CN115792817A - Ka frequency band multichannel T/R subassembly - Google Patents

Abstract

The invention provides a Ka-frequency-band multichannel T/R assembly, which belongs to the technical field of radio frequency microwaves and comprises an antenna transceiving unit and a power dividing unit, wherein the antenna transceiving unit comprises a radio frequency board, an antenna module integrated on the front surface of the radio frequency board and a four-channel multifunctional module stacked on the back surface of the radio frequency board; the power dividing unit comprises a power dividing plate, a power dividing module stacked on the back of the power dividing plate and a connector arranged on the back of the power dividing plate; twelve isolation grooves for isolating the multifunctional modules are correspondingly arranged on the front surface of the power division plate one by one; the three four-channel multifunctional modules are respectively provided with an independent power distribution module and a connector; the power dividing plate is vertically connected with the back surface of the radio frequency plate, so that the antenna transceiving unit and the power dividing unit are vertically stacked into a whole. The invention adopts four receiving and transmitting channels and a tile type structure with high integration level, vertically stacks the antenna receiving and transmitting unit and the power dividing unit to form the four-channel microwave T/R component of the integrated radiation antenna, and has the characteristics of modularization, miniaturization and low cost.

Description

Ka frequency band multichannel T/R subassembly

Technical Field

The invention belongs to the technical field of radio frequency microwave, and particularly relates to a Ka frequency band multi-channel T/R assembly.

Background

The TR component is a critical part of the communication system. With the increasing transmission bandwidth, the lower frequency band becomes more and more crowded, and the requirement of the transmission bandwidth cannot be met, and the exploration and research of the high frequency band (such as millimeter wave) is never interrupted, which has the following advantages: the transmission bandwidth is wider, the wavelength is small, and the size of the device is easy to reduce, but the transmission bandwidth is limited by the material and the process thereof. The research on the Ka frequency band active phased array radar starts late in China, but since the 21 st century, the research progress is accelerated by a plurality of research units in China, and in recent years, the development is more towards modularization, miniaturization and low cost, so that a great result is obtained in this respect.

At present, the microwave T/R assembly at home and abroad generally adopts the traditional micro-assembly process in the metal box body, the volume of the whole assembly is larger, and the process flow is fussy.

Disclosure of Invention

The embodiment of the invention provides a Ka frequency band multichannel T/R component, which adopts a tile type 3D stacking structure and can realize modularization, miniaturization and low cost of a microwave component.

In order to achieve the purpose, the invention adopts the technical scheme that: a Ka-band multichannel T/R component is provided, which comprises: the antenna comprises an antenna transceiving unit and a power dividing unit, wherein the antenna transceiving unit comprises a radio frequency plate, an antenna module integrated on the front surface of the radio frequency plate and a four-channel multifunctional module stacked on the back surface of the radio frequency plate; the power division unit comprises a power division plate, a power division module stacked on the back of the power division plate and a connector arranged on the back of the power division plate; twelve isolation grooves for isolating the multifunctional modules are correspondingly arranged on the front surface of the power division plate one by one; the three four-channel multifunctional modules are respectively and correspondingly provided with the independent power division module and the connector so as to realize independent phase shift and attenuation of each channel; the power distribution board is vertically connected with the back surface of the radio frequency board, so that the antenna transceiving unit and the power distribution unit are vertically stacked into a whole.

In a possible implementation manner, the front surface of the radio frequency board is provided with 48 antenna modules to integrate into 48 transceiving channels.

In one possible implementation manner, the power distribution board and the radio frequency board are vertically connected through BGA ball-planting.

In a possible implementation manner, a surface-mounted bonding pad is arranged on the back surface of the radio frequency board, and the multifunctional module is arranged on the surface-mounted bonding pad.

In a possible implementation manner, the multifunctional modules are regularly arranged on the back surface of the radio frequency board in a square shape and correspondingly extend into the four isolation grooves.

In one possible implementation, the multifunctional module is located in the middle of the isolation slot.

In a possible implementation manner, the inner side surfaces of the partition walls between the four partition grooves are provided with metal shielding layers.

In one possible realization, the wall thickness between the isolation grooves is greater than the thickness of the outer wall thereof.

In one possible implementation, the isolation trench is rectangular in shape.

In one possible implementation, the multifunctional module includes a multifunctional chip, a power control chip, and a low-noise amplification chip.

Compared with the prior art, the Ka frequency band multichannel T/R component provided by the invention has the beneficial effects that: the four-channel microwave T/R component of the integrated radiation antenna is formed by vertically stacking and integrating the antenna transceiving unit and the power dividing unit into a whole by adopting four transceiving channels and a high-integration tile-type structure, and has the characteristics of modularization, miniaturization and low cost.

Drawings

Fig. 1 is a schematic diagram of an internal structure of a Ka-band multichannel T/R component according to an embodiment of the present invention;

FIG. 2 is a schematic perspective view of a Ka-band multichannel T/R assembly according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a front view structure of a Ka-band multichannel T/R component according to an embodiment of the present invention;

FIG. 4 is a schematic bottom view of the Ka-band multi-channel T/R module shown in FIG. 3;

FIG. 5 is a schematic diagram of a side view of the Ka-band multichannel T/R assembly shown in FIG. 3;

description of reference numerals:

1. an antenna module; 2. a multifunctional module; 3. a connector; 4. a radio frequency board; 5. a power division plate; 6. a power division module; 7. and (4) isolating the groove.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to 5, a Ka band multi-channel T/R device according to the present invention will now be described. The Ka-band multichannel T/R component comprises an antenna transceiving unit and a power dividing unit, wherein the antenna transceiving unit comprises a radio frequency board 4, an antenna module 1 integrated on the front surface of the radio frequency board 4 and a four-channel multifunctional module 2 stacked on the back surface of the radio frequency board 4; the power dividing unit comprises a power dividing plate 5, a power dividing module 6 stacked on the back of the power dividing plate 5 and a connector 3 arranged on the back of the power dividing plate 5; wherein, twelve isolation grooves 7 for isolating the multifunctional modules 2 are correspondingly arranged on the front surface of the power dividing plate 5 one by one; the three four-channel multifunctional modules 2 are respectively and correspondingly provided with an independent power division module 6 and a connector 3 so as to realize independent phase shift and attenuation of each channel; the power dividing plate 5 is vertically connected with the back surface of the radio frequency plate 4, so that the antenna transceiving unit and the power dividing unit are vertically stacked into a whole.

The Ka frequency band multichannel T/R subassembly that this embodiment provided has the following beneficial effect:

adopt the multi-functional chip of encapsulation form (one), the 4 ways of receiving of multi-functional chip internal integration and transmission passageway, four multi-functional modules 2 realize keeping apart through isolation slot 7, and the correspondence be equipped with connector 3 and merit divide module 6, can realize that every passageway shifts the phase and attenuate alone, the pipe after the pipe encapsulation can satisfy airtight requirement, antenna module 1, multi-functional module 2 and merit divide module 6 all to divide the assembly on radio frequency board 4 or merit divide board 5 through SMT surface mounting technology, the subassembly integrated level has been improved greatly, reduce technology complexity.

(II) integrate radiation antenna module 1 and T/R subassembly to a circuit board on, then carry out the design and the emulation of integration, solved traditional T/R subassembly and antenna connector 3 because of the loss problem that leads to the fact to inserting, reduced the use of components and parts such as connector 3 moreover, greatly reduced the cost of T/R subassembly, reduced the size and the weight of subassembly, promoted the integrated level of microwave subassembly.

And (III) a 3D stacking structure is adopted, elements such as the packaged tube shell, the power distribution module 6 and the connector 3 are reasonably distributed on the circuit board, the space structure is optimized, the assembly can be completed through an SMT surface mounting technology, the process assembly complexity is greatly reduced, and the integration level of the microwave assembly is also improved.

The T/R assembly provided by the invention can greatly improve the integration level of the microwave T/R assembly, provides important engineering experience for the development of the microwave assembly towards the direction of miniaturization and high integration level, and simultaneously meets the requirement of engineering application.

The description is as follows: in this embodiment, the multifunctional module 2 and the power dividing module 6 are packaged by SMT surface mounting. SMT is a Surface Mount Technology, known as Surface Mount Technology, and is currently the most popular Technology and process in the electronic assembly industry. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by reflow soldering. The problems of size and volume of the electronic component can be solved, and the device is light in weight and small in size through a surface-mounted packaging technology.

In some embodiments, referring to fig. 1 to 3, 48 antenna modules 1 are disposed on the front surface of the rf board 4 to integrate into 48 transceiving channels. The 48 antenna modules 1 are equally distributed to the four-channel multifunctional module 2, and the arrangement mode is a row-column matrix.

