CN219689834U - Equipment for depositing ITO (indium tin oxide) on LED (light-emitting diode) chip - Google Patents

Abstract

The utility model provides equipment for depositing ITO on an LED chip, which comprises a carrier disc, wherein the carrier disc comprises a body part, a protruding part and a recessed part, the protruding part is formed on the lower surface part of the body part in a protruding way, the recessed part is formed on the other part in a recessed way, the protruding part sequentially comprises a first annular support and a second annular support from the periphery to the center of the carrier disc, the recessed part comprises a first groove and a second groove, the first groove is positioned between the first annular support and the second annular support, the second groove is positioned in an inner ring of the second annular support, the equipment for depositing ITO on the LED chip further comprises a mechanical arm, the mechanical arm comprises a connecting part and a supporting part which are connected with each other, the connecting part is connected with a control device, and the supporting part is arranged far away from the control device.

Description

Equipment for depositing ITO (indium tin oxide) on LED (light-emitting diode) chip

Technical Field

The utility model relates to the technical field of magnetron sputtering, in particular to equipment for depositing ITO (indium tin oxide) on an LED (light-emitting diode) chip.

Background

The ITO film has good conductivity, light transmittance and high infrared reflection, is widely applied to high-tech fields such as large-screen liquid crystal displays, color plasma displays, electroluminescent displays and the like, and can be used for space antistatic, glass defrosting and manufacturing transparent electrodes of liquid crystal displays of satellites. Common methods for preparing ITO include CVD (chemical vapor deposition), PVD (physical vapor deposition), SOL-GEL (SOL-GEL method), microwave ECR plasma reaction deposition, pulse laser deposition, jet pyrolysis and the like, and magnetron sputtering deposition technology has the advantages of high film forming rate, good uniformity, few pinholes, high purity, controllable film thickness, good repeatability, capability of forming films in a large area and the like, so that the method is widely researched and applied.

In the prior art, the technology is limited, the slide plate needs a certain thickness for preventing deformation, meanwhile, the slide plate needs to correspond to the technology TSD, so that the slide plate is too heavy, ten slide plates are arranged in one cavity of the prior machine, the mass is too large, the physical power consumption of personnel is too large, even part of personnel cannot be lifted, the feeding efficiency is seriously influenced, and when the slide plate moves to the machine, the slide plate is thrown away due to inertia.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide equipment for depositing ITO on an LED chip, and aims to solve the technical problems that in the prior art, a carrier disc is too heavy, the quality is too large, the physical power of personnel is too high, even part of personnel cannot be lifted, and the feeding efficiency is seriously affected.

In order to achieve the above object, the present utility model is achieved by the following technical scheme:

the utility model provides a device for LED chip deposit ITO for prepare the ITO film for the LED chip, a device for LED chip deposit ITO includes the carrier plate, the carrier plate includes body portion, bellying and depressed part, the lower surface part evagination of body portion forms bellying, another part indent forms the depressed part, the bellying is from the carrier plate periphery to center includes first annular support and second annular support in proper order, the depressed part includes first recess and second recess, first recess is located between first annular support and the second annular support, the second recess is located in the inner ring of second annular support, second annular support is used for with the board contact, in order to support the carrier plate, a device for LED chip deposit ITO still includes robotic arm, robotic arm is operated by the control device, is used for with the carrier plate is carried to on the board, robotic arm includes connecting portion and the supporting part that are connected each other, connecting portion with the control device connects, supporting part sets up for the supporting part is kept away from to the supporting part the supporting mechanism the carrier plate is used for the supporting mechanism is kept away from to the supporting mechanism the carrier plate is used for the steady rest of carrier plate.

Compared with the prior art, the utility model has the beneficial effects that:

the slide disc is reformed, the second annular support is arranged, the second groove is formed in the second annular support, only the position where the machine platform thimble acts is left, so that the weight of a part of the slide disc is reduced, the first annular support is arranged on the periphery of the second annular support, the slide disc is stabilized, the photoelectric induction of the machine platform is not influenced, and the first groove is formed between the first annular support and the second annular support, so that the weight of the slide disc is greatly reduced. And the carrier plate is transported by the mechanical arm, the carrier plate is supported by the supporting mechanism, and the carrier plate is stabilized by the fastening mechanism, so that the risk that the carrier plate is thrown off when being transported to the machine is reduced.

Further, the bottom surface of the first annular support and the bottom surface of the second annular support are located at the same horizontal height.

