CN115798375A - Chip on film, display panel and display device - Google Patents
Chip on film, display panel and display device Download PDFInfo
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- CN115798375A CN115798375A CN202211431125.0A CN202211431125A CN115798375A CN 115798375 A CN115798375 A CN 115798375A CN 202211431125 A CN202211431125 A CN 202211431125A CN 115798375 A CN115798375 A CN 115798375A
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Abstract
The invention discloses a chip on film, a display panel and a display device. The chip on film comprises a substrate, a driving chip and a plurality of golden fingers, wherein the driving chip is arranged on the substrate, the substrate is provided with an input binding area and an output binding area which are opposite, the input binding area and the output binding area are both provided with the plurality of golden fingers which are arranged in a linear array, and the golden fingers are electrically connected with the driving chip through electric leads; the driving chip is in a long strip shape, and the plurality of golden fingers positioned in the input binding region and the plurality of golden fingers positioned in the output binding region are arranged in an array mode along the length extending direction perpendicular to the driving chip. According to the technical scheme, the plurality of gold fingers of the input binding region and the plurality of gold fingers of the output binding region are arrayed along the length extending direction vertical to the driving chip, at the moment, the number of the gold fingers can be increased to the required number only by adaptively adjusting the size of the substrate in the length direction vertical to the driving chip, so that more data can be processed, and the requirements of small size and high resolution are met.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a chip on film, a display panel using the chip on film, and a display device using the display panel.
Background
With the continuous development of display technology, high-resolution displays enter the lives of more and more people; particularly, many young people have increasingly high demands for small-sized high-resolution displays due to demands for game appearance, movie display effect, or art design. However, as the resolution of the display is higher, the amount of data transmitted by the necessary data driving chip is larger, the more output channels are required, i.e. the more gold fingers are required to be arranged on the chip on film.
In the related art, the array arrangement direction of the gold fingers of the chip on film is generally arranged along the transverse direction (i.e., arranged along the length direction of the driving chip), and the dimension of the transverse direction is generally a fixed dimension, so that it is difficult to arrange more gold fingers on the conventional chip on film under the same dimension of the driving chip.
Disclosure of Invention
The main objective of the present invention is to provide a chip on film, which can improve the problem of the conventional chip on film that the number of gold fingers is small.
In order to achieve the above object, the chip on film provided by the present invention comprises a substrate, a driving chip and a plurality of gold fingers, wherein the driving chip is disposed on the substrate, the substrate has an input binding region and an output binding region which are opposite to each other, the input binding region and the output binding region are both provided with the plurality of gold fingers arranged in a linear array, and the gold fingers are electrically connected with the driving chip through a conductive wire; the driving chip is in a long strip shape, and the plurality of golden fingers positioned in the input binding region and the plurality of golden fingers positioned in the output binding region are arranged in an array mode along the length extending direction perpendicular to the driving chip.
In an embodiment, each of the gold fingers is a strip, and a length extending direction of the gold finger is parallel to a length extending direction of the driving chip.
In an embodiment, the driver chip has a first center line parallel to a length direction of the driver chip, and the plurality of gold fingers of the input bonding area and the plurality of gold fingers of the output bonding area are symmetrically distributed about the first center line.
In one embodiment, each periphery of the driving chip is provided with a pin, and each pin is connected with one of the gold fingers through one of the conductive wires.
In an embodiment, the driver chip further has a second center line perpendicular to the length direction of the driver chip, and the leads respectively disposed at two sides of the second center line are electrically connected to the gold finger of the input bonding region and the gold finger of the output bonding region through the conductive wire.
In an embodiment, the length extending direction of the gold finger and the length extending direction of the driving chip are arranged at an acute angle.
In an embodiment, the chip on film further includes a protection film covering the driving chip.
In an embodiment, the chip on film further includes a heat dissipation layer covering the driving chip;
or the heat dissipation layer is arranged on one side of the substrate, which is far away from the driving chip.
The invention further provides a display panel which is characterized by comprising an array substrate and the chip on film, wherein the array substrate is provided with a butt joint binding area, and the butt joint binding area is electrically connected with the golden fingers of the output binding area.
