WO2023001291A1

WO2023001291A1 - Refrigeration apparatus for refrigerated container, and refrigerated container

Info

Publication number: WO2023001291A1
Application number: PCT/CN2022/107408
Authority: WO
Inventors: 邓玉林; 田德振; 王平旭
Original assignee: 理工亘舒(广东)科技有限公司
Priority date: 2021-07-23
Filing date: 2022-07-22
Publication date: 2023-01-26
Also published as: CN115682581A

Abstract

Provided are a refrigeration apparatus for a refrigerated container, and a refrigerated container. The refrigeration apparatus for a refrigerated container comprises: a box body; a semiconductor refrigeration sheet, which is disposed at an outer side of the box body and comprises a cold end and a hot end; a coolant circulation system, which comprises a liquid pump, a liquid cooling head, and a cooling liner, the liquid pump being disposed at the outer side of the box body and being configured to provide a driving force for a coolant to flow in the coolant circulating system; the liquid cooling head is disposed at the outer side of the box body in heat-conductive contact with the cold end, and is configured to perform heat exchange with the cold end; the cooling liner is disposed at an inner side of the box body and has a surrounding shape, and has a first wall cavity which has a surrounding shape and is configured to accommodate coolant, a liquid inlet of the cooling liner being in communication with a liquid outlet of the liquid cooling head, and a liquid outlet of the cooling liner being in communication with a liquid inlet of the liquid cooling head; and a heat dissipation module, which is disposed on the outer side of the box body adjacent to the hot end and is configured to dissipate heat from the hot end.

Description

Refrigeration device for refrigerator and refrigerator

Cross References to Related Applications

This application claims priority to the Chinese Patent Application No. 202110837506.8, entitled "Refrigeration Device for Refrigerators and Refrigerators," filed with the State Intellectual Property Office of China on July 23, 2021, the entire contents of which are incorporated by reference in this application.

technical field

The disclosure relates to the technical field of portable refrigeration equipment, in particular to a refrigeration device for a refrigerator and the refrigerator.

Background technique

The refrigerated temperature of some vaccines must be strictly controlled at 2°C to 8°C. Although my country has established a cold chain for the transportation of vaccines and biological products, most of them only cover district and county-level medical and health institutions. At present, when transporting vaccines to vaccination points in remote mountainous areas and remote villages, the commonly used A portable incubator that mainly relies on box insulation materials (such as polystyrene foam) for insulation.

The above-mentioned portable incubator, because the insulation material of the box body is difficult to completely isolate the external heat, therefore, with the increase of the external environment temperature, the temperature in the box will gradually increase. Once it exceeds the refrigerated temperature range of the vaccine, it will cause Vaccines don't work.

Contents of the invention

Embodiments of the present disclosure provide a refrigeration device for a refrigerator and the refrigerator, so as to improve the refrigeration effect and work reliability of the refrigerator.

According to an aspect of an embodiment of the present disclosure, there is provided a refrigeration device for a refrigerator, including: a box body; a semiconductor cooling chip, arranged on the outside of the box body, including a cold end and a hot end; a cooling liquid circulation system , including a liquid pump, a liquid cooling head and a cooling liner, wherein the liquid pump is arranged on the outside of the box and is configured to provide a driving force for the cooling liquid to flow in the cooling liquid circulation system; the liquid cooling The head is arranged on the outside of the box body and is in thermal contact with the cold end, and is configured to perform heat exchange with the cold end; the cooling liner is arranged on the inside of the box body and is in a surrounding shape, with Shaped, configured to accommodate the first wall cavity of the cooling liquid, the liquid inlet of the cooling liner communicates with the liquid outlet of the liquid cooling head, and the liquid outlet of the cooling liner communicates with the liquid cooling head The liquid inlet of the cold head is connected; and, the heat dissipation module is arranged on the outside of the box and adjacent to the hot end, and is configured to dissipate heat from the hot end.

