CN115799134A - Wafer transfer is with transmission arm - Google Patents
Wafer transfer is with transmission arm Download PDFInfo
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- CN115799134A CN115799134A CN202211557797.6A CN202211557797A CN115799134A CN 115799134 A CN115799134 A CN 115799134A CN 202211557797 A CN202211557797 A CN 202211557797A CN 115799134 A CN115799134 A CN 115799134A
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- 230000005540 biological transmission Effects 0.000 title abstract description 20
- 235000012431 wafers Nutrition 0.000 claims abstract description 97
- 230000001360 synchronised effect Effects 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 238000005086 pumping Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 4
- 241000252254 Catostomidae Species 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a transmission arm for wafer transfer, which comprises a supporting part, a movable rotating part arranged on the supporting part and an execution part arranged on the movable rotating part, wherein the movable rotating part comprises a first arm and a second arm; the movable rotating part can enable the executing part to move or/and rotate on the supporting part so as to capture wafers located in different directions and transfer the wafers to the next target direction; the execution part comprises at least 2 execution units which respectively capture the wafers in different capture modes, and each execution unit comprises a telescopic mechanism which can be horizontally stretched and contracted and an execution piece which is arranged on the telescopic mechanism and used for contacting and capturing the wafers. Through the scheme, the wafer transfer transmission arm can use different execution pieces on the same supporting part to capture wafers in different capture modes, and transfer the wafers to the target position through the matching of the rotary moving part and the telescopic mechanism, so that the utilization rate and the applicability of the wafer transfer arm are improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a transmission arm for wafer transfer.
Background
Wafer thinning is an important link of wafer processing and manufacturing, wafer transferring and transmitting are carried out through a mechanical arm in the wafer thinning process, if wafers are transferred to a positioning device from a feeding box for positioning, then the positioned wafers are transmitted to a thinning station for thinning, and the like, the wafers need to be transmitted through the mechanical arm, however, in the prior art, the wafer grabbing mode of a wafer transmission mechanical arm is single, the moving and stretching speed of the transmission mechanical arm is low, and due to the fact that the wafer fixing mode in the feeding box is different from the wafer fixing mode in the positioning device or the thinning device, when the wafer is transferred to the positioning device from the feeding box and the wafer is transferred to the thinning device from the positioning device through the transmission mechanical arm in the prior art, different wafer transmission mechanical arms are respectively used, and therefore the utilization rate and the applicability of the wafer transmission mechanical arm in the prior art need to be improved.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide a wafer transferring arm with higher utilization rate and applicability, so as to meet the requirements of picking and placing target wafers placed in different fixing manners, and improve the utilization rate and applicability of the wafer transferring robot arm.
In order to solve the technical problems, the invention adopts a technical scheme that: the wafer transfer transmission arm comprises a supporting part, a movable rotating part arranged on the supporting part and an execution part arranged on the movable rotating part; the moving and rotating part enables the executing part to move or/and rotate on the supporting part so as to capture wafers at different positions and transfer the wafers to a next target position; the execution part comprises at least two execution units which respectively adopt different capture modes to capture wafers, and each execution unit comprises a telescopic mechanism which can be horizontally stretched and contracted and an execution piece which is arranged on the telescopic mechanism and is used for contacting and capturing the wafers.
Through the scheme, the wafer transfer transmission arm can use different execution pieces on the same supporting part to capture wafers in different capture modes, and transfer the wafers placed at different positions in different modes to the target position through the cooperation with the rotary moving part and the telescopic mechanism, so that the utilization rate and the applicability of the wafer transfer arm are improved.
Further, the movable rotating part comprises a moving unit which slides up and down along the support frame and a rotating unit which is arranged on the moving unit and can horizontally rotate, and the executing part is arranged on the rotating unit.
Further, the at least two execution units are arranged in parallel or side by side, and the at least two execution units are simultaneously driven by the movable rotating part to synchronously move and/or rotate.
Further, telescopic machanism include with rotary unit fixed connection's bottom slide, sliding connection in middle part slide, sliding connection on the bottom slide in upper portion slide on the middle part slide, set up in with the drive on the bottom slide the middle part slide is followed the lower part drive group that bottom slide length direction removed with set up in drive on the middle part slide the upper portion slide is followed the gliding upper portion drive group of length direction of middle part slide.
Furthermore, the lower driving group comprises first belt wheels arranged at intervals along the length direction of the bottom sliding seat, a first synchronous belt wound on the first belt wheels, a first connecting block arranged on the first synchronous belt and connected with the middle sliding seat, and a first driving motor driving the first belt wheels to rotate; and/or
Upper portion drive group includes follows the second band pulley that the length direction interval of middle part slide set up, around locating second hold-in range on the second band pulley, locate on the last parallel section of second hold-in range and with the second connecting block that the upper portion slide is connected and locate on the lower parallel section of second hold-in range and with bottom slide fixed connection's lower part fixed block.
Furthermore, adjacent execution units are arranged in parallel along the vertical direction, bottom sliding seats on the adjacent execution units are detachably connected through connecting plates, all the execution units synchronously rotate under the driving of a rotating unit, execution pieces on the execution units below are configured into U-shaped supporting plates capable of capturing wafers from the lower portions of the wafers, the U-shaped supporting plates are horizontally arranged, a plurality of adsorption portions used for adsorbing the wafers onto the U-shaped supporting plates are arranged on the upper surfaces of the U-shaped supporting plates, and air passages used for communicating the adsorption portions with external vacuum-pumping equipment are arranged in the U-shaped supporting plates.
Furthermore, an execution piece on an execution unit above the wafer is configured to be an independent sucker capable of capturing the wafer from the upper side of the wafer, the independent sucker is detachably connected with the upper sliding seat through a sucker mounting seat, and the independent sucker is communicated with external vacuum pumping equipment through an air pipe.
Furthermore, a buffer piece is arranged between the independent sucker and the sucker mounting seat.
Further, the supporting seat is vertically arranged, the upper end of the supporting seat is horizontally and fixedly connected with an installation plate used for connecting the supporting seat with other accessories, and a passing hole for accommodating the mobile rotating part is formed in the installation plate.
Furthermore, the moving unit comprises a moving seat in sliding connection with the supporting seat and a Z-axis driving piece arranged on the supporting seat and used for driving the moving seat to move up and down along the supporting seat; the rotating unit comprises a rotating piece and a rotating driving piece for driving the rotating piece to rotate.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a perspective view of the present invention.
FIG. 2 is a schematic view of a view direction of the present invention.
FIG. 3 is a schematic view of another embodiment of the present invention.
Fig. 4 is a structural schematic diagram of a view direction of the telescoping mechanism.
Fig. 5 is a structural schematic diagram of another view direction of the telescopic mechanism.
Fig. 6 is an enlarged view of a portion a of fig. 5.
FIG. 7 is a schematic view of the connection of the independent suction cup and the suction cup mounting base.
The meaning of the reference symbols in the drawings is:
a support seat-10; a mounting plate-101; a through hole-102; a bottom slide-201; a connection plate-202; a middle slide-203; an upper slide-204; a first synchronization belt-301; a first connection block-302; a first drive motor-303; a first pulley-304; riser-305; a second synchronous belt-401; a second pulley-402; a lower fixed block-403; a second connecting block-404; a U-shaped pallet-501; an adsorption part-502; an independent sucker-601; a suction cup mount-602; a buffer-603; a drag chain-604; a movable seat-701; z-axis drive-702; a rotary table-801; rotating driver-802.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1 to fig. 3, the wafer transferring arm disclosed in the present invention includes a supporting portion, a moving and rotating portion disposed on the supporting portion, and an executing portion disposed on the moving and rotating portion; the movable rotating part enables the execution part to move or/and rotate on the supporting part so as to capture wafers located at different positions and transfer the wafers to a next target position; the execution part comprises at least two execution units which respectively capture the wafer by adopting different capture modes, and the at least two execution units can be limited to be simultaneously driven by the movable rotation part to synchronously move and/or rotate. In this embodiment, two execution units are provided, and the two execution units are arranged side by side in the vertical direction, in other embodiments, a larger number of execution units may be provided as needed, and these execution units may be arranged side by side or otherwise arranged on the moving and rotating part. Each execution unit comprises a telescopic mechanism capable of being stretched in the horizontal direction and an execution piece arranged on the telescopic mechanism and used for contacting and capturing the wafer.
The supporting part comprises a supporting seat 10, the supporting seat 10 is vertically arranged, an installation plate 101 used for enabling the supporting seat 10 to be connected with other accessories is horizontally and fixedly connected to the upper end of the supporting seat 10, and a passing hole 102 for allowing the mobile rotating part to pass is formed in the installation plate 101.
