CN115682581A - Refrigerating device for refrigerator and refrigerator - Google Patents
Refrigerating device for refrigerator and refrigerator Download PDFInfo
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- CN115682581A CN115682581A CN202110837506.8A CN202110837506A CN115682581A CN 115682581 A CN115682581 A CN 115682581A CN 202110837506 A CN202110837506 A CN 202110837506A CN 115682581 A CN115682581 A CN 115682581A
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A refrigerating device for a refrigerator and a refrigerator are provided. A refrigeration unit for a refrigeration container comprising: a case body; the semiconductor refrigerating sheet is arranged on the outer side of the box body and comprises a cold end and a hot end; the cooling liquid circulating system comprises a liquid pump, a liquid cooling head and a cooling liner, wherein the liquid pump is arranged on the outer side of the box body and is configured to provide driving force for the cooling liquid to flow in the cooling liquid circulating system; the liquid cooling head is arranged on the outer side of the box body, is in heat conduction contact with the cold end and is configured to exchange heat with the cold end; the cooling liner is arranged on the inner side of the box body in a surrounding manner, is provided with a surrounding first wall cavity configured to contain the cooling liquid, and is provided with a liquid inlet communicated with a liquid outlet of the liquid cooling head and a liquid outlet communicated with a liquid inlet of the liquid cooling head; and the heat dissipation module is arranged on the outer side of the box body, is adjacent to the hot end and is configured to dissipate heat of the hot end.
Description
Technical Field
The present disclosure relates to portable refrigeration devices, and more particularly to a refrigeration device for a refrigerator and a refrigerator.
Background
The refrigeration temperature of some vaccines must be strictly controlled from 2 ℃ to 8 ℃. Although China establishes a cold chain for transporting vaccines and biological products, most of the cold chain only covers county-level medical and health institutions, and at present, when the vaccines are transported to vaccination sites in areas such as remote mountainous areas and remote villages, portable incubators mainly relying on box insulation materials (such as polystyrene foam) for insulation are still commonly used.
Above-mentioned portable insulation can, because its box insulation material is difficult to accomplish completely isolated outside heat, consequently, along with the rising of external environment temperature, the temperature in the box also can rise gradually, in case surpass the cold-stored temperature range of bacterin, will lead to bacterin inefficacy.
Disclosure of Invention
The embodiment of the disclosure provides a refrigerating device for a refrigerating box and the refrigerating box, so as to improve the refrigerating effect and the working reliability of the refrigerating box.
According to an aspect of the disclosed embodiments, there is provided a refrigeration unit for a refrigeration case, comprising: a box body; the semiconductor refrigerating sheet is arranged on the outer side of the box body and comprises a cold end and a hot end; the cooling liquid circulating system comprises a liquid pump, a liquid cooling head and a cooling liner, wherein the liquid pump is arranged on the outer side of the box body and is configured to provide driving force for the cooling liquid to flow in the cooling liquid circulating system; the liquid cooling head is arranged on the outer side of the box body, is in heat conduction contact with the cold end and is configured to exchange heat with the cold end; the cooling liner is arranged on the inner side of the box body, is in a surrounding shape, is provided with a first wall cavity which is in a surrounding shape and is configured to contain the cooling liquid, a liquid inlet of the cooling liner is communicated with a liquid outlet of the liquid cooling head, and a liquid outlet of the cooling liner is communicated with a liquid inlet of the liquid cooling head; and the heat dissipation module is arranged on the outer side of the box body, is adjacent to the hot end and is configured to dissipate heat of the hot end.
In some embodiments, the first wall cavity is in a non-closed surrounding shape, the cooling liner includes a first end plate and a second end plate, the liquid inlet of the cooling liner is disposed on the first end plate or the second end plate, and the liquid outlet of the cooling liner is disposed on the first end plate or the second end plate.
In some embodiments, the inner and outer sidewalls of the cooling liner each have a closed circumferential shape, and the cooling liner includes a longitudinal partition defining the first wall cavity as a non-closed circumferential shape.
