CN115598509A - PCBA board welding spot test structure and test method thereof - Google Patents
PCBA board welding spot test structure and test method thereof Download PDFInfo
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- CN115598509A CN115598509A CN202211350475.4A CN202211350475A CN115598509A CN 115598509 A CN115598509 A CN 115598509A CN 202211350475 A CN202211350475 A CN 202211350475A CN 115598509 A CN115598509 A CN 115598509A
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- 238000012360 testing method Methods 0.000 title claims abstract description 62
- 238000003466 welding Methods 0.000 title claims abstract description 27
- 238000010998 test method Methods 0.000 title description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title 1
- 238000003825 pressing Methods 0.000 claims description 35
- 239000000523 sample Substances 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000002372 labelling Methods 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 10
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention relates to the technical field of testing devices, in particular to a PCBA (printed Circuit Board Assembly) plate welding spot testing structure and a testing method thereof.
Description
Technical Field
The invention relates to the technical field of testing devices, in particular to a PCBA board welding spot testing structure and a testing method thereof.
Background
After production to the PCBA board, need pass through the solder joint test to guarantee the product percent of pass, use probe and PCBA board solder joint contact usually, whether the test solder joint is qualified, but need artifical manual use anchor clamps fixed when installation PCBA board at present, very influence work efficiency.
In prior art, through placing two PCBA boards that await measuring respectively and placing the bench, after one of them PCBA board that awaits measuring finishes testing, can drive the support through rotary device and rotate 180, the support drives two and places the platform and rotate 180 for two place a switching position, can test another PCBA board that awaits measuring this moment, the staff can take off the PCBA board after the test simultaneously, and place a PCBA board that awaits measuring again, so reciprocal, can improve efficiency of software testing.
However, in the prior art, only two PCBA boards can be installed on the operating table for testing, and if a large number of PCBA boards are tested, a worker needs to continuously take the PCBA boards from the placing table for replacement, which consumes a large amount of time for the worker.
Disclosure of Invention
The invention aims to provide a PCBA (printed circuit board assembly) board welding spot testing structure and a testing method thereof, and solves the problems that in the prior art, only two PCBAs can be installed on an operation table for testing, and if a large number of PCBAs are tested, workers need to continuously take the PCBAs from a placing table for replacement, and a large amount of time is consumed by the workers.
In order to achieve the aim, the invention provides a PCBA board welding spot test structure, which comprises a bracket and a test component, wherein the bracket is provided with a through hole;
the testing component comprises a belt conveyor, two pressing units, a first air cylinder, a supporting block, a plurality of probes, an infrared scanner and a PLC (programmable logic controller), wherein the belt conveyor is arranged below the support, the two pressing units are fixedly connected with the support and sequentially located on the inner top wall of the support, a plurality of PCBA (printed circuit board assembly) boards are arranged on the belt conveyor, the first air cylinder is arranged on the inner top wall of the support, the supporting block is fixedly connected with the output end of the first air cylinder, the probes are sequentially arranged below the supporting block, and the infrared scanner and the PLC are sequentially fixedly connected with the belt conveyor and sequentially located above the belt conveyor.
The testing component further comprises a plurality of limiting blocks, the limiting blocks are fixedly connected with the belt conveyor and sequentially distributed on the belt conveyor, and each PCBA is distributed between the corresponding two limiting blocks.
The pressing unit comprises a second cylinder, a pressing block and a limiting rod, each limiting block is provided with a limiting hole, the second cylinder is fixedly connected with the support and is located on the inner top wall of the support, the pressing block is fixedly connected with the output end of the second cylinder, the pressing block and the PCBA plate are mutually abutted, the limiting rod is fixedly connected with the pressing block and is located below the pressing block, and the limiting rod is mutually matched with the limiting holes.
Wherein, PCBA board solder joint test structure still includes the mark subassembly, the mark subassembly set up in on the band conveyer.
Wherein, the mark subassembly includes third cylinder, bracing piece, slurcam, backup pad, mobile unit and pastes the mark device, the third cylinder set up in one side of band conveyer, the both ends of bracing piece respectively with the below of third cylinder with one side fixed connection of band conveyer, the slurcam with the output fixed connection of third cylinder, the slurcam with PCBA looks mutual adaptation, the backup pad with band conveyer fixed connection, and be located band conveyer keeps away from one side of third cylinder, the mobile unit set up in the backup pad, paste the mark device set up in on the mobile unit.