The invention further provides a display device which is characterized by comprising a backlight module and the display panel, wherein the backlight module is arranged on the light incident side of the display panel and comprises a main circuit board, and the main circuit board is electrically connected with the golden fingers of the input binding area.
According to the technical scheme, the input binding region and the output binding region which are oppositely arranged are arranged on the substrate, and the plurality of golden fingers positioned in the input binding region and the plurality of golden fingers positioned in the output binding region are electrically connected with the driving chip through the electric lead, so that the driving chip can transmit signals through the golden fingers positioned in the input binding region and the golden fingers positioned in the output binding region. In addition, it can be understood that the dimension of the substrate in the length direction parallel to the driving chip is a fixed dimension, the dimension of the substrate in the length direction perpendicular to the driving chip is a dimension capable of being flexibly adjusted according to requirements, the plurality of gold fingers in the input binding region and the plurality of gold fingers in the output binding region are all arrayed in the length extending direction perpendicular to the driving chip, the number of the gold fingers is no longer limited by the fixed dimension of the substrate in the length direction parallel to the driving chip, the number of the gold fingers can be increased to the required number, and at the moment, only the dimension of the substrate in the length direction perpendicular to the driving chip needs to be adjusted in an applicability manner, so that the effect of increasing the data processing capacity can be achieved. In addition, under the condition of achieving the same resolution, the number of the flip chips in the invention is less, so that the problem that the binding machine can not operate due to the fact that the number of the flip chips is more and the gap between two adjacent flip chips is smaller can be solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a top view of a COF according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an exemplary COF package according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of another exemplary flip-chip on film in accordance with the present invention;
FIG. 4 is a schematic structural diagram of a second display panel according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a connection structure between a display panel and a main circuit board in a third display device according to an embodiment of the present invention;
fig. 6 is a schematic side view of a third display device according to an embodiment of the invention.
The reference numbers indicate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The first embodiment is as follows:
the present invention provides a flip chip film 100.
In the embodiment of the present invention, as shown in fig. 1, the chip on film 100 includes a substrate 110, a driving chip 120 and a plurality of gold fingers 130, the driving chip 120 is disposed on the substrate 110, the substrate 110 has an input bonding region 111 and an output bonding region 112 opposite to each other, the input bonding region 111 and the output bonding region 112 are both provided with a plurality of gold fingers 130 arranged in a linear array, and the gold fingers 130 are electrically connected to the driving chip 120 through conductive wires 140; the driving chip 120 is in a strip shape, and the plurality of gold fingers 130 located in the input bonding region 111 and the plurality of gold fingers 130 located in the output bonding region 112 are all arranged in an array along a direction perpendicular to the length extension direction of the driving chip 120.
The flip-chip film 100 is a flexible circuit board provided with a driver chip 120, and includes a substrate 110, and the driver chip 120 and a plurality of gold fingers 130 are provided on the substrate 110, it can be understood that the driver chip 120 has a plurality of pins, and the plurality of pins include an input pin and an output pin, and the input pin and the output pin are usually provided on different two sides, so that by providing an input bonding area 111 and an output bonding area 112 on the substrate 110, the gold fingers 130 of the input bonding area 111 and the gold fingers 130 of the output bonding area 112 can be respectively electrically connected with the input pin and the output pin of the driver chip 120 through a conductive wire 140, so as to achieve the input and output effects of signals. After the manufacturers complete the production of the flip chip film 100, the packages are wound on the winding wheel in a tape-and-reel manner. In order to avoid the performance of the driving chip 120 from being affected by bending deformation after being wound on the winding wheel, the length direction of the driving chip 120 is generally parallel to the axial direction of the winding wheel, so the dimension of the flip-chip film 100 parallel to the length direction of the driving chip 120 is generally fixed, and it is difficult to arrange more golden fingers 130 along the length direction of the driving chip 120, and thus it is difficult to meet the requirement of processing more data amount. When the tape wound on the winding wheel is cut into a plurality of the flip chips 100, the cutting line is parallel to the axial direction of the winding wheel, and the size of the flip chips 100 along the direction of the material roll (i.e. perpendicular to the length direction of the driving chip 120) can be flexibly set according to the requirement and cut according to the requirement.
By arranging the plurality of gold fingers 130 arranged in the input bonding region 111 and the plurality of gold fingers 130 arranged in the output bonding region 112 on the substrate 110 in an array along the length extending direction of the vertical driving chip 120, the size of the flip-chip 100 in the length direction of the vertical driving chip 120 can be increased as required, and further more gold fingers 130 can be arranged in an array along the length direction of the vertical driving chip 120, so that the driving chip 120 in the invention can bear more routing channels and increase the data processing amount compared with the traditional driving chip 120 with the same size. Meanwhile, on the basis that more golden fingers 130 can be arranged according to requirements to increase the data processing amount under the condition that the dimension of the flip chip 100 in the direction parallel to the driving chip 120 is not changed, the arrangement can also reduce the number of the flip chip 100 in the display device, thereby solving the problem that the binding machine cannot operate due to more flip chip 100 and smaller gap between two adjacent flip chip 100, and facilitating the small-size display device to have the function of high resolution.
According to the technical scheme of the invention, the substrate 110 is provided with the input binding region 111 and the output binding region 112 which are oppositely arranged, and the plurality of gold fingers 130 positioned in the input binding region 111 and the plurality of gold fingers 130 positioned in the output binding region 112 are electrically connected with the driving chip 120 through the conducting wire 140, so that the driving chip 120 can transmit signals through the gold fingers 130 of the input binding region 111 and the gold fingers 130 of the output binding region 112. In addition, it can be understood that the dimension of the substrate 110 parallel to the length direction of the driving chip 120 is a fixed dimension, the dimension of the substrate 110 perpendicular to the length direction of the driving chip 120 is a dimension capable of being flexibly adjusted according to requirements, and the plurality of gold fingers 130 input into the bonding region 111 are arrayed in the direction perpendicular to the length extension direction of the driving chip 120, so that the number of the gold fingers 130 is no longer limited by the fixed dimension of the substrate 110 parallel to the length direction of the driving chip 120, the number of the gold fingers 130 can be increased to the required number, and at this time, only the dimension of the substrate 110 perpendicular to the length direction of the driving chip 120 needs to be adaptively adjusted, thereby achieving the effect of increasing the data processing amount. Moreover, under the condition of achieving the same resolution, the number of the flip chips 100 in the invention is small, so that the problem that the bonding machine cannot operate due to the fact that the gap between two adjacent flip chips 100 is small because the number of the flip chips 100 is large can be solved.
As an example, as shown in fig. 1, each gold finger 130 is in a strip shape, and a length extending direction of the gold finger 130 is parallel to a length extending direction of the driving chip 120.
By making the length extending direction of the golden finger 130 parallel to the length extending direction of the driving chip 120, the narrow side direction of the golden finger 130 extends along the length direction of the vertical driving chip 120, and further, when the plurality of golden fingers 130 are arranged in an array along the length direction of the vertical driving chip 120, more golden fingers 130 can be arranged to increase the routing channel. Moreover, the arrangement makes the guiding line between the gold finger 130 and the driving chip 120 shorter, so as to reduce the risk of attenuation of the transmission signal.
As another example, as shown in fig. 1, the length extending direction of the gold finger 130 and the length extending direction of the driving chip 120 are disposed at an acute angle.
The length extending direction of the gold finger 130 and the length extending direction of the driving chip 120 are arranged at an acute angle, so that when the gold finger 130 is connected with the driving chip 120 through the conductive wire 140, the risk of dislocation when the conductive wire 140 is bound with the gold finger 130 can be reduced.
Furthermore, the plurality of gold fingers 130 located in the input binding region 111 use the center line of the input binding region 111 as a symmetry axis, and the gold fingers 130 on both sides of the center line of the input binding region 111 have opposite inclination directions and are arranged in an outer "eight" shape, so that the length of the conductive line 140 connected with the gold fingers 130 of the input binding region 111 can be reduced, and the risk of attenuation of transmission signals is reduced. The plurality of gold fingers 130 located in the output bonding region 112 use the center line of the output bonding region 112 as a symmetry axis, and the gold fingers 130 on both sides of the center line of the output bonding region 112 have opposite inclination directions and are also arranged in an outer shape like a Chinese character 'ba', so that the length of the conductive wire 140 connected with the gold fingers 130 of the output bonding region 112 can be reduced, and the risk of attenuation of transmission signals can be reduced.
As an example, as shown in fig. 1, the driver chip 120 has a first center line 121 parallel to the length direction of the driver chip 120, and the plurality of gold fingers 130 of the input binding region 111 and the plurality of gold fingers 130 of the output binding region 112 are symmetrically distributed about the first center line 121.
By symmetrically distributing the gold fingers 130 of the input bonding region 111 and the gold fingers 130 of the output bonding region 112 with respect to the first center line 121 of the driver chip 120, the risk of signal attenuation due to too long length of the guiding lines when the individual gold fingers 130 are connected to the driver chip 120 through the conductive lines 140 can be avoided.
Specifically, the driving chip 120 has two opposite long sides and two opposite short sides, the two opposite long sides of the driving chip 120 are both provided with pins, and the gold finger 130 located on the same side of the first center line 121 is electrically connected with the pins on the long sides of the driving chip 120, so that the situation that the conductive wires 140 led out from the pins on the two long sides are intersected with each other is reduced. The conductive line 140 may be a straight line, a broken line, or a curved line.
Further, as shown in fig. 1, each periphery of the driving chip 120 is provided with a pin, and each pin is connected to a gold finger 130 through a conductive wire 140.
The pins are disposed on the periphery of the driving chip 120, and each pin is connected to one gold finger 130 through one more guiding point, so that the number of signal channels is increased, thereby improving the data processing capacity.
Specifically, the input binding region 111 has a plurality of gold fingers 130 opposite to the short side of the driver chip 120 facing the input binding region 111, and the gold fingers 130 are connected to the pins on the short side of the driver chip 120 facing the input binding region 111 through linear conductive wires 140; the output bonding region 112 has a plurality of gold fingers 130 opposite to the short side of the driver chip 120 facing the output bonding region 112, and the gold fingers 130 are connected to the pins on the short side of the driver chip 120 facing the output bonding region 112 through linear conductive wires 140. With such an arrangement, the length of the conductive line 140 is shortened on the basis of increasing the signal channel, thereby reducing the risk of signal attenuation.
Further, as shown in fig. 1, the driving chip 120 further has a second central line 122 perpendicular to the length direction of the driving chip 120, and the leads respectively disposed at two sides of the second central line 122 are electrically connected to the gold finger 130 of the input bonding region 111 and the gold finger 130 of the output bonding region 112 through the conductive line 140.
With the second central line 122 of the driver chip 120 as a boundary, the pins on one side of the second central line 122 are close to the input bonding region 111, the pins on the other side are close to the output bonding region 112, the pins close to the input bonding region 111 can be electrically connected with the gold fingers 130 in the input bonding region 111 through the conductive wires 140, and the pins close to the output bonding region 112 can be electrically connected with the gold fingers 130 in the output bonding region 112 through the conductive wires 140.
Further, as shown in fig. 2, the flip chip package 100 further includes a protection film 150, and the protection film 150 is disposed to cover the driving chip 120.
By providing the protective film 150, the effect of protecting the driver chip 120 can be achieved, and the driver chip 120 can be prevented from being corroded by water and oxygen. Specifically, the protective film 150 may be an encapsulation adhesive or a plastic film.
Further, as shown in fig. 2, the chip on film 100 further includes a heat dissipation layer 160, and the heat dissipation layer 160 covers the driving chip 120.
By covering the heat dissipation layer 160 on the driving chip 120, the heat dissipation layer 160 has a better heat dissipation effect on the driving chip 120, and the service life of the driving chip 120 is prolonged. Further, the heat dissipation layer 160 may be disposed on a side of the protection film 150 away from the driving chip 120, so that the heat dissipation layer 160 can dissipate heat of the driving chip 120 and also can isolate the driving chip 120 and the heat dissipation layer 160 through the protection film 150. Specifically, the heat dissipation layer 160 may be a graphite sheet, an aluminum sheet, or a heat dissipation silica gel.
