CN220604654U - Wafer grabbing device - Google Patents

Abstract

The application discloses wafer grabbing device relates to wafer transport technical field, includes: the wafer grabbing device comprises a base and a plurality of wafer grabbing claws arranged on the base, wherein the plurality of wafer grabbing claws are stacked and arranged at intervals; the plurality of wafer grabbing claws comprise at most one fixed wafer grabbing claw and a plurality of movable wafer grabbing claws, and the fixed wafer grabbing claws are fixedly arranged on the base; the plurality of movable wafer grabbing claws are movably arranged on the base through the same driving mechanism; the driving mechanism synchronously drives the plurality of movable wafer grabbing claws to move relative to the base, and the distances between adjacent movable wafer grabbing claws in the plurality of movable wafer grabbing claws are the same. The advantages are that: the driving mechanism synchronously drives the plurality of movable Wafer grabbing claws to move relative to the base, and further equidistant displacement change among the plurality of movable Wafer grabbing claws can be realized, so that transmission of different Wafer distances is realized, storage of wafers in a non-equidistant state is compatible, and process equipment butt joint of smaller installation space and larger variable-distance Wafer is met.

Description

Wafer grabbing device

Technical Field

The application relates to the technical field of wafer carrying, in particular to a wafer grabbing device.

Background

The wafer is a silicon wafer used in the processing and manufacturing of a silicon semiconductor integrated circuit, and is called a wafer because the wafer is generally circular in shape after processing. In semiconductor manufacturing processes, equipment front end modules (Equipment Front End Module), abbreviated as EFEM, are the most commonly used and important equipment for transporting wafers from pods to various processing stations and inspection modules. The front end module of the equipment mainly comprises three core components, namely a Loadport (Loadport), a wafer transport Robot (Robot) and a wafer Aligner (Aligner). A standard wafer cassette has a plurality of wafers (typically 25 wafers) therein, and after the wafer cassette is placed on a wafer loading system, fingers of a robot arm extend into the wafer cassette and pick up the wafers therein or drop the wafers on the fingers, which are in direct contact with the wafers and carry mechanical parts for transporting the individual wafers.

In the semiconductor field, the transfer mechanism of Wafer robot is basically shaped between equidistant cassetle boxes or between equidistant cassetle boxes and Buffer through standardized design for many years; the Wafer spacing in the casttle box is fixed within 10mm, and the ceramic jaw spacing for each transfer of Wafer is essentially a multiple of 5 mm; if a Wafer storage mechanism with a distance which is not 5mm multiple is not suitable for the Wafer storage mechanism, under the condition that traditional Wafer transfer Robots need to transfer wafers to a middle buffer position one by one, then transfer the wafers of the buffer position to corresponding Wafer transfer positions through the robots of different Wafer ceramic claws, the design is complicated, the efficiency is low, more space waste is caused, two Wafer robots are needed to realize the transfer, the maintenance cost is high, the equipment cost is high, hidden danger exists in the whole machine debugging operation stability, and the key is that the working efficiency is greatly reduced.

Disclosure of Invention

The purpose of this application is when meetting the Wafer storage mechanism of non-5 mm multiple interval among the prior art, and loaded down with trivial details when traditional Wafer conveying Robot transmits, and efficiency is lower, and the space is extravagant more, and needs two Wafer Robot to realize transmitting, not only maintenance cost is high, and the cost of equipment is also higher, and the complete machine debugging running stability also has hidden danger, the problem of work efficiency greatly reduced. Therefore, the Wafer grabbing device can realize transmission of different Wafer intervals, is compatible with storage of wafers in non-equidistant states, and has the advantages of being convenient and fast to transmit, and saving space and cost.

In order to solve the above problems, an embodiment of the present application provides a wafer gripping device, including:

the wafer chuck comprises a base, a fixed wafer grabbing claw and a plurality of movable wafer grabbing claws, wherein the fixed wafer grabbing claw is arranged on the base; the movable wafer grabbing claws are movably arranged on the base through the same driving mechanism; the driving mechanism synchronously drives the plurality of movable wafer grabbing claws to move relative to the base, and the distances between adjacent movable wafer grabbing claws in the plurality of movable wafer grabbing claws are the same.

