CN115621167A

CN115621167A - Plasma etching machine for semiconductor production

Info

Publication number: CN115621167A
Application number: CN202211344656.6A
Authority: CN
Inventors: 谢金海; 刘天华
Original assignee: Xuzhou Benos Information Technology Co ltd
Current assignee: Shenzhen Shenghong Yun Technology Co ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-01-17
Anticipated expiration: 2042-10-31
Also published as: CN115621167B

Abstract

The invention relates to the technical field of semiconductor chip manufacturing, and discloses a plasma etching machine for semiconductor production, which comprises a case, wherein a processing cavity is formed in the inner wall of the case, an air supply pipe is formed in one side of the surface of the case, a lifting device is fixedly arranged in the middle of the surface of the case, a driving motor is fixedly arranged at the top of the lifting device, a driving rod positioned in the inner cavity of the processing cavity is fixedly arranged on an output shaft of the driving motor, and a fixed block is fixedly arranged at the bottom end of the driving rod. According to the invention, the vibration lug is arranged on the base, and the fan blade moves on the surface of the base, so that the fan blade drives the wafer to rotate and simultaneously swings up and down after passing through the vibration lug, thereby vibrating and separating reaction products on the surface of the wafer, meanwhile, the lower limit block is pressed by the fan blade to fix the wafer, the wafer is firmly fixed during working, and finally, the purposes of stable positioning and easiness in impurity removal are realized.

Description

Plasma etching machine for semiconductor production

Technical Field

The invention relates to the technical field of semiconductor chip manufacturing, in particular to a plasma etching machine for semiconductor production.

Background

The plasma etching is a device for etching an object to be etched through chemical reaction caused by plasma and physical reaction generated by bombardment, and is the most common form in dry etching; the wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, the wafer is a carrier used for producing the integrated circuit, and the wafer generally refers to a monocrystalline silicon wafer.

In the process of rotating the wafer, a plurality of products of reaction on the surface of the wafer are removed in a vibration mode, so that the wafer needs to be stably fixed, the wafer is damaged by over-tight fixation, and the wafer flies out to influence normal work if the wafer is too light; meanwhile, in the using process, the reaction products on the wafer cannot be discharged in time, and new reaction is prevented from being carried out, so that the reaction rate is influenced, and when the injection of the reaction gas is too concentrated, ionized ions bombard the local area of the wafer too intensively, so that the etching layer on the reaction surface is not uniform, and the processing quality of the wafer is influenced.

Disclosure of Invention

Aiming at the defects of the prior plasma etcher in the background technology in the using process, the invention provides the plasma etcher for semiconductor production, which has the advantages of stable positioning and easy impurity removal and solves the technical problems in the background technology.

The invention provides the following technical scheme: the utility model provides a plasma etching machine for semiconductor production, includes quick-witted case, the process chamber has been seted up to the inner wall of machine case, and the surface one side of machine case has seted up the blast pipe, the surperficial middle part fixed mounting of machine case has hoisting device, and hoisting device's top fixed mounting has driving motor, driving motor's output shaft fixed mounting has the actuating lever that is located the process chamber inner chamber, and the bottom fixed mounting of actuating lever has the fixed block, be provided with the mounting bracket on the fixed block, movable mounting has the activity roller in the mounting bracket, and the inner wall bottom activity of mounting bracket cup joints the last gauge block with the laminating of activity roller roll surface, the bottom movable mounting of last gauge block has the wafer, and the bottom movable mounting of mounting bracket has the lower limit block that is used for realizing fixing the wafer, the lateral wall movable mounting of mounting bracket has the lock pole, and the lateral wall bottom movable mounting of lock pole has the fan blade, the outside fixed mounting of fan blade has the transmission barrel wheel that is used for realizing fixing the lower limit block, the inner wall bottom of machine case is located the process chamber fixed mounting has the base, and the middle part fixed mounting of base has the suction tube that is located the machine case outside, the surface of base is provided with the terminal surface shape and is the protruding vibration lug that is wedge-shaped.

Preferably, the number of the fan blades is three, and the three fan blades are fan-shaped.

Preferably, the lateral wall fixed mounting of fan blade has the cleaning rod that is located the wafer below, and the lateral wall fixed mounting of cleaning rod has the cleaning brush body with wafer sliding connection, cleaning rod and fan blade are in same axis, cleaning rod establishes to three at least groups, three groups equidistance between the cleaning rod and be ninety degrees between the cleaning rod between two adjacent groups and arrange.

Preferably, the number of the movable rollers is six, and the six movable rollers are all rollers.

Preferably, the activity cup joints between fixed block and the mounting bracket, the inner wall fixed mounting of mounting bracket has the lock nut that is located the movable roller end, and fixed block surface movable mounting has and is used for realizing the locking bolt that the fixed block promoted and whereabouts with the lock nut adaptation, the top and the fixed block movable mounting of locking pole.