In some embodiments, the first wall cavity is in an open circular shape, the cooling liner includes a first end plate and a second end plate, and the liquid inlet of the cooling liner is located at the first end plate or the second end plate, and the liquid outlet of the cooling liner is set on the first end plate or the second end plate.

In some embodiments, the inner side wall and the outer side wall of the cooling liner are respectively closed and surrounding, and the cooling liner includes a mediastinum that defines the first wall cavity as an open and surrounding shape.

In some embodiments, the refrigerating device for a refrigerator further includes: a circumferential cool storage liner disposed inside the box body, having a circumferential second wall cavity configured to accommodate the cool storage agent, The cold storage liner is located above or below the cooling liner and is in thermal contact with the cooling liner.

In some embodiments, the heat dissipation module includes: a heat pipe radiator, including a heat conduction block, a heat dissipation fin, and a plurality of heat pipes penetrating through the heat dissipation fin and fixedly connected to the heat conduction block, wherein the heat conduction block is connected to the heat conduction block The hot end is in thermally conductive contact.

In some embodiments, the heat dissipation module further includes a fan disposed opposite to the heat dissipation fins.

In some embodiments, the box body is a square box body, and the semiconductor cooling chip, the liquid pump, the liquid cooling head and the heat dissipation module are located in two adjacent side walls of the box body. The outer side of one side wall; the liquid inlet and liquid outlet of the cooling liner are adjacent to the inner corners of the two adjacent side walls of the box body.

In some embodiments, the liquid inlet of the cooling inner tank is located above the liquid outlet of the cooling inner tank.

In some embodiments, the cooling liner is a metal cooling liner; and/or, the box includes a vacuum heat insulation box or a heat insulation material box.

In some embodiments, the refrigeration device for a refrigerator further includes: a temperature monitoring module configured to monitor at least one temperature parameter of the refrigerator; a control module configured to respond to the monitored value of the temperature parameter being not lower than A temperature threshold, controlling the semiconductor cooling chip and the liquid pump to turn on, and in response to the monitored value of the temperature parameter being lower than the temperature threshold, controlling the semiconductor cooling chip and the liquid pump to turn off.

In some embodiments, the refrigerating device for a refrigerator further includes a control module configured to control the liquid pump to turn off in response to the peltier cooling chip stopping working.

According to another aspect of the embodiments of the present disclosure, there is provided a refrigerator, including the refrigeration device for a refrigerator in any one of the foregoing embodiments.

In the embodiments of the present disclosure, the cooling liquid circulation system is used to cool down the internal environment of the refrigerator, which has the advantages of high cooling efficiency, low energy consumption, low noise, high working reliability, simple and compact structure, and low cost. The cooling liner is in the shape of a surrounding plate, so that the heat conduction area is also larger, not only the heat conduction efficiency is better, but also the internal environment of the refrigerator can be cooled more uniformly, so that the refrigeration efficiency is high and reliable.

It should be understood that what is described in this section is not intended to identify key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will be readily understood through the following description.

Description of drawings

Further details, features and advantages of the present disclosure are disclosed in the following description of exemplary embodiments with reference to the accompanying drawings in which:

Fig. 1 is a schematic perspective view of a refrigeration device for a refrigerator according to some exemplary embodiments of the present disclosure;

Fig. 2 is a schematic side view of a refrigeration device for a refrigerator according to some exemplary embodiments of the present disclosure;

Fig. 3 is an exploded schematic diagram of a refrigeration device for a refrigerator according to some exemplary embodiments of the present disclosure;

Fig. 4 is a schematic perspective view of a cooling liner according to some exemplary embodiments of the present disclosure;

Fig. 5 is a schematic perspective view of a cooling liner and a cold storage liner according to some exemplary embodiments of the present disclosure; and

FIG. 6 is a perspective view of a refrigerator according to some exemplary embodiments of the present disclosure.