By adopting the technical scheme, the plurality of movable Wafer grabbing claws can be synchronously driven by the driving mechanism to move relative to the base, and further equidistant displacement change among the plurality of movable Wafer grabbing claws can be realized, so that transmission of different Wafer distances can be realized, storage of wafers in a non-equidistant state is compatible, and process equipment butt joint of smaller installation space and larger variable-distance Wafer can be met.

In some embodiments, the driving mechanism synchronously drives the plurality of movable wafer grabbing claws to move relative to the first reference plane; the fixed wafer grabbing claw is located on the first datum plane.

In some embodiments, the first reference surface is provided with the fixed wafer grabbing claws, and two sides of the first reference surface are symmetrically provided with a plurality of movable wafer grabbing claws;

the driving mechanism drives a plurality of movable wafer grabbing claws on two sides of the fixed wafer grabbing claw to symmetrically move relative to the first reference surface;

or, a plurality of movable wafer grabbing claws are arranged on one side of the first reference surface;

the movable wafer grabbing claws on the same side of the first reference surface comprise first movable wafer grabbing claws to Nth movable wafer grabbing claws which are sequentially arranged towards the direction away from the first reference surface; the driving mechanism drives the movement speed of the first movable wafer grabbing claw to be a, and the synchronous movement speed of the Nth movable wafer grabbing claw is N x a.

In some embodiments, at least one pair of movable wafer grabbing claws are symmetrically arranged on two sides of the first reference plane, and the driving mechanism drives the at least one pair of movable wafer grabbing claws to move symmetrically relative to the first reference plane.

In some embodiments, the driving mechanism comprises at least one lifting mechanism, the at least one lifting mechanism is mounted on the base, and one or a pair of movable wafer grabbing claws are connected to each lifting mechanism of the at least one lifting mechanism; the lifting mechanism drives one or a pair of movable wafer grabbing claws to move relative to the first datum plane.

In some embodiments, the lifting mechanism comprises a power motor, a screw, and one or a pair of movable wafer gripping claws provided to the screw; the power Ma Dagu is fixed on the base, the screw rod is rotatably arranged on the base, and the power motor is connected with the screw rod and used for driving the screw rod to rotate; the movable wafer grabbing claw is in threaded fit with the screw rod, and when the screw rod rotates, the movable wafer grabbing claw is close to or far away from the first datum plane.

In some embodiments, the screw rod of the lifting mechanism is provided with a pair of movable wafer grabbing claws which are symmetrical relative to the first reference plane; the screw rods are opposite in threads on two sides of the first datum plane; when the screw rod rotates, the movable wafer grabbing claws symmetrically arranged on two sides of the first reference surface synchronously approach or depart from the first reference surface.

In some embodiments, the drive mechanism comprises a plurality of the lifting mechanisms, and a transmission mechanism disposed between the plurality of lifting mechanisms;

the screw rods in the lifting mechanisms are in transmission connection through the transmission mechanism;

the power motor synchronously drives a plurality of screw rods through the transmission mechanism, and the motion speed ratio of the movable wafer grabbing claws corresponding to the screw rods is the transmission ratio of the transmission mechanism.

In some embodiments, the drive mechanism comprises a drive belt and a plurality of turntables;

the screw rods are arranged in one-to-one correspondence with the turntables, and the transmission belt is sleeved on the output shaft of the power motor and the turntables;

the transmission ratio of the transmission mechanism is the ratio of the diameters of the turntables on the plurality of screw rods.

In some embodiments, the first reference surface is provided with the fixed wafer gripping claws, and the plurality of movable wafer gripping claws on the same side of the first reference surface include a first movable wafer gripping claw and a second movable wafer gripping claw which are sequentially arranged towards the direction away from the first reference surface;

the transmission ratio of the transmission mechanism is set to be 2:1.

