CN115696747A - Manufacturing method of circuit board and circuit board - Google Patents
Manufacturing method of circuit board and circuit board Download PDFInfo
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- CN115696747A CN115696747A CN202110832812.2A CN202110832812A CN115696747A CN 115696747 A CN115696747 A CN 115696747A CN 202110832812 A CN202110832812 A CN 202110832812A CN 115696747 A CN115696747 A CN 115696747A
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Abstract
The invention discloses a manufacturing method of a circuit board and the circuit board, the manufacturing method comprises the following steps: obtaining a plate body and an embedded matrix, wherein the surface of the plate body is provided with an opening; placing the embedded substrate into the opening; an adhesive is filled between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening. This application is fixed in the opening of plate body through embedding the base member in advance, in the follow-up operation of being convenient for at the surperficial pressfitting metal level or the second core of plate body to make single-deck board, double-deck board with the circuit board, overcome the circuit board stromatolite and the limited problem of preparation list double faceboard structure, promoted the heat dispersion of circuit board simultaneously.
Description
Technical Field
The invention relates to the technical field of processing of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
A Printed Circuit Board (PCB), which is also called a Printed Circuit Board and is also called a Printed Circuit Board, is an important electronic component, is a support for an electronic component, and is a provider of electrical connection of the electronic component. It is called a printed wiring board because it is manufactured by electronic printing.
In order to improve the heat dissipation performance of the circuit board, a metal matrix needs to be embedded in the circuit board. When laminating, the metal base is placed in the grooved inner core plate groove, and the gap between the metal base and the circuit board is filled and solidified into a whole through glue which is melted by the prepreg when being heated, but the process limits the design of the laminated structure of the circuit board.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board manufacturing method and a circuit board thereof, and solves the problem that the laminated structure of the circuit board is limited in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: provided is a method for manufacturing a wiring board, including: obtaining a plate body and an embedded matrix, wherein the surface of the plate body is provided with an opening; placing the embedded substrate into the opening; an adhesive is filled between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening.
The plate body is a first core plate, and the first core plate comprises a substrate and a first metal layer arranged on the surface of the substrate; the embedded matrix is a metal matrix or a ceramic matrix, and the height of the embedded matrix is the same as the depth of the opening.
Wherein the step of placing the embedded substrate into the opening comprises: the surface of the embedded matrix is flush with the surface of the plate body.
Wherein, pack the adhesive between embedding base member and opening inner wall, so that the step that the embedding base member is fixed in the opening specifically includes: filling adhesive in the gap formed by the embedded substrate and the opening; a heat curing treatment is performed to cure the adhesive.
Wherein, the adhesive is at least one of resin, copper paste and adhesive glue.
Wherein, fill the adhesive between embedding base and opening inner wall, so that also include after the step of making the embedding base fix in the opening: removing the adhesive overflowing from the surface of the plate body; the end of the embedding base body is subjected to leveling treatment so that the surface of the embedding base body is flush with the surface of the plate body.
Wherein, fill the adhesive between embedding base and opening inner wall, so that also include after the step of making the embedding base fix in the opening: pressing a metal layer on the surface of the plate body provided with the opening so as to fixedly connect the metal layer with the surface of the plate body; wherein the embedded substrate is electrically connected with the metal layer.
Wherein, fill the adhesive between embedding matrix and opening inner wall, so that also include after the step of making the embedding matrix fix in the opening: pressing a second core plate on the surface of the plate body provided with the opening so as to fixedly connect the second core plate with the surface of the plate body; the second core board comprises a carrier board and a conducting layer arranged on the surface of the carrier board, and the embedded substrate is conducted with the conducting layer.
Wherein the metal layer is at least one of copper foil or aluminum foil.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: the circuit board comprises a board body, an embedded matrix is fixed in the board body, a metal layer covers the surface of the board body exposed and embedded in the matrix, and the metal layer is conducted with the embedded matrix.
In order to solve the above technical problems, the third technical solution adopted by the present invention is: the circuit board comprises a board body, wherein an opening is formed in the board body, an embedded base body is fixed in the opening, a second core board is arranged on the surface, exposed out of the embedded base body, of the board body, the second core board comprises a carrier board and a conducting layer arranged on the surface of the carrier board, and the embedded base body is conducted with the conducting layer.