Preferably, the locking rod is a combination of a rectangular rod and a cylindrical rod, and the locking rod is installed on the surface of the fixed block in a clearance mode.

The invention has the following beneficial effects:

1. according to the invention, the vibration lug is arranged on the base, and the fan blade moves on the surface of the base, so that the fan blade drives the wafer to rotate and simultaneously swings up and down after passing through the vibration lug, thereby vibrating and separating reaction products on the surface of the wafer, meanwhile, the lower limit block is pressed by the fan blade to fix the wafer, the wafer is firmly fixed during working, and finally, the purposes of stable positioning and easiness in impurity removal are realized.

2. The cleaning rod is arranged on the side wall of the fan blade, and the cleaning brushes are arranged on the side wall of the cleaning rod in an intermittent manner, so that when the cleaning brush is in work, airflow generated by rotation of the fan blade is directly blown to the surface of a wafer, reaction gas is uniformly distributed on the surface of the wafer, meanwhile, the cleaning brushes on the cleaning rod clean reaction products on the surface of the wafer, and further separation of the reaction products on the wafer is enhanced.

3. According to the invention, the fixing block is arranged in the mounting frame, so that in the using process, the movement of the fixing block is regulated through the locking bolt, the fan blade is pulled by the locking rod of the fixing block through the lifting of the fixing block, the wafer is fixed, on the other hand, the negative pressure is generated in the inner cavity of the mounting frame when the fixing block moves upwards, the wafer is attached to the upper limiting block, the fixing strength of the wafer is ensured, and the purpose of enhancing the fixing strength of the wafer is finally achieved.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic view of a structural base of the present invention;

FIG. 3 is a schematic view of a structural mount of the present invention;

FIG. 4 is a schematic view of a wafer with a structure according to the present invention;

FIG. 5 is a schematic view of a structural movable roll of the present invention;

FIG. 6 is a schematic sectional view of the overall assembly of the inventive structure;

FIG. 7 is an enlarged view of the point A in FIG. 6 according to the present invention.

In the figure: 1. a chassis; 2. a processing cavity; 3. a lifting device; 4. a drive rod; 5. a drive motor; 6. an air feed pipe; 7. a lock lever; 8. vibrating the bump; 9. a base; 10. a suction tube; 11. cleaning the rod; 12. cleaning the brush body; 13. a fan blade; 14. a drive drum wheel; 15. locking the nut; 16. a mounting frame; 17. a fixed block; 18. locking the bolt; 19. a movable roller; 20. an upper limiting block; 21. a wafer; 22. and a lower limiting block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, 2 and 6, a plasma etcher for semiconductor production includes a chassis 1, a processing chamber 2 for performing work is formed in an inner wall of the chassis 1, an air supply pipe 6 for supplying a reaction gas is formed in one side of a surface of the chassis 1, a lifting device 3 is fixedly installed in a middle portion of the surface of the chassis 1, the lifting device 3 can be set as a pushing component such as an air bag cylinder, so that the mounting frame 16 can move up and up when vibration occurs while the driving motor 5 is lifted, a driving motor 5 is fixedly installed at a top of the lifting device 3, a driving rod 4 located in an inner cavity of the processing chamber 2 is fixedly installed at an output shaft of the driving motor 5, a fixed block 17 is fixedly installed at a bottom end of the driving rod 4, a mounting frame 16 is provided on the fixed block 17, a movable roller 19 is movably installed in the mounting frame 16, an upper limit block 20 attached to a roller surface of the movable roller 19 is movably sleeved at a bottom of the inner wall of the mounting frame 16, a wafer 21 is movably installed at a bottom of the upper limit block 20, a lower limit block 22 for fixing the wafer 21, a locking rod 7 is movably installed at a bottom of the mounting frame 16, a side wall of the bottom of the mounting frame 7 is movably sleeved to be attached to a side wall of the chassis, a reaction rod 7, a reaction rod 14 is installed at a side wall of the bottom of the chassis 2, a reaction rod 9, and a reaction rod 14 for easily attached to a reaction rod 9, a reaction rod of the chassis 9, a reaction rod is easily attached to a reaction rod of the chassis 9, a reaction rod 14 installed at the bottom of the chassis, and a reaction rod for sucking a reaction rod 9, through the rotation of its transmission barrel wheel 14, realize the rotation of its wafer 21, guarantee it and reaction gas homogeneous mixing, at last, be provided with the terminal surface shape on the surface of base 9 and be the bellied vibration lug 8 of wedge, therefore when mounting bracket 16 rolls through transmission barrel wheel 14 and revolves along base 9 circumference, transmission barrel wheel 14 passes through behind vibration lug 8, can realize that mounting bracket 16 wholly produces the vibration effect of periodic "promotion-reset" through vibration lug 8, thereby the reaction product on the wafer 21 breaks away from of being convenient for.

