CN115631167A - Cloud storage and identification tracing method and system for integrated wafer and chip electronic view - Google Patents
Cloud storage and identification tracing method and system for integrated wafer and chip electronic view Download PDFInfo
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- CN115631167A CN115631167A CN202211322672.5A CN202211322672A CN115631167A CN 115631167 A CN115631167 A CN 115631167A CN 202211322672 A CN202211322672 A CN 202211322672A CN 115631167 A CN115631167 A CN 115631167A
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
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- G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
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Abstract
The invention discloses a cloud storage and identification tracing method for an integrated wafer and chip electronic view, which comprises the following steps: s1, generating a chip electronic view; s2, generating an identification code; s3, downloading the electronic views and updating the defects respectively by the whole station; s4, screening good products and defective products, and S1, generating a chip electronic view: according to the wafer model and the packaging type, the server automatically generates a corresponding wafer electronic view and a corresponding frame electronic view; and S2, generating an identification code. According to the invention, the original paper frame simulation diagram is upgraded to the electronic view of the cloud, all the existing stations are communicated to realize networking and linkage, the wafer, the frame and the defect information are marked by using a method of downloading the electronic view from the cloud by using equipment, and the wafer, the frame and the defect information are shared by the equipment in the whole process chain, so that the requirements of foolproof, mistake proofing, accurate defect positioning and long-time traceability are met.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a cloud storage and identification tracing method and system for integrating wafer and chip electronic views.
Background
In the prior art of semiconductor production, different defects can be found and generated from wafer feeding to packaging testing, the positions of chip defects on a wafer or a frame need to be printed with a frame shape simulation diagram record, in the production process, the defects generated in each process need to be manually filled into the printed paper frame simulation diagram according to defect codes, thousands of chips exist in the wafer and the frame every day, and an electronic view of the paper cannot meet the accurate recording and transmission of all defect coordinates and cannot be traced back for a long time.
The defects of the prior art are as follows:
manual recording is carried out on a paper simulation diagram, only the number of defects in batches can be recorded, the accurate coordinates of the frame and the wafer cannot be positioned, and the long-time traceability of the vehicle-specification-level product cannot be realized.
Disclosure of Invention
The invention aims to provide a cloud storage and identification tracing method and system for integrating wafer and chip electronic views, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a cloud storage and identification tracing method for integrated wafer and chip electronic views comprises the following steps: s1, generating a chip electronic view; s2, generating an identification code; s3, downloading the electronic views and updating the defects respectively by the whole station; s4, screening good products and defective products, wherein:
s1, generating a chip electronic view: according to the wafer model and the packaging type, the server automatically generates a corresponding wafer electronic view and a corresponding frame electronic view;
s2, generating an identification code: the method comprises the following steps:
a1, acquiring wafer position information of each wafer on a wafer of each divided small unit based on the wafer electronic view generated in the step S1;
a2, acquiring frame position information of each wafer segmentation small unit on a frame based on the frame electronic view generated in the step 1;
a3, obtaining product information of the wafer;
a4, automatically generating an identification code through a server based on the wafer position information, the frame position information and the product information of the wafer obtained in the step, and uploading the identification code to a cloud end;
s3, downloading the electronic views and updating defects by the total station: each station downloads the wafer electronic view and the frame electronic view from the cloud according to the production sequence, and uploads the contained defect information and coordinate information to the cloud, so that the next process can further mark the defect information on the information of the previous stage;
s4, screening good products and defective products: the laser machine automatically downloads an electronic view of the tail end of the integrated circuit package, respectively carries out laser lettering on the good products and the defective products, distinguishes the good products and the defective products at the product end, and eliminates the defective products.
As a further improvement of the invention, the wafer position information is used for cutting the wafer into a plurality of small units and then carrying out coordinate marking on the positions of the small units, so that the small units of the wafer stuck on the frame by silver paste after cutting are all effective wafers, and defective wafers are removed preliminarily.
