CN220874530U - Tile type receiving component and phased array system - Google Patents

Abstract

The utility model discloses a tile type receiving assembly and a phased array system, wherein the tile type receiving assembly comprises a shell and a first cover plate, a radio frequency microstrip line connected with an antenna is arranged on the upper surface of the shell, a radio frequency insulator and a multi-layer circuit board which are sequentially connected from top to bottom are arranged in the shell, a receiving module is arranged on the multi-layer circuit board, the receiving module is connected with the antenna through the radio frequency insulator and the radio frequency microstrip line, and the first cover plate covers the shell and forms a closed space containing the radio frequency insulator and the multi-layer circuit board with the shell. The utility model reduces noise loss caused by the traditional connecting cable, integrates the receiving module and the antenna array surface in a tile-type mode, has high integration level, realizes miniaturization and light weight, reduces cost and occupies space.

Description

Tile type receiving component and phased array system

Technical Field

The utility model relates to the technical field of satellite communication, in particular to a tile type receiving assembly and a phased array system.

Background

In recent years, with the continuous development of phased array technology, the system has high working frequency, compact structure and high integration level. Each antenna unit in the electric scanning array radar antenna is provided with a Receiver (R) module, the R module is an important component of a passive phased array, the R module amplifies a received signal of the antenna, provides a good signal noise coefficient, compensates signal loss, prevents excessive signal attenuation, ensures that a target signal is detected and processed, and therefore, high performance and high integration are important for the R module.

The common form of the R module is a brick structure and a tile structure, the components of the brick structure are distributed on a plane vertical to the feed port of the antenna array, the whole machine belongs to a longitudinal integrated transverse assembly mode, the section is higher, and the weight is larger; the tile structure belongs to a transverse integrated longitudinal assembly mode, the circuit design plane of the tile structure is parallel to the antenna array feed port, the heat sink of the tile structure and the lower shell of the R module assembly are integrated integrally, and the tile structure has unique advantages in high-integration-level and miniaturized application scenes. However, the existing tile-type R module still has the problems of large occupied space and low integration level.

Disclosure of utility model

The utility model aims to overcome the defects of large occupied space and low integration level of a tile-type R module in the prior art and provides a tile-type receiving assembly and a phased array system.

The technical scheme of the utility model provides a tile type receiving assembly, which comprises a shell and a first cover plate, wherein a radio frequency microstrip line connected with an antenna is arranged on the upper surface of the shell, a radio frequency insulator and a multilayer circuit board which are sequentially connected from top to bottom are arranged in the shell, a receiving module is arranged on the multilayer circuit board, the receiving module is connected with the antenna through the radio frequency insulator and the radio frequency microstrip line, and the first cover plate covers the shell and forms a closed space containing the radio frequency insulator and the multilayer circuit board with the shell.

Further, the receiving module includes N quadrant receiving arrays, a power supply and a beam controller, each quadrant receiving array includes N receiving subarrays and N-in-one combining power divider, each receiving subarray includes N multi-functional chips with N channels and N parallel multi-signal channels, each multi-signal channel includes a coupler, a limiter and a low noise amplifier, the power supply and the beam controller are electrically connected with the quadrant receiving arrays, the power supply and the beam controller are in communication connection with the limiter and the multi-functional chips, output signals of the antenna are transmitted to the multi-functional chips through the radio frequency insulator sequentially through the coupler, the limiter and the low noise amplifier, and output signals of the N multi-functional chips are transmitted to the combining power divider.

Further, the receiving module further comprises N isolation strips for isolating adjacent quadrant receiving arrays, grooves corresponding to the isolation strips are formed in the back face of the multilayer circuit board, and the isolation strips are arranged in the grooves.

Further, the material of the multifunctional chip is different from the material of the limiter and the material of the composite power divider.

Further, the multilayer circuit board comprises a radio frequency layer, at least one low-frequency signal layer, at least one power supply layer and a grounding layer which are sequentially arranged from top to bottom, the quadrant receiving array is arranged on the radio frequency layer, the power supply is arranged on the power supply layer, the beam controller is arranged on the low-frequency signal layer, and the low-frequency signal layer and the power supply layer are connected with the grounding layer.

