CN115621167B - Plasma etching machine for semiconductor production - Google Patents
Plasma etching machine for semiconductor production Download PDFInfo
- Publication number
- CN115621167B CN115621167B CN202211344656.6A CN202211344656A CN115621167B CN 115621167 B CN115621167 B CN 115621167B CN 202211344656 A CN202211344656 A CN 202211344656A CN 115621167 B CN115621167 B CN 115621167B
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- wafer
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- machine case
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000001020 plasma etching Methods 0.000 title claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 47
- 238000003754 machining Methods 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 abstract description 13
- 239000012535 impurity Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- 230000005540 biological transmission Effects 0.000 description 16
- 239000012495 reaction gas Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- B08B1/12—
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- B08B1/20—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of semiconductor chip manufacturing, and discloses a plasma etching machine for semiconductor production, which comprises a machine case, wherein a processing cavity is formed in the inner wall of the machine case, an air supply pipe is formed in one side of the surface of the machine case, a lifting device is fixedly arranged in the middle of the surface of the machine case, a driving motor is fixedly arranged at the top of the lifting device, a driving rod positioned in the inner cavity of the processing cavity is fixedly arranged on an output shaft of the driving motor, and a fixing block is fixedly arranged at the bottom end of the driving rod. According to the invention, the vibration convex blocks are arranged on the base and move on the surface of the base through the fan blades, so that the fan blades drive the wafer to rotate and swing up and down after passing through the vibration convex blocks, thereby vibrating and separating reaction products on the surface of the wafer, and meanwhile, the fan blades press the lower limit blocks to fix the wafer, so that the wafer is firmly fixed during working, and finally, the purposes of stable positioning and easy impurity removal are realized.
Description
Technical Field
The invention relates to the technical field of semiconductor chip manufacturing, in particular to a plasma etching machine for semiconductor production.
Background
Plasma etching is a device for etching a piece to be etched through a chemical reaction caused by plasma and a physical reaction generated by bombardment, and is the most common form in dry etching; a wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, a wafer refers to a carrier used for producing an integrated circuit, and a wafer in a general sense refers to a single crystal silicon wafer.
In the process of rotating the wafer, a plurality of products of the wafer surface reaction are removed in a vibration mode, so that the wafer needs to be firmly fixed, the wafer is damaged due to too tight fixation, and the wafer flies out due to too light weight, and normal work is affected; meanwhile, in the using process, the products of the reaction on the wafer cannot be discharged in time, new reaction is prevented from being carried out, so that the reaction rate is influenced, and when the reaction gas is injected too intensively, ionized ions bombard the local area of the wafer too intensively, so that the etching layer on the reaction surface is uneven, and the processing quality of the wafer is influenced.
Disclosure of Invention
Aiming at the defects of the prior plasma etcher in the use process, the invention provides the plasma etcher for semiconductor production, which has the advantages of stable positioning and easy impurity removal, and solves the technical problems in the prior art.
The invention provides the following technical scheme: the utility model provides a plasma etching machine for semiconductor production, includes the quick-witted case, the processing chamber has been seted up to the inner wall of machine case, and the air pipe has been seted up to surface one side of machine case, the surface middle part fixed mounting of machine case has hoisting device, and hoisting device's top fixed mounting has driving motor, driving motor's output shaft fixed mounting has the actuating lever that is located the processing chamber inner chamber, and the bottom fixed mounting of actuating lever has the fixed block, be provided with the mounting bracket on the fixed block, movable mounting has movable roller in the mounting bracket, and the inner wall bottom movable sleeve of mounting bracket has cup jointed the upper limit piece with movable roller roll surface laminating, the bottom movable mounting of upper limit piece has the wafer, and the bottom movable mounting of mounting bracket has the lower limit piece that is used for realizing fixing the wafer, the lateral wall movable mounting of mounting bracket has the locking lever, and the lateral wall bottom movable mounting of locking lever has the fan blade, the outside fixed mounting of fan blade has the transmission drum that is used for realizing fixing the lower limit piece, the inner wall bottom of machine case and be located the processing chamber fixed mounting has the base, and the fixed mounting of base has the suction tube that is located the base outside the middle part of chassis, the surface setting has the protruding wedge-shaped vibration.
Preferably, the number of the fan blades is three, and the three fan blades are all fan-shaped.
Preferably, the side wall of the fan blade is fixedly provided with a cleaning rod positioned below the wafer, the side wall of the cleaning rod is fixedly provided with a cleaning brush body which is in sliding connection with the wafer, the cleaning rod and the fan blade are positioned on the same axis, the cleaning rods are arranged into at least three groups, and the cleaning rods of the three groups are equidistant and are distributed at ninety degrees between the cleaning rods of two adjacent groups.