Referring to fig. 3 and 4, in order to further enhance the dropping of the reactant on the wafer 21 and the uniform diffusion of the reaction gas, the number of the three fan blades 13 is set, and the three fan blades 13 are all fan-shaped, so that the fan blades 13 uniformly blow the reaction gas to the bottom surface of the wafer 21 when the transmission drum wheel 14 rotates, and on the other hand, the fan blades 13 are fastened by the locking rod 7, so that the transmission drum wheel 14 is always fixed to the lower limit block 22 in the working process, that is, the stability of fixing the wafer 21 is ensured.

Referring to fig. 3, 4 and 7, in order to further enhance the removal of the reaction products on the surface of the wafer 21, a cleaning rod 11 located below the wafer 21 is fixedly mounted on a side wall of the blade 13, the blade 13 is coaxially connected to the cleaning rod 11, and a cleaning brush 12 slidably connected to the wafer 21 is fixedly mounted on a side wall of the cleaning rod 11, so that the bottom of the wafer 21 is synchronously brushed out by the cleaning brush 12 during the rotation process, and meanwhile, since the cleaning rod 11 and the blade 13 are located on the same axis, during the air flow of the blade 13 to the cleaning rod 11, the reaction products scraped off the cleaning brush 12 are also removed, so that the cleaning brush 12 is kept clean all the time, and meanwhile, since the cleaning brush 12 is always in contact with the bottom surface of the wafer 21, the wafer 21 is also elastically supported in the middle of the wafer 21 during the vibration process, so that the phenomenon that the wafer 21 is damaged due to the generated vibration is avoided, and at the cleaning rod 11 is set to be at least ninety groups, and the cleaning rods 11 are arranged between the cleaning rods 21 are arranged at intervals, so that the cleaning brushes 12 are easily separated from the cleaning rod 21, and the cleaning brush 12 is easily separated from the cleaning rod 21, and the cleaning rod 11, so that the cleaning rod 21 is easily separated from the cleaning rod.

Referring to fig. 5, in order to enhance the fixation of the wafer 21 and facilitate the rotation, six movable rollers 19 are provided, and the six movable rollers 19 are all rollers, so that the upper limit block 20 is ensured to be attached to the movable roller 19 after being pressed, and the upper limit block 20 is easily rotated by the movable rollers 19.

Referring to fig. 4 and 5, in order to enhance the fixing strength of the wafer 21, the fixed block 17 is movably sleeved with the mounting frame 16, the locking nut 15 located at the end of the movable roller 19 is fixedly installed on the inner wall of the mounting frame 16, the locking bolt 18 adapted to the locking nut 15 to achieve lifting and dropping of the fixed block 17 is movably installed on the surface of the fixed block 17, and the top end of the locking rod 7 is movably installed on the fixed block 17, so that during the process that the fixed block 17 pulls the locking rod 7 to achieve adjustment and locking of the driving drum wheel 14, negative pressure is generated in the mounting frame 16 to cause the wafer 21 to be adsorbed, thereby enhancing the fixing strength of the wafer 21.

Referring to fig. 1 and 3, in order to facilitate the purpose that the locking rod 7 drives the fan blade 13 to move and the fan blade 13 is separated from the wafer 21 to be taken out, the locking rod 7 is a combination of a rectangular rod and a cylindrical rod, and the locking rod 7 is installed on the surface of the fixing block 17 with a gap, so that the locking rod 7 can be ensured to be capable of further fixing the lower limit block 22 by self force after the fixing block 17 is fixed and after the transmission drum wheel 14 is pressed, the locking rod 7 still has a tendency of moving upward for a certain distance, so that the transmission drum wheel 14 is ensured to be capable of further fixing the lower limit block 22 in the pressing process, meanwhile, by the combination of the locking rod 7, when the locking rod 7 is in a rectangular fixing state, the stability of the fan blade 13 is ensured, and when the wafer 21 is taken out and put in, when the cylinder is placed in a rectangular groove for fixing the locking rod 7 on the side wall of the mounting frame 16, the cylinder rotates on the mounting frame 16, so that the fan blade 13 is easy to rotate out, and the wafer 21 is not affected by the wafer thereon and the wafer 21.