By adopting the technical scheme, the three-wafer grabbing device is simple in structure, can grab three wafers at a time, and is high in efficiency when the first movable wafer grabbing claws and the second movable wafer grabbing claws are symmetrically arranged on the other side of the first datum plane.

In some embodiments, the driving mechanism further comprises a sliding rail and a sliding block, wherein the sliding rail is fixed on the base, the sliding block is slidably arranged on the sliding rail, and the sliding block is fixedly connected with the movable wafer grabbing claw.

By adopting the technical scheme, the vertical precision of lifting and the stability of power transmission can be ensured by sliding the sliding block up and down on the sliding rail along the movement direction of the movable wafer grabbing claw.

In some embodiments, the lifting mechanism further comprises a guide piece, the guide piece is in threaded fit with the screw rod, and guide parts on different screw rods are staggered; the movable wafer grabbing claw is fixed on the guide piece; the wafer grabbing device further comprises a connecting plate, the side edge of the connecting plate is fixed on the guide piece and the sliding block, and the movable wafer grabbing claw is further fixed on the connecting plate.

In some embodiments, the lifting mechanism further comprises a sliding rail arranged in parallel with the screw rod and a sliding block fixedly connected with the movable wafer grabbing claw; the sliding blocks of different lifting mechanisms are staggered.

By adopting the technical scheme, the space layout of the whole device is more compact, the volume of the device is reduced, and the space utilization rate is improved through the staggered arrangement of the guide parts on different screw rods and the staggered arrangement of the sliding blocks of different lifting mechanisms.

In some embodiments, the movable wafer gripper is connected to the driving mechanism by a connection plate, and in a direction perpendicular to a movement direction of the movable wafer gripper, the driving mechanism is connected to a side edge in a first direction of the connection plate, the movable wafer gripper is connected to a side edge in a second direction of the connection plate, and the first direction and the second direction are perpendicular to each other.

In some embodiments, three blocking pieces are arranged on the base at intervals, and a limiting piece is arranged on the sliding block and is positioned between two adjacent blocking pieces.

By adopting the technical scheme, the moving range of the sliding block is further limited through the two baffle plates, so that the moving distance range of the movable wafer grabbing claw is controlled.

The four-layer wafer ceramic claw is changed in distance of 6-15 mm relative to the middle layer, so that wafer transfer among different wafer storage devices can be realized, and 5 wafers can be transferred at a time;

additional features and corresponding advantages of the present application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present application.

Drawings

Fig. 1 is a schematic structural diagram of a wafer gripping device and wafer combination according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a wafer gripping device according to an embodiment of the present application.

Fig. 3 is a schematic diagram of an internal structure of a wafer gripping device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a base and a driving mechanism of a wafer gripping device according to an embodiment of the present disclosure.

Fig. 5 is a schematic diagram of a split structure of a driving mechanism of a wafer grabbing device according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a movable wafer gripper of the wafer gripping device according to the embodiment of the present application.

Fig. 7 is a schematic structural diagram of a lifting mechanism of a wafer grabbing device according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of another view of the lifting mechanism of the wafer gripping device according to the embodiment of the present application.

Fig. 9 is a schematic structural diagram of a connection board of a wafer grabbing device according to an embodiment of the present application.

Fig. 10 is a schematic structural view of another view of the connection board of the wafer grabbing device according to the embodiment of the present application.

Fig. 11 is a schematic structural diagram of a baffle plate and a limiting plate of a wafer grabbing device according to an embodiment of the present application.

Reference numerals illustrate:

1. base seat

11. Bottom plate

12. Supporting plate

13. Bearing pedestal

14. Baffle plate

2. Wafer grabbing claw

21. Fixed wafer grabbing claw

22. Movable wafer grabbing claw

3. Lifting mechanism

31. Power motor

32. Screw rod

33. Transmission belt

34. Turntable

35. Guide piece

4. Sliding rail

5. Sliding block

51. Limiting sheet

6. Connecting plate

Detailed Description

Further advantages and effects of the present application will be readily apparent to those skilled in the art from the present disclosure, by describing embodiments of the present application with specific examples. While the description of the present application will be presented in conjunction with the preferred embodiments, it is not intended that the features of this application be limited to only this implementation. Rather, the purpose of the description presented in connection with the embodiments is to cover other alternatives or modifications, which may be extended by the claims based on the present application. The following description contains many specific details in order to provide a thorough understanding of the present application. The present application may be practiced without these specific details. Furthermore, some specific details are omitted from the description in order to avoid obscuring the focus of the application. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

It should be noted that in this specification, like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Referring to fig. 1 to fig. 4, fig. 1 is a schematic structural diagram of a combination of a wafer gripping device and a wafer provided in an embodiment of the present application, fig. 2 is a schematic structural diagram of a wafer gripping device provided in an embodiment of the present application, fig. 3 is a schematic internal structural diagram of a wafer gripping device provided in an embodiment of the present application, and fig. 4 is a schematic structural diagram of a base and a driving mechanism of a wafer gripping device provided in an embodiment of the present application.

As shown in fig. 1-4, the present application provides a wafer gripping device, including:

the wafer chuck comprises a base 1 and a plurality of wafer grabbing claws 2 arranged on the base 1, wherein the plurality of wafer grabbing claws 2 are stacked and arranged at intervals;

the plurality of wafer grabbing claws 2 comprise at most one fixed wafer grabbing claw 21 and a plurality of movable wafer grabbing claws 22, and the fixed wafer grabbing claws 21 are fixedly arranged on the base 1; the plurality of movable wafer grabbing claws 22 are movably arranged on the base 1 through the same driving mechanism; the driving mechanism synchronously drives the plurality of movable wafer grabbing claws 22 to move relative to the base 1, and the distances between adjacent movable wafer grabbing claws 22 in the plurality of movable wafer grabbing claws 22 are the same.

It should be noted that, the driving mechanism synchronously drives the plurality of movable Wafer grabbing claws 22 to move relative to the base 1, so that equidistant displacement change between the plurality of movable Wafer grabbing claws 22 can be realized, thereby realizing transmission of different Wafer distances, being compatible with storage of wafers in a non-equidistant state, and meeting the requirement of docking process equipment with smaller installation space and larger variable distance Wafer.

Further, the driving mechanism synchronously drives the plurality of movable wafer grabbing claws 22 to move relative to the first reference plane; at most one stationary wafer gripping jaw 21 is located on the first reference plane.

In one embodiment, as shown in fig. 2, a first reference surface is provided with a fixed wafer gripping claw 21, and two sides of the first reference surface are symmetrically provided with a plurality of movable wafer gripping claws 22; the driving mechanism drives a plurality of movable wafer grabbing claws 22 on two sides of the fixed wafer grabbing claw 21 to symmetrically move relative to the first reference plane; alternatively, one side of the first reference surface is provided with a plurality of movable wafer gripping claws 22; the plurality of movable wafer gripping claws 22 on the same side as the first reference surface include first to nth movable wafer gripping claws 22 sequentially arranged toward the first movable wafer gripping claw 22 facing away from the first reference surface; the driving mechanism drives the first movable wafer gripper 22 to move at a speed a, and the synchronous movement speed of the nth movable wafer gripper 22 is n×a.

In one embodiment, a plurality of movable wafer gripping claws 22 are provided on both sides of the first reference surface. In other alternative embodiments, a plurality of movable wafer gripper fingers 22 may be provided on only one side of the first reference surface, or one movable wafer gripper finger 22 may be provided on both sides of the first reference surface. Specifically, the present application is not limited.

Therefore, in the following description, two pairs of movable wafer gripping claws 22 are provided on both sides of the first reference surface, and at this time, the plurality of movable wafer gripping claws 22 on the same side of the first reference surface include a first movable wafer gripping claw 22 and a second movable wafer gripping claw 22 that are sequentially provided toward the direction away from the first reference surface;

it will be appreciated by those skilled in the art that the manner in which the driving mechanism drives the plurality of movable wafer gripping claws 22 disposed at both sides of the first reference plane to move synchronously is independent of the number of the plurality of movable wafer gripping claws 22, and in other alternative embodiments, the number of the movable wafer gripping claws 22 disposed at both sides of the first reference plane may be 3, 4, 5, or the like.

Specifically, the first reference surface is provided with a fixed wafer gripper 21, and the plurality of movable wafer grippers 22 on the same side of the first reference surface include a first movable wafer gripper 22 and a second movable wafer gripper 22 which are sequentially arranged away from the first reference surface (i.e., N is equal to 2, at this time, the ratio of the movement speeds of the first movable wafer gripper 22 and the second movable wafer gripper 22 is 1:2)

By adopting the technical scheme, the device has the advantages that the structure is simple, five wafers can be grabbed at one time, the grabbing efficiency is high, and the distance between adjacent wafers in the five wafers can be kept consistent.

In other alternative embodiments, the first reference surface may be provided without the fixed wafer gripping claws 21;

the movable wafer grabbing claws 22 are symmetrically arranged relative to the first reference surface, and the driving mechanism drives the movable wafer grabbing claws 22 on two sides of the first reference surface to symmetrically move relative to the first reference surface;

the plurality of movable wafer gripping claws 22 on the same side as the first reference surface include first to nth movable wafer gripping claws 22 sequentially arranged toward the first movable wafer gripping claw 22 facing away from the first reference surface; the driving mechanism drives the first movable wafer gripper 22 to move at a speed of a, and the synchronous movement speed of the nth movable wafer gripper 22 is 2N x a-a.

In one example, when N is equal to 2, the plurality of movable wafer gripper claws 22 on the same side of the first reference plane include a first movable wafer gripper claw 22 and a second movable wafer gripper claw 22 that are sequentially disposed towards the first reference plane, and at this time, the ratio of the speeds of the first movable wafer gripper claw 22 and the second movable wafer gripper claw 22 is 1:3, so that the driving mechanism can drive the two pairs of movable wafer gripper claws 22 on two sides of the first reference plane to move synchronously, and the intervals between any two adjacent movable wafer gripper claws 22 in the four movable wafer gripper claws 22 are the same.

Referring to fig. 5 to 10, fig. 5 is a schematic diagram of a split structure of a driving mechanism of a wafer gripping device provided in an embodiment of the present application, fig. 6 is a schematic diagram of a structure of a movable wafer gripping claw of the wafer gripping device provided in an embodiment of the present application, fig. 7 is a schematic diagram of a structure of a lifting mechanism of the wafer gripping device provided in an embodiment of the present application, fig. 8 is a schematic diagram of another view angle of the lifting mechanism of the wafer gripping device provided in an embodiment of the present application, fig. 9 is a schematic diagram of a structure of a connecting plate of the wafer gripping device provided in an embodiment of the present application, and fig. 10 is a schematic diagram of another view angle of the connecting plate of the wafer gripping device provided in an embodiment of the present application.

As shown in fig. 5-10, in one embodiment, the driving mechanism includes at least one lifting mechanism 3, at least one lifting mechanism 3 is mounted on the base 1, and one or a pair of movable wafer gripping claws 22 are connected to each lifting mechanism 3 in the at least one lifting mechanism 3; the lifting mechanism 3 moves one or a pair of movable wafer gripping claws 22 relative to the first reference surface.

In one embodiment, the lifting mechanism 3 includes a power motor 31 and a screw 32, and one or a pair of movable wafer gripping claws 22 are provided on the screw 32 of the corresponding lifting mechanism 3; the power motor 31 is fixed on the base 1, the screw rod 32 is rotatably arranged on the base 1, and the power motor 31 is connected with the screw rod 32 and is used for driving the screw rod 32 to rotate; the movable wafer gripper 22 is in threaded engagement with the screw 32, and when the screw 32 rotates, the movable wafer gripper 22 approaches or moves away from the first reference surface. Further, a pair of movable wafer gripping claws 22 symmetrical with respect to the first reference plane are provided on the screw rod 32 of the elevating mechanism 3; the screw rods 32 are positioned on two sides of the first reference surface, the screw threads are opposite, and the screw pitches are the same; when the screw 32 rotates, the movable wafer gripping claws 22 symmetrically arranged at both sides of the first reference surface synchronously move toward or away from the first reference surface, and symmetrical movement relative to the first reference surface can be realized.