Reference signs:

100 - Refrigeration device;

110-box body;

120-semiconductor refrigeration sheet;

121-cold end;

122 - hot end;

130-liquid pump;

140-liquid cooling head;

141, 151-liquid inlet;

142, 152-liquid outlet;

150-cooling liner;

160-pipeline;

170-cooling module;

153 - the first end plate;

154 - the second end plate;

155 - longitudinal partition;

180-cold storage liner;

171 - heat pipe radiator;

1711-heat conduction block;

1712-radiating fins;

1713 - heat pipe;

172 - fan;

156 - coolant;

157 - cooling agent;

200 - storage space for refrigerated goods; and

500 - Freezer.

detailed description

In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

The portable incubator in the related art mainly relies on the insulation material of the box body for heat preservation. With the increase of the external environment temperature, the temperature inside the box is easy to exceed the refrigerated temperature range of the vaccine, thereby causing the vaccine to fail.

Based on this, the embodiments of the present disclosure provide a refrigeration device for a refrigerator and the refrigerator, so as to improve the refrigeration effect and the reliability of the refrigerator.

Among them, the specific application scenarios of the refrigerator are not limited, and can be used for various preparations, medicines or organisms that need to be refrigerated, such as vaccines, insulin, blood, stem cells, living organs, etc.

As shown in Figure 1, Figure 2 and Figure 3, some embodiments of the present disclosure provide a refrigeration device 100 for a refrigerator, the main structure of which includes a box body 110, a semiconductor cooling chip 120, a cooling liquid circulation system and a heat dissipation module 170.

The semiconductor cooling chip 120 is disposed on the outside of the box body 110 and includes a cold end 121 and a hot end 122 .

The cooling liquid circulation system includes a liquid pump 130 , a liquid cooling head 140 and a cooling liner 150 connected by a pipeline 160 . The liquid pump 130 is arranged on the outside of the box body 110, for example, it can be arranged on the pipeline between the liquid outlet 152 of the cooling liner 150 and the liquid inlet 141 of the liquid cooling head 140 as shown in the figure, or it can also be arranged on the On the pipeline between the liquid outlet 142 of the liquid cooling head 140 and the liquid inlet 151 of the cooling liner 150 . The liquid pump 130 is configured to provide a driving force for cooling liquid to flow in the cooling liquid circulation system. The liquid cooling head 140 is disposed on the outside of the box body 110 and is in thermal contact with the cold end 121 , and is configured to exchange heat with the cold end 121 . The cooling liner 150 is disposed inside the box body 110 and has a surrounding shape, and has a surrounding first wall cavity configured to accommodate the cooling liquid 156 . The liquid inlet 151 of the cooling inner tank 150 communicates with the liquid outlet 142 of the liquid cooling head 140 , and the liquid outlet 152 of the cooling inner tank 150 communicates with the liquid inlet 141 of the liquid cooling head 140 .

The heat dissipation module 170 is disposed outside the box body 110 and adjacent to the hot end 122 , configured to dissipate heat from the hot end 122 .

The specific type of the box body 110 is not limited, and may be a vacuum heat insulation box body or a heat insulation material box body. In some embodiments, the refrigeration unit 100 may be located entirely within the outer shell of the refrigerator. In some other embodiments, at least a part of the outer surface of the box body 110 is directly used as the appearance surface of the refrigerator, and the components such as the semiconductor cooling chip 120, the liquid cooling head 140, the liquid pump 130 and the heat dissipation module 170 are collectively arranged and placed in a protective Inside.

The basic working principle of the semiconductor refrigeration chip is that when a current flows through the thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other. , thus generating a temperature difference to form a cold end and a hot end, and this process is positive heat transfer. Due to the resistance of the semiconductor itself, heat is also generated when the current passes through the semiconductor, resulting in reverse heat transfer. In addition, the heat between the cold end and the hot end will also undergo reverse heat transfer through the air and the semiconductor itself. When the cold end and the hot end reach a certain temperature difference and the forward and reverse heat transfer cancel each other out, the temperature of the cold end and the hot end will not continue to change. Usually, the heat dissipation of the hot end is used to reduce the temperature of the hot end, so that the cold end reaches a lower temperature.

