CN115767919A - 一种电路板生产用防错位压合工艺 - Google Patents
一种电路板生产用防错位压合工艺 Download PDFInfo
- Publication number
- CN115767919A CN115767919A CN202211637705.5A CN202211637705A CN115767919A CN 115767919 A CN115767919 A CN 115767919A CN 202211637705 A CN202211637705 A CN 202211637705A CN 115767919 A CN115767919 A CN 115767919A
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- layer
- pressing
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- circuit board
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- 238000003825 pressing Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 238000007790 scraping Methods 0.000 claims abstract description 44
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- 230000002457 bidirectional effect Effects 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202211637705.5A CN115767919B (zh) | 2022-12-20 | 2022-12-20 | 一种电路板生产用防错位压合工艺 |
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CN202211637705.5A CN115767919B (zh) | 2022-12-20 | 2022-12-20 | 一种电路板生产用防错位压合工艺 |
Publications (2)
Publication Number | Publication Date |
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CN115767919A true CN115767919A (zh) | 2023-03-07 |
CN115767919B CN115767919B (zh) | 2023-08-04 |
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CN202211637705.5A Active CN115767919B (zh) | 2022-12-20 | 2022-12-20 | 一种电路板生产用防错位压合工艺 |
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CN (1) | CN115767919B (zh) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6268748A (ja) * | 1985-09-20 | 1987-03-28 | 株式会社日立製作所 | 多層プリント板のボイドレス成形方法 |
JPH07205389A (ja) * | 1994-01-24 | 1995-08-08 | Somar Corp | フィルム圧着方法及びラミネータ |
JP2009039960A (ja) * | 2007-08-09 | 2009-02-26 | Hitachi Aic Inc | 平板ラミネート装置 |
KR20190004569A (ko) * | 2017-07-04 | 2019-01-14 | 주식회사 리텍 | 진공 라미네이터 및 진공 라미네이팅 방법 |
CN211090155U (zh) * | 2019-07-04 | 2020-07-24 | 珠海市佳晟荣电子科技有限公司 | 一种电路板加工用自动贴合装置 |
CN213522554U (zh) * | 2020-11-27 | 2021-06-22 | 华通电脑(惠州)有限公司 | 一种模板刮平装置 |
CN113524861A (zh) * | 2021-06-18 | 2021-10-22 | 丁晓强 | 燃料电池双极板石墨片增强骨架层叠压合装置 |
CN114043714A (zh) * | 2021-10-29 | 2022-02-15 | 杭州中芯微信息技术有限公司 | 一种信息采集用电子标签生产覆光膜处理装置 |
CN114274651A (zh) * | 2021-12-30 | 2022-04-05 | 廖广寿 | 玻璃钢夹心层压板生产设备 |
CN216873468U (zh) * | 2021-09-29 | 2022-07-01 | 信丰福昌发电子有限公司 | 一种具有板体保护结构的高密度pcb板压平机装置 |
CN115257154A (zh) * | 2022-06-10 | 2022-11-01 | 湖南竣能科技有限公司 | 一种路由器生产用pcb印刷设备 |
-
2022
- 2022-12-20 CN CN202211637705.5A patent/CN115767919B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6268748A (ja) * | 1985-09-20 | 1987-03-28 | 株式会社日立製作所 | 多層プリント板のボイドレス成形方法 |
JPH07205389A (ja) * | 1994-01-24 | 1995-08-08 | Somar Corp | フィルム圧着方法及びラミネータ |
JP2009039960A (ja) * | 2007-08-09 | 2009-02-26 | Hitachi Aic Inc | 平板ラミネート装置 |
KR20190004569A (ko) * | 2017-07-04 | 2019-01-14 | 주식회사 리텍 | 진공 라미네이터 및 진공 라미네이팅 방법 |
CN211090155U (zh) * | 2019-07-04 | 2020-07-24 | 珠海市佳晟荣电子科技有限公司 | 一种电路板加工用自动贴合装置 |
CN213522554U (zh) * | 2020-11-27 | 2021-06-22 | 华通电脑(惠州)有限公司 | 一种模板刮平装置 |
CN113524861A (zh) * | 2021-06-18 | 2021-10-22 | 丁晓强 | 燃料电池双极板石墨片增强骨架层叠压合装置 |
CN216873468U (zh) * | 2021-09-29 | 2022-07-01 | 信丰福昌发电子有限公司 | 一种具有板体保护结构的高密度pcb板压平机装置 |
CN114043714A (zh) * | 2021-10-29 | 2022-02-15 | 杭州中芯微信息技术有限公司 | 一种信息采集用电子标签生产覆光膜处理装置 |
CN114274651A (zh) * | 2021-12-30 | 2022-04-05 | 廖广寿 | 玻璃钢夹心层压板生产设备 |
CN115257154A (zh) * | 2022-06-10 | 2022-11-01 | 湖南竣能科技有限公司 | 一种路由器生产用pcb印刷设备 |
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Publication number | Publication date |
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CN115767919B (zh) | 2023-08-04 |
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Application publication date: 20230307 Assignee: XINFENG ZHENGTIANWEI ELECTRONIC TECHNOLOGIES Co.,Ltd. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980049034 Denomination of invention: An anti misalignment pressing process for circuit board production Granted publication date: 20230804 License type: Common License Record date: 20231130 |
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Application publication date: 20230307 Assignee: SHENZHEN ZHENGTIANWEI TECHNOLOGIES CO.,LTD. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980050304 Denomination of invention: An anti misalignment pressing process for circuit board production Granted publication date: 20230804 License type: Common License Record date: 20231205 |
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Denomination of invention: An anti misalignment pressing process for circuit board production Granted publication date: 20230804 Pledgee: Agricultural Bank of China Limited Xinfeng County Branch Pledgor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Registration number: Y2024980013496 |
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