Further, the multi-layer circuit board further comprises a radio frequency grounding layer connected with the radio frequency layer.

Further, the multi-layer circuit board is provided with a blind hole and a circuit board through hole, the radio frequency layer is communicated with the radio frequency grounding layer through the blind hole, and the low-frequency signal layer, the power supply layer and the grounding layer are communicated with each other through the circuit board through hole.

Further, the control signal transmission line, the power line and the clock signal transmission line are embedded in the multilayer circuit board.

Further, a transition circuit board and a second cover plate which is covered on the multilayer circuit board are further arranged in the shell, an inter-board connector, a plurality of internal radio frequency connectors and a plurality of external radio frequency connectors which are connected with external radio frequency connectors are arranged on the transition circuit board, an avoidance groove and a plurality of cover plate through holes which correspond to the internal radio frequency connectors are arranged on the second cover plate, the transition circuit board passes through the inter-board connector and is connected with the multilayer circuit board through the avoidance groove, the internal radio frequency connectors pass through the cover plate through holes and are connected with the multilayer circuit board, and the external radio frequency connectors are electrically connected with the internal radio frequency connectors.

The technical scheme of the utility model also provides a phased array system which comprises an antenna and the tile-type receiving assembly, wherein the receiving module of the tile-type receiving assembly is connected with the antenna.

After the technical scheme is adopted, the method has the following beneficial effects: through setting up casing and first apron, the upper surface of casing sets up the radio frequency microstrip line of being connected with the antenna, set up radio frequency insulator and multilayer circuit board in the casing, be equipped with receiving module on the multilayer circuit board, receiving module passes through radio frequency insulator and radio frequency microstrip line and antenna connection, reduce because the noise loss that traditional connecting cable introduced, make between receiving module and the antenna array surface integrate with the tile mode, the integrated level is high, and cover on the casing through first apron, and form the airtight space that holds radio frequency insulator and multilayer circuit board with the casing, realize miniaturization and lightweight, reduce cost, occupation space is reduced.

Drawings

The present disclosure will become more readily understood with reference to the accompanying drawings. It should be understood that: the drawings are for illustrative purposes only and are not intended to limit the scope of the present utility model. In the figure:

FIG. 1 is a schematic view of a tile-type receiving assembly according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of the structure of the multi-layer circuit board shown in FIG. 1;

Fig. 3 is a cross-sectional view of a receiving module of the present utility model;

fig. 4 is a schematic diagram of a stacked relationship structure of a receiving module of the present utility model;

Fig. 5 is a schematic circuit principle structure of the multi-layered circuit board shown in fig. 1.

Reference numeral control table:

11-a housing; 111-radio frequency microstrip lines; 12-a first cover plate; 13-a radio frequency insulator; 14-a multilayer circuit board; 141-a receiving module; 1411-quadrant receive array; 1412-power supply and beam controller; 1413-receiving subarray; 1414-combining the successful splitters; 1415-a multi-function chip; 1416 coupler; 1417—limiter; 1418-low noise amplifier; 1419-spacer; 142-radio frequency layer; 143-a low frequency signal layer; 144-a power supply layer; 145-a ground layer; 146-radio frequency ground layer; 147-blind hole; 148-circuit board vias; 15-a transition circuit board; 151-inter-board connectors; 152-inscribing a radio frequency connector; 16-a second cover plate; 161-avoiding grooves; 162-cover plate through holes.

Detailed Description

Specific embodiments of the present utility model will be further described below with reference to the accompanying drawings.

It is to be readily understood that, according to the technical solutions of the present utility model, those skilled in the art may replace various structural modes and implementation modes with each other without changing the true spirit of the present utility model. Accordingly, the following detailed description and drawings are merely illustrative of the utility model and are not intended to be exhaustive or to limit the utility model to the precise form disclosed.

Terms of orientation such as up, down, left, right, front, rear, front, back, top, bottom, etc. mentioned or possible to be mentioned in the present specification are defined with respect to the configurations shown in the drawings, which are relative concepts, and thus may be changed according to different positions and different use states thereof. These and other directional terms should not be construed as limiting terms.