The liquid cooling head 140 is in thermal contact with the cold end 121 of the semiconductor cooling chip 120, thereby exchanging heat with the cold end 121, and cooling the internal coolant; The refrigerated products are refrigerated to absorb the heat of the internal environment of the refrigerator; the coolant after the temperature rises flows out of the cooling inner tank 150 and then enters the liquid cooling head 140 to exchange heat with the cold end 121 of the semiconductor cooling chip 120. This is a cycle process. In the embodiment of the present disclosure, the cooling module 170 dissipates heat from the hot end 122 , so that the cold end 121 of the semiconductor cooling chip 120 is in a trend of continuous cooling, thereby continuously providing cooling capacity for the liquid cooling head 140 .

The cooling liner 150 may be a metal cooling liner, such as an aluminum cooling liner, an aluminum alloy cooling liner, or a copper cooling liner, and the like. The inner side of the surrounding cooling liner 150 defines a storage space 200 for refrigerated goods.

The embodiment of the present disclosure cools down the internal environment of the refrigerator through the cooling liquid circulation system. Compared with some related technologies that use compressor refrigeration, it has the advantages of high cooling efficiency, low energy consumption, low noise, high working reliability, and simple and compact structure. , The advantage of low cost. The cooling liner is in the shape of a surrounding plate, so that the heat conduction area is also larger, not only the heat conduction efficiency is better, but also the internal environment of the refrigerator can be cooled more uniformly, making the refrigeration efficiency higher and more reliable.

The specific type of the cooling module 170 is not limited. As shown in FIG. 1 , in one embodiment, the heat dissipation module 170 includes a heat pipe radiator 171 . The main structure of the heat pipe radiator 171 includes a heat conduction block 1711, a heat dissipation fin 1712, and a plurality of heat pipes 1713 that pass through the heat dissipation fin 1712 and are fixedly connected with the heat conduction block 1711, wherein the heat conduction block 1711 conducts heat with the hot end 122 of the semiconductor cooling fin 120 touch. In this embodiment, the heat dissipation module 170 further includes a fan 172 disposed opposite to the heat dissipation fins 1712, so as to accelerate the heat dissipation effect. In some embodiments, if the heat pipe radiator 171 can basically meet the heat dissipation requirements, the fan 172 may not be provided.

A heat pipe generally includes a shell, a liquid-absorbing wick, and an end cap, and is roughly divided into an evaporation section, an adiabatic section, and a condensation section. The liquid working medium is heated and evaporated by the heat flow in the evaporating section, and its vapor flows to the condensing section through the adiabatic section. In the condensing section, the steam is cooled by the cold fluid outside the tube to release latent heat and condenses into a liquid. The capillary force of the liquid core returns to the evaporation section and then absorbs heat and evaporates. The heat pipe radiator has the advantages of high heat dissipation efficiency, compact structure, flexible application and high working reliability.

In some embodiments of the present disclosure, the refrigeration device 100 further includes a temperature monitoring module and a control module (not shown in the figure). The temperature monitoring module is configured to monitor at least one temperature parameter of the refrigerator, such as the temperature at the liquid inlet 151 or the liquid outlet 152 of the cooling liner 150 . The control module is configured to control the semiconductor refrigeration chip 120 and the liquid pump 130 to turn on in response to the monitored value of the temperature parameter being not lower than the temperature threshold, and to control the semiconductor refrigeration chip 120 and the liquid pump 130 in response to the monitored value of the temperature parameter being lower than the temperature threshold. Pump 130 is off.

The solution of this embodiment can realize the intelligent temperature control of the refrigerator. When the monitored value of the temperature parameter is lower than the temperature threshold, the semiconductor cooling chip 120 and the liquid pump 130 are turned off, and the cooling liquid in the cooling liquid circulation system no longer flows, and the cooling liquid in the cooling liner 150 no longer flows out of the cooling tank. The inner liner is 150, so as to reduce the heat exchange with the outside world, not only save energy consumption, but also achieve the effect of continuous heat preservation for a period of time.