In some embodiments, referring to fig. 1, the power splitter board 5 and the rf board 4 are vertically connected by BGA ball-planting. The BGA ball mounting, i.e., ball grid array packaging, is a common technique for semiconductor packaging. In this embodiment, BGA ball-planting is provided around each isolation trench 7.

In some embodiments, referring to fig. 1, the back surface of the rf board 4 is provided with a surface mount pad on which the multifunctional module 2 is disposed. That is, each multifunctional module and each power dividing module are attached to the radio frequency board 4 or the power dividing board 5 through the SMT surface mount technology, so that vertical stacking is achieved.

In some embodiments, as shown in fig. 1, the multifunctional modules 2 are arranged on the back of the rf board 4 in a regular square shape, and correspondingly extend into the four isolation slots 7. Each isolation slot 7 forms a shielding space to realize independent phase shift and attenuation of each channel, and improve the fidelity of signal receiving and transmitting. Wherein, each functional module and the inner wall of the isolation groove 7 are provided with an isolation gap.

In some embodiments, referring to fig. 1, the multifunctional module 2 is located in the middle of the isolation slot 7.

In some embodiments, referring to fig. 1, the inner side of the partition wall between the four partition grooves 7 is provided with a metal shielding layer. Through the metal shielding layer that sets up, improve shielded effect, prevent the mutual interference between each passageway signal.

In some embodiments, the wall thickness between the isolation slots 7 is greater than the thickness of the outer walls thereof, see fig. 1. Specifically, the wall thickness between the isolation grooves 7 is twice the thickness of the outer wall, so that the shielding effect between each other is improved, and mutual interference is avoided.

In some embodiments, referring to fig. 1, the isolation trenches 7 are rectangular in shape. Optionally, the shape of the isolation groove 7 can be circular or oval, and the shape of the isolation groove can be adapted to the number and shape of the functional modules to achieve the purposes of saving space and reducing size.

In some embodiments, the multifunction module 2 includes a multifunction chip, a power control chip, and a low-noise amplification chip.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. A Ka-band multichannel T/R component, comprising:

the antenna transceiving unit comprises a radio frequency board (4), an antenna module (1) integrated on the front surface of the radio frequency board (4) and a four-channel multifunctional module (2) stacked on the back surface of the radio frequency board (4); and

the power division unit comprises a power division plate (5), a power division module (6) stacked on the back of the power division plate (5) and a connector (3) arranged on the back of the power division plate (5); twelve isolation grooves (7) for isolating the multifunctional modules (2) are correspondingly arranged on the front surface of the power division plate (5) one by one; the three four-channel multifunctional modules (2) are respectively and correspondingly provided with the independent power division module (6) and the connector (3) so as to realize independent phase shift and attenuation of each channel;

the power distribution plate (5) is vertically connected with the back surface of the radio frequency plate (4) so that the antenna transceiving unit and the power distribution unit are vertically stacked into a whole.

2. The Ka-band multichannel T/R assembly according to claim 1, characterized in that 48 antenna modules (1) are provided on the front face of the radio frequency board (4) to be integrated into 48 transceiving channels.

3. The Ka-band multichannel T/R assembly according to claim 1, characterized in that the power splitting board (5) and the radio frequency board (4) are vertically connected by BGA ball-mounting.

4. The Ka-band multichannel T/R assembly according to claim 1, wherein the back of the radio frequency board (4) is provided with a surface-mounted pad, and the multifunctional module (2) is arranged on the surface-mounted pad.

5. The Ka-band multichannel T/R assembly as claimed in claim 1, wherein the multifunctional modules (2) are arranged on the back of the radio frequency board (4) in a square regular manner and correspondingly extend into the four isolation grooves (7).

6. The Ka-band multichannel T/R assembly according to claim 5, characterized in that the multifunctional module (2) is located in the middle of the isolation slot (7).

7. The Ka-band multichannel T/R assembly as claimed in claim 1, characterized in that the inner side of the partition wall between the four said isolation slots (7) is provided with a metal shielding layer.

8. The Ka-band multichannel T/R assembly according to claim 1, characterized in that the wall thickness between the isolation grooves (7) is greater than the thickness of the outer walls thereof.

9. The Ka-band multichannel T/R assembly according to claim 1, characterized in that the isolation slot (7) is rectangular in shape.

10. The Ka band multichannel T/R module according to claim 1, characterized in that the multifunctional module (2) comprises a multifunctional chip, a power control chip and a low noise amplification chip.

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