CN212677159U - Novel 16 passageway X wave band receiving and dispatching subassembly - Google Patents
Novel 16 passageway X wave band receiving and dispatching subassembly Download PDFInfo
- Publication number
- CN212677159U CN212677159U CN202021836017.8U CN202021836017U CN212677159U CN 212677159 U CN212677159 U CN 212677159U CN 202021836017 U CN202021836017 U CN 202021836017U CN 212677159 U CN212677159 U CN 212677159U
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- circuit
- frequency
- channel
- control circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Transceivers (AREA)
Abstract
The utility model discloses a novel 16-channel X-band transceiver component, which relates to the field of microwave transceiver components and comprises a shell and 16-channel transceiver modules arranged in the shell, wherein each transceiver module comprises 3 radio frequency circuits, a control circuit is connected with each radio frequency circuit, the 16-channel transceiver modules are arranged on a high-frequency plate according to the mode of 4 transceiver modules in each row and 4 transceiver modules in each column, a first radio frequency circuit is arranged on the front side of a first high-frequency plate, a second radio frequency circuit and the control circuit are arranged on the back side of the first high-frequency plate, each second radio frequency circuit realizes channel isolation through a partition frame, a third radio frequency circuit is arranged on a second high-frequency plate, each third radio frequency circuit realizes channel isolation through the partition frame, the first high-frequency plate and the second high-frequency plate realize the transmission of radio frequency signals through glass insulators or fuzzy buttons, the transmission of the radio frequency signals is realized through microstrip lines in the multilayer high-frequency plate, the volume of the receiving and transmitting assembly is reduced by utilizing longitudinal distribution, and radio frequency signals of all channels are not interfered with each other by the partition frame.
Description
Technical Field
The utility model belongs to the technical field of microwave receiving and dispatching subassembly and specifically relates to a novel 16 passageway X wave band receiving and dispatching subassembly.
Background
The transceiver module is a part between the intermediate frequency processing and the antenna of a wireless transceiver system and is also a key part of an active phased array radar, and whether the design success or not determines the cost, the producibility and the system performance of the whole radar.
At present, most of transmitting and receiving components in a relatively mature radar system in China are of brick type structures, occupied space is large in size, miniaturization design of the system is not facilitated, and production cost is relatively high.
SUMMERY OF THE UTILITY MODEL
The invention provides a novel 16-channel X-waveband transmitting-receiving assembly aiming at the problems and the technical requirements, the size of the transmitting-receiving assembly is reduced by utilizing longitudinal distribution, radio frequency signals of all channels are not interfered with each other by a spacer frame, and the stability of the transmission of the radio frequency signals of the transmitting-receiving assembly is improved.
The technical scheme of the utility model as follows:
a novel 16-channel X-band transceiving component comprises a shell and a 16-channel transceiving module arranged in the shell, wherein one channel corresponds to one antenna port, and the shell comprises a box body, a partition frame, a plurality of layers of high-frequency plates and a cover plate, wherein the partition frame, the multi-layer high-frequency plates and the cover plate are arranged in the box body; each transceiver module comprises 3 radio frequency circuits, a control circuit is connected with each radio frequency circuit, 16-channel transceiver modules are arranged on a high-frequency board in a mode of 4 radio frequency circuits in each row and 4 radio frequency circuits in each column, a first radio frequency circuit is arranged on the front side of a first high-frequency board, a second radio frequency circuit and the control circuit are arranged on the back side of the first high-frequency board, each second radio frequency circuit realizes channel isolation through a partition frame, a third radio frequency circuit is arranged on a second high-frequency board, each third radio frequency circuit realizes channel isolation through the partition frame, the first high-frequency board and the second high-frequency board realize transmission of radio frequency signals through glass insulators or fuzz buttons, and transmission of the radio frequency signals is realized through microstrip lines in the multilayer high-frequency board.
The further technical scheme is that a plurality of T-shaped cavity structures are further arranged between the cover plate and the front face of the first high-frequency plate, the T-shaped cavity structures are sealed through the sealing plate, and the gap between the T-shaped cavity structures and the first high-frequency plate and the cover plate is filled through the two L-shaped structural members.
The further technical scheme is that a first radio frequency circuit and 3 MMIC chips are arranged in the T-shaped cavity structure, each MMIC chip comprises an amplitude-phase control circuit and a radio frequency switch connected with the amplitude-phase control circuit, each amplitude-phase control circuit is correspondingly connected with one radio frequency circuit, the amplitude-phase control circuit and the radio frequency switches are connected with a power distribution network module through the transmission direction of the microstrip line-coaxial line-stripline line-coaxial line-microstrip line, and the radio frequency switches are used for switching on and off control, numerical control phase shifting and attenuation of the amplitude-phase control circuit on the radio frequency circuits.