The movable and rotatable part includes a movable unit sliding up and down along the support base 10 and a rotatable unit horizontally rotatable on the movable unit, and the actuating part is disposed on the rotatable unit.
The moving unit comprises a moving seat 701 slidably connected with the supporting seat 10, and a Z-axis driving member 702 disposed on the supporting seat 10 for driving the moving seat 701 to move up and down along the supporting seat 10, wherein the Z-axis driving member 702 is fixedly connected to a bottom plate of the supporting seat 10, in this embodiment, the Z-axis driving member 702 is configured as a servo motor, the Z-axis driving member 702 can drive a lead screw vertically disposed on the supporting seat 10 to drive the moving seat 701 to slide up and down along the supporting seat 10, and the moving seat 701 is fixedly connected to a lead screw nut matched with the lead screw on the supporting seat 10.
The rotating unit includes a rotating member and a rotating driving member 802 for driving the rotating member to rotate, in this embodiment, the rotating member may be configured as a rotary table 801, the rotating driving member 802 may be configured as a servo motor, and a base of the rotary table 801 is fixedly connected to the moving base 701. In other possible embodiments, the rotary driving element 802 may be configured as other power devices, and the rotary driving element 802 may drive the table top of the rotary table 801 to rotate through a gear transmission, a screw transmission, or a chain transmission.
As shown in fig. 4 to 6, the telescopic mechanism includes a bottom sliding base 201 fixedly connected to the rotary unit, a middle sliding base 203 slidably connected to the bottom sliding base 201, an upper sliding base 204 slidably connected to the middle sliding base 203, a lower driving set disposed on the bottom sliding base 201 to drive the middle sliding base 203 to move along the length direction of the bottom sliding base 201, and an upper driving set disposed on the middle sliding base 203 to drive the upper sliding base 204 to slide along the length direction of the middle sliding base 203.
The lower driving set comprises first belt pulleys 304 arranged at intervals along the length direction of the bottom sliding base 201, a first synchronous belt 301 wound on the first belt pulleys 304, a first connecting block 302 arranged on the first synchronous belt 301 and connected with the middle sliding base 203, and a first driving motor 303 driving the first belt pulleys 304 to rotate. One end of the first connecting block 302 is fixedly connected with a first synchronous belt 301 located above the first belt pulley 304, the other end of the first connecting block 302 is fixedly connected with the middle sliding base 203, specifically, a vertical plate 305 is fixedly connected to the bottom sliding base 201, the vertical plate 305 is vertically arranged, the first belt pulleys 304 at two ends of the first synchronous belt 301 are rotatably connected with the vertical plate 305, and the first driving motor 303 is fixedly connected with the bottom sliding base 201.
The upper portion drive group includes the edge the length direction interval of middle part slide set up the second band pulley 402, around locating second hold-in range 401 on the second band pulley 402, locate on the last parallel section of second hold-in range 402 and with the second connecting block 404 that upper portion slide 204 is connected and locate on the lower parallel section of second hold-in range 401 and with bottom slide 201 fixed connection's lower part fixed block 403, more specifically, the second band pulley 402 with the lateral wall of middle part slide 203 rotates to be connected, is located the lower parallel section of second hold-in range 401 of second band pulley 402 below fixed connection lower part fixed block 403, lower part fixed block 403 with bottom slide 201 fixed connection is located fixed connection second connecting block 404 on the last parallel section of second hold-in range 401 above second band pulley 402, second connecting block 404 with upper portion slide 204 fixed connection.
The actuating member on the lower actuating unit is configured as a U-shaped supporting plate 501 capable of capturing a wafer from the lower part of the wafer, the U-shaped supporting plate 501 is horizontally arranged, a plurality of adsorption parts 502 used for adsorbing the wafer on the U-shaped supporting plate 501 are arranged on the upper surface of the U-shaped supporting plate 501, the adsorption parts 502 can be arranged as adsorption holes or suckers, the adsorption holes or the suckers are arranged as the suckers in the embodiment, an air passage is arranged inside the U-shaped supporting plate 501, and the air passage is communicated with external vacuum-pumping equipment through an air pipe so as to communicate the adsorption parts 502 with the external vacuum-pumping equipment.