In some embodiments, the refrigeration unit for a cooler further comprises: the cold accumulation inner container is arranged on the inner side of the box body and is in a surrounding shape, the second wall cavity is in a surrounding shape and is configured to contain cold accumulation agent, and the cold accumulation inner container is located above or below the cooling inner container and is in heat conduction contact with the cooling inner container.
In some embodiments, the heat dissipation module comprises: the heat pipe radiator comprises a heat conduction block, a heat dissipation fin and a plurality of heat pipes which penetrate through the heat dissipation fin and are fixedly connected with the heat conduction block, wherein the heat conduction block is in heat conduction contact with the hot end.
In some embodiments, the heat dissipation module further comprises a fan disposed opposite the heat dissipation fins.
In some embodiments, the box body is a square box body, and the semiconductor refrigeration sheet, the liquid pump, the liquid cooling head and the heat dissipation module are positioned on the outer side of one of two adjacent side walls of the box body; the liquid inlet and the liquid outlet of the cooling liner are adjacent to the inner corners of the two adjacent side walls of the box body.
In some embodiments, the liquid inlet of the cooling liner is positioned above the liquid outlet of the cooling liner.
In some embodiments, the cooling liner is a metal cooling liner; and/or the box comprises a vacuum insulation box or an insulation material box.
In some embodiments, the refrigeration unit for the refrigeration case further comprises: a temperature monitoring module configured to monitor at least one temperature parameter of the refrigeration container; and the control module is configured to respond that the monitored value of the temperature parameter is not lower than a temperature threshold value, control the semiconductor refrigerating piece and the liquid pump to be started, and respond that the monitored value of the temperature parameter is lower than the temperature threshold value, and control the semiconductor refrigerating piece and the liquid pump to be stopped.
In some embodiments, the refrigeration unit for the refrigeration case further comprises a control module configured to control the liquid pump to be turned off in response to the semiconductor chilling plate ceasing to operate.
According to another aspect of the embodiments of the present disclosure, there is provided a refrigerator including the refrigerating apparatus for a refrigerator according to any one of the embodiments.
In the embodiment of the disclosure, the cooling liquid circulation system is used for cooling the internal environment of the refrigerating box, and the refrigerating box has the advantages of high cooling efficiency, low energy consumption, low noise, high working reliability, simple and compact structure and low cost. The cooling inner container is integrally in a surrounding plate shape, so that the heat conduction area is larger, the heat conduction efficiency is better, and the internal environment of the refrigerating box can be uniformly cooled, so that the refrigerating efficiency is higher and reliable.
It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.
Drawings
Further details, features and advantages of the disclosure are disclosed in the following description of exemplary embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic perspective view of a refrigeration unit for a refrigeration case according to some exemplary embodiments of the present disclosure;
FIG. 2 is a side schematic view of a refrigeration unit for a refrigeration case according to some exemplary embodiments of the present disclosure;
FIG. 3 is an exploded schematic view of a refrigeration unit for a refrigeration case according to some exemplary embodiments of the present disclosure;
FIG. 4 is a schematic perspective view of a cooling liner according to some exemplary embodiments of the present disclosure;
FIG. 5 is a schematic perspective view of a cooling liner and a cold storage liner according to some exemplary embodiments of the present disclosure; and
FIG. 6 is a perspective view of a cooler, according to some exemplary embodiments of the present disclosure.
Reference numerals:
100-a refrigeration device;
110-a cartridge;
120-semiconductor refrigeration piece;
121-cold end;
122-hot side;
130-liquid pump;
140-liquid cooling head;
141. 151-liquid inlet;
142. 152-a liquid outlet;
150-cooling the inner container;
160-pipeline;
170-heat dissipation module;
153-a first end plate;
154-second end plate;
155-longitudinal baffle;
180-cold accumulation inner container;
171-heat pipe heat sink;
1711-heat conducting block;
1712-heat dissipating fins;
1713-heat pipes;
172-a fan;
156-cooling liquid;
157-a coolant;
200-a refrigerated product accommodating space; and
500-refrigerating box.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art can appreciate, the described embodiments can be modified in various different ways, without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
The portable insulation can in the correlation technique mainly relies on box insulation material to keep warm, and along with the rising of external environment temperature, the temperature in the box exceedes the cold-stored temperature range of bacterin very easily to lead to the bacterin to become invalid.