Alternatively, as shown in fig. 3, in other examples, the heat dissipation layer 160 is disposed on a side of the substrate 110 facing away from the driving chip 120. With such a configuration, the heat dissipation effect of the driving chip 120 can be achieved. Specifically, when the heat dissipation layer 160 is disposed on a side of the substrate 110 away from the driving chip 120, a projection of the heat dissipation layer 160 on the substrate 110 may only cover a projection of the driving chip 120 on the substrate 110; or the heat dissipation layer 160 may further cover the substrate 110, so that on the premise that the driving chip 120 can be guaranteed to dissipate heat, the conductive wires 140 and the gold fingers 130 arranged on the substrate 110 may also be dissipated, and the stability of the chip on film 100 in use is further improved.
Further, as shown in fig. 3, the chip on film 100 further includes a heat conductor 170, a heat conduction channel is disposed on the substrate 110, the heat conduction channel penetrates through a side of the substrate 110 where the driving chip 120 is disposed and a side of the substrate 110 away from the driving chip 120, the heat conductor 170 is disposed in the heat conduction channel, and two opposite sides of the heat conductor 170 are respectively in contact with the heat dissipation layer 160 and the conductive wires 140.
It is understood that the substrate 110 of the flip-chip film 100 is usually a polyimide film, and the material may hinder the heat conduction and easily affect the heat dissipation of the flip-chip film 100. In this example, by providing the heat conductor 170, and the two opposite sides of the heat conductor 170 are respectively in contact with the heat dissipation layer 160 and the conductive wires 140, the heat of the conductive wires 140 and the heat transferred from the driving chip 120 to the conductive wires 140 can directly cross the substrate 110, and directly transfer to the heat dissipation layer 160 through the heat conductor 170, and dissipate the heat through the heat dissipation layer 160, thereby avoiding the risk that the substrate 110 affects the heat dissipation effect.
Furthermore, the heat conduction channel is a long strip, and the projection of the heat conduction channel on the heat dissipation layer 160 intersects with the projection of the at least two conductive wires 140 on the heat dissipation layer 160, so that the at least two conductive wires 140 can perform heat transfer through the heat conductor 170 in the same heat conduction channel.
Example two:
the present invention further provides a display panel, as shown in fig. 4, the display panel includes an array substrate 200 and a flip-chip film 100, the specific structure of the flip-chip film 100 refers to the above embodiments, and since the display panel adopts all technical solutions of all the above embodiments, the display panel at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. The array substrate 200 has a docking binding region 210, and the docking binding region 210 is electrically connected to the gold finger 130 of the output binding region 112.
The gold finger 130 of the output bonding area 112 of the chip on film 100 is bonded to the butt bonding area 210 of the array substrate 200, so that the chip on film 100 connects the signal to the array substrate 200 through the gold finger 130 of the output bonding area 112 and provides the display signal for the pixel unit on the array substrate 200 through the butt bonding area 210 of the array substrate 200.
Example three:
the present invention further provides a display device, please refer to fig. 5 and fig. 6 in combination, the display device includes a backlight module 300 and a display panel, the specific structure of the display panel refers to the above embodiments, and since the display device adopts all technical solutions of all the above embodiments, the display device at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. The backlight module 300 is disposed on the light incident side of the display panel, the backlight module 300 includes a main circuit board 400, and the main circuit board 400 is electrically connected to the gold finger 130 of the input binding region 111.
The backlight module 300 includes a main circuit board 400, the main circuit board 400 is electrically connected to the gold fingers 130 of the input binding region 111, and further processes the received data signal through the driving chip 120, and further transmits the data signal to the array substrate 200 through the gold fingers 130 of the output binding region 112, and can supply power to the display panel.