The actuator of the upper actuator unit is configured as an independent sucker 601 capable of capturing a wafer from above the wafer, the independent sucker 601 is detachably connected with the upper sliding seat 204 through a sucker mounting seat 602, the independent sucker 601 is communicated with an external vacuum-pumping device through an air pipe, a drag chain 604 for the air pipe to pass through is arranged on the actuator, as shown in fig. 7, a buffer 603 is arranged between the independent sucker 601 and the sucker mounting seat 602, in this embodiment, the buffer 603 is a spring, in other possible embodiments, the buffer 603 can be an elastic rubber pad or other structures or components with buffering effect, and the buffer 603 can prevent the wafer from being cracked due to the hard contact between the independent sucker 601 and the wafer.
The principle and the beneficial effect of the scheme are as follows:
when a wafer needs to be taken and placed from the lower part of the wafer, the rotary driving piece 802 is controlled to enable the rotary worktable 801 to rotate and the Z-axis driving piece 702 to drive the movable seat 701 to move up and down so that the U-shaped supporting plate 501 points to the wafer to be taken, the first driving motor 303 is controlled to enable the U-shaped supporting plate 501 to extend into the lower part of the wafer to be taken, then the movable seat 701 is controlled to ascend so that the adsorption part 502 on the U-shaped supporting plate 501 contacts with the wafer and adsorbs the wafer, and then the wafer on the U-shaped supporting plate 501 is conveyed to a specified position to be placed through the cooperation of the Z-axis driving piece 702, the first driving motor 303 and the rotary driving piece 802.
When a wafer needs to be taken and placed from the upper side of the wafer, the rotary driving piece 802 is controlled to enable the rotary worktable 801 to rotate and the Z-axis driving piece 702 to drive the movable seat 701 to move up and down to enable the independent sucker 601 to point to the wafer to be taken, the first driving motor 303 is controlled to enable the independent sucker 601 to be located above the wafer to be taken, then the movable seat 701 is controlled to descend to enable the independent sucker 601 to be in contact with the upper surface of the wafer and absorb the wafer, and then the wafer on the independent sucker 601 is conveyed to a designated position to be placed through the cooperation control of the Z-axis driving piece 702, the first driving motor 303 and the rotary driving piece 802.
When the first driving motor 303 drives the first synchronous belt 301 to rotate, the first connecting block 302 on the first synchronous belt 301 drives the middle slide carriage 203 to slide on the bottom slide carriage 201, when the middle slide carriage 203 slides, the second pulley 402 on the middle slide carriage 203 moves along the middle slide carriage 203, because the lower fixed block 403 is fixedly connected with the second synchronous belt 401 and the bottom slide carriage 201, the lower fixed block 403 cannot move, when the second pulley 402 on the middle slide carriage 203 moves along the middle slide carriage 203, the distance between the second pulley 402 on the middle slide carriage 203 and the lower fixed block 403 changes, so that the second synchronous belt 401 rotates to drive the second connecting block 404 to move, the second connecting block 404 moves to drive the upper slide carriage 204 to synchronously slide along the length direction of the middle slide carriage 203, because the upper slide carriage 204 moves along the middle slide carriage 203 on the moving middle slide carriage 203, the moving speed of the upper slide carriage 204 relative to the fixed bottom slide carriage 201 is further accelerated, so that an executive component installed on the upper slide carriage 204 can drive a wafer to rapidly move along the length direction of the bottom slide carriage 201, so as to increase the wafer conveying speed of the slide carriage.
Compared with the existing wafer transmission arm with a single grabbing mode, the invention at least has the following beneficial effects:
1, this wafer transfer is with transmission arm can use different executions on the same supporting part to adopt different capture modes to catch the wafer and through the cooperation with rotatory removal portion and telescopic machanism, will be in different positions with the wafer transfer target location that the mode was placed to the difference, improved the rate of utilization and the suitability of wafer transmission arm.
2, the upper sliding seat has a quick moving function of fast-out and fast-in by arranging a telescopic mechanism with an accelerating function, and the transmission rate of the wafer is improved by adopting the scheme; less motors are used when the same transmission rate is achieved, the cost is saved, the structural layout is simpler, and the occupied space is reduced.