The invention has the beneficial effects that: in the manufacturing process of the circuit board, the embedded matrix is put into the opening of the board body, and the adhesive is filled between the embedded matrix and the inner wall of the opening so as to fix the embedded matrix in the opening of the board body. This application is fixed in the opening of plate body through embedding the base member in advance, in the follow-up operation of being convenient for at the surperficial pressfitting metal level or the second core of plate body to make single-deck board, double-deck board with the circuit board, overcome the circuit board stromatolite and the limited problem of preparation list double faceboard structure, promoted the heat dispersion of circuit board simultaneously.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a circuit board according to the present invention;
fig. 2 (a) is a schematic structural diagram of an embodiment corresponding to step S11 in the circuit board manufacturing method provided in fig. 1;
fig. 2 (b) is a schematic structural diagram of an embodiment corresponding to step S12 in the circuit board manufacturing method provided in fig. 1;
fig. 2 (c) is a schematic structural diagram of an embodiment corresponding to step S13 in the circuit board manufacturing method provided in fig. 1;
fig. 2 (d) is a schematic structural diagram of an embodiment corresponding to step S14 in the circuit board manufacturing method provided in fig. 1;
fig. 2 (e) is a schematic structural diagram of another embodiment corresponding to step S14 in the circuit board manufacturing method provided in fig. 1;
FIG. 3 is a schematic structural diagram of an embodiment of a circuit board provided in the present invention;
FIG. 4 is a schematic flow chart of another embodiment of the circuit board manufacturing method provided by the present invention;
fig. 5 (a) is a schematic structural diagram of an embodiment corresponding to step S25 in the circuit board manufacturing method provided in fig. 4;
fig. 5 (b) is a schematic structural diagram of another embodiment corresponding to step S25 in the circuit board manufacturing method provided in fig. 4;
fig. 5 (c) is a schematic structural diagram of another embodiment corresponding to step S25 in the circuit board manufacturing method provided in fig. 4;
fig. 6 is a schematic structural diagram of another embodiment of the circuit board provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as upper, lower, left, right, front, rear \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components in a certain posture (as shown in the drawing), the motion situation, etc., and if the certain posture is changed, the directional indicators are correspondingly changed. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1 and fig. 2 (a) to fig. 2 (e), fig. 1 is a schematic flow chart of an embodiment of a circuit board manufacturing method provided by the present invention; fig. 2 (a) is a schematic structural diagram of an embodiment corresponding to step S11 in the method for manufacturing a circuit board provided in fig. 1; fig. 2 (b) is a schematic structural diagram of an embodiment corresponding to step S12 in the circuit board manufacturing method provided in fig. 1; fig. 2 (c) is a schematic structural diagram of an embodiment corresponding to step S13 in the method for manufacturing a circuit board provided in fig. 1; fig. 2 (d) is a schematic structural diagram of an embodiment corresponding to step S14 in the circuit board manufacturing method provided in fig. 1; fig. 2 (e) is a schematic structural diagram of another embodiment corresponding to step S14 in the circuit board manufacturing method provided in fig. 1. In the present embodiment, a method for manufacturing a wiring board 100 is provided, and the method for manufacturing the wiring board 100 includes the following steps.
S11: a plate body and an embedded substrate are obtained, wherein the plate body has an opening on a surface thereof.
Specifically, the plate body 1 may be a first core 12, and the first core 12 includes a substrate 121 and a first metal layer 122 disposed on a surface of the substrate 121. The substrate 121 may be a rigid substrate 121, and the material of the rigid substrate 121 may be teflon; the substrate 121 may be a flexible substrate 121, and the material of the flexible substrate 121 may be polyimide. In an alternative embodiment, the first core 12 includes a substrate 121 and a first metal layer 122 disposed on only one surface of the substrate 121. Referring to fig. 2 (a), in another alternative embodiment, the plate body 1 may be directly the substrate 121.
An opening 11 is provided in at least one surface of the plate body 1. The opening 11 may be a through hole, that is, a through hole penetrates through two opposite surfaces of the plate body 1. In an alternative embodiment, the opening 11 may also be a blind hole. The opening 11 may be circular or rectangular. The shape of the opening 11 is not limited as long as the opening 11 can accommodate the insertion base 2.