As shown in fig. 1-5, a tile-type receiving assembly provided in an embodiment of the present utility model includes a housing 11 and a first cover plate 12, a radio frequency microstrip line 111 connected with an antenna is disposed on an upper surface of the housing 11, a radio frequency insulator 13 and a multi-layer circuit board 14 sequentially connected from top to bottom are disposed inside the housing 11, a receiving module 141 is disposed on the multi-layer circuit board 14, the receiving module 141 is connected with the antenna through the radio frequency insulator 13 and the radio frequency microstrip line 111, the first cover plate 12 covers the housing 11, and forms a closed space with the housing 11 for accommodating the radio frequency insulator 13 and the multi-layer circuit board 14, so as to improve heat dissipation.

The tile-type receiving assembly of the present embodiment mainly includes a housing 11 and a first cover plate 12.

The shell 11 is provided with the radio frequency microstrip line 111 connected with the antenna, the inside of the shell 11 is provided with the radio frequency insulator 13 and the multilayer circuit board 14, the radio frequency insulator 13 is sintered in the inside of the shell 11 and integrated on the back of the antenna, the receiving module 141 is connected with the antenna through the radio frequency insulator 13 and the radio frequency microstrip line 111, noise loss caused by a traditional connecting cable is reduced, and the receiving module 141 and the antenna array surface are integrated in a tile type.

The multilayer circuit board 14 adopts the mixed pressure board as the circuit carrier, is equipped with receiving module 141 on the multilayer circuit board 14, and receiving module 141 is used for amplifying the received signal, encapsulates in the airtight space that casing 11 and first apron 12 formed, and casing 11 and first apron 12 accessible laser seal welds and forms airtight integrated structure, and the integrated level is high, small.

Preferably, the radio frequency insulator 13 is a glass insulator for ease of maintenance and cost reduction.

According to the embodiment, the radio frequency microstrip line connected with the antenna is arranged on the upper surface of the shell, the radio frequency insulator and the multilayer circuit board are arranged in the shell, the receiving module is arranged on the multilayer circuit board and connected with the antenna through the radio frequency insulator and the radio frequency microstrip line, noise loss caused by a traditional connecting cable is reduced, the receiving module and the antenna array surface are integrated in a tile-type mode, the integration level is high, the shell is covered by the first cover plate, and a closed space for accommodating the radio frequency insulator and the multilayer circuit board is formed with the shell, so that miniaturization and light weight are realized, cost is reduced, and occupied space is reduced.

In one embodiment, as shown in fig. 2, 3 and 5, the receiving module 141 includes N quadrant receiving arrays 1411, a power supply and beam controller 1412, each quadrant receiving array 1411 includes N receiving sub-arrays 1413 and N-in-one composite power divider 1414, each receiving sub-array 1413 includes N multi-functional chips 1415 having N channels, and N parallel multi-signal channels, each multi-signal channel includes a coupler 1416, a limiter 1417 and a low noise amplifier 1418, the power supply and beam controller 1412 is electrically connected to the quadrant receiving array 1411, the power supply and beam controller 1412 is communicatively connected to the limiter 1417 and the multi-functional chips 1415, an output signal of the antenna is transmitted to the multi-functional chips 1415 through the radio frequency insulator 13 sequentially through the coupler 1416, the limiter 1417 and the low noise amplifier 1418, and an output signal of the N multi-functional chips 1415 is transmitted to the composite power divider 1414.

The receiving module 141 includes N quadrant receiving arrays 1411, a power supply and beam controller 1412, each quadrant receiving array 1411 includes N receiving sub-arrays 1413 and N-in-one composite power divider 1414, each receiving sub-array 1413 includes N multi-functional chips 1415 having N channels and N parallel multi-signal channels, each multi-signal channel includes a coupler 1416, a limiter 1417 and a Low Noise Amplifier (LNA) 1418, and the coupler 1416 is used for coupling and detecting received antenna signals, and judging whether the antenna has a fault, so as to calibrate the antenna and the tile type receiving module; the limiter 1417 is used for limiting the stronger interference signal, so as to protect the device of the whole channel; the LNA1418 is used to amplify very weak antenna signals; the multi-functional chip 1415 is used for beam forming, so that devices in the whole channel link are guaranteed to be in a linear state in a dynamic range, the multi-functional chip 1415 is realized by adopting a silicon-based multi-functional multi-channel integrated chip, and low cost and miniaturization are further realized.