Specifically, the base 1 comprises a bottom plate 11 and a supporting plate 12, the supporting plate 12 is vertically connected to the bottom plate 11, a bearing seat 13 is fixedly connected to one end, away from the bottom plate 11, of the supporting plate 12, one end of a screw rod 32 is rotatably connected to the bearing seat 13, and the other end of the screw rod 32 is rotatably connected to the bottom plate 11.

In one embodiment, the driving mechanism comprises a plurality of lifting mechanisms 3 and a transmission mechanism arranged among the lifting mechanisms 3; the plurality of screw rods 32 in the plurality of lifting mechanisms 3 are in transmission connection through a transmission mechanism;

the power motor 31 synchronously drives the plurality of screw rods 32 through the transmission mechanism, and the screw pitches of the screw rods 32 in different lifting mechanisms 3 are the same, so that the screw rods 32 in different lifting mechanisms 3 rotate for one circle to drive the movable wafer grabbing claws 22 to move by the same distance, and the movement speed ratio of the movable wafer grabbing claws 22 corresponding to the plurality of screw rods 32 is the transmission ratio of the transmission mechanism.

In one example, the transmission ratio of the transmission mechanism may be set, so that the driving mechanism drives the first movable wafer gripper 22 to move at a speed a, and the synchronous movement speed of the nth movable wafer gripper 22 is n×a. Or, the motion speed of the first movable wafer grabbing claw 22 driven by the driving mechanism is a, and the synchronous motion speed of the nth movable wafer grabbing claw 22 is 2n×a-a.

Specifically, in one embodiment, the transmission mechanism includes a transmission belt 33 and a plurality of turntables 34;

the screw rods 32 are arranged in one-to-one correspondence with the turntables 34, and the transmission belt 33 is sleeved on the output shaft of the power motor 31 and the turntables 34; the transmission ratio of the transmission mechanism is the ratio of the diameters of the turntables 34 on the plurality of screw rods 32.

In one embodiment, the driving mechanism further includes a sliding rail 4 and a sliding block 5, the sliding rail 4 is fixed on the base 1, specifically fixed on the supporting plate 12, the sliding block 5 is slidably disposed on the sliding rail 4, and the sliding block 5 is fixedly connected with the movable wafer grabbing claw 22.

By adopting the technical scheme, the vertical precision of lifting and the stability of power transmission can be ensured by sliding the sliding block 5 up and down on the sliding rail 4 along the movement direction of the movable wafer grabbing claw 22, so that the stability and reliability of wafer transportation are ensured.

In one embodiment, the lifting mechanism 3 further comprises a guide piece 35 (which may be a nut), the guide piece 35 is in threaded fit with the screw rod 32, and guide parts on different screw rods 32 are staggered; the movable wafer gripper 22 is fixed to the guide 35; the wafer gripping device further comprises a connecting plate 6, the side edges of the connecting plate 6 are fixed on the guide piece 35 and the sliding block 5, and the connecting plate 6 is also fixed with a movable wafer gripping claw 22.

In one embodiment, the lifting mechanism 3 further comprises a sliding rail 4 arranged in parallel with the screw rod 32 and a sliding block 5 fixedly connected with the movable wafer grabbing claw 22; the sliding blocks 5 of different lifting mechanisms 3 are staggered.

By adopting the technical scheme, the space layout of the whole device is more compact, the volume of the device is reduced, and the space utilization rate is improved by the staggered arrangement of the guide parts on different screw rods 32 and the staggered arrangement of the sliding blocks 5 of different lifting mechanisms 3.