As a further improvement of the present invention, the product information of the wafer includes lot information of the wafer and chip number information of the wafer.
As a further improvement of the invention, the identification code in the method comprises a wafer identification code and a frame identification code, wherein the wafer identification code is a bar code, the frame identification code is a two-dimensional code, and the identification code is photo-etched on a chip obtained after the wafer is packaged on the frame.
As a further improvement of the invention, the total station comprises wafer cutting equipment, wafer mounting equipment, a full-automatic bonding machine, full-automatic copper sheet bonding on-line equipment, a full-automatic testing machine, a full-automatic plastic sealing machine and a full-automatic optical detection machine.
As a further improvement of the present invention, after each station device of the total station completes the corresponding processing technology, the information including the defect and the coordinate is uploaded to the cloud, the cloud updates the data, and the next station device automatically skips the processing of the defect on the frame according to the information of the frame electronic view downloaded by the cloud.
As a further improvement of the invention, the frame electronic view can generate an updated frame electronic view according to the frame number information request based on the frame position information and the frame electronic view.
As a further improvement of the invention, the identification code is used for tracing back the position information of the frame where the wafer small unit is located and the product information of the wafer, and is used for tracing back the position information of the small unit captured on the wafer, so that the precision of the wafer source information is improved.
The invention also comprises a cloud storage and identification tracing and system integrating the wafer and chip electronic views, which comprises a memory, a processor and a small processing unit, wherein the memory is used for storing program instructions, and the processor is used for operating the program instructions and executing the program instructions through the small processing unit.
As a further development of the invention, the processing cell comprises:
the wafer position information acquisition module is used for acquiring the position information of each cell on the wafer of the cell according to the wafer electronic view;
the frame position acquisition module is used for acquiring the position information of the small unit on the frame;
the product information acquisition module is used for acquiring the product information of the wafer, wherein the product information comprises the batch information of the wafer and the chip number information of the wafer;
the generating module is used for generating the identification code of the wafer based on the position information of the wafer, the position information of the frame and the information of the product;
the identification module is used for photo-etching the identification code generated by the packaging of the wafer on the chip;
and the scanning module is used for scanning the identification code to obtain a chip mark traceability result.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the original paper frame simulation diagram is upgraded to an electronic view of a cloud end, all devices of the existing station are communicated to realize networking and linkage, the wafer, the frame and the defect information are marked by using a method of downloading the electronic view from the cloud end by using the devices, and the wafer, the frame and the defect information are shared by the devices of the whole process chain, so that the requirements of fool proofing, mistake proofing, accurate defect positioning and long-time traceability are met.
Drawings
FIG. 1 is a flow diagram of a cloud storage and identity tracing method and system for integrating wafer and chip electronic views;
FIG. 2 is a framework electronic view of a cloud storage and identity tracing method and system integrating wafer and chip electronic views;
FIG. 3 is a schematic diagram of a chip processing device data transmission for a cloud storage and tag trace back method and system for integrating wafer and chip electronic views;
FIG. 4 is a schematic view of a cloud storage and identity tracking and system query page integrating an electronic view of a wafer and a chip;
FIG. 5 is a schematic diagram of cloud storage and identification traceability and system defect coordinate display of an integrated wafer and chip electronic view;
FIG. 6 is a schematic diagram of cloud storage and identification traceability of an integrated wafer and chip electronic view and a system per station defect coordinate display.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "fixed," "mounted," "connected," or "disposed" to another element, it can be directly on the other element or be indirectly on the other element. It will be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, are used merely to facilitate description of the present invention and to simplify description, and do not indicate or imply that the referenced devices or elements must have the particular orientations, configurations and operations described in the specification, and therefore are not to be considered limiting.
As a further development of the invention, the terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying a number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
Examples
Referring to fig. 1-6, the present invention provides a technical solution: a cloud storage and identification tracing method for integrating wafer and chip electronic views comprises the following steps: s1, generating a chip electronic view; s2, generating an identification code; s3, downloading the electronic views and updating the defects respectively by the whole station; s4, screening good products and defective products, wherein:
s1, generating an electronic view of a chip: the processor runs the program instructions stored in the memory, the product information of the wafer is obtained by the product information obtaining module, the product information comprises batch information of the wafer and chip number information of the wafer, and the server generates an electronic view of the wafer according to the batch information of the wafer and the chip number information of the wafer;
s2, generating an identification code: the method comprises the following steps:
a1, acquiring wafer position information of each wafer on a wafer of each divided small unit based on the wafer electronic view generated in the step 1, and acquiring the position information of each cell on the wafer of each cell by a wafer position information acquisition module according to the wafer electronic view;
a2, obtaining frame position information of each wafer segmentation small unit on a frame based on the frame electronic view generated in the step 1, realizing the segmentation of the small units through wafer cutting equipment, transmitting the updated wafer electronic view to a cloud end, automatically downloading the updated wafer electronic view through the cloud end through wafer pasting equipment, pasting the small units on the frame through silver paste according to the position information of the small units on the wafer, directly eliminating defective small units, and automatically generating the frame electronic view through a server according to the packaging type;
a3, obtaining product information of the wafer;
a4, automatically generating an identification code through a server based on the wafer position information, the frame position information and the product information of the wafer obtained in the previous step and uploading the identification code to a cloud end, acquiring the number information described by the frame electronic view of the frame through a frame position acquisition module, acquiring the position information of the wafer placed on the frame or the frame small unit number information, positioning the position of the wafer on the frame according to the frame small unit number information, acquiring the position information of the small unit on the frame and updating the frame electronic view and transmitting the frame electronic view to the cloud end, and simultaneously generating the identification code of the wafer based on the position information of the wafer, the position information of the frame and the product information through a generation module and uploading the identification code of the wafer to the cloud end;
s3, downloading the electronic view and updating the defects by the total station: each station downloads the wafer electronic view and the frame electronic view from the cloud according to the production sequence, and uploads the contained defect information and coordinate information to the cloud, so that the next process can further mark the defect information on the information of the previous stage;
s4, screening good products and defective products: the laser machine automatically downloads an electronic view of the tail end of the integrated circuit package, respectively carries out laser lettering on the good products and the defective products, distinguishes the good products and the defective products at the product end, and eliminates the defective products.
The wafer position information is used for cutting the wafer into a plurality of small units and then carrying out coordinate marking on the positions of the small units, so that the small units of the wafer stuck on the frame by silver paste after cutting are all effective wafers, and defective wafers are removed preliminarily.
The product information of the wafer comprises batch information of the wafer and chip number information of the wafer.
The identification code comprises a wafer identification code and a frame identification code, the wafer identification code is a bar code, the frame identification code is a two-dimensional code, the identification code is photo-etched on a chip obtained after the wafer is packaged on the frame, the identification code on the surface of the chip can be scanned and identified, a result of tracking a chip mark, namely chip source information, is obtained, the chip source information does not need to be inquired and obtained one by one, and the efficiency of obtaining the chip source information can be improved.
The total station comprises wafer cutting equipment, wafer pasting equipment, a full-automatic bonding machine, full-automatic copper sheet bonding on-line equipment, a full-automatic testing machine, a full-automatic plastic sealing machine and a full-automatic optical detection machine.
And after each station device of the whole station finishes the corresponding processing technology, uploading information containing the defects and the coordinates to a cloud end, updating data by the cloud end, and processing the defective goods on the frame automatically by the next station device according to the information of the frame electronic view downloaded by the cloud end.
The frame electronic view can generate an updated frame electronic view based on the frame position information and the frame electronic view according to the frame number information request, describe the number information according to the frame electronic view on the frame, acquire the position information of the wafer placed on the frame or the frame unit number information, position the wafer on the frame according to the frame unit number information, and improve the accuracy of the position information described in the wafer.
The identification code is used for tracing the position information of the frame where the wafer small unit is located and the product information of the wafer, and is used for tracing the position information of the small unit captured on the wafer, so that the precision of the wafer source information is improved.
A cloud storage and identification tracing and system integrating wafer and chip electronic views comprises a memory, a processor and a processing unit, wherein the memory is used for storing program instructions, and the processor is used for running and executing the program instructions through the processing unit.
The processing cell includes:
the wafer position information acquisition module is used for acquiring the position information of each cell on the wafer of the cell according to the wafer electronic view;
the frame position acquisition module is used for acquiring the position information of the small units on the frame, describing the number information according to the frame electronic view on the frame, acquiring the position information of the wafer placed on the frame or the frame small unit number information, and positioning the position of the wafer on the frame according to the frame small unit number information, so that the accuracy of the position information described in the wafer is improved;
the product information acquisition module is used for acquiring the product information of the wafer, wherein the product information comprises the batch information of the wafer and the chip number information of the wafer;
the generating module is used for generating the identification code of the wafer based on the position information of the wafer, the position information of the frame and the information of the product;
the identification module is used for photo-etching the identification code generated by the packaging of the wafer on the chip;
and the scanning module is used for scanning the identification code to obtain a chip mark traceability result.
In the device, a processor runs a program instruction stored in a memory, a product information acquisition module is used for acquiring product information of a wafer, wherein the product information comprises batch information of the wafer and chip number information of the wafer, a server generates a wafer electronic view according to the batch information of the wafer and the chip number information of the wafer, then a wafer position information acquisition module acquires position information of each cell on the wafer of the wafer according to the wafer electronic view, a wafer cutting device is used for realizing the segmentation of small units and transmitting the updated wafer electronic view to a cloud end, a wafer pasting device is used for automatically downloading the updated wafer electronic view through the cloud end, the small units are pasted on a frame by silver paste according to the position information of the small units on the wafer, the defective small units are directly removed, and the server automatically generates a frame electronic view according to the packaging type, acquiring the number information described by the frame electronic view of the frame through a frame position acquisition module, acquiring the position information of a wafer placed on the frame or the number information of small units of the frame, positioning the position of the wafer on the frame according to the number information of the small units of the frame, acquiring the position information of the small units on the frame, updating the frame electronic view, transmitting the frame electronic view to a cloud terminal, generating the position information of the frame and the information of a product based on the position information of the wafer, generating an identification code of the wafer, uploading the identification code to the cloud terminal, processing the wafer through a full-automatic bonding machine, downloading the frame electronic view updated in the last step through the cloud terminal by the full-automatic bonding machine, skipping the small units which are defective on the frame in the processing process, updating the frame electronic view after the processing is finished, and adopting the same working mode by the full-automatic optical inspection machine and the full-automatic plastic packaging machine, and then, the identification code is photoetched by the laser machine through the identification module, and the defective products and the non-defective products are engraved with characters, so that the management is convenient, and the identification code is scanned by the scanning module to obtain a traceability result of the chip mark.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A cloud storage and identification tracing method for integrating wafer and chip electronic views is characterized by comprising the following steps: the method comprises the following steps: s1, generating a chip electronic view; s2, generating an identification code; s3, downloading the electronic views and updating the defects respectively by the whole station; s4, screening good products and defective products, wherein:
s1, generating an electronic view of a chip: according to the wafer model and the packaging type, the server automatically generates a corresponding wafer electronic view and a corresponding frame electronic view;
s2, generating an identification code: the method comprises the following steps:
a1, acquiring wafer position information of each wafer on the wafer of the small unit after the wafer is divided based on the wafer electronic view generated in the step S1;
a2, acquiring frame position information of each wafer segmentation small unit on the frame based on the frame electronic view generated in the step 1;
a3, obtaining product information of the wafer;
a4, automatically generating an identification code through a server based on the wafer position information, the frame position information and the product information of the wafer obtained in the step, and uploading the identification code to a cloud end;
s3, downloading the electronic view and updating the defects by the total station: each station downloads the wafer electronic view and the frame electronic view from the cloud according to the production sequence, and uploads the contained defect information and coordinate information to the cloud, so that the next process can further mark the defect information on the information of the previous stage;
s4, screening good products and defective products: the laser machine automatically downloads an electronic view of the tail end of the integrated circuit package, respectively performs laser lettering on the good products and the defective products, distinguishes the good products and the defective products at the product end, and rejects the defective products.