The further technical scheme is that a conductive structure is arranged between the second radio frequency circuit and the third radio frequency circuit, the conductive structure is arranged corresponding to the second radio frequency circuit and the third radio frequency circuit and is isolated through a spacer, and the conductive structure is used for making up the height difference between the second radio frequency circuit and the third radio frequency circuit between channels and increasing the isolation between the channels.
The further technical scheme is that the radio frequency circuit comprises a receiving branch and a transmitting branch, the receiving branches of the radio frequency circuits in each transceiver module are connected in series to form three-stage receiving low-noise amplification, and the transmitting branches of the radio frequency circuits in each transceiver module are connected in series to form three-stage transmitting saturated amplification; the transmitting branch comprises a driving amplifier and a high-power amplifier, the input end of the driving amplifier is connected with the first end of the single-pole double-throw switch, the output end of the driving amplifier is connected with the input end of the high-power amplifier, and the output end of the high-power amplifier is connected with the circulator;
the receiving branch comprises an amplitude limiter and a two-stage low-noise amplifier, the input end of the amplitude limiter is connected with the circulator, the output end of the amplitude limiter is connected with the low-noise amplifier, the low-noise amplifier is connected with the second end of the single-pole double-throw switch, the common end of the single-pole double-throw switch is connected with the power distribution network module, the power distribution network module is connected with the radio frequency input port, and the circulator is connected with the antenna port;
the power distribution network module is arranged inside the first high-frequency board and comprises two one-to-eight power distribution networks, and each one-to-eight power distribution network corresponds to 8 radio frequency circuits respectively.
The further technical proposal is that the length, width and height of the shell are 50mm multiplied by 60mm multiplied by 14mm, and the height of the T-shaped cavity structure is 0.6 mm.
The utility model has the beneficial technical effects that:
the 16-channel transceiving modules are distributed on the multilayer high-frequency plate in a mode of 4 in each row and 4 in each column, each channel is isolated through the partition frame, radio-frequency signals between the channels are guaranteed not to interfere with each other, the multilayer high-frequency plate realizes the spatial longitudinal distribution of transceiving components, and compared with the traditional brick type structure, the overall size is reduced; the radio frequency circuit is used for transmitting radio frequency signals and receiving signals, each channel is provided with 3 radio frequency circuits connected in series, the receiving/transmitting amplification effect is improved, the T-shaped cavity structure is further arranged for placing a first radio frequency circuit and 3 MMIC chips, the isolation effect is achieved, and the two signal interconnection modes are arranged according to the structure of the receiving and transmitting assembly: the first high-frequency board and the second high-frequency board realize the transmission of radio frequency signals through glass insulators or fuzz buttons, the transmission of the radio frequency signals is realized through microstrip lines in the multilayer high-frequency boards, and the stability of the transmission of the radio frequency signals of the receiving and transmitting assembly is ensured.
Drawings
Fig. 1 is a cross-sectional view of a transceiver assembly as disclosed herein.
Fig. 2 is a schematic diagram of a transceiver module disclosed herein.
Fig. 3 is a schematic diagram of an eight-in-one power division network disclosed in the present application.
FIG. 4 is a schematic diagram of a T-shaped cavity structure as disclosed herein.
Detailed Description
The following describes the embodiments of the present invention with reference to the accompanying drawings.
The application discloses novel 16 passageway X wave band transceiver module, transceiver module cross-sectional view is shown in fig. 1, including the casing and set up 16 passageway transceiver module in the casing, and optional, the length and width height of casing is 50mm X60 mm X14 mm. One channel corresponds to one antenna port, an external device is connected through the SMP connector 1, and the shell comprises a box body 201, a bulkhead 202 arranged in the box body 201, a multi-layer high-frequency board and a cover plate 203 used for sealing the box body 201. Each transceiver module comprises 3 radio frequency circuits, the control circuit 3 is connected with each radio frequency circuit, and optionally, the control circuit 3 comprises a feed network, a logic control circuit and a power protection circuit.