In one embodiment, the movable wafer gripper 22 is connected to the driving mechanism through the connecting plate 6, and in the moving direction perpendicular to the movable wafer gripper 22, the driving mechanism is connected to a side edge in the first direction of the connecting plate 6, the movable wafer gripper 22 is connected to a side edge in the second direction of the connecting plate 6, and the first direction and the second direction are perpendicular to each other. Therefore, the space layout of the whole device is more compact, the volume of the device is reduced, and the space utilization rate is improved.

Fig. 11 is a schematic structural diagram of a baffle plate and a limiting plate of a wafer grabbing device according to an embodiment of the present application. Referring to fig. 11, three blocking pieces 14 are disposed on the base 1 at intervals, a limiting piece 51 is disposed on the slider 5, and the limiting piece 51 is located between two adjacent blocking pieces 14; specifically, three baffles 14 are secured to one side of the support plate 12 adjacent the movable wafer gripper 22.

By adopting the technical scheme, the moving range of the sliding block 5 is further limited through the three baffle plates 14, so that the moving distance range of the movable wafer grabbing claw 22 is controlled.

Specifically, for example, when the movable wafer chuck claws 22 are four, a pitch change of 6 to 15mm of four layers of wafer ceramic claws with respect to the intermediate layer can be achieved, so that wafer transfer between different wafer storage devices can be achieved, and 5 wafers can be transferred at a time.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (15)

1. A wafer gripping device, comprising:

the wafer chuck comprises a base (1), a fixed wafer grabbing claw (21) and a plurality of movable wafer grabbing claws (22), wherein the fixed wafer grabbing claw (21) is arranged on the base (1); the movable wafer grabbing claws (22) are movably arranged on the base (1) through the same driving mechanism;

the driving mechanism synchronously drives the movable wafer grabbing claws (22) to move relative to the base (1), and the distances between adjacent movable wafer grabbing claws (22) in the movable wafer grabbing claws (22) are the same.

2. The wafer gripping device according to claim 1, wherein: the driving mechanism synchronously drives the plurality of movable wafer grabbing claws (22) to move relative to a first reference surface; the fixed wafer gripping claw (21) is located on the first reference surface.

3. The wafer gripping device according to claim 2, wherein:

the first reference surface is provided with the fixed wafer grabbing claws (21), and two sides of the first reference surface are symmetrically provided with a plurality of movable wafer grabbing claws (22);

the driving mechanism drives a plurality of movable wafer grabbing claws (22) on two sides of the fixed wafer grabbing claw (21) to symmetrically move relative to the first reference plane;

or, a plurality of movable wafer grabbing claws (22) are arranged on one side of the first reference surface;

the movable wafer grabbing claws (22) on the same side of the first reference surface comprise first movable wafer grabbing claws (22) to Nth movable wafer grabbing claws (22) which are sequentially arranged towards the direction away from the first reference surface;

the driving mechanism drives the movement speed of the first movable wafer grabbing claw (22) to be a, and the synchronous movement speed of the Nth movable wafer grabbing claw (22) is N.

4. The wafer gripping device according to claim 2, wherein: at least one pair of movable wafer grabbing claws (22) are symmetrically arranged on two sides of the first reference surface, and the driving mechanism drives the at least one pair of movable wafer grabbing claws (22) to symmetrically move relative to the first reference surface.

5. Wafer gripping device according to claim 4, wherein the drive mechanism comprises at least one lifting mechanism (3), the at least one lifting mechanism (3) being mounted on the base (1), one or a pair of the movable wafer gripping claws (22) being connected to each lifting mechanism (3) of the at least one lifting mechanism (3); the lifting mechanism (3) drives one or a pair of movable wafer grabbing claws (22) to move relative to the first datum plane.

6. Wafer gripping device according to claim 5, characterized in that the lifting mechanism (3) comprises a power motor (31) and a screw (32), one or a pair of the movable wafer gripping claws (22) being arranged on the screw (32) corresponding to the lifting mechanism (3);

the power motor (31) is fixed on the base (1), the screw rod (32) is rotatably arranged on the base (1), and the power motor (31) is connected with the screw rod (32) and is used for driving the screw rod (32) to rotate;

the movable wafer grabbing claw (22) is in threaded fit with the screw rod (32), and when the screw rod (32) rotates, the movable wafer grabbing claw (22) is close to or far away from the first datum plane.