Further, the first annular support and the second annular support are concentric rings, the circle center of the second annular support and the circle center of the slide tray are located on the same normal line of the slide tray plane, and the first annular support is tightly attached to the bottom edge of the body portion.

Further, the fastening mechanism comprises an abutting piece, the abutting piece extends upwards from the upper surface of the supporting mechanism to form the abutting piece, and the side face of the abutting piece is arc-shaped.

Further, the inner side wall of the first annular support is recessed towards the periphery of the carrier plate to form an embedded groove.

Further, the supporting mechanism includes two support arms that set up relatively, fastening mechanism includes two inserts and compression spring, from every the upper surface of support arm upwards extends and outwards buckles and forms one the inserts, two the inserts are in set up relatively on the support arm, compression spring's both ends are located two respectively the support arm is relative one side each other, be equipped with on the connecting portion and supply two support arm relative motion's spout, two the support arm bearing slide glass dish, compression spring drives two the support arm is kick-backed, so that the inserts stretch into in the embedding groove.

Further, the device for depositing the ITO on the LED chip further comprises a machine table, the machine table comprises a placement position for placing the carrier disc, a plurality of ejector pins are arranged on the placement position and are arranged at annular intervals, and the ejector pins are located under the second annular support, so that the ejector pins extend out of the machine table and are in contact with the second annular support.

Further, the diameter of the carrier plate is 330mm, and the thickness is 6.4mm; the diameter of the outer ring of the first annular support is 330mm, and the diameter of the inner ring of the first annular support is 310mm; the second annular support has an outer ring diameter of 115mm and an inner ring diameter of 85mm.

Further, the upper surface of body portion is equipped with a plurality of piece grooves of getting and a plurality of piece grooves of getting, get the piece groove and be used for holding the LED chip, every get the piece groove all correspond to be connected with one get the groove of putting, get the degree of depth of putting the groove be greater than get the degree of depth of piece groove.

Drawings

FIG. 1 is a bottom perspective view of a carrier platter according to a first embodiment of the utility model;

fig. 2 is a perspective view of an apparatus for depositing ITO on LED chips in a first embodiment of the present utility model;

FIG. 3 is a perspective view of the robot of FIG. 2 from one perspective;

FIG. 4 is a top perspective view of the slide tray of FIG. 2;

FIG. 5 is a perspective view of a carrier platter and a robot arm according to a second embodiment of the utility model;

description of main reference numerals:

the utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, an apparatus for depositing ITO on an LED chip according to a first embodiment of the present utility model is used for preparing an ITO film on an LED chip, where the apparatus for depositing ITO on an LED chip includes a carrier plate 10, the carrier plate 10 includes a body portion 11, a protruding portion and a recess portion, the protruding portion is formed by protruding a lower surface portion of the body portion 11, the recess portion is formed by recessing another portion, the protruding portion includes a first annular support 20 and a second annular support 30 sequentially from a periphery to a center of the carrier plate 10, the recess portion includes a first groove 25 and a second groove 35, the first groove 25 is located between the first annular support 20 and the second annular support 30, the second groove 35 is located in an inner ring of the second annular support 30, and the second annular support 30 is used for contacting with a platform 60 to support the carrier plate 10.

In this embodiment, the bottom surface of the first annular support 20 and the bottom surface of the second annular support 30 are located at the same level.

The first annular support 20 and the second annular support 30 are concentric rings, the center of the second annular support 30 and the center of the slide tray 10 are located on the same normal line of the slide tray 10, and the first annular support 20 is tightly attached to the bottom edge of the body 11.

It can be appreciated that, by arranging the second annular support 30 and digging out the second groove 35 in the second annular support 30 and only leaving the position acted by the ejector pin 65 of the platform 60, the weight of a part of the slide tray 10 is reduced, and arranging the first annular support 20 on the periphery of the second annular support 30, the slide tray 10 is stabilized, the photoelectric induction of the platform 60 is not affected, and the first groove 25 is dug out between the first annular support 20 and the second annular support 30, so that the weight of the slide tray 10 is greatly reduced.

It should be noted that, the distance between the carrier tray 10 and the target position determines the quality of the ITO film finally formed by the LED chip, and the farther the carrier tray 10 is away from the target position, the worse the uniformity of the ITO film, if the overall height of the carrier tray 10 is simply changed to reduce the weight, the uniformity of the finally formed ITO film will be degraded, and the voltage of the LED chip during operation will be affected; the slide tray 10 of the present utility model minimizes the weight of the slide tray 10 without affecting the overall operating efficiency of the slide tray 10.