Based on this, the embodiment of the disclosure provides a refrigerating device for a refrigerating box and the refrigerating box, so as to improve the refrigerating effect and the working reliability of the refrigerating box.
The specific application scenario of the refrigerator is not limited, and the refrigerator can be used for various preparations, medicines or organisms requiring refrigeration treatment, such as vaccines, insulin, blood, stem cells, living organs, and the like.
As shown in fig. 1, 2 and 3, some embodiments of the present disclosure provide a cooling device 100 for a refrigerator, which mainly comprises a box body 110, a semiconductor cooling plate 120, a cooling liquid circulation system and a heat dissipation module 170.
The semiconductor chilling plates 120 are disposed on the outside of the case 110 and include a cold end 121 and a hot end 122.
The cooling liquid circulation system includes a liquid pump 130, a liquid cooling head 140, and a cooling liner 150 connected by a pipe 160. The liquid pump 130 is disposed outside the box body 110, and may be disposed on a pipeline between the liquid outlet 152 of the cooling liner 150 and the liquid inlet 141 of the liquid-cooling head 140, or may be disposed on a pipeline between the liquid outlet 142 of the liquid-cooling head 140 and the liquid inlet 151 of the cooling liner 150. The liquid pump 130 is configured to provide a driving force for the flow of the coolant in the coolant circulation system. Liquid cooling head 140 is disposed outside of cassette body 110 and in thermally conductive contact with cold end 121, and is configured to exchange heat with cold end 121. The cooling liner 150 is disposed inside the case 110, has a circumferential shape, and has a first wall cavity configured to receive the cooling liquid 156. The liquid inlet 151 of the cooling liner 150 is communicated with the liquid outlet 142 of the liquid cooling head 140, and the liquid outlet 152 of the cooling liner 150 is communicated with the liquid inlet 141 of the liquid cooling head 140.
The heat dissipation module 170 is disposed outside the case 110 and adjacent to the hot end 122, and configured to dissipate heat of the hot end 122.
The specific type of the cartridge 110 is not limited, and may be a vacuum insulation cartridge or an insulation material cartridge. In some embodiments, the refrigeration unit 100 may be located entirely within the enclosure of the refrigeration case. In other embodiments, at least a portion of the outer surface of the case 110 directly serves as the outer surface of the refrigerator, and the semiconductor cooling plate 120, the liquid cooling head 140, the liquid pump 130, and the heat dissipation module 170 are collectively disposed and disposed in a protective enclosure.
The basic working principle of the semiconductor refrigerating sheet is that when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the thermocouple pair, heat transfer can be generated between the two ends, the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end, and the process is forward heat transfer. Because of the resistance of the semiconductor itself, heat is also generated when current passes through the semiconductor, resulting in reverse heat transfer, and in addition, heat between the cold and hot sides is also transferred through the air and the semiconductor itself in reverse. When the cold end and the hot end reach a certain temperature difference and the positive and reverse heat transfer are mutually offset, the temperature of the cold end and the temperature of the hot end can not be continuously changed. Typically, heat is removed from the hot side to lower the temperature of the hot side, thereby bringing the cold side to a lower temperature.
The liquid cooling head 140 is in heat-conducting contact with the cold end 121 of the semiconductor chilling plate 120, so as to exchange heat with the cold end 121 and cool the internal cooling liquid; the cooled cooling liquid enters the cooling inner container 150, and the refrigerated products surrounded by the cooling inner container 150 are refrigerated to absorb the heat of the internal environment of the refrigerating box; the cooling liquid with the increased temperature flows out of the cooling liner 150 and then enters the liquid cooling head 140 again to perform heat exchange with the cold end 121 of the semiconductor chilling plate 120, which is a circulation process. In the embodiment of the present disclosure, the heat dissipating module 170 dissipates heat to the hot end 122, so that the cold end 121 of the semiconductor refrigeration chip 120 is in a trend of continuous cooling, thereby continuously providing cooling capacity for the liquid cooling head 140.
