CN115781040A - Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field - Google Patents

Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field Download PDF

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Publication number
CN115781040A
CN115781040A CN202210787263.6A CN202210787263A CN115781040A CN 115781040 A CN115781040 A CN 115781040A CN 202210787263 A CN202210787263 A CN 202210787263A CN 115781040 A CN115781040 A CN 115781040A
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crystal
fluoranthene
cutting
lithium niobate
laser
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CN202210787263.6A
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Chinese (zh)
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阎文博
曹学勇
高波
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Hebei University of Technology
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Hebei University of Technology
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Priority to CN202210787263.6A priority Critical patent/CN115781040A/en
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Abstract

The invention discloses a device and a method for cutting fluoranthene crystals by utilizing a lithium niobate photo-generated electric field. The method utilizes a space electric field generated by irradiating the iron-doped lithium niobate with laser to cut the fluoranthene crystal with micron size under the heating condition. The whole device is simple to build, and the real-time control of the cutting position and the residual length of the crystal is realized. The technology can be applied to various applications of organic optoelectronics such as organic field effect transistors and the like, and has important significance for processing and modifying organic crystals.

Description

Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field
Technical Field
The invention relates to a laser cutting method of a micro-size fluoranthene crystal, in particular to a device and a method for realizing non-contact cutting of the micro-size fluoranthene crystal by utilizing an electric field generated by irradiating a lithium niobate crystal with laser to attract dielectric substances.
Background
In recent years, organic crystals have attracted considerable scientific attention for their potential application as photonic elements in the fields of lasers, waveguides, transducers, transistors, and light emitting diodes. Compared with its inorganic counterpart, organic crystals have the advantages of convenient manufacture and unique photonic and electronic properties due to weak intermolecular interactions and high luminous efficiency, and various applications of organic optoelectronics can be satisfied by simply modifying organic crystals.
At present, a laser cutting machine is mostly used for crystal processing, however, the diameter of a focused light spot of the laser cutting machine is mostly between 100 and 400 micrometers, and the laser output power is more than 1000W, so that the common laser cutting machine is not suitable for processing organic crystals used by small devices such as transistors and the like.
Disclosure of Invention
The crystal cutting method using laser reported at present has many disadvantages, such as: only large-volume crystals can be cut, and micron-size crystals cannot be precisely cut; the laser power is high, and the local temperature change of the crystal is obvious; the laser directly acts on the crystal and has great influence on the appearance of the facet. Aiming at the problems, the invention provides a simple and easy fluoranthene crystal cutting method, the cutting position and the residual length of the method are controllable, the unprocessed crystal can be directly placed on the lower surface of lithium niobate, the focused laser is used for cutting the crystal with the diameter of 100 micrometers or less and any length, and the whole process is real-time controllable.
A method for cutting fluoranthene crystal by utilizing a lithium niobate photo-generated electric field is characterized by comprising the following steps: and carrying out non-contact cutting on the micron-sized fluoranthene crystal by using a space electric field generated by irradiating the lithium niobate with low-power laser under the condition of small-amplitude temperature rise.
Compared with the prior art, the invention has the advantages that: lithium niobate is used as a substrate, the fluoranthene microcrystal is accurately cut in a non-contact manner through a photo-generated space electric field under the condition of small temperature change, the laser power is low, the phenomenon that the temperature of local crystals at a section is changed too much is avoided, the device is simple in structure and low in cost, and the whole process can be observed in real time.
Drawings
Fig. 1 is a schematic view of the overall structure of a device for cutting a fluoranthene crystal by using a lithium niobate photo-electric field according to the present invention.
Fig. 2 is a diagram of a cutting process of an embodiment (embodiment 1) of the method for cutting a fluoranthene crystal by using a lithium niobate photovoltaic electric field according to the present invention.
Fig. 3 is a diagram of a cutting process of an embodiment (embodiment 2) of the method for cutting a fluoranthene crystal by using a lithium niobate photovoltaic electric field according to the present invention.
Fig. 4 is a diagram of a cutting process of an embodiment (embodiment 3) of the method for cutting a fluoranthene crystal by using a lithium niobate photovoltaic electric field according to the present invention.
Detailed Description
The invention will be further illustrated by the following examples and figures
The invention discloses a device and a method for cutting fluoranthene crystal by utilizing a lithium niobate photo-generated electric field, wherein the device comprises the following steps: the small-size organic crystal cutting optical path is formed by a laser 1, an electronic shutter 2, a diaphragm 3, a laser semi-transparent semi-reflecting mirror 4, a focusing objective lens 5, lithium niobate 6, a glass slide 7 with a fluoranthene raw material, a gasket 8, a metal heating plate 13, a temperature control device 14 and a fine adjustment three-dimensional translation table 15 in sequence; the background light source 12, the focusing objective lens 5, the laser semi-transmitting and semi-reflecting mirror 4, the laser reflecting mirror 9, the optical filter 10 and the CCD camera 11 form a real-time observation light path in sequence.
The invention discloses a method for cutting fluoranthene crystal by utilizing a lithium niobate photo-generated electric field, which comprises the following operation steps: placing a fluoranthene crystal to be cut on the lower surface of a lithium niobate crystal, adjusting a fine adjustment three-dimensional translation table to enable a region to be cut of the crystal to be positioned near the focus of a focusing objective lens, and capturing a clear object image by using a CCD camera; the power of the laser and the set temperature of the heating device are adjusted, the electronic shutter is opened, the laser enters the focusing objective lens through the reflection of the semi-transparent semi-reflector and is focused on the lithium niobate chip, so that a space electric field is generated, and the length of the crystal on the lithium niobate substrate is gradually reduced along with the time.
In order to effectively cut fluoranthene crystal, the laser 1 needs to irradiate the lithium niobate chip with laser light to effectively excite carriers, so the wavelength of the laser 1 is 400-500 nm, and the power of the laser is not lower than 11mW; the background light source 10 may use a halogen lamp; the focusing objective 5 has a magnification of 10 to 30 times.
Combining the above and considering the cost and transportation effect of the components, the preferred range of each parameter is: the wavelength of the laser is 390-500 nm, and the background light source 7 is a halogen lamp; the focusing objective magnification should be between 10 and 30 times. In order to ensure the correct light transmission and measurement accuracy, all optical elements and electronic devices on the light path are fixed on the rigid connecting frame.
The working principle of the scheme of the invention is as follows: the laser is utilized to irradiate the lithium niobate chip, a spatial electric field is generated on the surface of the lithium niobate chip, the molecules in the fluoranthene crystal move more violently by heating, the spatial electric field generated on the surface of the lithium niobate chip acts on fluoranthene molecules by adjusting the distance between a focused laser spot and the crystal to directionally capture the fluoranthene molecules to the position of the laser spot, the laser is turned off, the length of the crystal stops changing, and therefore the micro-size fluoranthene crystal on the lithium niobate substrate can be cut and the length can be controlled. After the cutting is finished, the fluoranthene raw material can be heated to the sublimation temperature, so that the crystal obtained by cutting continues to grow.
Specific examples of the scheme for realizing the cutting of the micro-sized fluoranthene crystal on the lithium niobate substrate according to the present invention are given below, and the specific examples are only used for illustrating the present invention in detail and do not limit the scope of protection of the claims of the present application.
Example 1
The method comprises the steps of using a 405nm laser, setting the heating temperature to be 50 ℃, setting the amplification factor of a focusing objective to be 16 times, setting the diameter of a crystal to be cut to be 3.5 mu m, placing fluoranthene microcrystal on the lower surface of lithium niobate, moving a fine-tuning three-dimensional translation table to enable a laser spot to be located in the middle section of the crystal and have the vertical distance of 50 mu m, opening an electronic shutter, enabling the crystal located near the laser focus to gradually disappear, dividing the complete crystal into two sections, closing the electronic shutter, enabling the crystal length not to change any more, and achieving cutting of the micro-size fluoranthene crystal.
Example 2
The method comprises the steps of using a 405nm laser, enabling the laser power to be 11.2mW, enabling a background light source to be a halogen lamp, setting the heating temperature to be 50 ℃, enabling the magnification of a focusing objective lens to be 16 times, enabling an organic crystal to be cut to be fluoranthene, enabling the diameter of the crystal to be 5.5 mu m, placing fluoranthene microcrystal on the lower surface of lithium niobate, moving a fine-tuning three-dimensional translation table to enable a laser spot to be located in the middle section of the crystal and enabling the vertical distance to be 63 mu m, opening an electronic shutter, enabling the crystal located near the laser focus to gradually disappear, enabling the complete crystal to be divided into two sections, closing the electronic shutter, enabling the crystal length not to change any more, and achieving cutting of the micro-size fluoranthene crystal.
Example 3
The method comprises the steps of using a 405nm laser with the laser power of 15.3mW, selecting a halogen lamp as a background light source, setting the heating temperature to be 50 ℃, the magnification of a focusing objective lens to be 16 times, using fluoranthene as an organic crystal to be cut and the crystal diameter to be 3 mu m, placing fluoranthene microcrystal on the lower surface of lithium niobate, moving a fine-tuning three-dimensional translation table to enable laser spots to be 26 mu m away from the tail end of the crystal, opening an electronic shutter, gradually shortening the crystal from the tail end, closing the electronic shutter, enabling the crystal length not to change any more, and realizing the cutting of the micro-size fluoranthene crystal.
The above embodiments are further described in detail, it should be understood that the above embodiments are not intended to limit the present invention, and all equivalent modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be considered within the scope of the present invention.

Claims (2)

1. The utility model provides an utilize lithium niobate photo-generated electric field to carry out fluoranthene crystal cutting's device which characterized in that: the small-size organic crystal cutting optical path is formed by a laser 1, an electronic shutter 2, a diaphragm 3, a laser semi-transparent semi-reflecting mirror 4, a focusing objective lens 5, lithium niobate 6, a glass slide 7 with a fluoranthene raw material, a gasket 8, a metal heating plate 13, a temperature control device 14 and a fine adjustment three-dimensional translation table 15 in sequence; the background light source 12, the focusing objective lens 5, the laser semi-transparent semi-reflecting mirror 4, the laser reflecting mirror 9, the optical filter 10 and the CCD camera 11 form a real-time observation optical path in sequence, and the cutting and observation of the small-size organic crystal are simultaneously carried out through the two optical paths which are partially overlapped.
2. A method for cutting fluoranthene crystal by utilizing a lithium niobate photo-generated electric field is characterized by comprising the following steps: and carrying out non-contact cutting on the micron-sized fluoranthene crystal by using a space electric field generated by irradiating the lithium niobate with low-power laser under the condition of small-amplitude temperature rise.
CN202210787263.6A 2022-07-06 2022-07-06 Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field Pending CN115781040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210787263.6A CN115781040A (en) 2022-07-06 2022-07-06 Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210787263.6A CN115781040A (en) 2022-07-06 2022-07-06 Device and method for cutting fluoranthene crystal by utilizing lithium niobate photo-generated electric field

Publications (1)

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CN115781040A true CN115781040A (en) 2023-03-14

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