The combining splitter 1414 is realized by a microwave single-chip power splitter, so that the space occupied by each network is reduced, and the wiring space utilization rate is improved.

The power supply and beam controller 1412 is used to provide power supply and amplitude and phase control.

It should be noted that, the specific structures and operation principles of the coupler 1416, the limiter 1417, the LNA1418, the composite power divider 1414, and the power and beam controller 1412 do not belong to the improvement points of the present application, and the functions thereof can be implemented by adopting the existing structures, which are not described herein.

The receiving module 141 forms a receiving sub-array 1413 with N channels, and includes N receiving sub-arrays 1413 in a quadrant receiving array 1411, where the overall synthesis mode of the array surface is divided into N-1 stages, which are respectively in-subarray synthesis, in-quadrant synthesis and array surface synthesis, the receiving sub-arrays 1413 in each quadrant receiving array 1411 are synthesized into the output of the quadrant, and the N quadrant receiving arrays 1411 output array surface and difference signals through sum and difference processing by a sum and difference network, so that each receiving sub-array 1413 and layout of the receiving module 141 are kept consistent, design efficiency is improved, maintainability of the module is enhanced, and meanwhile, multifunctional miniaturized integration of low noise, multi-channel amplitude-phase control of the receiving module is realized, and the integration degree of the tile receiving module is further improved.

Preferably, the number of N is 4, that is, the number of the quadrant receiving arrays is 4, the number of the receiving subarrays 1413 is also 4, the number of the multifunctional chips 1415 in each receiving subarray is also 4, the multifunctional chips 1415 are 4-channel multifunctional chips, the combining successful splitter 1414 is a four-in-one power splitter, and the output port of each combining successful splitter 1414 is combined into one quadrant receiving array output port, that is, the quadrant one port, the quadrant two port, the quadrant three port and the quadrant four port in fig. 2.

In one embodiment, as shown in fig. 1, in order to improve isolation, the receiving module 141 further includes N isolation bars 1419 for isolating adjacent quadrant receiving arrays 1411, and a groove corresponding to the isolation bars 1419 is provided on the back surface of the multi-layer circuit board 141, and the isolation bars 1419 are disposed in the groove.

Preferably, the number of spacer bars 1419 is 4, and the 4 spacer bars 1419 form a cross to enhance the isolation of the quadrant receiving array 1411.

In one embodiment, the material of the multifunctional chip 1415 is different from the material of the limiter 1417 and the composite power divider 1414, so that the multifunctional chip 1415, the limiter 1417 and the composite power divider 1414 form a heterogeneous integration mode, and lower noise coefficients, channel-to-channel and component-to-component amplitude consistency and isolation can be ensured.

Preferably, to facilitate heterogeneous integration, the multi-function chip 1415 is made of silicon, and the limiter 1417 and the composite power divider 1414 are made of gallium arsenide (GaAs).

In one embodiment, as shown in fig. 4, the multi-layer circuit board 14 includes a radio frequency layer 142, at least one low frequency signal layer 143, at least one power supply layer 144 and a ground layer 145 sequentially disposed from top to bottom, the quadrant receiving array 1411 is disposed on the radio frequency layer 142, the power and beam controller 1412 is disposed on the power supply layer 144, the beam controller 1414 is disposed on the low frequency signal layer 143, and the low frequency signal layer 143 and the power supply layer 144 are connected to the ground layer 145.

The multilayer circuit board 14 is a multilayer mixed pressure board, the multilayer circuit board 14 includes from last radio frequency layer 142, at least one low frequency signal layer 143, at least one power supply layer 144 and the earth layer 145 that set gradually down, adopt quadrature (dislocation) to walk the line between layer and the layer, keep apart between layer and the layer by adopting the mode of shielding post, prevent signal interference each other, be good to radio frequency impedance matching, let the impedance matching of the tie point that sets up on every hole better, make the multilayer circuit board 14 form coaxial-like structure from the antenna feed point of top layer to bottom, realize the low insertion loss transmission of plane-vertical direction.