In some embodiments of the present disclosure, the control module is further configured to control the liquid pump 130 to turn off in response to the stoppage of the peltier 120 . When the semiconductor cooling chip 120 cannot work due to accidental failure or other reasons, the control module controls the liquid pump 130 to close, so that the cooling liquid in the cooling inner tank 150 will no longer flow out of the cooling inner tank 150, thereby reducing the heat exchange with the outside world. Exchange can achieve the effect of continuous heat preservation for a period of time, and can greatly reduce the risk of failure of refrigerated products due to unexpected failures.

The present disclosure does not specifically limit the specific shape of the box body 110 , for example, the box body 110 may be a square box or a barrel-shaped box, wherein the square box is, for example, a rectangular parallelepiped box or a cube-shaped box. In some embodiments, the box body 110 is a square box body, and the semiconductor cooling chip 120, the liquid pump 130, the liquid cooling head 140 and the heat dissipation module 170 are located on the outside of one of the two adjacent side walls and arranged together. As shown in Figures 1 and 2, in this embodiment, the box body 110 is specifically a rectangular parallelepiped box body, and the heat dissipation module 170, the semiconductor cooling chip 120, the liquid cooling head 140, the liquid pump 130 and the pipeline 160 follow the order from bottom to top. They are sequentially and compactly arranged on the outer side of one wide side wall of the box body 110 . The liquid inlet 151 and the liquid outlet 152 of the cooling liner 150 are adjacent to the inner corners of the aforementioned two adjacent side walls of the box body 110, that is, arranged at a corner of the box body 110, and the liquid inlet 151 is located at the liquid outlet 152 above.

The refrigerating device 100 adopts the above-mentioned arrangement, which has a compact structure and takes up less space. On the one hand, it is beneficial to reduce the volume of the refrigerator, or it can be designed to increase the refrigeration space when the volume of the refrigerator remains basically unchanged. On the other hand, due to the compact structure, the length of the pipeline can be reduced, thereby reducing the loss of cooling capacity, improving the heat exchange effect between the cold end 121 and the hot end 122 of the semiconductor refrigeration chip 120, and further improving the refrigeration effect of the refrigerator. In addition, setting the liquid inlet 151 above the liquid outlet 152 can reduce the pressure of filling the cooling inner tank 150 with cooling liquid, thereby reducing the working resistance of the liquid pump 130, thereby reducing the pressure of the liquid pump 130 to a certain extent. energy consumption and improve the reliability of the coolant circulation system.

As shown in FIG. 3 , in some disclosed embodiments, the first wall cavity of the cooling liner 150 is in a non-closed circular shape, and the cooling liner 150 includes a first end plate 153 and a second end plate 154, which are respectively arranged on non-closed The two ends of the closed loop encircle the direction, and the cooling liner 150 adopting this design is convenient for processing and manufacturing. The liquid inlet 151 of the cooling liner 150 can be arranged on the first end plate 153 or the second end plate 154, the liquid outlet 152 can be arranged on the first end plate 153 or the second end plate 154, and can be combined with the specific layout of other components To design the positions of the liquid inlet 151 and the liquid outlet 152, for example, as shown in the figure, in order to reduce the pipeline consumption and cooling loss, simplify the pipeline design, the liquid inlet 151 and the liquid outlet 152 are both set on the first end plate 153 .

As shown in FIG. 4 , in other disclosed embodiments, the inner side wall and the outer side wall of the cooling liner 150 are respectively closed and surrounding, and the cooling liner 150 includes longitudinal partitions that define the first wall cavity as an open and surrounding shape. plate 155. The coolant on both sides of the longitudinal partition 155 cannot flow to the opposite side through the longitudinal partition 155 .

As shown in FIG. 5 , in some embodiments, the refrigerating device 100 further includes a circumferential cold storage liner 180 disposed on the inner side of the box body 110 and has a circumferential second wall configured to accommodate the cold storage agent 157 cavity. The cold storage liner 180 is located above or below the cooling liner 150 and is in thermal contact with the cooling liner 150 . The cold storage liner 180 and the cooling liner 150 can be assembled or welded together, and can also be manufactured integrally. The cold storage liner 180 can be made of metal material with better thermal conductivity. In this embodiment, the cooling inner container 150 and the inner side of the cold storage inner container 180 jointly define a storage space 200 for refrigerated goods of the refrigerator.

The cold storage liner 180 is in the shape of a surrounding plate as a whole. The second wall chamber is configured to accommodate the cool storage agent 157, which can be injected before the refrigerator leaves the factory, or after the refrigerator is sold, the user can choose a cool storage agent with a suitable phase transition point to inject according to needs. Coolant is a translucent or opaque, viscous, jelly-like mixture of organic and/or inorganic compounds that absorbs and stores cold energy at low temperatures and releases it when the temperature rises to its phase transition temperature , therefore, can keep itself and the surrounding low temperature environment for a long time.

In this embodiment, when the coolant circulation system is working, the low-temperature coolant in the cooling inner tank 150 will transfer the cold energy to the cool storage agent through the heat conduction between the inner tanks for storage, that is, the cool storage agent will be stored with the coolant circulation system. Work and store cold. Since the temperature of the coolant in the cooling inner tank 150 can be controlled by the cooling liquid circulation system, the temperature of the cool storage agent in the cold storage inner tank can also be controlled within a certain range without overcooling, so that it can be directly cooled when needed. Freezing without pre-chilling.

When the cooling liquid circulation system stops working and the temperature of the refrigerated environment rises, so that the temperature of the cold storage agent reaches the temperature of the phase transition point, the cold storage agent will release the cold and continue to provide cold energy for the refrigerated environment, so that the refrigerated environment can still be used for a long period of time. It is in a lower and suitable temperature range, for example, the suitable refrigeration temperature for vaccines is 2°C to 8°C. According to the embodiment of the present disclosure, since the cold storage agent works with the coolant circulation system to store cold, there is no need to store and release cold in advance, and there is no need to configure an additional refrigeration device to supply cold to the cold storage liner. Therefore, it can not only improve the refrigeration effect, Improve the convenience of use, reduce the use preparation time of the refrigerator, and will not increase the design complexity and cost of the refrigerator, and the service life is longer.

As shown in FIG. 6 , an embodiment of the present disclosure further provides a refrigerator 500 , including the refrigeration device 100 of any one of the foregoing embodiments. It can be understood that the refrigeration device 100 is only a part of the structure of the refrigerator 500, and the refrigerator 500 may also include an ice row, a casing, a display screen, a lock, and the like.

The refrigerator 500 provided by the embodiment of the present disclosure has the advantages of high cooling efficiency, good refrigeration effect, low energy consumption, low noise, high working reliability, simple and compact structure, and low cost.

It should be understood that in this specification the terms "central", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear" , "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", " The orientation or positional relationship or size indicated by "radial direction", "circumferential direction" and so on are based on the orientation or positional relationship or size shown in the drawings, and these terms are used only for the convenience of description, not to indicate or imply the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and thus should not be construed as limiting the scope of the present disclosure.

In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only, and should not be interpreted as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include one or more of these features. In the description of the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

In this disclosure, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection unless otherwise clearly defined and limited. , or integrated; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection or an indirect connection through an intermediary, it can be the internal communication of two components or the interaction relationship between two components . Those of ordinary skill in the art can understand the specific meanings of the above terms in the present disclosure according to specific situations.

In the present disclosure, unless otherwise clearly stated and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

This specification provides many different embodiments or examples that can be used to implement the present disclosure. It should be understood that these different embodiments or examples are purely exemplary and are not intended to limit the protection scope of the present disclosure in any way. Those skilled in the art can conceive of various changes or substitutions on the basis of the disclosure content in the specification of the present disclosure, and these should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be defined by the appended claims.

Claims

A refrigeration device for a refrigerator, characterized in that it comprises:

box body;

A semiconductor cooling chip is arranged on the outside of the box body, including a cold end and a hot end;

A cooling liquid circulation system, including a liquid pump, a liquid cooling head, and a cooling liner, wherein the liquid pump is arranged on the outside of the box and is configured to provide a driving force for the cooling liquid to flow in the cooling liquid circulation system; The liquid cooling head is arranged on the outside of the box body and is in thermal contact with the cold end, and is configured to perform heat exchange with the cold end; the cooling liner is arranged on the inside of the box body and is in a ring shape , having a circular first wall cavity configured to accommodate the cooling liquid, the liquid inlet of the cooling liner communicates with the liquid outlet of the liquid cooling head, and the liquid outlet of the cooling liner communicate with the liquid inlet of the liquid cooling head; and

The heat dissipation module is arranged outside the box and adjacent to the hot end, configured to dissipate heat from the hot end.
The refrigerating device for a refrigerator according to claim 1, characterized in that,

The first wall cavity is non-closed and circular, the cooling liner includes a first end plate and a second end plate, and the liquid inlet of the cooling liner is set on the first end plate or the second end plate. The end plate, the liquid outlet of the cooling liner is set on the first end plate or the second end plate.
The refrigerating device for a refrigerator according to claim 1, characterized in that,

The inner side wall and the outer side wall of the cooling liner are respectively in a closed and surrounding shape, and the cooling liner includes a longitudinal septum that defines the first wall cavity as a non-closed and surrounding shape.
The refrigerating device for a refrigerator according to claim 1, further comprising:

The encircling cold storage liner arranged inside the box has a second wall cavity configured to accommodate the cool storage agent, the cool storage liner is located above or below the cooling liner, And be in thermal contact with the cooling liner.
The refrigerating device for a refrigerator according to claim 1, wherein the heat dissipation module comprises:

The heat pipe radiator includes a heat conduction block, heat dissipation fins, and a plurality of heat pipes penetrating through the heat dissipation fins and fixedly connected to the heat conduction block, wherein the heat conduction block is in thermal contact with the hot end.
The refrigerating device for a refrigerator according to claim 5, wherein the heat dissipation module further comprises: a fan disposed opposite to the heat dissipation fins.
The refrigerating device for a refrigerator according to claim 1, characterized in that,

The box body is a square box body, and the semiconductor refrigeration chip, the liquid pump, the liquid cooling head and the heat dissipation module are located on the outside of one of the two adjacent side walls of the box body;

The liquid inlet and liquid outlet of the cooling liner are adjacent to the inner corners of the two adjacent side walls of the box body.
The refrigerating device for a refrigerator according to claim 1, characterized in that,

The liquid inlet of the cooling inner bag is located above the liquid outlet of the cooling inner bag.
The refrigerating device for a refrigerator according to claim 1, characterized in that,

The cooling liner is a metal cooling liner; and/or, the box body includes a vacuum heat insulation box body or a heat insulation material box body.
The refrigerating device for a refrigerator according to any one of claims 1 to 9, further comprising:

a temperature monitoring module configured to monitor at least one temperature parameter of the reefer;

A control module, configured to control the semiconductor refrigeration chip and the liquid pump to be turned on in response to the monitored value of the temperature parameter being not lower than the temperature threshold, and to control the The peltier and the liquid pump are turned off.
The refrigerating device for a refrigerator according to any one of claims 1 to 9, further comprising:

A control module configured to control the liquid pump to shut down in response to the peltier cooling chip stopping.
A refrigerator, characterized by comprising: the refrigeration device for refrigerators according to any one of claims 1 to 11.