CN115529060A - Tile type multi-channel integrated antenna microwave T/R assembly - Google Patents
Tile type multi-channel integrated antenna microwave T/R assembly Download PDFInfo
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- CN115529060A CN115529060A CN202211160501.7A CN202211160501A CN115529060A CN 115529060 A CN115529060 A CN 115529060A CN 202211160501 A CN202211160501 A CN 202211160501A CN 115529060 A CN115529060 A CN 115529060A
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- carrier plate
- microwave
- tile
- integrated antenna
- frequency connector
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- 230000005855 radiation Effects 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000002955 isolation Methods 0.000 claims abstract description 19
- 238000003475 lamination Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000306 component Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010622 cold drawing Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention provides a tile-type multi-channel integrated antenna microwave T/R assembly, which belongs to the technical field of microwaves and comprises a radiation antenna, a carrier plate and a heat dissipation cold plate which are vertically stacked, wherein a multifunctional chip is arranged on the front surface of the carrier plate; the radiation antenna is integrated on the front surface of the carrier plate and is provided with a first isolation groove for isolating the multifunctional chip; the power distribution network is arranged on the back of the carrier plate; the radio frequency connector and the low frequency connector are arranged on the back surface of the carrier plate; the radiating cold plate is stacked on the back surface of the carrier plate and is provided with a second isolation groove for isolating the power distribution network and a through hole for penetrating out of the radio frequency connector and the low frequency connector. The tile type multi-channel integrated antenna microwave T/R component provided by the invention can greatly improve the integration level of the microwave T/R component, reduce the volume of the microwave T/R component, realize miniaturization and light weight of the component and meet the requirements of a new generation of phased array radar system.
Description
Technical Field
The invention belongs to the technical field of microwaves, and particularly relates to a tile type multichannel integrated antenna microwave T/R assembly.
Background
The microwave T/R component is a core component forming a modern active phased array radar, and continuously pushes the radar to be converted towards the direction of high integration level and light weight. As a key module for forming the active phased array radar, the index performance of the microwave T/R assembly directly influences the overall performance of the radar, such as detection distance, positioning accuracy and the like, and the active phased array radar applied to electronic warfare has stricter requirements on the weight and the overall dimension of the microwave T/R assembly.
At present, the microwave T/R assembly at home and abroad generally adopts the traditional micro-assembly process in the metal box body, the volume of the whole assembly is larger, and the process flow is fussy.
Disclosure of Invention
The embodiment of the invention provides a tile type multi-channel integrated antenna microwave T/R assembly, aiming at solving the problems of large volume and heavy weight of the existing assembly.
In order to achieve the purpose, the invention adopts the technical scheme that: provided is a tile type multi-channel integrated antenna microwave T/R assembly, comprising: the radiating antenna, the carrier plate and the heat dissipation cold plate are vertically stacked, and the multifunctional chip is arranged on the front surface of the carrier plate; the radiation antenna is integrated on the front surface of the carrier plate and is provided with a first isolation groove for isolating the multifunctional chip; the power distribution network is arranged on the back surface of the carrier plate; the radio frequency connector and the low frequency connector are arranged on the back surface of the carrier plate; the radiating cold plate is stacked on the back of the carrier plate and is provided with a second isolation groove for isolating the power distribution network and a through hole for the radio frequency connector and the low-frequency connector to penetrate out.
In a possible implementation manner, the radiation antenna and the carrier plate are connected by ball bonding.
In one possible implementation, the heat dissipation cold plate is connected with the carrier plate in a welding mode.
In a possible implementation manner, four side surfaces of the radiation antenna are respectively provided with a first avoidance gap, and a connecting hole is formed in the position, corresponding to the first avoidance gap, of the heat dissipation cold plate.
In a possible implementation manner, a boss is arranged at a position of the heat dissipation cold plate corresponding to the first avoidance notch, and the connecting hole is arranged on the boss; and a second avoidance notch is arranged at the position of the support plate corresponding to the boss.