The quadrant receiving array 1411 is disposed on the radio frequency layer 142, specifically, the multifunctional chip 1415 is assembled on the radio frequency layer 142 in a mounting manner, the coupler 1416, the limiter 1417, the LNA1418 and the composite power divider 1414 are assembled on the radio frequency layer 142 in a bonding manner of a sticky piece and a gold wire, each channel of the radio frequency layer 142 adopts a serpentine (as shown in fig. 2) and other phase wiring to ensure the phase consistency, and meanwhile, the radio frequency combining port of each quadrant receiving array 1411 is led out from the radio frequency layer 142 and then directly buckled and interconnected with the lower layer through a transfer connector, so that the transmission loss is reduced. Preferably, the thickness of the radio frequency layer 142 is 0.25mm.

The low frequency signal layer 143 is a low frequency control signal layer, and provides wave control signals and power control management signals for the antenna array surface. Preferably, the thickness of the low frequency signal layer 143 is 0.1mm.

The power supply layer 144 is a power supply layer, and provides driving power for the active chip. Preferably, the thickness of the power supply layer 144 is 0.1mm.

The ground layer 145 is common to the low frequency signal layer 143 and the power supply layer 144, and further saves costs by reducing the number of layers and thickness of the multilayer circuit board 14 by sharing the control signal ground and the power supply ground.

Preferably, the number of low frequency signal layers 143 is 4 and the number of power supply layers is 2.

In one embodiment, as shown in fig. 4, the multi-layer circuit board 14 further includes a radio frequency ground layer 146 connected to the radio frequency layer 142, which avoids radio frequency signal interference and improves stability.

In one embodiment, as shown in fig. 4, the multi-layer circuit board 14 is provided with a blind hole 147 and a circuit board through hole 148, the radio frequency layer 142 is communicated with the radio frequency ground layer 146 through the blind hole 147, the low frequency signal layer 143, the power supply layer 144 and the ground layer 145 are communicated with each other through the circuit board through hole 148, so that the number of the blind holes is reduced, the multi-layer circuit board 14 can be processed by only two pressing steps, and the processing cost is greatly reduced.

In one embodiment, control signal transmission lines, power lines and clock signal transmission lines are embedded in the multi-layer circuit board 14, so that the control, power and clock lines form a three-dimensional stacked design, and signal connectivity and electromagnetic compatibility are improved.

In one embodiment, as shown in fig. 1, a transition circuit board 15 and a second cover plate 16 covering the multilayer circuit board 14 are further disposed in the housing 11, the transition circuit board 15 is provided with an inter-board connector 151, a plurality of internal radio frequency connectors 152, and a plurality of external radio frequency connectors connected with external radio frequency connectors, the second cover plate 16 is provided with an avoidance groove 161, and a plurality of cover plate through holes 162 corresponding to the internal radio frequency connectors 152, the transition circuit board 15 is connected with the multilayer circuit board 14 by passing through the avoidance groove 161 through the inter-board connector 151, the internal radio frequency connectors 152 are connected with the multilayer circuit board 14 by passing through the cover plate through holes 162, and the external radio frequency connectors are electrically connected with the internal radio frequency connectors 152.

The shell 11 is also internally provided with a transition circuit board 15 and a second cover plate 16, the position of the transition circuit board 15, which is used for leading out a port, is converted, the transition circuit board 15 is provided with an inter-board connector 151, an inscription radio frequency connector 152 and an external radio frequency connector, the inscription radio frequency connector 152 and the external radio frequency connector are oppositely arranged on two opposite sides of the transition circuit board 15, the second cover plate 16 is provided with an avoidance groove 161 and a cover plate through hole 162, the inter-board connector 151 penetrates through the avoidance groove 161 to be electrically connected with the multilayer circuit board 14, the inscription radio frequency connector 152 penetrates through the cover plate through hole 162 to be electrically connected with the multilayer circuit board 14, so that an output signal of the multilayer circuit board 14 is led out conveniently, and the inter-board connector is connected with the external radio frequency connector.