Preferably, the number of the movable rollers is six, and the six movable rollers are all rollers.
Preferably, the fixed block is movably sleeved with the mounting frame, a locking nut positioned at the end head of the movable roller is fixedly mounted on the inner wall of the mounting frame, a locking bolt used for realizing lifting and falling of the fixed block with the locking nut is movably mounted on the surface of the fixed block, and the top end of the locking rod is movably mounted with the fixed block.
Preferably, the locking rod is a combination of a rectangular rod and a cylindrical rod, and the locking rod is installed on the surface of the fixed block in a clearance mode.
The invention has the following beneficial effects:
1. according to the invention, the vibration convex blocks are arranged on the base and move on the surface of the base through the fan blades, so that the fan blades drive the wafer to rotate and swing up and down after passing through the vibration convex blocks, thereby vibrating and separating reaction products on the surface of the wafer, and meanwhile, the fan blades press the lower limit blocks to fix the wafer, so that the wafer is firmly fixed during working, and finally, the purposes of stable positioning and easy impurity removal are realized.
2. According to the invention, the cleaning rods are arranged on the side walls of the fan blades, and the cleaning brush bodies are intermittently arranged on the side walls of the cleaning rods, so that when the cleaning brush works, the air flow generated by the rotation of the fan blades is directly blown to the surface of the wafer, so that the reaction gas is uniformly arranged on the surface of the wafer, meanwhile, the cleaning brush bodies on the cleaning rods are used for cleaning the reaction products on the surface of the wafer, so that the separation of the reaction products on the wafer is enhanced, and the intermittent arrangement of the cleaning brush bodies can cause intermittent vibration to the surface of the wafer when the cleaning brush bodies clean the wafer, so that the separation of the reaction products is enhanced, and the reaction gas is timely blown out by combining the fan blades to form self-cleaning, so that the purposes of enhancing the falling strength of the reaction products, self-cleaning and uniformly arranging the reaction gas are finally realized.
3. According to the invention, the fixing block is arranged in the mounting frame, so that in the using process, the movement of the fixing block is regulated through the locking bolt, the fan blade is pulled by the locking rod through the lifting of the fixing block, and the fixing of the wafer is ensured, on the other hand, the inner cavity of the mounting frame generates negative pressure when the fixing block moves upwards, so that the wafer is attached to the upper limit block, the fixing strength of the wafer is ensured, and the purpose of enhancing the fixing strength of the wafer is finally achieved.
Drawings
FIG. 1 is a schematic perspective view of the whole structure of the present invention;
FIG. 2 is a schematic view of a base of the structure of the present invention;
FIG. 3 is a schematic view of a structural mount of the present invention;
FIG. 4 is a schematic view of a wafer structure according to the present invention;
FIG. 5 is a schematic view of a movable roller of the present invention;
FIG. 6 is a schematic cross-sectional view of the overall assembly of the structure of the present invention;
FIG. 7 is an enlarged schematic view of the structure of the present invention at A in FIG. 6.
In the figure: 1. a chassis; 2. a processing chamber; 3. a lifting device; 4. a driving rod; 5. a driving motor; 6. an air supply pipe; 7. a locking lever; 8. vibrating the bump; 9. a base; 10. a suction tube; 11. a cleaning lever; 12. a cleaning brush body; 13. a fan blade; 14. a transmission drum wheel; 15. a locking nut; 16. a mounting frame; 17. a fixed block; 18. a locking bolt; 19. a movable roller; 20. an upper limit block; 21. a wafer; 22. and a lower limit block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, 2 and 6, a plasma etcher for semiconductor production includes a cabinet 1, a processing chamber 2 for working is provided at an inner wall of the cabinet 1, an air supply pipe 6 for supplying a reaction gas is provided at one side of a surface of the cabinet 1, a lifting device 3 is fixedly installed at a middle part of the surface of the cabinet 1, the lifting device 3 is configured as a pushing part such as an air bag cylinder, thereby ensuring lifting of a driving motor 5 thereof and lifting a mounting rack 16 when vibration occurs, the driving motor 5 is fixedly installed at a top of the lifting device 3, a driving rod 4 positioned in an inner cavity of the processing chamber 2 is fixedly installed at an output shaft of the driving motor 5, a fixing block 17 is fixedly installed at a bottom end of the driving rod 4, the mounting rack 16 is provided on the fixing block 17, and a movable roller 19 is movably installed in the mounting rack 16, the upper limit block 20 which is jointed with the roll surface of the movable roll 19 is movably sleeved at the bottom of the mounting frame 16, the wafer 21 is movably mounted at the bottom of the upper limit block 20, the lower limit block 22 which is used for fixing the wafer 21 is movably mounted at the bottom of the mounting frame 16, meanwhile, the locking rod 7 is movably mounted at the side wall of the mounting frame 16, the fan blade 13 is movably mounted at the bottom of the side wall of the locking rod 7, the transmission drum wheel 14 which is used for fixing the lower limit block 22 is fixedly mounted at the outer side of the fan blade 13, meanwhile, the base 9 is fixedly mounted at the bottom of the inner wall of the machine case 1 and is positioned in the processing cavity 2, the suction pipe 10 which is positioned at the outer side of the machine case 1 is fixedly mounted at the middle of the base 9, so that reaction products are easily sucked out through the suction pipe 10, the surface of the base 9 is jointed with the outer side of the transmission drum wheel 14, and the driving motor 5 is ensured to rotate in the process, through the rotation of its transmission drum wheel 14, realize the rotation of its wafer 21, guarantee its and reactant gas homogeneous mixing, finally, be provided with the bellied vibration lug 8 of terminal surface shape wedge in the surface of base 9, therefore when the mounting bracket 16 passes through the roll of transmission drum wheel 14 and follows base 9 circumference gyration, after transmission drum wheel 14 passed through vibration lug 8, can realize through vibration lug 8 that mounting bracket 16 wholly produce the vibration effect of cycle "promotion-reset", thereby the reaction product on the wafer 21 of being convenient for breaks away from.
Referring to fig. 3 and 4, in order to further enhance the dropping of the reactant on the wafer 21 and the uniform diffusion of the reactant gas, the number of the fan blades 13 is set to three, and the shapes of the three fan blades 13 are all fan-shaped, so that the fan blades 13 blow the reactant gas to the bottom surface of the wafer 21 uniformly when the driving drum 14 rotates, and on the other hand, the fan blades 13 are fastened by the locking rod 7, so that the driving drum 14 always keeps fixing the lower limit block 22 in the working process, i.e. the stability of fixing the wafer 21 is ensured.
Referring to fig. 3, 4 and 7, in order to further enhance the removal of the reaction products on the surface of the wafer 21, the cleaning rod 11 located below the wafer 21 is fixedly installed on the side wall of the fan blade 13, meanwhile, the fan blade 13 is coaxially connected with the cleaning rod 11, and the cleaning brush body 12 slidably connected with the wafer 21 is fixedly installed on the side wall of the cleaning rod 11, so that the bottom of the wafer 21 is synchronously brushed out through the cleaning brush body 12 in the rotating process, meanwhile, the cleaning rod 11 and the fan blade 13 are located on the same axis, so that the reaction products scraped on the cleaning brush body 12 are removed in the process of blowing the air flow of the fan blade 13 to the cleaning rod 11, the cleaning brush body 12 is always kept clean, meanwhile, the cleaning brush body 12 is always contacted with the bottom surface of the wafer 21, and the middle part of the wafer 21 is also provided with a certain elastic support in the process of receiving vibration, so that the wafer 21 is prevented from being damaged due to the generated vibration, and meanwhile, the cleaning rod 11 is set to be at least three groups, and the two groups of cleaning brush bodies are separated from the surface of the wafer 21 in the equal distance from the cleaning brush body 12 due to the fact that the vibration is easily generated between the cleaning brush bodies and the cleaning brush body 12 is arranged in the process of cleaning rod 12.
Referring to fig. 5, in order to enhance the fixing of the wafer 21 and facilitate the rotation, six movable rollers 19 are provided, and the six movable rollers 19 are all rollers, so that the upper limit block 20 is pressed and then attached to the movable rollers 19, and the upper limit block 20 is easily rotated by the movable rollers 19.
Referring to fig. 4 and 5, in order to enhance the fixing strength of the wafer 21, a fixing block 17 is movably sleeved with a mounting frame 16, a locking nut 15 located at the end of a movable roller 19 is fixedly installed on the inner wall of the mounting frame 16, a locking bolt 18 for adapting to the locking nut 15 to lift and drop the fixing block 17 is movably installed on the surface of the fixing block 17, and the top end of the locking rod 7 is movably installed with the fixing block 17, so that in the process of pulling the locking rod 7 by the fixing block 17 to adjust and lock the transmission drum wheel 14, negative pressure is generated in the mounting frame 16 to enable the wafer 21 to be adsorbed, thereby enhancing the fixing strength of the wafer 21.
