CN115720685A - 背板及其制作方法、背光模组、显示装置 - Google Patents
背板及其制作方法、背光模组、显示装置 Download PDFInfo
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- CN115720685A CN115720685A CN202180001614.XA CN202180001614A CN115720685A CN 115720685 A CN115720685 A CN 115720685A CN 202180001614 A CN202180001614 A CN 202180001614A CN 115720685 A CN115720685 A CN 115720685A
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
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- 238000009792 diffusion process Methods 0.000 claims description 19
- 239000002096 quantum dot Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
一种背板，包括衬底、电路结构层、反射层、多个电子器件和多个封装部；每个封装部覆盖一个电子器件；至少一条第一导电线包括第一直线延伸部、第二直线延伸部和第三直线延伸部；第一直线延伸部在衬底上的正投影为第一正投影，第二直线延伸部在衬底上的正投影为第二正投影，第三直线延伸部在衬底上的正投影为第三正投影，封装部在衬底上的正投影为第四正投影；第一正投影位于第四正投影内，第二正投影与第四正投影部分交叠，第三正投影位于第四正投影之外；第四正投影中，沿第二直线延伸部宽度方向距离最远的两个端点均为第一端点；第二正投影与过第一端点且与第二直线延伸部平行的第一参考线之间的距离不小于第二直线延伸部的线宽的一半。
Description
PCT国内申请，说明书已公开。
Claims (23)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/102192 WO2022266960A1 (zh) | 2021-06-24 | 2021-06-24 | 背板及其制作方法、背光模组、显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115720685A true CN115720685A (zh) | 2023-02-28 |
Family
ID=84543995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180001614.XA Pending CN115720685A (zh) | 2021-06-24 | 2021-06-24 | 背板及其制作方法、背光模组、显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4207291A4 (zh) |
| CN (1) | CN115720685A (zh) |
| WO (1) | WO2022266960A1 (zh) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4316019B2 (ja) * | 1996-10-01 | 2009-08-19 | 株式会社東芝 | 半導体装置及び半導体装置製造方法 |
| JP4754850B2 (ja) * | 2004-03-26 | 2011-08-24 | パナソニック株式会社 | Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法 |
| JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
| JP2008244151A (ja) * | 2007-03-27 | 2008-10-09 | Toyoda Gosei Co Ltd | 発光装置 |
| JP5340583B2 (ja) * | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
| KR20120119396A (ko) * | 2011-04-21 | 2012-10-31 | 삼성전자주식회사 | 발광소자 모듈 및 그의 제조방법 |
| US20200335482A1 (en) * | 2017-11-14 | 2020-10-22 | Barco N.V. | System and method for chip-on-board light emitting diode |
| CN207425918U (zh) * | 2018-01-16 | 2018-05-29 | 苏州工业园区弘磊光电有限公司 | 一种改进的pcb-led结构 |
| CN109411457A (zh) * | 2018-10-26 | 2019-03-01 | 吉安市木林森光电有限公司 | Rgb led集成封装模块 |
-
2021
- 2021-06-24 EP EP21946456.7A patent/EP4207291A4/en active Pending
- 2021-06-24 WO PCT/CN2021/102192 patent/WO2022266960A1/zh active Application Filing
- 2021-06-24 CN CN202180001614.XA patent/CN115720685A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP4207291A4 (en) | 2024-01-03 |
| WO2022266960A1 (zh) | 2022-12-29 |
| EP4207291A1 (en) | 2023-07-05 |
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