The 16-channel transceiving module is arranged on the high-frequency board in a mode of 4 in each row and 4 in each column, the first radio-frequency circuit 401 is arranged on the front surface of the first high-frequency board 501, the second radio-frequency circuit 402 and the control circuit 3 are arranged on the back surface of the first high-frequency board 501, the second radio-frequency circuits 402 are isolated through the partition frame 202, the third radio-frequency circuits 403 are arranged on the second high-frequency board 502, the third radio-frequency circuits 403 are isolated through the partition frame 202, it is guaranteed that radio-frequency signals among channels are not interfered with one another, the multi-layer high-frequency board achieves space longitudinal distribution of transceiving components, and compared with a traditional brick type structure, the overall size is reduced. The radio frequency signals are divided according to the connection mode, and simulation verification is carried out. The transceiving component mainly has two interconnection modes, one is interconnection between different physical units, namely transmission of radio frequency signals is realized by the first high-frequency board 501 and the second high-frequency board 502 through glass insulators or fuzz buttons, and the other is internal interconnection based on the multilayer high-frequency boards, namely transmission of radio frequency signals is realized by microstrip lines in the multilayer high-frequency boards, so that stability of transmission of radio frequency signals of the transceiving component is ensured.
The radio frequency circuit comprises a receiving branch and a transmitting branch, the receiving branches of the radio frequency circuits in each transceiver module are connected in series to form three-stage receiving low-noise amplification, the transmitting branches of the radio frequency circuits in each transceiver module are connected in series to form three-stage transmitting saturated amplification, and each channel is provided with 3 radio frequency circuits connected in series, so that the receiving/transmitting amplification effect is improved. As shown in fig. 2, the transmit branch includes a driver amplifier 411 and a high power amplifier 412, where the driver amplifier 411 is implemented based on model AMDA0001S and the high power amplifier 412 is implemented based on model AMPA 0004S. The input of driver amplifier 411 is connected to the first terminal of single pole double throw switch 413, the output of driver amplifier 411 is connected to the input of high power amplifier 412, the output of high power amplifier 412 is connected to circulator 414, circulator 414 is implemented based on model ZDM2-80120 RM-3.
The receiving branch comprises a limiter 415 and a two-stage low noise amplifier 416, wherein the limiter 415 is implemented based on WID080120-P30 model, and the low noise amplifier 416 is implemented based on AMLA0003S and AMLA0002S model. The input end of the limiter 415 is connected to the circulator 414, the output end of the limiter 415 is connected to the low noise amplifier 416, the low noise amplifier 416 is connected to the second end of the single-pole double-throw switch 413, the common end of the single-pole double-throw switch 413 is connected to the output end 121 of the power distribution network module 12, the two input ends 122 of the power distribution network module 12 are connected to the rf input port, and the circulator 414 is connected to the antenna port.
The power distribution network module 12 is disposed inside the first high frequency board 501, as shown in fig. 3, the power distribution network module 12 includes two one-to-eight power distribution networks, and each one-to-eight power distribution network corresponds to 8 radio frequency circuits.
The two ends of the glass insulator 601 are respectively welded on the first high-frequency plate 501 and the second high-frequency plate 502, so that the interconnection between the upper high-frequency plate and the lower high-frequency plate is realized, and the simulation result shows that the loss is less than 0.1dB and the standing wave coefficient is less than-20 dB under the condition of meeting the good grounding condition in a required frequency band, so that the transmission requirement of radio-frequency signals can be better met.
The high-frequency board has good radio frequency transmission capability, radio frequency interconnection inside the high-frequency board mainly realizes low-loss intercommunication of front and back signals, and radio frequency signals are mainly transmitted in the high-frequency board through three transmission structures (according to microstrip line-coaxial line-strip line-coaxial line-microstrip line). According to simulation results, the loss is about 0.1dB and the standing wave coefficient is less than-16 dB in a required frequency band, so that the transmission requirement of radio frequency signals can be met.
A plurality of T-shaped cavity structures 7 (not shown in fig. 1) are further disposed between the cover plate 203 and the front surface of the first high-frequency plate 501, as shown in fig. 4, the T-shaped cavity structures 7 are sealed by a sealing plate 8, and the gap between the T-shaped cavity structures 7 and the first high-frequency plate 501 and the cover plate 203 is filled by two L-shaped structural members 9, after debugging is completed, the sealing plate 8 and the L-shaped structural members 9 complete airtight packaging in a welding manner, and sealing of the T-shaped cavity structures 7 is ensured. In order to reduce the influence of the cavity sealing plate 8 on the microwave characteristics of the metal via hole, the microstrip line and the gold wire of the bonded MMIC chip 10, the transverse space of the T-shaped cavity structure 7 should be as high as possible, but the height of the cavity is increased, so that the difficulty of the manufacturing process is easily increased, the yield of the product is reduced, and the height of the T-shaped cavity structure 7 is set to be 0.6mm under the condition of considering both the aspects.
The T-shaped cavity structure 7 is internally provided with a first radio frequency circuit 401 and 3 MMIC chips 10, the 3 MMIC chips 10 are connected through gold wires, each MMIC chip 10 comprises an amplitude-phase control circuit and a radio frequency switch connected with the amplitude-phase control circuit, each amplitude-phase control circuit is also correspondingly connected with one radio frequency circuit, the amplitude-phase control circuit is connected with the power distribution network module 12 through the transmission direction of the microstrip line-coaxial line-strip line-coaxial line-microstrip line, and the radio frequency switches are used for switching on-off control, numerical control phase shifting and attenuation of the amplitude-phase control circuit on the radio frequency circuits. It should be noted that the control circuit 3, the MMIC chip 10, and the power dividing network module 12 of the present application are all commercially available modules, and the internal circuit structures thereof are not described in detail herein.
Optionally, a conductive structure 11 is disposed between the second rf circuit 402 and the third rf circuit 403, the conductive structure 11 is disposed corresponding to the second rf circuit 402 and the third rf circuit 403 and isolated by the spacer 202, and the conductive structure 11 is configured to compensate for a height difference between the second rf circuit 402 and the third rf circuit 403 between channels and increase an isolation between the channels.
What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.
Claims (6)
1. A novel 16-channel X-band transceiving component is characterized by comprising a shell and a 16-channel transceiving module arranged in the shell, wherein one channel corresponds to one antenna port, and the shell comprises a box body, a separation frame, a plurality of layers of high-frequency plates and a cover plate for sealing the box body, wherein the separation frame, the plurality of layers of high-frequency plates and the cover plate are arranged in the box body; each transceiver module comprises 3 radio frequency circuits, a control circuit is connected with each radio frequency circuit, 16-channel transceiver modules are arranged on a high-frequency board in a mode of 4 radio frequency circuits in each row and 4 radio frequency circuits in each column, a first radio frequency circuit is arranged on the front face of a first high-frequency board, a second radio frequency circuit and the control circuit are arranged on the back face of the first high-frequency board, each second radio frequency circuit realizes channel isolation through a separation frame, a third radio frequency circuit is arranged on a second high-frequency board, each third radio frequency circuit realizes channel isolation through the separation frame, the first high-frequency board and the second high-frequency board realize transmission of radio frequency signals through glass insulators or fuzz buttons, and transmission of the radio frequency signals is realized through microstrip lines in the multilayer high-frequency boards.
2. The novel 16-channel X-band transceiver module as claimed in claim 1, wherein a plurality of T-shaped cavity structures are further disposed between the cover plate and the front surface of the first rf plate, the T-shaped cavity structures are sealed by a sealing plate, and the gap between the T-shaped cavity structures and the first rf plate and the cover plate is filled by two L-shaped structural members.
3. The novel 16-channel X-band transceiver module of claim 2, wherein the first rf circuit and 3 MMIC chips are disposed in the T-shaped cavity structure, the MMIC chips include an amplitude-phase control circuit and an rf switch connected to the amplitude-phase control circuit, each amplitude-phase control circuit is further correspondingly connected to one rf circuit, the amplitude-phase control circuit and the rf switch are connected to the power distribution network module through the transmission direction of microstrip line-coaxial line-stripline line-coaxial line-microstrip line, and the rf switch is configured to switch on-off control, digitally controlled phase shift, and attenuation of the amplitude-phase control circuit to the rf circuit.
4. The novel 16-channel X-band transceiver module of claim 1, wherein a conductive structure is disposed between the second rf circuit and the third rf circuit, the conductive structure is disposed corresponding to the second rf circuit and the third rf circuit and is separated by the spacer, and the conductive structure is configured to compensate for a height difference between the second rf circuit and the third rf circuit between channels and increase an isolation between the channels.
5. The novel 16-channel X-band transceiver module according to any one of claims 1 to 4, wherein the rf circuit comprises a receiving branch and a transmitting branch, the receiving branches of the rf circuits in each transceiver module are connected in series to form a three-stage receiving low noise amplifier, and the transmitting branches of the rf circuits in each transceiver module are connected in series to form a three-stage transmitting saturated amplifier; the transmitting branch comprises a driving amplifier and a high-power amplifier, wherein the input end of the driving amplifier is connected with the first end of the single-pole double-throw switch, the output end of the driving amplifier is connected with the input end of the high-power amplifier, and the output end of the high-power amplifier is connected with the circulator;
the receiving branch comprises an amplitude limiter and a two-stage low-noise amplifier, the input end of the amplitude limiter is connected with the circulator, the output end of the amplitude limiter is connected with the low-noise amplifier, the low-noise amplifier is connected with the second end of the single-pole double-throw switch, the common end of the single-pole double-throw switch is connected with a power distribution network module, the power distribution network module is connected with a radio frequency input port, and the circulator is connected with an antenna port;
the power distribution network module is arranged inside the first high-frequency board and comprises two one-to-eight power distribution networks, and each one-to-eight power distribution network corresponds to 8 radio-frequency circuits respectively.