The above are merely examples of the present invention, and common general knowledge of known specific structures and characteristics in the schemes is not described herein. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be defined by the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. A transfer arm for transferring a wafer, comprising: the device comprises a supporting part, a movable rotating part arranged on the supporting part and an executing part arranged on the movable rotating part; the moving and rotating part enables the executing part to move or/and rotate on the supporting part so as to capture wafers at different positions and transfer the wafers to a next target position; the execution part comprises at least two execution units which respectively adopt different capture modes to capture the wafer, and each execution unit comprises a telescopic mechanism which can be stretched in the horizontal direction and an execution piece which is arranged on the telescopic mechanism and is used for contacting and capturing the wafer.
2. The transfer arm for wafer transfer as claimed in claim 1, wherein: the movable rotating part comprises a moving unit which slides up and down along the supporting part and a rotating unit which is arranged on the moving unit and can horizontally rotate, and the executing part is arranged on the rotating unit.
3. The transfer arm for wafer transfer as set forth in claim 1, wherein: the at least two execution units are arranged in parallel or side by side, and are driven by the movable rotating part to synchronously move and/or rotate simultaneously.
4. A transfer arm for wafer transfer as recited in claim 3, wherein: telescopic machanism include with rotary unit fixed connection's bottom slide, sliding connection in middle part slide, sliding connection on the bottom slide upper portion slide on the slide of middle part, set up in with the drive on the slide of bottom the middle part slide is followed the lower part drive group that bottom slide length direction removed with set up in drive on the slide of middle part the upper portion slide is followed the gliding upper portion drive group of length direction of middle part slide.
5. The transfer arm for wafer transfer as claimed in claim 4, wherein: the lower driving group comprises first belt wheels arranged at intervals along the length direction of the bottom sliding seat, a first synchronous belt wound on the first belt wheels, a first connecting block arranged on the first synchronous belt and connected with the middle sliding seat, and a first driving motor for driving the first belt wheels to rotate; and/or
The upper portion drive group is including following the second band pulley that the length direction interval of middle part slide set up, around locating second hold-in range on the second band pulley, locate on the last parallel section of second hold-in range and with the second connecting block that the upper portion slide is connected and locate on the lower parallel section of second hold-in range and with bottom slide fixed connection's lower part fixed block.
6. The transfer arm for wafer transfer as claimed in claim 3, wherein: the at least two execution units are arranged in parallel along the vertical direction, two adjacent execution units are detachably connected together through a connecting piece, and the execution unit at the bottommost layer is connected with the movable rotating part through a corresponding telescopic mechanism; the executing part of an executing unit below is configured to be a U-shaped supporting plate capable of capturing the wafer from the lower part of the wafer, the U-shaped supporting plate is connected with the upper sliding seat of the corresponding telescopic mechanism, a plurality of adsorption parts used for adsorbing the wafer on the U-shaped supporting plate are arranged on the upper surface of the U-shaped supporting plate, and the adsorption parts are communicated with external vacuum-pumping equipment through air channels.
7. The transfer arm for wafer transfer as claimed in claim 6, wherein: the actuating piece of an actuating unit above is configured as an independent sucker capable of capturing a wafer from the upper part of the wafer, the independent sucker is connected with the upper sliding seat of the corresponding telescopic mechanism through a sucker mounting seat, and the independent sucker is communicated with external vacuum pumping equipment through an air pipe.
8. The transfer arm for wafer transfer as claimed in claim 7, wherein: and a buffer piece is arranged between the independent sucker and the sucker mounting seat.
9. The transfer arm for wafer transfer as claimed in claim 8, wherein: the supporting part comprises a supporting seat, the upper end of the supporting seat is horizontally and fixedly connected with a mounting plate, and a passing hole for accommodating the mobile rotating part is formed in the mounting plate.
10. The transfer arm for wafer transfer of claim 9, wherein: the moving unit comprises a moving seat in sliding connection with the supporting seat and a Z-axis driving piece arranged on the supporting seat and used for driving the moving seat to move up and down along the supporting seat; the rotating unit comprises a rotating piece and a rotating driving piece for driving the rotating piece to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557797.6A CN115799134A (en) | 2022-12-06 | 2022-12-06 | Wafer transfer is with transmission arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557797.6A CN115799134A (en) | 2022-12-06 | 2022-12-06 | Wafer transfer is with transmission arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115799134A true CN115799134A (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211557797.6A Pending CN115799134A (en) | 2022-12-06 | 2022-12-06 | Wafer transfer is with transmission arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115799134A (en) |
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2022
- 2022-12-06 CN CN202211557797.6A patent/CN115799134A/en active Pending
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