In a possible implementation manner, the first avoidance gap and the second avoidance gap are both rectangular structures.
In a possible implementation manner, the mesa of the boss is higher than the front surface of the carrier plate.
In one possible implementation, the wall thickness between the first isolation grooves is greater than the thickness of the outer walls thereof.
In a possible implementation manner, the power distribution network and the multifunctional chip table are attached to the carrier board.
In a possible implementation manner, the radiation antenna, the carrier plate and the heat dissipation cold plate are stacked to have flush side surfaces.
Compared with the prior art, the tile type multi-channel integrated antenna microwave T/R component provided by the invention has the beneficial effects that: the radiation antenna, the carrier plate and the heat dissipation cold plate are vertically stacked, the power distribution network and the multifunctional chip are integrated on the back surface and the front surface of the carrier plate, and the microwave T/R assembly of the radiation antenna is integrated through the tile type structure with high integration degree, so that the radiation antenna has the characteristics of miniaturization, light weight and low cost.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a tile-type multichannel integrated antenna microwave T/R assembly according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a tile-type multi-channel integrated antenna microwave T/R assembly according to an embodiment of the present invention;
description of reference numerals:
1. a heat dissipation cold plate; 2. a radio frequency connector; 3. a carrier plate; 4. a multifunctional chip; 5. a radiating antenna; 6. a power distribution network; 7. a second isolation trench; 8. a low frequency connector; 9. a through hole; 10. a first isolation trench; 11. a first avoidance notch; 12. connecting holes; 13. and (4) a boss.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2 together, the tile-type multi-channel integrated antenna microwave T/R assembly provided by the present invention will now be described. The tile type multi-channel integrated antenna microwave T/R assembly comprises a radiation antenna 5, a carrier plate 3 and a heat dissipation cold plate 1 which are vertically stacked, wherein a multifunctional chip 4 is arranged on the front surface of the carrier plate 3; the radiation antenna 5 is integrated on the front surface of the carrier plate 3 and is provided with a first isolation groove 10 for isolating the multifunctional chip 4; the power distribution network 6 is arranged on the back of the carrier plate 3; the radio frequency connector 2 and the low frequency connector 8 are arranged on the back surface of the carrier plate 3; the heat dissipation cold plate 1 is stacked on the back surface of the carrier plate 3, and has a second isolation groove 7 for isolating the power distribution network 6 and a through hole 9 for the radio frequency connector 2 and the low frequency connector 8 to penetrate out.
The tile type multi-channel integrated antenna microwave T/R component provided by the embodiment has the beneficial effects that:
(1) The multifunctional chip 4 in a packaging form is adopted, 4 paths of receiving and transmitting channels are integrated in the multifunctional chip 4, and the air tightness requirement can be met after packaging.
(2) By adopting a 3D stacking structure, the three-dimensional Z-axis vertical space is fully utilized, components such as the radiation antenna 5, the multifunctional chip 4, the power distribution network 6, the radio frequency connector 2, the low-frequency connector 8 and the like are stacked in the vertical space, the space structure is optimized, and tile type three-dimensional integration is realized. By the tile type structure with high integration level and the microwave T/R component of the integrated radiation antenna 5, the novel phased array radar system has the characteristics of miniaturization, light weight and low cost, meets the requirements of a new generation of phased array radar system, and has very important significance and engineering application value.
(3) The integrated design of the radiation antenna 5 and the microwave T/R component is realized through combined simulation, the index deterioration caused by an extra transmission transition structure is avoided, and meanwhile, the installation is simplified.
(4) The back of the carrier plate 3 is directly connected with the heat dissipation cold plate 1, so that the heat dissipation effect is achieved, the good conduction and heat dissipation effect can be achieved for heating elements such as the multifunctional chip 4 and the power distribution network 6 which are packaged inside, and the stability of the use performance of the device and the fidelity of signal transmission are improved.
The tile-type multi-channel integrated antenna microwave T/R component formed by the embodiment can realize transceiving transmission through the radio frequency connector 2 and the low-frequency connector 8.
The microwave T/R component is simple in structure and operation, the integration level of the microwave T/R component can be greatly improved, the size of the microwave T/R component is reduced, and miniaturization and light weight of the component are realized.
In some embodiments, referring to fig. 1 and 2, the radiation antenna 5 and the carrier plate 3 are connected by ball bonding. The BGA ball mounting, i.e., ball grid array packaging, is a common technique for semiconductor packaging. In this embodiment, BGA balls are disposed around the first isolation trench 10.
In some embodiments, referring to fig. 1 and 2, the heat sink cold plate 1 is connected to the carrier plate 3 by welding.
In some embodiments, referring to fig. 1 and fig. 2, four side surfaces of the radiation antenna 5 are respectively provided with a first avoidance gap 11, and a connecting hole 12 is provided on the heat dissipation cold plate 1 at a position corresponding to the first avoidance gap 11. With the attachment holes 12 provided, the present embodiment provides for attachment as a modular assembly to other mating structures.
In some embodiments, referring to fig. 1 and fig. 2, a boss 13 is disposed at a position of the heat dissipation cold plate 1 corresponding to the first avoiding gap 11, and the connection hole 12 is disposed on the boss 13; a second avoidance notch is arranged at the position of the support plate 3 corresponding to the boss 13. Through the boss 13 that sets up, increase the length of connecting hole 12 to increase the length that the bolt contacted with heat dissipation cold drawing 1, thereby improve the reliability of connecting. Meanwhile, the boss 13 also has a positioning function on the carrier plate 3.
In some embodiments, referring to fig. 1 and 2, the first avoidance gap 11 and the second avoidance gap are both rectangular in configuration. And the second avoidance notch diagram is not marked.
In some embodiments, referring to fig. 1 and 2, the surface of the boss 13 is higher than the front surface of the carrier plate 3. The height of the boss 13 is set to position the radiation antenna 5.
In some embodiments, referring to fig. 1 and 2, the wall thickness between the first isolation trenches 10 is greater than the wall thickness of the outer walls thereof. Specifically, the wall thickness between the first isolation grooves 10 is twice the thickness of the outer wall, so as to improve the shielding effect and avoid mutual interference. Each first isolation slot 10 forms a shielding space to realize independent phase shift and attenuation of each channel, thereby improving the fidelity of signal transceiving. Wherein, an isolation gap is provided between each multifunctional chip 4 and the inner wall of the first isolation groove 10.
Wherein, the inner side of the partition wall between the first isolation grooves 10 is provided with a metal shielding layer, and the radiation antenna 5 is internally provided with a metal shielding hole. Through the metal shielding layer and the metal shielding hole, the shielding effect is improved, and mutual interference among channel signals is prevented.
In some embodiments, referring to fig. 1 and fig. 2, the power distribution network 6 and the multifunctional chip 4 are attached to the carrier 3. The Surface Mount Technology (SMT) and the reflow soldering technology are adopted to assemble the circuit. The problems of size and volume of the electronic component can be solved, and the device is light in weight and small in size through a surface-mounted packaging technology.
In some embodiments, referring to fig. 1 and 2, the radiation antenna 5, the carrier plate 3 and the heat sink cold plate 1 are stacked and have flush side surfaces.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A tile-type multi-channel integrated antenna microwave T/R assembly, comprising:
a carrier plate (3);
the multifunctional chip (4) is arranged on the front surface of the carrier plate (3);
a radiation antenna (5) integrated on the front side of the carrier plate (3) and having a first isolation slot (10) isolating the multifunctional chip (4);
the power distribution network (6) is arranged on the back surface of the carrier plate (3);
the radio frequency connector (2) and the low-frequency connector (8) are arranged on the back surface of the carrier plate (3); and
and the heat dissipation cold plate (1) is stacked on the back surface of the carrier plate (3) and is provided with a second isolation groove (7) for isolating the power distribution network (6) and a through hole (9) for the radio frequency connector (2) and the low-frequency connector (8) to penetrate out.
2. The tile-type multichannel integrated antenna microwave T/R assembly according to claim 1, characterized in that the radiating antenna (5) is connected to the carrier plate (3) by ball-bonding.
3. The tiled, multi-channel, integrated antenna microwave T/R assembly according to claim 1, characterized in that the heat sink cold plate (1) is soldered to the carrier plate (3).
4. The tile-type multichannel integrated antenna microwave T/R assembly according to claim 1, wherein four side surfaces of the radiation antenna (5) are respectively provided with a first avoidance notch (11), and a connecting hole (12) is formed in the heat dissipation cold plate (1) at a position corresponding to the first avoidance notch (11).
5. The tile type multichannel integrated antenna microwave T/R assembly as claimed in claim 4, wherein a boss (13) is provided at a position of the heat dissipation cold plate (1) corresponding to the first avoidance gap (11), and the connection hole (12) is provided on the boss (13); and a second avoidance notch is arranged at the position of the support plate (3) corresponding to the boss (13).
6. The tile type multi-channel integrated antenna microwave T/R assembly according to claim 5, characterized in that the first avoidance gap (11) and the second avoidance gap are both rectangular structures.
7. The tile-type multichannel integrated antenna microwave T/R assembly according to claim 5, characterized in that the mesa of the boss (13) is higher than the front surface of the carrier plate (3).
8. The tile-type multi-channel integrated antenna microwave T/R assembly according to claim 1, characterized in that the wall thickness between the first isolation grooves (10) is greater than the thickness of the outer wall thereof.
9. The tile-type multichannel integrated antenna microwave T/R assembly according to claim 1, characterized in that the power distribution network (6) and the multifunctional chip (4) are surface-mounted on the carrier board (3).
10. The tiled multi-channel integrated antenna microwave T/R assembly according to claim 1, characterized in that the sides of the radiation antenna (5), the carrier plate (3) and the heat sink cold plate (1) after lamination are flush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211160501.7A CN115529060A (en) | 2022-09-22 | 2022-09-22 | Tile type multi-channel integrated antenna microwave T/R assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211160501.7A CN115529060A (en) | 2022-09-22 | 2022-09-22 | Tile type multi-channel integrated antenna microwave T/R assembly |
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| Publication Number | Publication Date |
|---|---|
| CN115529060A true CN115529060A (en) | 2022-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211160501.7A Pending CN115529060A (en) | 2022-09-22 | 2022-09-22 | Tile type multi-channel integrated antenna microwave T/R assembly |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655725A (en) * | 2016-03-14 | 2016-06-08 | 中国电子科技集团公司第三十八研究所 | Two-dimensional expandable chip type active array antenna |
| CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
| CN109245793A (en) * | 2018-09-29 | 2019-01-18 | 中国电子科技集团公司第五十四研究所 | A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method |
| CN113203989A (en) * | 2021-04-29 | 2021-08-03 | 上海航天电子通讯设备研究所 | Front and back PCB substrate coplanar multi-channel tile type receiving and transmitting assembly |
| CN216213437U (en) * | 2021-10-08 | 2022-04-05 | 苏州硕贝德创新技术研究有限公司 | Waveguide antenna module |
-
2022
- 2022-09-22 CN CN202211160501.7A patent/CN115529060A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655725A (en) * | 2016-03-14 | 2016-06-08 | 中国电子科技集团公司第三十八研究所 | Two-dimensional expandable chip type active array antenna |
| CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
| CN109245793A (en) * | 2018-09-29 | 2019-01-18 | 中国电子科技集团公司第五十四研究所 | A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method |
| CN113203989A (en) * | 2021-04-29 | 2021-08-03 | 上海航天电子通讯设备研究所 | Front and back PCB substrate coplanar multi-channel tile type receiving and transmitting assembly |
| CN216213437U (en) * | 2021-10-08 | 2022-04-05 | 苏州硕贝德创新技术研究有限公司 | Waveguide antenna module |
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