6. The novel 16-channel X-band transceiver module of claim 2, wherein the housing has a length, width, and height of 50mm X60 mm X14 mm, and the height of the T-shaped cavity structure is 0.6 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836017.8U CN212677159U (en) | 2020-08-27 | 2020-08-27 | Novel 16 passageway X wave band receiving and dispatching subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836017.8U CN212677159U (en) | 2020-08-27 | 2020-08-27 | Novel 16 passageway X wave band receiving and dispatching subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212677159U true CN212677159U (en) | 2021-03-09 |
Family
ID=74820231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021836017.8U Active CN212677159U (en) | 2020-08-27 | 2020-08-27 | Novel 16 passageway X wave band receiving and dispatching subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212677159U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437501A (en) * | 2021-04-27 | 2021-09-24 | 中国电子科技集团公司第十四研究所 | Miniaturized high integrated antenna interface module |
| CN114759940A (en) * | 2022-04-11 | 2022-07-15 | 无锡华睿芯微电子科技有限公司 | Front-end equipment for multichannel receiving and transmitting of X-band radio-frequency signals |
-
2020
- 2020-08-27 CN CN202021836017.8U patent/CN212677159U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437501A (en) * | 2021-04-27 | 2021-09-24 | 中国电子科技集团公司第十四研究所 | Miniaturized high integrated antenna interface module |
| CN113437501B (en) * | 2021-04-27 | 2023-02-14 | 中国电子科技集团公司第十四研究所 | Miniaturized high integrated antenna interface module |
| CN114759940A (en) * | 2022-04-11 | 2022-07-15 | 无锡华睿芯微电子科技有限公司 | Front-end equipment for multichannel receiving and transmitting of X-band radio-frequency signals |
| CN114759940B (en) * | 2022-04-11 | 2023-04-11 | 无锡华睿芯微电子科技有限公司 | Front-end equipment for multichannel receiving and transmitting of X-band radio-frequency signals |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105846019B (en) | Double-layer cavity common-port combiner | |
| CN111025235A (en) | Microwave TR assembly with ultra-wide working bandwidth | |
| US20190207325A1 (en) | Filter feeding network and base station antenna | |
| CN212677159U (en) | Novel 16 passageway X wave band receiving and dispatching subassembly | |
| CN112993507B (en) | Miniaturized T-shaped branch waveguide broadband power divider | |
| CN212677148U (en) | X-waveband small-volume transceiving channel | |
| CN216251157U (en) | 64-unit mixed beam forming active antenna array | |
| CN114614275B (en) | HTCC dual-beam tile-type airtight SIP module | |
| CN113271118B (en) | Dual-frequency dual-polarization TR module | |
| CN110994088B (en) | LTCC-based non-reflection low-pass filter | |
| CN204258802U (en) | A kind of miniaturization structure MiMo radio-frequency front-end assembly | |
| JPH06112351A (en) | Microwave package | |
| CN210326059U (en) | Switch filter bank | |
| CN101471467A (en) | Microstrip microwave switch with multiple sub-cavities | |
| CN107483062B (en) | Multipath receiving channel | |
| CN112630765A (en) | Instantaneous broadband four-channel microwave TR (transmitter-receiver) assembly | |
| CN116938276B (en) | Dual-polarized multi-channel phased array SIP module | |
| CN114070349B (en) | Double-frequency composite high-power brick type T/R assembly | |
| CN221081303U (en) | Ka frequency band miniaturized resettable transceiving frequency conversion device | |
| CN114006179B (en) | 64-Unit hybrid wave beam forming active antenna array | |
| CN213401464U (en) | Filter and communication base station | |
| CN113093117B (en) | Millimeter wave single-channel control TR component | |
| CN215120755U (en) | Conformal solid-state radio frequency switch structure | |
| CN114899570B (en) | Microstrip-waveguide conversion structure with out-of-band suppression function | |
| CN220874530U (en) | Tile type receiving component and phased array system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |