CN115720685A - 背板及其制作方法、背光模组、显示装置 - Google Patents

背板及其制作方法、背光模组、显示装置 Download PDF

Info

Publication number
CN115720685A
CN115720685A CN202180001614.XA CN202180001614A CN115720685A CN 115720685 A CN115720685 A CN 115720685A CN 202180001614 A CN202180001614 A CN 202180001614A CN 115720685 A CN115720685 A CN 115720685A
Authority
CN
China
Prior art keywords
orthographic projection
substrate
layer
conductive
linear extension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180001614.XA
Other languages
English (en)
Inventor
汤海
耿霄霖
高亮
张树柏
秦建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN115720685A publication Critical patent/CN115720685A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种背板，包括衬底、电路结构层、反射层、多个电子器件和多个封装部；每个封装部覆盖一个电子器件；至少一条第一导电线包括第一直线延伸部、第二直线延伸部和第三直线延伸部；第一直线延伸部在衬底上的正投影为第一正投影，第二直线延伸部在衬底上的正投影为第二正投影，第三直线延伸部在衬底上的正投影为第三正投影，封装部在衬底上的正投影为第四正投影；第一正投影位于第四正投影内，第二正投影与第四正投影部分交叠，第三正投影位于第四正投影之外；第四正投影中，沿第二直线延伸部宽度方向距离最远的两个端点均为第一端点；第二正投影与过第一端点且与第二直线延伸部平行的第一参考线之间的距离不小于第二直线延伸部的线宽的一半。

Description

PCT国内申请，说明书已公开。

Claims (23)

  1. PCT国内申请，权利要求书已公开。
CN202180001614.XA 2021-06-24 2021-06-24 背板及其制作方法、背光模组、显示装置 Pending CN115720685A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/102192 WO2022266960A1 (zh) 2021-06-24 2021-06-24 背板及其制作方法、背光模组、显示装置

Publications (1)

Publication Number Publication Date
CN115720685A true CN115720685A (zh) 2023-02-28

Family

ID=84543995

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180001614.XA Pending CN115720685A (zh) 2021-06-24 2021-06-24 背板及其制作方法、背光模组、显示装置

Country Status (4)

Country Link
US (1) US20240178205A1 (zh)
EP (1) EP4207291A4 (zh)
CN (1) CN115720685A (zh)
WO (1) WO2022266960A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4316019B2 (ja) * 1996-10-01 2009-08-19 株式会社東芝 半導体装置及び半導体装置製造方法
JP4754850B2 (ja) * 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
JP2008060344A (ja) * 2006-08-31 2008-03-13 Toshiba Corp 半導体発光装置
JP2008244151A (ja) * 2007-03-27 2008-10-09 Toyoda Gosei Co Ltd 発光装置
JP5340583B2 (ja) * 2007-11-26 2013-11-13 スタンレー電気株式会社 半導体発光装置
KR20120119396A (ko) * 2011-04-21 2012-10-31 삼성전자주식회사 발광소자 모듈 및 그의 제조방법
US20200335482A1 (en) * 2017-11-14 2020-10-22 Barco N.V. System and method for chip-on-board light emitting diode
CN207425918U (zh) * 2018-01-16 2018-05-29 苏州工业园区弘磊光电有限公司 一种改进的pcb-led结构
CN109411457A (zh) * 2018-10-26 2019-03-01 吉安市木林森光电有限公司 Rgb led集成封装模块

Also Published As

Publication number Publication date
WO2022266960A1 (zh) 2022-12-29
EP4207291A4 (en) 2024-01-03
EP4207291A1 (en) 2023-07-05
US20240178205A1 (en) 2024-05-30

Similar Documents

Publication Publication Date Title
US7478925B2 (en) Lighting source unit, illuminating apparatus using the same and display apparatus using the same
JP4753431B2 (ja) 発光ダイオード
CN102104100A (zh) 发光器件
EP2369649B1 (en) Light emitting device
US20170200706A1 (en) Light Source Module
US8487336B2 (en) Light emitting device package
CN102347435A (zh) 半导体装置
CN115720685A (zh) 背板及其制作方法、背光模组、显示装置
US9366803B2 (en) Display device
JP2009069443A (ja) 液晶表示装置
CN114709343A (zh) 显示基板、制作方法、显示装置、检测方法以及检测装置
JP2007142085A (ja) 発光装置、及び発光装置の製造方法
KR101916025B1 (ko) 발광 모듈 및 이를 구비한 라이트 유닛
KR101892921B1 (ko) 발광 모듈 및 백라이트 유닛
JP6715933B2 (ja) 液晶表示装置
JP2008185978A (ja) 液晶モジュール
CN114447183B (zh) 显示模块
KR101888657B1 (ko) 발광 모듈 및 이를 구비한 라이트 유닛
WO2024040614A1 (zh) 基板、背光模组及显示装置
KR20070050767A (ko) 유기 발광 소자 패널
KR101946834B1 (ko) 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR101950756B1 (ko) 발광소자 패키지
CN118192120A (zh) 背光模组、制作方法以及显示装置
CN114038841A (zh) 背板、背光模组、显示装置
KR102432215B1 (ko) 라이트 유닛 및 이를 구비한 조명 장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination