and is positioned at the lower part of the frame body (101), and the bottom support (102) is provided with a window (103);

the bottom gasket (200) is placed on the bottom support (102), the upper end face (202) of the bottom gasket and the inner peripheral surface (203) of the bottom gasket are intersected on an upper edge line (204), the upper edge line (204) is higher than other areas of the upper end face (202) of the bottom gasket, a groove (205) is formed in the upper end face (202) of the bottom gasket, and the wall of the groove (205) extends to the upper edge line (204);

a peripheral surface gasket (300) provided on the inner peripheral wall of the frame (101);

when the substrate (400) is loaded on the carrier (100), the substrate is accommodated in a space formed by the bottom gasket (200) and the peripheral gasket, the lower surface (402) of the substrate is in sealing fit with the upper edge line (204), and a vapor deposition area is formed at a part of the lower surface (402) of the substrate exposed to the window (103).

2. The tool for forming a thin film according to claim 1, wherein the inner peripheral surface (203) of the bottom gasket is inclined from the lower end surface (201) of the bottom gasket to the upper end surface (202) of the bottom gasket, and an included angle between the inner peripheral surface (203) of the bottom gasket and the upper end surface (202) of the bottom gasket is an acute angle.

3. The tooling for forming thin films as claimed in claim 2, wherein the upper surface (104) of the shoe is provided with a protrusion (105) on one side of the window (103), the protrusion (105) surrounds the window (103), and the protrusion (105) is used for supporting the bottom gasket.

4. The tool for forming the thin film as claimed in claim 2, wherein a boss (206) is arranged on the lower end face (201) of the bottom gasket, the boss (206) surrounds the inner circumferential surface (203) of the bottom gasket, and the outer circumferential surface (208) of the boss is attached to the inner circumferential surface of the bottom support (102).

5. The tool for forming thin films as claimed in claim 1, wherein the peripheral gasket (300) is formed by surrounding a strip-shaped gasket, and two ends of the strip-shaped gasket are inclined surfaces matched with each other.

6. The tool for forming a thin film according to claim 1, wherein the carrier (100) further comprises a connecting lug (107) and a hanging member (500), the connecting lug (107) is disposed on the upper portion of the frame body (101), and the hanging member (500) is connected to the connecting lug (107).

7. The tool for forming a thin film according to claim 1, wherein the frame body (101) is provided with a plurality of centrally symmetrical threaded holes (110), and the threaded holes (110) are used for adjusting the coaxiality of the substrate (400) and the carrier (100) by matching with a jackscrew.

8. A jig assembly for film forming, characterized by comprising a feeding and discharging auxiliary member (600) and the jig assembly for film forming of any one of claims 1 to 7, wherein the feeding and discharging auxiliary member (600) comprises a mounting plate (601) and a plurality of pins (602) arranged on the mounting plate (601), and the lower ends of the pins (602) are connected with the mounting plate (601);

the bottom support (102) is provided with first through holes (106) for the pin shafts (602) to penetrate through, and the first through holes (106) correspond to the pin shafts (602) one to one.

9. The jig assembly for molding a thin film according to claim 8,

the bottom gasket (200) is provided with second through holes (210) for the pin shafts (602) to pass through, and the second through holes (210) correspond to the pin shafts (602) one to one;

the bottom support (102) is further provided with a blocking piece for blocking the first through hole (106), and the blocking piece is detachably connected with the first through hole (106).

10. The jig assembly for forming thin films as claimed in claim 9, wherein the second through hole (210) communicates with the groove (205).