Further, the apparatus for depositing ITO on LED chips further includes a robot arm 50, where the robot arm 50 is controlled by a control apparatus and is used for transporting the slide tray 10 onto the machine 60, the robot arm 50 includes a connection portion 51 and a support portion 52 connected to each other, the connection portion 51 is connected to the control apparatus, the support portion 52 is disposed away from the control apparatus, and the support portion 52 includes a support mechanism and a fastening mechanism, where the support mechanism is used for supporting the slide tray 10, and the fastening mechanism is used for stabilizing the slide tray 10.

In this embodiment, the inner side wall of the first annular support 20 is recessed towards the periphery of the slide tray 10 to form an embedding groove 525, the support mechanism includes two oppositely disposed support arms 521, the fastening mechanism includes two embedding blocks 522 and a compression spring 523, the two embedding blocks 522 extend upwards from the upper surface of each support arm 521 and are bent outwards to form one embedding block 522, the two embedding blocks 522 are oppositely disposed on the support arms 521, two ends of the compression spring 523 are respectively located at one surface of the two support arms 521 opposite to each other, a sliding groove for the two support arms 521 to move relatively is disposed on the connecting portion 51, the two support arms 521 support the slide tray 10, and the compression spring 523 drives the two support arms 521 to rebound, so that the embedding blocks 522 extend into the embedding groove 525.

Further, the apparatus for depositing ITO on LED chips further includes the machine 60, where the machine 60 includes a placement position for placing the slide tray 10, and a plurality of pins 65 are disposed on the placement position, where the plurality of pins 65 are disposed at annular intervals, and the pins 65 are located under the second annular support 30, so that the pins 65 extend from the machine 60 and contact with the second annular support 30.

It can be understood that after the slide glass tray 10 is loaded with the LED chips, the slide glass tray 10 needs to be transported to the machine 60 to deposit the ITO film, this step requires that the control device operate the mechanical arm 50 to extend into the lower part of the slide glass tray 10, the bottom of the conventional slide glass tray 10 is a plane, when the mechanical arm 50 supports the slide glass tray 10, there is a risk that the slide glass tray 10 is thrown away during the moving process, while the utility model improves the mechanical arm 50 according to the shape of the new slide glass tray 10, by arranging two oppositely arranged protruding parts at the edges of the upper surfaces of two support arms 521, and the bending directions of the two protruding parts deviate from each other, and connecting the two support arms 521 through the compression springs 523, when the mechanical arm 50 extends into the bottom of the slide glass tray 10, the two support arms 521 are clamped by the control device, the compression springs 521 are in a compressed state, when the two embedding blocks 522 on the two support arms 521 are positioned in the middle part of the slide glass tray 10, the two support arms 522 are pushed by the control device, the two support arms 522 are completely embedded in the slide glass tray 522, and the two support arms 521 are completely embedded in the slide glass tray 522 are prevented from being completely, and the two insertion grooves 522 are completely embedded in the slide glass tray 521 are completely;

when the slide tray 10 is stably placed on the machine 60, the ejector pins 65 on the machine 60 are lifted to be in contact with the second annular support 30, so that the slide tray 10 is lifted to a certain height to realize the extraction of the mechanical arm 50, then the ejector pins 65 are lowered, and the ITO film can be prepared in the subsequent operation.

It should be noted that, during loading, the photoelectric sensor of the machine 60 scans the slide tray 10 in the loading frame, if the edge thickness of the slide tray 10 changes, the photoelectric sensing will be affected, and when the mechanical arm 50 places the slide tray 10 in the loading frame, the edge thickness will affect the mechanical arm 50.

Preferably, the carrier tray 10 has a diameter of 330mm and a thickness of 6.4mm; the first annular support 20 has an outer ring diameter of 330mm and an inner ring diameter of 310mm; the second annular support 30 has an outer ring diameter of 115mm and an inner ring diameter of 85mm.

Preferably, an aluminum alloy material is used as a main body material of the slide tray 10, so that deformation and dissolution abnormality can not occur in the sputtering deposition process, the slide tray 10 can not be oxidized when being exposed to the atmosphere in a vacant manner, and the service life of the slide tray 10 is further prolonged;

further, the upper surface of the body 11 is provided with a plurality of pick-up slots 12 and a plurality of pick-up slots 13, the pick-up slots 12 are used for accommodating the LED chips, each pick-up slot 12 is correspondingly connected with one pick-up slot 13, the depth of the pick-up slot 13 is greater than that of the pick-up slot 12, and the pick-up slots 13 are arranged to facilitate the pick-up of the LED chips by workers.

In summary, in the apparatus for depositing ITO on an LED chip according to the above embodiment of the present utility model, the second annular support is used to support the carrier plate, and the first annular support is used to stabilize the carrier plate, and the rest portions are provided with the first groove and the second groove, so that the weight of the carrier plate is greatly reduced, and the operation difficulty of the staff is reduced without affecting the original function.

Referring to fig. 5, an apparatus for depositing ITO on an LED chip according to a second embodiment of the present utility model is different from the apparatus for depositing ITO on an LED chip according to the first embodiment in that:

the fastening mechanism includes an abutment 524 extending upward from an upper surface of the support mechanism to form the abutment 524, the sides of the abutment 524 being arc-shaped.

It will be appreciated that positioning the robotic arm 50 below the slide tray 10 and then extending the free end of the support mechanism beyond the slide tray 10, then placing the slide tray 10 on the support mechanism and pulling the robotic arm 50 outwardly to bring the abutment 524 into abutment with the edge of the slide tray 10, wherein the arc-shaped mortgage increases the contact area with the slide tray 10 and makes it less prone to being thrown off during transport of the slide tray 10.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (9)

1. The utility model provides a device for LED chip deposit ITO, its characterized in that, includes the carrier plate, the carrier plate includes body portion, bellying and depressed part, the lower surface part evagination of body portion forms the bellying, another part indent forms the depressed part, the bellying is from the carrier plate periphery to center including first annular support and second annular support in proper order, the depressed part includes first recess and second recess, first recess is located first annular support with between the second annular support, the second recess is located in the inner ring of second annular support, the second annular support is used for with the board contact, in order to support the carrier plate, the device for LED chip deposit ITO still includes robotic arm, robotic arm is operated, is used for with the carrier plate is carried to on the board, robotic arm includes connecting portion and the supporting portion that are connected each other, connecting portion with the control device is connected, the supporting portion is kept away from the control device sets up, supporting portion and supporting mechanism include the slide fastening device for the carrier plate is used for the stabilizing the carrier plate.

2. The apparatus for depositing ITO on an LED chip of claim 1, wherein a bottom surface of the first annular support and a bottom surface of the second annular support are at the same level.

3. The apparatus for depositing ITO on an LED chip of claim 1, wherein the first annular support and the second annular support are concentric rings with each other, and a center of the second annular support and a center of the slide plate are both located on a same normal line to a plane of the slide plate, and the first annular support is disposed closely to a bottom surface edge of the body portion.

4. The apparatus for depositing ITO on an LED chip of claim 1, wherein the fastening mechanism includes an abutment member extending upward from an upper surface of the supporting mechanism to form the abutment member, and a side surface of the abutment member has an arc shape.

5. The apparatus for depositing ITO on an LED chip of claim 1, wherein an inner sidewall of the first annular support is recessed toward a periphery of the carrier platter to form an embedded slot.

6. The apparatus according to claim 5, wherein the supporting mechanism comprises two oppositely disposed supporting arms, the fastening mechanism comprises two embedded blocks and a compression spring, the two embedded blocks extend upwards from the upper surface of each supporting arm and are bent outwards to form one embedded block, the two embedded blocks are oppositely disposed on the supporting arms, two ends of the compression spring are respectively located on one surface of the two supporting arms opposite to each other, a sliding groove for the two supporting arms to move relatively is formed in the connecting portion, the two supporting arms support the slide tray, and the compression spring drives the two supporting arms to rebound, so that the embedded blocks extend into the embedded grooves.

7. The apparatus for depositing ITO on LED chips of claim 1, further comprising a platform including a placement site for placement of the carrier tray, wherein the placement site has a plurality of pins disposed therein at annular intervals, and wherein the pins are disposed directly below the second annular support such that the pins extend from the platform into contact with the second annular support.

8. An apparatus for depositing ITO on LED chips as claimed in claim 3, wherein the diameter of the carrier plate is 330mm and the thickness is 6.4mm; the diameter of the outer ring of the first annular support is 330mm, and the diameter of the inner ring of the first annular support is 310mm; the second annular support has an outer ring diameter of 115mm and an inner ring diameter of 85mm.

9. The apparatus for depositing ITO on LED chips of claim 1, wherein the upper surface of the body portion is provided with a plurality of pick-and-place grooves for holding the LED chips, each of the pick-and-place grooves being correspondingly connected with one of the pick-and-place grooves, the depth of the pick-and-place groove being greater than the depth of the pick-and-place groove.