The moving unit comprises a sliding block and a fourth cylinder, the supporting plate is provided with a sliding groove, the sliding block is in sliding connection with the sliding groove, the fourth cylinder is fixedly connected with the supporting plate and located above the supporting plate, the labeling device is fixedly connected with the sliding block and located above the sliding block, and an output end of the fourth cylinder is fixedly connected with the labeling device and located on one side, away from the PCBA, of the labeling device.
The invention also provides a PCBA board welding spot test method, which is applied to the PCBA board welding spot test structure and comprises the following steps:
placing a plurality of the PCBA boards on the belt conveyor;
the PCBA is scanned by the infrared scanner, and a pressing unit is started by the PLC to tightly press the PCBA;
the first air cylinder drives the supporting block and the probes to move downwards;
the probe tests whether the welding spots of the PCBA board have insufficient solder and false solder;
and when the insufficient soldering and the false soldering are detected, the labeling device is started to label and mark the PCBA, and then the PCBA is taken out.
According to the PCBA board welding spot testing structure and the testing method thereof, firstly, a plurality of PCBA boards are placed on the belt conveyor to be transported, when the PCBA boards pass through the infrared scanner and are detected by the infrared scanner, the belt conveyor is stopped under the action of the PLC, the pressing unit is started to press the PCBA boards, then the first air cylinder drives the supporting plate and the plurality of probes to move downwards, the probes are contacted with and detected by welding spots of the PCBA boards, fixing is cancelled after the testing is completed, the belt conveyor is transported continuously, and therefore repeated operation is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is an overall configuration diagram of a first embodiment of the present invention.
Fig. 2 is an overall sectional view of the first embodiment of the present invention.
Fig. 3 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 2 of the present invention.
Fig. 4 is an overall configuration diagram of the second embodiment of the present invention.
Fig. 5 is an overall sectional view of a second embodiment of the present invention.
Fig. 6 is an overall configuration diagram of the second embodiment of the present invention.
Fig. 7 is an overall sectional view of a second embodiment of the present invention.
Fig. 8 is a sectional view taken along line B-B of fig. 7 of the present invention.
Fig. 9 is a cross-sectional view taken along line C-C of fig. 7 of the present invention.
FIG. 10 is a flow chart of the steps of the method for testing the solder joints of the PCBA board of the present invention.
101-bracket, 102-belt conveyer, 103-first cylinder, 104-supporting block, 105-probe, 106-infrared scanner, 107-PLC controller, 108-PCBA board, 109-limiting block, 110-second cylinder, 111-pressing block, 112-limiting rod, 113-limiting hole, 201-third cylinder, 202-supporting rod, 203-pushing plate, 204-supporting plate, 205-labeling device, 206-sliding block, 207-fourth cylinder, 208-sliding groove, 301-fixing groove, 302-motor, 303-threaded rod, 304-connecting block, 305-threaded hole.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, and the embodiments described below with reference to the accompanying drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention.
The first embodiment:
referring to fig. 1 to 3, fig. 1 isbase:Sub>A schematic overall structure diagram ofbase:Sub>A first embodiment of the present invention, fig. 2 isbase:Sub>A cross-sectional view of the first embodiment of the present invention, and fig. 3 isbase:Sub>A cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 2. The invention provides a PCBA board welding spot test structure, which comprises a bracket 101 and a test component, wherein the test component comprises a belt conveyer 102, two pressing units, a first air cylinder 103, a supporting block 104, a plurality of probes 105, an infrared scanner 106, a PLC 107 and a plurality of limit blocks 109, the belt conveyer 102 is provided with a plurality of PCBA boards 108, the pressing units comprise a second air cylinder 110, a pressing block 111 and a limit rod 112, each limit block 109 is provided with a limit hole 113,
for the present embodiment, the bracket 101 supports the PCBA board solder joint test structure.