2. The cloud storage and identity tracing method for integrated wafer and chip electronic views of claim 1, wherein: the wafer position information is used for cutting the wafer into a plurality of small units and then carrying out coordinate marking on the positions of the small units, so that the small units of the wafer stuck on the frame by silver paste after cutting are all effective wafers, and defective wafers are removed preliminarily.
3. The method of cloud storage and identity traceability of an integrated wafer and chip electronic view of claim 1, wherein: the product information of the wafer comprises batch information of the wafer and chip number information of the wafer.
4. The method of cloud storage and identity traceability of an integrated wafer and chip electronic view of claim 1, wherein: the identification code comprises a wafer identification code and a frame identification code, wherein the wafer identification code is a bar code, the frame identification code is a two-dimensional code, and the identification code is photo-etched on a chip obtained after the wafer is packaged on the frame.
5. The method of cloud storage and identity traceability of an integrated wafer and chip electronic view of claim 1, wherein: the total station comprises wafer cutting equipment, wafer chip mounting equipment, a full-automatic bonding machine, full-automatic copper sheet bonding line equipment, a full-automatic testing machine, a full-automatic plastic sealing machine and a full-automatic optical detection machine.
6. The method of cloud storage and identity traceability of an integrated wafer and chip electronic view of claim 1, wherein: and after each station device of the whole station finishes the corresponding processing technology, the information containing the defects and the coordinates is uploaded to a cloud, the cloud updates data, and the next station device automatically skips the processing of the defective goods on the frame according to the information of the frame electronic view downloaded by the cloud.
7. The cloud storage and identity tracing method for integrated wafer and chip electronic views of claim 1, wherein: the frame electronic view can generate an updated frame electronic view based on the frame position information and the frame electronic view according to a frame number information request.
8. The method of cloud storage and identity traceability of an integrated wafer and chip electronic view of claim 1, wherein: the identification code is used for tracing back the position information of the frame where the wafer small unit is located and the product information of the wafer, and is also used for tracing back the position information of the small unit captured on the wafer, so that the precision of the wafer source information is improved.
9. The cloud storage and identity traceability and system of integrated wafer and chip electronic views of any of claims 1-8, comprising a memory, a processor and a processing cell, wherein: the memory is configured to store program instructions, the processor is configured to execute and the program instructions are executed by the processing cell.
10. The cloud storage and identity traceability and system of integrated wafer and chip electronic views of claim 9, wherein: the processing cell includes:
the wafer position information acquisition module is used for acquiring the position information of each cell on the wafer of the cell according to the wafer electronic view;
the frame position acquisition module is used for acquiring the position information of the small unit on the frame;
the product information acquisition module is used for acquiring the product information of the wafer, wherein the product information comprises the batch information of the wafer and the chip number information of the wafer;
the generating module is used for generating the identification code of the wafer based on the position information of the wafer, the position information of the frame and the information of the product;
the identification module is used for photo-etching the identification code generated by the packaging of the wafer on the chip;
and the scanning module is used for scanning the identification code to obtain a chip mark traceability result.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117130264A (en) * | 2023-10-27 | 2023-11-28 | 深圳中宝新材科技有限公司 | Method and device for controlling bonded silver wire equipment based on side time-frequency resource |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117130264A (en) * | 2023-10-27 | 2023-11-28 | 深圳中宝新材科技有限公司 | Method and device for controlling bonded silver wire equipment based on side time-frequency resource |
| CN117130264B (en) * | 2023-10-27 | 2024-01-05 | 深圳中宝新材科技有限公司 | Method and device for controlling bonded silver wire equipment based on side time-frequency resource |
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