7. Wafer gripping device according to claim 6, characterized in that the screw (32) of the lifting mechanism (3) is provided with a pair of the movable wafer gripping claws (22) symmetrical with respect to the first reference plane;

the screw rods (32) are opposite in threads on two sides of the first datum plane;

when the screw rod (32) rotates, the movable wafer grabbing claws (22) symmetrically arranged on two sides of the first reference surface synchronously approach or depart from the first reference surface.

8. Wafer gripping device according to claim 6, characterized in that the drive mechanism comprises a plurality of the lifting mechanisms (3), and a transmission mechanism arranged between the plurality of lifting mechanisms (3);

a plurality of screw rods (32) in the lifting mechanisms (3) are in transmission connection through the transmission mechanism;

the power motor (31) synchronously drives a plurality of screw rods (32) through the transmission mechanism, and the motion speed ratio of the movable wafer grabbing claws (22) corresponding to the screw rods (32) is the transmission ratio of the transmission mechanism.

9. The wafer gripping device according to claim 8, wherein: the transmission mechanism comprises a transmission belt (33) and a plurality of turntables (34);

the screw rods (32) are arranged in one-to-one correspondence with the turntables (34), and the transmission belt (33) is sleeved on the output shaft of the power motor (31) and the turntables (34);

the transmission ratio of the transmission mechanism is the ratio of the diameters of the turntables (34) on a plurality of screw rods (32).

10. The wafer gripping device according to claim 8, wherein: the first reference surface is provided with the fixed wafer grabbing claws (21), and the plurality of movable wafer grabbing claws (22) on the same side of the first reference surface comprise a first movable wafer grabbing claw (22) and a second movable wafer grabbing claw (22) which are sequentially arranged towards the direction away from the first reference surface;

the transmission ratio of the transmission mechanism is set to be 2:1.

11. The wafer gripping apparatus according to claim 5, wherein: the driving mechanism further comprises a sliding rail (4) and a sliding block (5), the sliding rail (4) is fixed on the base (1), the sliding block (5) is slidably arranged on the sliding rail (4), and the sliding block (5) is fixedly connected with the movable wafer grabbing claw (22).

12. The wafer gripping device according to claim 8, wherein:

the lifting mechanism (3) further comprises guide pieces (35), the guide pieces (35) are in threaded fit with the screw rods (32), and guide parts on different screw rods (32) are staggered; the movable wafer grabbing claw (22) is fixed on the guide piece (35);

the driving mechanism further comprises a sliding rail (4) and a sliding block (5), the sliding rail (4) is fixed on the base (1), and the sliding block (5) is slidably arranged on the sliding rail (4);

the wafer grabbing device further comprises a connecting plate (6), the side edge of the connecting plate (6) is fixed on the guide piece (35) and the sliding block (5), and the movable wafer grabbing claw (22) is further fixed on the connecting plate (6).

13. The wafer gripping apparatus according to claim 12, wherein:

the lifting mechanism (3) further comprises a sliding rail (4) which is arranged in parallel with the screw rod (32), and a sliding block (5) which is fixedly connected with the movable wafer grabbing claw (22); the sliding blocks (5) of different lifting mechanisms (3) are staggered.

14. The wafer gripping apparatus according to claim 12, wherein: the movable wafer grabbing claw (22) is connected with the driving mechanism through the connecting plate (6), and in the direction perpendicular to the movable direction of the movable wafer grabbing claw, the driving mechanism is connected to the side edge of the connecting plate (6) in the first direction, the movable wafer grabbing claw (22) is connected with the side edge of the connecting plate (6) in the second direction, and the first direction is perpendicular to the second direction.

15. The wafer gripping apparatus according to claim 12, wherein:

three baffle plates (14) are arranged on the base (1) at intervals, limiting plates (51) are arranged on the sliding block (5), and the limiting plates (51) are located between two adjacent baffle plates (14).