In the present embodiment, the insertion base body 2 is a metal base or a ceramic base, and the height of the insertion base body 2 is the same as the depth of the opening 11 provided in the plate body 1. The shape of the insertion base 2 may be the same as or different from the shape of the opening 11 as long as the insertion base 2 can be placed in the opening 11. In one embodiment, the embedded substrate 2 may be a copper block or a ceramic block.
S12: the embedded matrix is placed into the opening.
Specifically, referring to fig. 2 (b), the embedded substrate 2 obtained as described above is placed in the opening 11 of the plate body 1. In an alternative embodiment, the height of the embedding base 2 is the same as the depth of the opening 11, and the surface of the embedding base 2 is flush with the surface of the plate body 1.
In an alternative embodiment, when the opening 11 is a through hole, the embedded substrate 2 is placed in the through hole, and both end surfaces of the embedded substrate 2 are flush with the surface of the board body 1. In an embodiment, the embedded base 2 is placed in the through hole formed on the first core 12, one end surface of the embedded base 2 is flush with the surface of the first metal layer 122 away from the substrate 121, and the other end surface of the embedded base 2 is flush with the surface of the substrate 121 away from the first metal layer 122.
In another alternative embodiment, when the opening 11 is a blind hole, the embedded substrate 2 is placed in the blind hole, one end surface of the embedded substrate 2 contacts with the bottom wall of the blind hole, and the other end surface of the embedded substrate 2 is flush with the surface of the plate body 1 where the blind hole is arranged. In an embodiment, when the bottom wall of the blind via is the first metal layer 122, one end surface of the embedded substrate 2 contacts the first metal layer 122, and the other end surface of the embedded substrate 2 is flush with the surface of the first metal layer 122 away from the substrate 121.
S13: an adhesive is filled between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening.
Specifically, referring to fig. 2 (c), an adhesive is filled in a gap formed between the insertion substrate 2 and the opening 11, so that the adhesive fills the gap between the insertion substrate 2 and the inner wall of the opening 11. The plate body 1 filled with the adhesive is subjected to heating treatment, so that the adhesive is cured under heating conditions to form the adhesive layer 5, and then the embedded base body 2 is fixed in the opening 11 through the adhesive layer 5, so that the embedded base body 2 is fixed in the plate body 1, and the embedded base body 2 and the plate body 1 are prevented from being fixed by heating a prepreg when the circuit board 100 is laminated in subsequent operations. Wherein, the adhesive is at least one of resin, copper paste and adhesive glue.
S14: and removing the adhesive overflowing from the surface of the plate body.
Specifically, the adhesive agent filled in the gap formed between the embedded base body 2 and the inner wall of the opening 11 may overflow onto the exposed end surface of the plate body 1 and/or the embedded base body 2 when heated and cured, and the cured adhesive layer 5 on the surface of the plate body 1 and the end surface of the embedded base body 2 is removed, so that the end surface of the embedded base body 2 and the surface of the plate body 1 are exposed.
In an alternative embodiment, when the surface of the embedded base body 2 is slightly higher than the surface of the plate body 1, the end of the embedded base body 2 needs to be processed by grinding so that the end of the embedded base body 2 is flush with the surface of the plate body 1.
S15: pressing a metal layer on the surface of the plate body provided with the opening so as to fixedly connect the metal layer with the surface of the plate body; wherein the embedded substrate is in electrical communication with the metal layer.
Specifically, the metal layer 3 and the plate body 1 having the embedded base 2 embedded therein obtained in step S14 are obtained.
When the plate body 1 is a substrate 121, please refer to fig. 2 (d), the metal layer 3 is directly pressed on the surface of the substrate 121, so that the surface of the substrate 121 exposed by the embedded base 2 is fixedly connected with the end surface of the metal layer 3, and a part of the metal layer 3 contacts with the end surface of the embedded base 2.
In another embodiment, referring to fig. 2 (e), when the plate body 1 is the first core plate 12, the first core plate 12 includes a substrate 121 and a first metal layer 122 disposed on only one surface of the substrate 121. And pressing the metal layer 3 on the surface of the substrate 121 far from the first metal layer 122, so that the metal layer 3 is fixedly connected with the surface of the substrate 121. The embedded base 2 connects the first metal layer 122 and the metal layer 3 on the two opposite surfaces of the substrate 121.
When the embedded substrate 2 is a metal base, the metal layer 3 and the metal base can realize both heat conduction and electrical connection. When the insertion substrate 2 is a ceramic substrate, thermal conduction between the ceramic substrate and the metal layer 3 can be achieved.
In the manufacturing method of the circuit board provided by this embodiment, the embedded substrate is placed in the opening of the board body, and the adhesive is filled between the embedded substrate and the inner wall of the opening to form the adhesive layer, so as to fix the embedded substrate in the opening of the board body. The embedded matrix is fixed in the opening of the board body in advance, so that the metal layer is pressed on the surface of the board body to manufacture the single-layer circuit board in the subsequent operation, the problem that the laminated structure of the circuit board is limited is solved, and the heat dissipation performance of the circuit board is improved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a circuit board provided in the present invention. The present embodiment provides a circuit board 100, the circuit board 100 includes a board body 1, an embedded substrate 2 is fixed in the board body 1, a metal layer 3 covers a surface of the board body 1 exposed out of the embedded substrate 2, and the metal layer 3 is conducted with the embedded substrate 2.
In the present embodiment, the plate body 1 is provided with an opening 11, the insertion base body 2 is accommodated in the opening 11, and the adhesive layer 5 is provided between the insertion base body 2 and the opening 11, and the adhesive layer 5 is used to fixedly connect the insertion base body 2 and the plate body 1.
In an alternative embodiment, the first core 12 includes a substrate 121 and a first metal layer 122 disposed on only one surface of the substrate 121. In another alternative embodiment, the plate body 1 may be directly the substrate 121.
An opening 11 is provided in at least one surface of the plate body 1. The opening 11 may be a through hole, that is, a through hole penetrates through two opposite surfaces of the board body 1. In an alternative embodiment, the opening 11 may also be a blind hole. The opening 11 may be circular or rectangular in shape. The shape of the opening 11 is not limited as long as the opening 11 can accommodate the insertion base 2.
In the present embodiment, the insertion base body 2 is a metal base or a ceramic base, and the height of the insertion base body 2 is the same as the depth of the opening 11 provided in the plate body 1. The shape of the insertion base 2 may be the same as or different from the shape of the opening 11 as long as the insertion base 2 can be placed in the opening 11. In one embodiment, the embedded substrate 2 may be a copper block or a ceramic block. The height of the insertion base 2 is equal to the depth of the opening 11, i.e., the end face of the insertion base 2 is flush with the surface of the substrate 121.
In an alternative embodiment, the substrate 121 may be a rigid substrate 121, and the material of the rigid substrate 121 may be teflon; the substrate 121 may be a flexible substrate 121, and the material of the flexible substrate 121 may be polyimide.
In the circuit board in the embodiment, the metal layer is directly pressed on the board body embedded with the embedded substrate, so that the problem of limited laminated structure of the circuit board is solved, and the heat dissipation performance of the circuit board is improved.
Referring to fig. 4 and fig. 5 (a) to 5 (c), fig. 4 is a schematic flow chart of another embodiment of the circuit board manufacturing method provided by the present invention; fig. 5 (a) is a schematic structural diagram of an embodiment corresponding to step S25 in the circuit board manufacturing method provided in fig. 4; fig. 5 (b) is a schematic structural diagram of another embodiment corresponding to step S25 in the circuit board manufacturing method provided in fig. 4; fig. 5 (c) is a schematic structural diagram of another embodiment corresponding to step S25 in the method for manufacturing a wiring board provided in fig. 4. In the present embodiment, a method for manufacturing a circuit board 100 is provided, and the method for manufacturing the circuit board 100 includes the following steps.
S21: a plate body and an embedded substrate are obtained, wherein the plate body has an opening on a surface thereof.
Specifically, the plate body 1 may be a first core 12, and the first core 12 includes a substrate 121 and a first metal layer 122 disposed on a surface of the substrate 121. The substrate 121 may be a rigid substrate 121, and the material of the rigid substrate 121 may be teflon; the substrate 121 may be a flexible substrate 121, and the material of the flexible substrate 121 may be polyimide. In an alternative embodiment, the first core 12 includes a substrate 121, and a first metal layer 122 and a second metal layer 123 disposed on two opposite surfaces of the substrate 121. In another alternative embodiment, the plate body 1 may be directly the substrate 121.
An opening 11 is provided in at least one surface of the plate body 1. The opening 11 may be a through hole, that is, a through hole penetrates through two opposite surfaces of the board body 1. In an alternative embodiment, the opening 11 may also be a blind hole. The opening 11 may be circular or rectangular in shape. The shape of the opening 11 is not limited as long as the opening 11 can accommodate the insertion base 2.
In the present embodiment, the insertion base body 2 is a metal base or a ceramic base, and the height of the insertion base body 2 is the same as the depth of the opening 11 provided in the plate body 1. The shape of the insertion base 2 may be the same as or different from the shape of the opening 11 as long as the insertion base 2 can be placed in the opening 11. In one embodiment, the embedded substrate 2 may be a copper block or a ceramic block.
S22: the insert substrate is placed into the opening.
S23: an adhesive is filled between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening.
S24: and removing the adhesive overflowing from the surface of the plate body.
Specifically, the specific implementation of steps S22 to S24 in this embodiment is the same as the specific implementation of steps S12 to S14 in the above embodiment, and is not repeated herein.
S25: pressing a second core plate on the surface of the plate body provided with the opening so as to fixedly connect the second core plate with the surface of the plate body; the second core board comprises a carrier board and a conducting layer arranged on the surface of the carrier board, and the embedded substrate is conducted with the conducting layer.
Specifically, the second core plate 4 and the plate body 1 having the insertion base body 2 embedded therein obtained in the above step S24 are obtained.
When the board body 1 is a substrate 121, referring to fig. 5 (a), the second core board 4 includes a carrier 41, and a first conductive layer 421 and a second conductive layer 422 disposed on two opposite surfaces of the carrier 41. That is, the conductive layer 42 in the second core board 4 includes a first conductive layer 421 and a second conductive layer 422. The first conductive layer 421 or the second conductive layer 422 of the carrier 41 faces the substrate 121 and is stacked on the surface of the substrate 121 exposed by the embedded base 2 for lamination, so that the second core board 4 is fixedly connected with the surface of the substrate 121, and the first conductive layer 421 or the second conductive layer 422 is in contact with the end surface of the embedded base 2.
When the board body 1 is the first core board 12, referring to fig. 5 (b), the first core board 12 includes a substrate 121 and a first metal layer 122 disposed on only one surface of the substrate 121, and the second core board 4 includes a carrier 41 and a first conductive layer 421 and a second conductive layer 422 disposed on two opposite surfaces of the carrier 41, that is, the conductive layer 42 in the second core board 4 includes the first conductive layer 421 and the second conductive layer 422. The first conductive layer 421 or the second conductive layer 422 in the second core board 4 faces the surface of the substrate 121 far away from the first metal layer 122 and is stacked on the first core board 12 for lamination, so that the first conductive layer 421 or the second conductive layer 422 in the second core board 4 is fixedly connected with the surface of the substrate 121 where the first metal layer 122 is not disposed. The end face of the embedded base 2 on the first core board 12 is electrically connected to the first conductive layer 421 or the second conductive layer 422 on the second core board 4.
When the board body 1 is a first core board 12, referring to fig. 5 (c), the first core board 12 includes a substrate 121, and a first metal layer 122 and a second metal layer 123 disposed on two opposite surfaces of the substrate 121, and the second core board 4 includes a carrier board 41 and a first conductive layer 421 disposed on only one surface of the carrier board 41, that is, the conductive layer 42 in the second core board 4 includes only the first conductive layer 421. The surface of the carrier plate 41 without the first conductive layer 421 is faced to the surface of the first core board 12 embedded with the embedded substrate 2 and stacked on the first core board 12 for pressing, so that the surface of the carrier plate 41 without the first conductive layer 421 is fixedly connected to the first metal layer 122 or the second metal layer 123 in the arrangement of the first core board 12.
When the embedded substrate 2 is a metal substrate, the conductive layer 42 and the metal substrate can be both thermally conductive and electrically connected. When the insertion substrate 2 is a ceramic substrate, the ceramic substrate and the conductive layer 42 can be thermally conducted.
In the manufacturing method of the circuit board according to this embodiment, the embedded substrate is placed in the opening of the board body, and the adhesive is filled between the embedded substrate and the inner wall of the opening, so as to fix the embedded substrate in the opening of the board body. The embedded base body is fixed in the opening of the board body in advance, so that the second core board can be pressed on the surface of the board body in the subsequent operation conveniently, the problem that the laminated structure of the circuit board is limited is solved, and the heat dissipation performance of the circuit board is improved.
Referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of the circuit board provided by the present invention. The embodiment provides a circuit board 100, the circuit board 100 includes a board body 1, an opening 11 is disposed on the board body 1, an embedded substrate 2 is fixed in the opening 11, a second core board 4 is disposed on a surface of the board body 1 exposed to the embedded substrate 2, the second core board 4 includes a substrate 121 and a conductive layer 42 disposed on a surface of the substrate 121, and the embedded substrate 2 is conducted with the conductive layer 42.
The plate body 1 may be a first core plate 12. In an alternative embodiment, the first core 12 includes a substrate 121, and a first metal layer 122 and a second metal layer disposed on a surface of the substrate 121. In another alternative embodiment, the first core 12 includes a substrate 121 and the first metal layer 122 or the second metal layer disposed on only one surface of the substrate 121. In another alternative embodiment, the plate body 1 may be directly the substrate 121.
The substrate 121 may be a rigid substrate 121, and the material of the rigid substrate 121 may be teflon; the substrate 121 may be a flexible substrate 121, and the material of the flexible substrate 121 may be polyimide.
An opening 11 is provided in at least one surface of the plate body 1. The opening 11 may be a through hole, that is, a through hole penetrates through two opposite surfaces of the board body 1. In an alternative embodiment, the opening 11 may also be a blind hole. The opening 11 may be circular or rectangular. The shape of the opening 11 is not limited as long as the opening 11 can accommodate the insertion base 2. The insertion base body 2 is accommodated in the opening 11, and an adhesive layer 5 is provided between the insertion base body 2 and the opening 11, and the adhesive layer 5 is used for fixedly connecting the insertion base body 2 and the plate body 1.
When the board body 1 is a substrate 121, the second core board 4 includes a carrier 41, and a first conductive layer 421 and a second conductive layer 422 disposed on two opposite surfaces of the carrier 41. That is, the conductive layer 42 in the second core board 4 includes a first conductive layer 421 and a second conductive layer 422. The first conductive layer 421 or the second conductive layer 422 in the second core board 4 is fixedly connected to the surface of the substrate 121, and the first conductive layer 421 or the second conductive layer 422 is in contact with the end face of the embedded base 2.
When the board body 1 is a first core board 12, the first core board 12 includes a substrate 121 and a first metal layer 122 disposed on only one surface of the substrate 121, and the second core board 4 includes a carrier board 41 and a first conductive layer 421 and a second conductive layer 422 disposed on two opposite surfaces of the carrier board 41, that is, the conductive layer 42 in the second core board 4 includes a first conductive layer 421 and a second conductive layer 422. The first conductive layer 421 or the second conductive layer 422 in the second core board 4 is fixedly connected to the surface of the substrate 121 on which the first metal layer 122 is not disposed. The end face of the embedded base 2 on the first core board 12 is electrically connected to the first conductive layer 421 or the second conductive layer 422 on the second core board 4.
When the board body 1 is the first core board 12, the first core board 12 includes a substrate 121, and a first metal layer 122 and a second metal layer disposed on two opposite surfaces of the substrate 121, and the second core board 4 includes a carrier 41 and a first conductive layer 421 disposed on only one surface of the carrier 41, that is, the conductive layer 42 in the second core board 4 includes only the first conductive layer 421. The surface of the carrier 41 not provided with the first conductive layer 421 is fixedly connected to the first metal layer 122 or the second metal layer in the first chip 12. The end face of the embedded base 2 on the first core plate 12 is in contact with the carrier plate 41 in the second core plate 4.