It can be understood that, since the backlight module 300 is disposed on the back of the display panel, when the display panel is connected to the main circuit board 400 of the backlight module 300 through the chip on film 100, the chip on film 100 needs to be bent to be connected to the main circuit board 400, and therefore, a distance is provided between the driving chip 120 in the chip on film 100 and the input binding region 111 and the output binding region 112, so that after the gold finger 130 of the output binding region 112 of the chip on film 100 is connected to the array substrate 200, the gold finger will bend the position between the output binding region 112 and the driving chip 120 during bending, thereby preventing the driving chip 120 from bending and ensuring the integrity of the driving chip 120.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A chip on film comprises a substrate, a driving chip and a plurality of golden fingers, wherein the driving chip is arranged on the substrate, the substrate is provided with an input binding area and an output binding area which are opposite, the input binding area and the output binding area are respectively provided with the plurality of golden fingers which are arranged in a linear array, and the golden fingers are electrically connected with the driving chip through electric leads; the driving chip is in a long strip shape, and the plurality of golden fingers positioned in the input binding region and the plurality of golden fingers positioned in the output binding region are arranged in an array mode along the length extending direction perpendicular to the driving chip.
2. The chip on film of claim 1, wherein each of the gold fingers is a strip shape, and a length extending direction of the gold finger is parallel to a length extending direction of the driving chip.
3. The chip on film of claim 2, wherein the driver chip has a first center line parallel to a length direction of the driver chip, and the plurality of gold fingers of the input bonding area and the plurality of gold fingers of the output bonding area are symmetrically distributed about the first center line.
4. The chip on film of claim 3, wherein each of the driving chips has a pin at its periphery, and each of the pins is connected to one of the gold fingers through one of the conductive wires.
5. The chip on film of claim 4, wherein the driving chip further has a second center line perpendicular to the length direction of the driving chip, and the leads respectively disposed at two sides of the second center line are electrically connected to the gold fingers of the input bonding area and the gold fingers of the output bonding area through the conductive wires.
6. The chip on film of claim 1, wherein the extending direction of the gold finger and the extending direction of the driving chip form an acute angle.
7. The chip on film according to any one of claims 1 to 6, further comprising a protective film disposed to cover the driving chip.
8. The chip on film according to any one of claims 1 to 6, further comprising a heat dissipation layer covering the driving chip;
or the heat dissipation layer is arranged on one side of the substrate, which is far away from the driving chip.
9. A display panel comprising an array substrate and the chip on film of any one of claims 1 to 8, wherein the array substrate has a docking bonding area, and the docking bonding area is electrically connected to the gold finger of the output bonding area.
10. A display device, comprising a backlight module and the display panel of claim 9, wherein the backlight module is disposed on the light incident side of the display panel, and the backlight module comprises a main circuit board electrically connected to the gold finger of the input bonding area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211431125.0A CN115798375A (en) | 2022-11-14 | 2022-11-14 | Chip on film, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211431125.0A CN115798375A (en) | 2022-11-14 | 2022-11-14 | Chip on film, display panel and display device |
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| CN115798375A true CN115798375A (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211431125.0A Pending CN115798375A (en) | 2022-11-14 | 2022-11-14 | Chip on film, display panel and display device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109087589A (en) * | 2018-10-22 | 2018-12-25 | 惠科股份有限公司 | array substrate, display panel and display device |
| WO2020168849A1 (en) * | 2019-02-21 | 2020-08-27 | 京东方科技集团股份有限公司 | Display panel and drive method therefor, and display apparatus |
| WO2021103147A1 (en) * | 2019-11-26 | 2021-06-03 | Tcl华星光电技术有限公司 | Chip-on-film and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
| CN216901261U (en) * | 2022-03-29 | 2022-07-05 | 绵阳惠科光电科技有限公司 | Display device |
-
2022
- 2022-11-14 CN CN202211431125.0A patent/CN115798375A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109087589A (en) * | 2018-10-22 | 2018-12-25 | 惠科股份有限公司 | array substrate, display panel and display device |
| WO2020168849A1 (en) * | 2019-02-21 | 2020-08-27 | 京东方科技集团股份有限公司 | Display panel and drive method therefor, and display apparatus |
| WO2021103147A1 (en) * | 2019-11-26 | 2021-06-03 | Tcl华星光电技术有限公司 | Chip-on-film and display device |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
| CN216901261U (en) * | 2022-03-29 | 2022-07-05 | 绵阳惠科光电科技有限公司 | Display device |
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