The cooling liner 150 may be a metal cooling liner, such as an aluminum cooling liner, an aluminum alloy cooling liner, or a copper cooling liner. The inside of the cooling inner container 150 in a surrounding shape defines a refrigerated goods accommodating space 200.
The embodiment of the disclosure cools the internal environment of the refrigerating box through the cooling liquid circulating system, and has the advantages of high cooling efficiency, low energy consumption, low noise, high working reliability, simple and compact structure and low cost compared with the scheme of refrigerating by adopting a compressor in some related technologies. The cooling inner container is integrally in a surrounding plate shape, so that the heat conduction area is larger, the heat conduction efficiency is better, and the internal environment of the refrigerating box can be uniformly cooled, so that the refrigerating efficiency is higher and reliable.
The specific type of the heat dissipation module 170 is not limited. As shown in FIG. 1, in one embodiment, heat dissipation module 170 includes a heat pipe heat sink 171. The main structure of the heat pipe radiator 171 includes a heat conducting block 1711, heat dissipating fins 1712, and a plurality of heat pipes 1713 penetrating the heat dissipating fins 1712 and fixedly connected to the heat conducting block 1711, wherein the heat conducting block 1711 is in heat conducting contact with the hot end 122 of the semiconductor chilling plate 120. In this embodiment, the heat dissipation module 170 further includes a fan 172 disposed opposite to the heat dissipation fins 1712, so that the heat dissipation effect can be accelerated. In some embodiments, the fan 172 may not be provided if the heatpipe heatsink 171 can substantially meet the heat dissipation requirements.
Heat pipes generally comprise a shell, a wick, and end caps, and are generally divided into an evaporator section, an insulator section, and a condenser section. The liquid working medium is heated and evaporated by heat flow in the evaporation section, the steam flows to the condensation section through the heat insulation section, the steam is cooled by cold fluid outside the pipe in the condensation section to release latent heat and is condensed into liquid, and the condensed liquid accumulated in the liquid suction core of the heat dissipation section returns to the evaporation section to absorb heat for evaporation by virtue of the capillary force of the liquid suction core. The heat pipe radiator has the advantages of high radiating efficiency, compact structure, flexible application and high working reliability.
In some embodiments of the present disclosure, the refrigeration device 100 further includes a temperature monitoring module and a control module (not shown in the figures). The temperature monitoring module is configured to monitor at least one temperature parameter of the refrigeration container, such as a temperature at the inlet 151 or the outlet 152 of the cooling liner 150. The control module is configured to control the semiconductor chilling plate 120 and the liquid pump 130 to be turned on in response to the monitored value of the temperature parameter not being lower than the temperature threshold, and to control the semiconductor chilling plate 120 and the liquid pump 130 to be turned off in response to the monitored value of the temperature parameter being lower than the temperature threshold.
The scheme of the embodiment can realize intelligent temperature control of the refrigerating box. When the monitoring value of the temperature parameter is lower than the temperature threshold value, the semiconductor refrigerating sheet 120 and the liquid pump 130 are closed, the cooling liquid in the cooling liquid circulating system does not flow any more at the moment, and the cooling liquid in the cooling inner container 150 does not flow out of the cooling inner container 150 any more, so that heat exchange with the outside is reduced, energy consumption can be saved, and a continuous heat preservation effect within a period of time can be achieved.
In some embodiments of the present disclosure, the control module is further configured to control the liquid pump 130 to shut down in response to the semiconductor chilling plate 120 ceasing to operate. When the semiconductor chilling plate 120 cannot work due to unexpected faults or other reasons, the control module controls the liquid pump 130 to be closed, so that cooling liquid in the cooling inner container 150 cannot flow out of the cooling inner container 150 any more, heat exchange with the outside is reduced, a continuous heat preservation effect can be achieved within a period of time, and the risk of failure of refrigerated products due to unexpected faults can be greatly reduced.
The specific shape of the box 110 is not particularly limited in the present disclosure, for example, the box 110 may be a square box or a barrel-shaped box, and the like, where the square box is, for example, a rectangular box or a square box. In some embodiments, the case 110 is a square case, and the semiconductor chilling plate 120, the liquid pump 130, the liquid cooling head 140 and the heat dissipation module 170 are located outside one of two adjacent sidewalls and are centrally disposed. As shown in fig. 1 and 2, in this embodiment, the case body 110 is a rectangular parallelepiped case body, and the heat dissipation module 170, the semiconductor chilling plate 120, the liquid cooling head 140, the liquid pump 130, and the pipeline 160 are compactly arranged on the outer side of one wide side wall of the case body 110 in the order from bottom to top. The liquid inlet 151 and the liquid outlet 152 of the cooling liner 150 are adjacent to the inner corners of the two adjacent sidewalls of the box body 110, that is, arranged at a corner of the box body 110, and the liquid inlet 151 is located above the liquid outlet 152.
The refrigerating device 100 adopting the above arrangement has a compact structure and occupies a small space, which is beneficial to reducing the volume of the refrigerating box or increasing the refrigerating space under the condition that the volume of the refrigerating box is basically unchanged. On the other hand, the structural arrangement is compact, so that the length of the pipeline can be reduced, the cold loss is reduced, the heat exchange effect of the cold end 121 and the hot end 122 of the semiconductor refrigerating sheet 120 is improved, and the refrigerating effect of the refrigerating box is further improved. In addition, the liquid inlet 151 is disposed above the liquid outlet 152, so that the pressure of the cooling liquid filled into the cooling liner 150 can be reduced, the working resistance of the liquid pump 130 can be reduced, the energy consumption of the liquid pump 130 can be reduced to a certain extent, and the working reliability of the cooling liquid circulation system can be improved.
As shown in fig. 3, in some embodiments of the disclosure, the first wall cavity of the cooling liner 150 is in a non-closed loop shape, and the cooling liner 150 includes a first end plate 153 and a second end plate 154 respectively disposed at two ends of the non-closed loop direction, so that the cooling liner 150 adopting this design is convenient for manufacturing. The inlet port 151 of the cooling liner 150 may be disposed on the first end plate 153 or the second end plate 154, the outlet port 152 may be disposed on the first end plate 153 or the second end plate 154, and the positions of the inlet port 151 and the outlet port 152 may be designed in combination with the specific layout of other components, for example, as shown in the figure, in order to reduce the amount of piping and the loss of cooling capacity, and simplify the piping design, both the inlet port 151 and the outlet port 152 are disposed on the first end plate 153.
As shown in FIG. 4, in other disclosed embodiments, the inner and outer sidewalls of the cooling liner 150 each have a closed perimeter, and the cooling liner 150 includes a longitudinal partition 155 that defines the first wall cavity as a non-closed perimeter. The coolant on both sides of longitudinal partition 155 cannot flow through longitudinal partition 155 to the opposite side.
As shown in fig. 5, in some embodiments, the refrigeration device 100 further includes a cold accumulation liner 180 disposed inside the case 110 and having a surrounding shape, and a second wall cavity configured to accommodate the cold accumulation agent 157. The cold storage inner container 180 is located above or below the cooling inner container 150 and is in heat conductive contact with the cooling inner container 150. The cold accumulation inner container 180 and the cooling inner container 150 can be assembled or welded together, or can be integrally processed and manufactured. The cold accumulation inner container 180 can be made of a metal material with better heat conductivity. In this embodiment, the inner sides of the cooling inner container 150 and the cool storage inner container 180, which are in a surrounding shape, together define a refrigerated goods accommodating space 200 of the refrigerator.
The cold accumulation inner container 180 is integrally in a surrounding plate shape. The second wall cavity is configured to contain a coolant 157, and the coolant may be injected before the refrigerator is shipped, or after the refrigerator is sold, the coolant with a suitable phase transition point may be selected by a user as required. The cold accumulating agent is one kind of translucent, opaque and viscous mixture of organic and/or inorganic compounds, and can absorb and store cold at low temperature and release cold after the temperature reaches its phase change point.
In this embodiment, when the cooling liquid circulation system operates, the low-temperature cooling liquid in the cooling liner 150 transfers the cold energy to the cold storage agent for storage through heat conduction between the liners, that is, the cold storage agent stores the cold as the cooling liquid circulation system operates. Since the temperature of the cooling liquid in the cooling inner container 150 can be controlled by the cooling liquid circulation system, the temperature of the coolant in the cold storage inner container can also be controlled within a certain range, and supercooling can not occur, so that the coolant can be directly released when needed without releasing cold in advance.
When the cooling liquid circulation system stops working and the temperature of the refrigeration environment rises, so that the temperature of the coolant reaches the phase transition point temperature, the coolant releases cold to continuously provide cold for the refrigeration environment, so that the refrigeration environment can still be in a lower and proper temperature range within a longer period of time, for example, the proper refrigeration temperature of vaccines is 2-8 ℃. According to the scheme of the embodiment of the disclosure, the cold storage agent works along with the cooling liquid circulating system to store cold, cold storage and cold release are not required in advance, and a refrigerating device for supplying cold energy to the cold storage inner container is not required to be additionally arranged, so that the refrigeration effect can be improved, the convenience in use is improved, the use preparation time of the refrigerating box is shortened, the design complexity and the cost of the refrigerating box are not increased, and the service life is longer.
As shown in fig. 6, an embodiment of the present disclosure further provides a refrigeration container 500 including the refrigeration device 100 of any of the foregoing embodiments. It is understood that the refrigeration unit 100 is only a partial structure of the cooler 500, and that the cooler 500 may also include an ice bank, a housing, a display screen, a lock, etc.
The refrigerating box 500 provided by the embodiment of the present disclosure has the advantages of high cooling efficiency, good refrigerating effect, low energy consumption, low noise, high working reliability, simple and compact structure, and low cost.
It will be understood that in this specification, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicate an orientation or positional relationship or dimension based on that shown in the drawings, which terms are used for convenience of description only and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered limiting to the scope of the disclosure.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.
In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
This specification provides many different embodiments, or examples, which can be used to implement the present disclosure. It should be understood that these various embodiments or examples are purely exemplary and are not intended to limit the scope of the disclosure in any way. Those skilled in the art can conceive of various changes or substitutions based on the disclosure of the specification of the present disclosure, which are intended to be included within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope defined by the appended claims.
Claims (12)
1. A refrigeration unit for a cooler, comprising:
a case body;
the semiconductor refrigerating sheet is arranged on the outer side of the box body and comprises a cold end and a hot end;
the cooling liquid circulating system comprises a liquid pump, a liquid cooling head and a cooling liner, wherein the liquid pump is arranged on the outer side of the box body and is configured to provide driving force for the cooling liquid to flow in the cooling liquid circulating system; the liquid cooling head is arranged on the outer side of the box body, is in heat conduction contact with the cold end and is configured to exchange heat with the cold end; the cooling liner is arranged on the inner side of the box body, is in a surrounding shape, is provided with a first wall cavity which is in a surrounding shape and is configured to contain the cooling liquid, a liquid inlet of the cooling liner is communicated with a liquid outlet of the liquid cooling head, and a liquid outlet of the cooling liner is communicated with a liquid inlet of the liquid cooling head; and
and the heat dissipation module is arranged on the outer side of the box body, is adjacent to the hot end and is configured to dissipate heat of the hot end.
2. The refrigeration unit for the refrigerated case of claim 1,
the first wall cavity is in a non-closed surrounding shape, the cooling liner comprises a first end plate and a second end plate, a liquid inlet of the cooling liner is arranged on the first end plate or the second end plate, and a liquid outlet of the cooling liner is arranged on the first end plate or the second end plate.
3. The refrigerating apparatus for a refrigerator as claimed in claim 1, wherein,
the inner side wall and the outer side wall of the cooling liner are respectively in a closed surrounding shape, and the cooling liner comprises a longitudinal partition plate which defines the first wall cavity into a non-closed surrounding shape.
4. The refrigeration unit for the refrigerated case of claim 1 further comprising:
the cold accumulation inner container is arranged on the inner side of the box body and is in a surrounding shape, the second wall cavity is in a surrounding shape and is configured to contain cold accumulation agent, and the cold accumulation inner container is located above or below the cooling inner container and is in heat conduction contact with the cooling inner container.
5. The refrigeration unit for the refrigeration container of claim 1 wherein said heat sink module comprises:
the heat pipe radiator comprises a heat conduction block, a heat dissipation fin and a plurality of heat pipes which penetrate through the heat dissipation fin and are fixedly connected with the heat conduction block, wherein the heat conduction block is in heat conduction contact with the hot end.
6. The refrigeration unit for freezers of claim 5 wherein said heat sink module further comprises: and the fan is arranged opposite to the radiating fins.
7. The refrigeration unit for the refrigerated case of claim 1,
the box body is a square box body, and the semiconductor refrigerating sheet, the liquid pump, the liquid cooling head and the heat dissipation module are positioned on the outer side of one of two adjacent side walls of the box body;
the liquid inlet and the liquid outlet of the cooling liner are adjacent to the inner corners of the two adjacent side walls of the box body.
8. The refrigeration unit for the refrigerated case of claim 1,
the liquid inlet of the cooling liner is positioned above the liquid outlet of the cooling liner.
9. The refrigerating apparatus for a refrigerator as claimed in claim 1, wherein,
the cooling liner is a metal cooling liner; and/or the box comprises a vacuum insulation box or an insulation material box.
10. The refrigerating apparatus for a refrigerator as claimed in any one of claims 1 to 9, further comprising:
a temperature monitoring module configured to monitor at least one temperature parameter of the refrigeration container;
and the control module is configured to respond that the monitored value of the temperature parameter is not lower than a temperature threshold value, control the semiconductor refrigerating sheet and the liquid pump to be started, and respond that the monitored value of the temperature parameter is lower than the temperature threshold value, and control the semiconductor refrigerating sheet and the liquid pump to be stopped.
11. The refrigerating apparatus for a refrigerator as claimed in any one of claims 1 to 9, further comprising:
and the control module is configured to control the liquid pump to be closed in response to the semiconductor chilling plate stopping working.
12. A cooler, comprising: the refrigeration unit for the refrigerated case of any of claims 1 to 11.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN202110837506.8A CN115682581A (en) | 2021-07-23 | 2021-07-23 | Refrigerating device for refrigerator and refrigerator |
PCT/CN2022/107408 WO2023001291A1 (en) | 2021-07-23 | 2022-07-22 | Refrigeration apparatus for refrigerated container, and refrigerated container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110837506.8A CN115682581A (en) | 2021-07-23 | 2021-07-23 | Refrigerating device for refrigerator and refrigerator |
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CN115682581A true CN115682581A (en) | 2023-02-03 |
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CN202110837506.8A Pending CN115682581A (en) | 2021-07-23 | 2021-07-23 | Refrigerating device for refrigerator and refrigerator |
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CN (1) | CN115682581A (en) |
WO (1) | WO2023001291A1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005156026A (en) * | 2003-11-26 | 2005-06-16 | Matsushita Electric Ind Co Ltd | Cooling device |
CN102500272B (en) * | 2011-10-11 | 2014-04-02 | 奇瑞汽车股份有限公司 | Agitating vessel used for manufacturing power cell pole piece and temperature control device thereof |
CN104329829B (en) * | 2014-03-28 | 2017-04-26 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
CN207214560U (en) * | 2017-06-22 | 2018-04-10 | 江西科技学院 | A kind of car refrigerator refrigeration structure |
CN207193240U (en) * | 2017-08-07 | 2018-04-06 | 东源县黄樽酒业有限公司 | A kind of alcoholic cooling device |
CN212778106U (en) * | 2020-06-03 | 2021-03-23 | 广东普能达科技有限公司 | Vehicle-mounted refrigerator with outage memory function |
-
2021
- 2021-07-23 CN CN202110837506.8A patent/CN115682581A/en active Pending
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