Referring to fig. 1 and 3, for the purpose of facilitating the movement of the locking bar 7 to drive the fan blade 13 and enabling the fan blade 13 to be separated from the wafer 21 to be taken out, the locking bar 7 is set to be a combination of a rectangular bar and a cylindrical bar, and the locking bar 7 is installed on the surface of the fixing block 17 in a clearance manner, so that after the fixing block 17 is fixed, the locking bar 7 still has a tendency to move upwards for a certain distance after the transmission drum 14 is pressed, so that the transmission drum 14 is ensured to further fix the lower limit block 22 through self force in the pressing process, meanwhile, the stability of the fan blade 13 is ensured when the locking bar 7 is fixed in a rectangular shape, and when the wafer 21 is taken out and put in, the wafer 13 is easily rotated out through the cylinder on the mounting frame 16 when the cylinder is placed in a rectangular groove for fixing the locking bar 7, so that the wafer 21 is not affected.
The working principle of the invention is as follows:
when the wafer 21 is used, the lower part of the wafer 21 is limited by the lower limit block 22 by placing the wafer 21 under the upper limit block 20, meanwhile, the locking bolt 18 is screwed, so that the fixed block 17 is lifted, and the fan blade 13 is lifted by the fixed block 17 through the locking rod 7, so that the fan blade 13 is driven to push the lower limit block 22 to limit the wafer 21, and meanwhile, negative pressure is synchronously generated in the inner cavity of the mounting frame 16 in the process of upward movement of the fixed block 17, so that the wafer 21 is attached to the upper limit block 20, and the upper limit block 20 is attached to the movable roller 19;
after that, through the reaction gas in the gas supply pipe 6, the lifting device 3 is not operated, so that the fixed block 17 falls under the action of gravity, the transmission drum wheel 14 is pressed on the surface of the base 9, the driving rod 4 is driven to rotate by the driving motor 5, the fixed block 17 moves on the surface of the base 9 through the transmission drum wheel 14, the transmission drum wheel 14 synchronously rotates in the rotating process of the fixed block 17, and at the moment, the transmission drum wheel 14 drives the lower limit block 22, the wafer 21 and the upper limit block 20 to synchronously rotate when the transmission drum wheel 14 rotates, and the upper limit block 20 drives the movable roller 19 to synchronously rotate;
on the other hand, in the process of rotating the transmission drum 14, the reaction product on the wafer 21 is easy to separate through the vibration bump 8 and vibration generated on the wafer 21 in the process of passing through the vibration bump 8, meanwhile, the rotation of the wafer 21 and the fan blade 13 thereof can continuously pour the reaction gas into the bottom of the wafer 21 in the rotating process, so that the bottom of the wafer 21 and the reaction gas are uniformly distributed, the cleaning brush body 12 on the cleaning rod 11 contacts the bottom of the wafer 21 while the fan blade 13 rotates, so that the reaction product on the bottom of the wafer 21 is brushed out, finally, the dropped reaction product is sucked out through the suction pipe 10, and the processing of the wafer 21 is finished according to the operating process.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a semiconductor manufacture uses plasma etching machine, includes quick-witted case (1), its characterized in that: the inner wall of the machine case (1) is provided with a processing cavity (2), one side of the surface of the machine case (1) is provided with an air supply pipe (6), the middle part of the surface of the machine case (1) is fixedly provided with a lifting device (3), the top of the lifting device (3) is fixedly provided with a driving motor (5), the output shaft of the driving motor (5) is fixedly provided with a driving rod (4) positioned in the inner cavity of the processing cavity (2), the bottom end of the driving rod (4) is fixedly provided with a fixed block (17), the fixed block (17) is provided with a mounting frame (16), the mounting frame (16) is internally and movably provided with a movable roller (19), the bottom of the inner wall of the mounting frame (16) is movably sleeved with an upper limit block (20) attached to the roller surface of the movable roller (19), the bottom of the upper limit block (20) is movably provided with a wafer (21), the bottom of the mounting frame (16) is movably provided with a lower limit block (22) for fixing the wafer (21), the side wall of the mounting frame (16) is movably provided with a locking rod (7), the side wall of the locking rod (7) is movably provided with a movable block (13), the side wall of the locking rod (7) is movably provided with a movable block (22) for fixing the blade wheel (13), the machine case is characterized in that a base (9) is fixedly installed at the bottom of the inner wall of the machine case (1) and located in the machining cavity (2), a suction pipe (10) located at the outer side of the machine case (1) is fixedly installed in the middle of the base (9), and a vibration lug (8) with a wedge-shaped bulge end face is arranged on the surface of the base (9).
2. The plasma etcher for semiconductor production as claimed in claim 1, wherein: the number of the fan blades (13) is three, and the three fan blades (13) are fan-shaped.