The technical scheme of the utility model also provides a phased array system which comprises an antenna and the tile-type receiving assembly, wherein the receiving module of the tile-type receiving assembly is connected with the antenna.

According to the embodiment, through the arrangement of the tile-type receiving component, noise loss caused by the traditional connecting cable is reduced, the receiving module and the antenna array surface are integrated in a tile-type mode, the integration level is high, miniaturization and light weight are realized, the cost is reduced, and the occupied space is reduced.

What has been described above is merely illustrative of the principles and preferred embodiments of the present utility model. It should be noted that several other variants are possible to those skilled in the art on the basis of the principle of the utility model and should also be considered as the scope of protection of the present utility model.

Claims (10)

1. The utility model provides a tile formula receiving element, its characterized in that includes casing and first apron, be equipped with the radio frequency microstrip line of being connected with the antenna on the upper surface of casing, the inside of casing is equipped with from last radio frequency insulator and the multilayer circuit board that connects gradually down, be equipped with receiving module on the multilayer circuit board, receiving module passes through the radio frequency insulator with the radio frequency microstrip line with the antenna is connected, first apron lid is in on the casing, and with the casing forms and holds the airtight space of radio frequency insulator with the multilayer circuit board.

2. The tile-type reception module of claim 1, wherein the reception module comprises N quadrant reception arrays, each quadrant reception array comprising N reception subarrays and N-up combining power splitters, each reception subarray comprising N multi-functional chips having N channels, and N parallel multi-signal channels, each multi-signal channel comprising a coupler, a limiter, and a low noise amplifier, a power supply and beam controller electrically connected to the quadrant reception arrays, the power supply and beam controller being communicatively connected to the limiter and the multi-functional chips, an output signal of the antenna being transmitted to the multi-functional chips through the radio frequency isolator in sequence via the coupler, the limiter, and the low noise amplifier, and an output signal of the N multi-functional chips being transmitted to the combining power splitters.

3. The tile-type receiving assembly of claim 2, wherein the receiving module further comprises N spacer bars for isolating adjacent ones of the quadrant receiving arrays, the back of the multi-layer circuit board being provided with grooves corresponding to the spacer bars, the spacer bars being disposed within the grooves.

4. The tile-type receiver assembly of claim 2, wherein the multi-function chip is of a different material than the limiter and the composite power divider.

5. The tile receiving assembly of claim 4, wherein the multi-layer circuit board comprises a radio frequency layer, at least one low frequency signal layer, at least one power supply layer, and a ground layer disposed in sequence from top to bottom, the quadrant receiving array is disposed on the radio frequency layer, the power supply is disposed on the power supply layer, the beam controller is disposed on the low frequency signal layer, and the low frequency signal layer and the power supply layer are connected to the ground layer.

6. The tile receiving assembly of claim 5, wherein the multi-layer circuit board further comprises a radio frequency ground layer coupled to the radio frequency layer.

7. The tile-type receiving assembly of claim 6, wherein the multi-layer circuit board is provided with blind holes and circuit board through holes, the radio frequency layer is in communication with the radio frequency ground layer through the blind holes, and the low frequency signal layer, the power supply layer and the ground layer are in communication through the circuit board through holes.

8. The tile-type reception assembly of claim 7, wherein control signal transmission lines, power lines, and clock signal transmission lines are embedded in the multi-layer circuit board.

9. The tile-type receiving assembly of any one of claims 1-8, wherein a transition circuit board and a second cover board covering the multilayer circuit board are further arranged in the housing, an inter-board connector, a plurality of internal radio-frequency connectors and a plurality of external radio-frequency connectors connected with external radio-frequency connectors are arranged on the transition circuit board, an avoidance groove and a plurality of cover board through holes corresponding to the internal radio-frequency connectors are arranged on the second cover board, the transition circuit board is connected with the multilayer circuit board through the inter-board connector penetrating the avoidance groove, the internal radio-frequency connectors are connected with the multilayer circuit board through the cover board through holes, and the external radio-frequency connectors are electrically connected with the internal radio-frequency connectors.

10. A phased array system comprising an antenna, and the tiled reception assembly of any of claims 1-9, the reception module of the tiled reception assembly being connected to the antenna.