In the present embodiment, the insertion base body 2 is a metal base or a ceramic base, and the height of the insertion base body 2 is the same as the depth of the opening 11 provided in the plate body 1. The shape of the insertion base 2 may be the same as or different from the shape of the opening 11 as long as the insertion base 2 can be placed in the opening 11. In one embodiment, the embedded substrate 2 may be a copper block or a ceramic block.
In the circuit board in this embodiment, the second core board is directly pressed on the board body embedded with the embedded base body, so that the first conducting layer or the second conducting layer of the second core board is directly and fixedly connected with the surface of the substrate, and a gap formed between the embedded base body and the opening does not need to be filled with a dielectric layer, thereby overcoming the problem that the structure of laminating and manufacturing the single-double panel of the circuit board is limited, and simultaneously improving the heat dissipation performance of the circuit board.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (11)
1. A method for manufacturing a wiring board, comprising:
obtaining a plate body and an embedded matrix, wherein the surface of the plate body is provided with an opening;
placing the embedded matrix within the opening;
and filling adhesive between the embedded matrix and the inner wall of the opening so as to fix the embedded matrix in the opening.
2. The method for manufacturing a circuit board according to claim 1, wherein the board body is a first core board, and the first core board comprises a substrate and a first metal layer disposed on a surface of the substrate; the embedded substrate is a metal matrix or a ceramic matrix, and the height of the embedded substrate is the same as the depth of the opening.
3. The method of manufacturing a wiring board according to claim 1, wherein the step of placing the insertion substrate into the opening comprises: the surface of the embedded matrix is flush with the surface of the plate body.
4. The method for manufacturing a wiring board according to claim 1, wherein the step of filling an adhesive between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening includes:
filling the gap formed by the embedding matrix and the opening with the adhesive;
a heat curing treatment is performed to cure the adhesive.
5. The method for manufacturing a wiring board according to claim 1, wherein the adhesive is at least one of a resin, a copper paste, and an adhesive glue.
6. The method for manufacturing a wiring board according to claim 1, further comprising, after the step of filling an adhesive between the embedding base and the inner wall of the opening to fix the embedding base in the opening:
removing the adhesive overflowing from the surface of the plate body;
and leveling the end of the embedded base body so that the surface of the embedded base body is leveled with the surface of the plate body.
7. The method for manufacturing a wiring board according to claim 6, further comprising, after the step of filling an adhesive between the insertion substrate and the inner wall of the opening to fix the insertion substrate in the opening:
and pressing a metal layer on the surface of the plate body provided with the opening so as to fixedly connect the metal layer with the surface of the plate body.
8. The method for manufacturing a wiring board according to claim 6, further comprising, after the step of filling an adhesive between the embedding base and the inner wall of the opening to fix the embedding base in the opening:
pressing a second core board on the surface of the plate body provided with the opening so as to fixedly connect the second core board with the surface of the plate body; the second core board comprises a carrier board and a conducting layer arranged on the surface of the carrier board, and the embedded base body is conducted with the conducting layer.
9. The method of manufacturing a wiring board according to claim 7, wherein the metal layer is at least one of a copper foil or an aluminum foil.
10. The circuit board is characterized by comprising a board body, wherein an embedded matrix is fixed in the board body, the surface of the embedded matrix is exposed by the board body, and a metal layer is covered on the surface of the embedded matrix and is conducted with the embedded matrix.
11. The utility model provides a circuit board, its characterized in that, the circuit board includes the plate body, be provided with the opening on the plate body, the opening internal fixation has the embedding base member, the plate body exposes the surface of embedding base member is provided with the second core, the second core include the support plate and set up in the surperficial conducting layer of support plate, the embedding base member with the conducting layer switches on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832812.2A CN115696747A (en) | 2021-07-22 | 2021-07-22 | Manufacturing method of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832812.2A CN115696747A (en) | 2021-07-22 | 2021-07-22 | Manufacturing method of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115696747A true CN115696747A (en) | 2023-02-03 |
Family
ID=85044036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110832812.2A Pending CN115696747A (en) | 2021-07-22 | 2021-07-22 | Manufacturing method of circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115696747A (en) |
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2021
- 2021-07-22 CN CN202110832812.2A patent/CN115696747A/en active Pending
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