3. The plasma etcher for semiconductor production as claimed in claim 1, wherein: the cleaning device is characterized in that the side wall of the fan blade (13) is fixedly provided with a cleaning rod (11) positioned below the wafer (21), the side wall of the cleaning rod (11) is fixedly provided with a cleaning brush body (12) which is in sliding connection with the wafer (21), the cleaning rod (11) and the fan blade (13) are positioned on the same axis, the cleaning rod (11) is arranged into at least three groups, and the cleaning rods (11) of the three groups are equidistantly arranged between the cleaning rods (11) and are distributed at ninety degrees between the cleaning rods (11) between two adjacent groups.
4. The plasma etcher for semiconductor production as claimed in claim 1, wherein: six movable rollers (19) are arranged, and the six movable rollers (19) are all rollers.
5. The plasma etcher for semiconductor production as claimed in claim 1, wherein: the movable sleeve joint is movably sleeved between the fixed block (17) and the mounting frame (16), a locking nut (15) positioned at the end head of the movable roller (19) is fixedly mounted on the inner wall of the mounting frame (16), a locking bolt (18) used for realizing lifting and falling of the fixed block (17) through matching with the locking nut (15) is movably mounted on the surface of the fixed block (17), and the top end of the locking rod (7) is movably mounted with the fixed block (17).
6. A plasma etcher for semiconductor production as defined in claim 5, wherein: the locking rod (7) is a combination of a rectangular rod and a cylindrical rod, and the locking rod (7) is installed on the surface of the fixed block (17) in a clearance mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211344656.6A CN115621167B (en) | 2022-10-31 | 2022-10-31 | Plasma etching machine for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211344656.6A CN115621167B (en) | 2022-10-31 | 2022-10-31 | Plasma etching machine for semiconductor production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115621167A CN115621167A (en) | 2023-01-17 |
| CN115621167B true CN115621167B (en) | 2023-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211344656.6A Active CN115621167B (en) | 2022-10-31 | 2022-10-31 | Plasma etching machine for semiconductor production |
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| Country | Link |
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| CN (1) | CN115621167B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004227017A (en) * | 1992-12-30 | 2004-08-12 | Ricoh Co Ltd | Image developer supply device |
| JP2015035471A (en) * | 2013-08-08 | 2015-02-19 | 株式会社荏原製作所 | Substrate cleaning device and substrate processing device |
| CN205731964U (en) * | 2016-07-07 | 2016-11-30 | 宜昌九鼎牧业有限公司 | Clear device at the beginning of the rotary feedstuff of a kind of vibration |
| CN107552248A (en) * | 2017-09-30 | 2018-01-09 | 广州公孙策信息科技有限公司 | A kind of rotary and centrifugal type Chinese medicine equipment for separating liquid from solid |
| CN108666198A (en) * | 2018-05-16 | 2018-10-16 | 汪玉洁 | A kind of semiconductor chip production technology |
| CN108682637A (en) * | 2018-05-21 | 2018-10-19 | 陈涛 | A kind of semiconductor chip plasma etching machine |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258824A (en) * | 2012-06-12 | 2013-12-26 | Seiko Epson Corp | Movement mechanism, robot hand, electronic component transfer device, electronic component inspection device, liquid feeding pump, printing apparatus, projection apparatus, and transport apparatus |
| US20160100564A1 (en) * | 2014-10-14 | 2016-04-14 | Reinaldo Perez | Self-sustained rodless fishing apparatus and alert system |
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2022
- 2022-10-31 CN CN202211344656.6A patent/CN115621167B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004227017A (en) * | 1992-12-30 | 2004-08-12 | Ricoh Co Ltd | Image developer supply device |
| JP2015035471A (en) * | 2013-08-08 | 2015-02-19 | 株式会社荏原製作所 | Substrate cleaning device and substrate processing device |
| CN205731964U (en) * | 2016-07-07 | 2016-11-30 | 宜昌九鼎牧业有限公司 | Clear device at the beginning of the rotary feedstuff of a kind of vibration |
| CN107552248A (en) * | 2017-09-30 | 2018-01-09 | 广州公孙策信息科技有限公司 | A kind of rotary and centrifugal type Chinese medicine equipment for separating liquid from solid |
| CN108666198A (en) * | 2018-05-16 | 2018-10-16 | 汪玉洁 | A kind of semiconductor chip production technology |
| CN108682637A (en) * | 2018-05-21 | 2018-10-19 | 陈涛 | A kind of semiconductor chip plasma etching machine |
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| CN115621167A (en) | 2023-01-17 |
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