The belt conveyor 102 is arranged below the support 101, the two pressing units are fixedly connected with the support 101 and sequentially located on an inner top wall of the support 101, the belt conveyor 102 is provided with a plurality of PCBA boards 108, the first cylinder 103 is arranged on the inner top wall of the support 101, the supporting block 104 is fixedly connected with an output end of the first cylinder 103, the probes 105 are sequentially arranged below the supporting block 104, and the infrared scanner 106 and the PLC 107 are fixedly connected with the belt conveyor 102 and sequentially located above the belt conveyor 102. The belt conveyor 102 drives the PCBA boards 108 to move, the pressing unit presses the PCBA boards 108 needing solder joint testing, the first air cylinder 103 drives the supporting block 104 and the probes 105 to move downwards, the supporting block 104 supports the probes 105, the probes 105 detect the solder joints, the infrared scanner 106 scans the PCBA boards 108 passing through, the PLC controller 107 can start the pressing unit to press after receiving scanning information of the infrared scanner 106, the belt conveyor 102 is closed at the same time, the PLC controller 107 is in pICS7-200SMART 20 type, and the infrared scanner 106 is in REVOPOINTSPOP 2 type.
Secondly, a plurality of the limiting blocks 109 are all fixedly connected with the belt conveyor 102 and are sequentially distributed on the belt conveyor 102, and each PCBA board 108 is respectively distributed between two corresponding limiting blocks 109. The PCBA plate 108 is limited by the limiting block 109.
Meanwhile, each of the limiting blocks 109 has a limiting hole 113, the second cylinder 110 is fixedly connected with the bracket 101 and is located on the inner top wall of the bracket 101, the pressing block 111 is fixedly connected with the output end of the second cylinder 110, the pressing block 111 and the upper side of the PCBA board 108 are abutted against each other, the limiting rod 112 is fixedly connected with the pressing block 111 and is located below the pressing block 111, and the limiting rod 112 and the limiting hole 113 are adapted to each other. The second cylinder 110 drives the pressing block 111 to move downwards to press the PCBA board 108, and meanwhile, the limiting rod 112 enters the limiting hole 113 to limit and prevent shaking.
When the PCBA board welding spot testing structure of the embodiment is used, firstly, a plurality of PCBA boards 108 are placed on the belt conveyor 102 to be transported, when the PCBA boards 108 pass through the infrared scanner 106 and are detected by the infrared scanner 106, the belt conveyor 102 is stopped under the action of the PLC 107, meanwhile, the second air cylinder 110 is started to drive the pressing block 111 to press downwards, the limiting rod 112 enters the limiting hole 113, the limiting block 109 compresses the PCBA boards 108 to complete limiting and fixing, then the first air cylinder 103 drives the supporting plate 204 and the plurality of probes 105 to move downwards, the probes 105 are in contact with welding spots of the PCBA boards 108 and detect, after the test is completed, the first air cylinder 103 and the second air cylinder 110 contract, the belt conveyor 102 continues to be started to transport, and therefore the automatic welding spot testing operation can be performed on the PCBA boards 108 through the structural arrangement, multiple times of welding spot testing can be continuously performed, the welding spot testing efficiency is improved, workers do not need to continuously take the PCBA boards 108, and the working hours are saved.
Second embodiment:
on the basis of the first embodiment, please refer to fig. 4 and fig. 5, wherein fig. 4 is a structural schematic diagram of the second embodiment of the present invention, and fig. 5 is a sectional view of the second embodiment of the present invention. The invention provides a PCBA (printed circuit board assembly) welding spot testing structure, which further comprises a marking assembly, wherein the marking assembly comprises a third air cylinder 201, a supporting rod 202, a pushing plate 203, a supporting plate 204, a moving unit and a labeling device 205, the moving unit comprises a sliding block 206 and a fourth air cylinder 207, and the supporting plate 204 is provided with a sliding groove 208.
For this embodiment, the marking assembly is disposed on the belt conveyor 102. The marking component marks the PCBA board 108 that is detected to have cold and false solder joints.