The working principle of the invention is as follows:

when the wafer 21 is used, the wafer 21 is placed below the upper limiting block 20, the lower part of the wafer 21 is limited through the lower limiting block 22, meanwhile, the locking bolt 18 is screwed, the fixed block 17 is lifted, the fixed block 17 lifts the fan blade 13 through the locking rod 7, the fan blade 13 is enabled to push against the lower limiting block 22 to limit the wafer 21, meanwhile, in the process that the fixed block 17 moves upwards, the inner cavity of the mounting frame 16 can synchronously generate negative pressure, so that the wafer 21 is attached to the upper limiting block 20, and the upper limiting block 20 is attached to the movable roller 19;

then, the reaction gas passes through the gas supply pipe 6, the lifting device 3 does not work, so that the fixed block 17 falls under the action of the gravity of the lifting device, the transmission barrel wheel 14 presses the surface of the base 9, the driving motor 5 drives the driving rod 4 to rotate, the fixed block 17 moves on the surface of the base 9 through the transmission barrel wheel 14, the transmission barrel wheel 14 synchronously rotates in the rotating process of the fixed block 17, at the moment, when the transmission barrel wheel 14 rotates, the transmission barrel wheel 14 drives the lower limit block 22, the wafer 21 and the upper limit block 20 to synchronously rotate, and the upper limit block 20 drives the movable roller 19 to synchronously rotate;

on the other hand, in the process that the transmission drum wheel 14 rotates, the vibration bump 8 is passed through, and in the process that the vibration bump 8 is passed through, the wafer 21 is vibrated, so that the reaction product on the wafer 21 is easy to separate, meanwhile, the rotation of the wafer 21 and the fan blades 13 thereof continuously inject the reaction gas to the bottom of the wafer 21 in the rotating process, the bottom of the wafer 21 and the reaction gas are ensured to be uniformly distributed, and the cleaning brush body 12 on the cleaning rod 11 contacts the bottom of the wafer 21 while the fan blades 13 rotate, so that the reaction product at the bottom of the wafer 21 is brushed out, and finally, the dropped reaction product is sucked out through the suction pipe 10, so far, the processing of the wafer 21 is completed according to the above operation process.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a plasma etching machine for semiconductor manufacture, includes quick-witted case (1), its characterized in that: the inner wall of the machine case (1) is provided with a processing cavity (2), an air supply pipe (6) is arranged on one side of the surface of the machine case (1), a lifting device (3) is fixedly arranged in the middle of the surface of the machine case (1), a driving motor (5) is fixedly arranged at the top of the lifting device (3), an output shaft of the driving motor (5) is fixedly provided with a driving rod (4) positioned in an inner cavity of the processing cavity (2), a fixed block (17) is fixedly arranged at the bottom end of the driving rod (4), a mounting frame (16) is arranged on the fixed block (17), a movable roller (19) is movably arranged in the mounting frame (16), an upper limit block (20) which is attached to the roller surface of the movable roller (19) is movably sleeved at the bottom of the inner wall of the mounting frame (16), a wafer (21) is movably arranged at the bottom of the upper limit block (20), a lower limit block (22) which is fixed to the wafer (21) is movably arranged at the bottom of the fan blade (16), a locking rod (7) is movably arranged at the side wall of the locking rod (7), a lower limit block (13) is movably arranged at the bottom of the side wall of the fan blade (14) and a transmission wheel (14) is fixedly arranged at the bottom of the inner wall of the machine case (1), and the middle part of the base (9) is fixedly provided with a suction pipe (10) positioned outside the case (1), and the surface of the base (9) is provided with a vibration bump (8) with the end surface in a wedge-shaped bulge shape.

2. The plasma etching machine for semiconductor production according to claim 1, wherein: the number of the fan blades (13) is three, and the three fan blades (13) are fan-shaped.

3. The plasma etching machine for semiconductor production according to claim 1, wherein: the utility model discloses a cleaning brush, including blade (13), lateral wall fixed mounting of fan blade (13) has clean pole (11) that are located wafer (21) below, and the lateral wall fixed mounting of clean pole (11) have with wafer (21) sliding connection's clean brush body (12), clean pole (11) are in same axis with fan blade (13), clean pole (11) are established to at least three groups, three groups between clean pole (11) equidistance and adjacent two clean pole (11) between the group be ninety degrees and arrange.

4. The plasma etching machine for semiconductor production according to claim 1, wherein: six movable rollers (19) are arranged, and the six movable rollers (19) are all rollers.

5. The plasma etching machine for semiconductor production according to claim 1, wherein: the activity cup joints between fixed block (17) and mounting bracket (16), the inner wall fixed mounting of mounting bracket (16) has lock nut (15) that are located movable roller (19) end, and fixed block (17) surface movable mounting have be used for with lock nut (15) adaptation realize that fixed block (17) promote and locking bolt (18) of whereabouts, the top and fixed block (17) movable mounting of locking pole (7).

6. The plasma etching machine for semiconductor production according to claim 5, wherein: the locking rod (7) is a combination of a rectangular rod and a cylindrical rod, and the locking rod (7) is installed on the surface of the fixing block (17) in a clearance mode.