The third cylinder 201 is arranged on one side of the belt conveyor 102, two ends of the supporting rod 202 are respectively fixedly connected with the lower side of the third cylinder 201 and one side of the belt conveyor 102, the pushing plate 203 is fixedly connected with the output end of the third cylinder 201, the pushing plate 203 is matched with the PCBA plate 108, the supporting plate 204 is fixedly connected with the belt conveyor 102 and is located on one side of the belt conveyor 102 far away from the third cylinder 201, the moving unit is arranged on the supporting plate 204, and the labeling device 205 is arranged on the moving unit. The third cylinder 201 drives the push plate 203 to support the PCBA board 108, the support rod 202 supports the third cylinder 201, the moving unit drives the labeling device 205 to move, and the labeling device 205 labels the PCBA board 108.
Next, the supporting plate 204 has a sliding groove 208, the sliding block 206 is slidably connected to the sliding groove 208, the fourth air cylinder 207 is fixedly connected to the supporting plate 204 and located above the supporting plate 204, the labeling device 205 is fixedly connected to the sliding block 206 and located above the sliding block 206, and an output end of the fourth air cylinder 207 is fixedly connected to the labeling device 205 and located on a side of the labeling device 205 away from the PCBA board 108. The fourth cylinder 207 drives the labeling device 205 to slide under the action of the sliding block 206 and the sliding groove 208.
When using a PCBA board solder joint test structure of this embodiment, when detecting to have rosin joint and false welding, third cylinder 201 stretches out, drives promotion board 203 supports and holds PCBA board 108's one end prevents to paste the mark the PCBA board 108 quilt paste the output top of mark device 205 and move, lead to pasting the mark failure, then fourth cylinder 207 stretches out, drives mark device 205 removes, slider 206 is in slide in spout 208, finally paste mark device 205 with PCBA board 108 is kept away from the one end contact of promotion board 203 and pastes the mark, through the setting of above-mentioned structure, to detecting out rosin joint or false welding PCBA board 108 pastes the mark, and then the staff of being convenient for distinguishes, carries out follow-up classification.
The third embodiment:
PCBA board solder joint test structure still includes four removal subassemblies, every remove the subassembly all set up in band conveyer 102 with on the support 101. The movable assembly comprises a fixing groove 301, a motor 302, a threaded rod 303 and a connecting block 304, the fixing groove 301 is fixedly connected with the support 101 and is located on the inner side wall of the support 101, the motor 302 is fixedly connected with the fixing groove 301 and is located above the fixing groove 301, one end of the threaded rod 303 is fixedly connected with the output end of the motor 302, the other end of the threaded rod 303 penetrates through the fixing groove 301 and is connected with the inner bottom wall of the fixing groove 301 in a rotating mode, the connecting block 304 is provided with a threaded hole 305, the threaded rod 303 is matched with the threaded hole 305 in a mutually matched mode, and the connecting block 304 is far away from one end of the fixing groove 301 and the belt conveyor 102 in a fixed mode.
Referring to fig. 6 to 9 on the basis of the second embodiment, fig. 6 is a schematic overall structure diagram of the second embodiment of the present invention, fig. 7 is a sectional view of the second embodiment of the present invention, fig. 8 is a sectional view taken along line B-B of fig. 7 of the present invention, and fig. 9 is a sectional view taken along line C-C of fig. 7 of the present invention. The invention provides a PCBA board welding spot test structure, which further comprises four moving components, wherein each moving component comprises a fixing groove 301, a motor 302, a threaded rod 303 and a connecting block 304, and the connecting block 304 is provided with a threaded hole 305.
For the present embodiment, each moving assembly is disposed on the belt conveyor 102 and the support 101. The moving assembly may height adjust the belt conveyor 102.
Wherein, fixed slot 301 with support 101 fixed connection to be located the inside wall of support 101, motor 302 with fixed slot 301 fixed connection to be located the top of fixed slot 301, the one end of threaded rod 303 with the output fixed connection of motor 302, the other end of threaded rod 303 runs through fixed slot 301, and with the interior diapire of fixed slot 301 rotates to be connected, connecting block 304 has screw hole 305, threaded rod 303 with screw hole 305 mutual adaptation, the one end that fixing slot 301 was kept away from to connecting block 304 with band conveyer 102 fixed connection. The fixing groove 301 supports the whole moving assembly, the motor 302 drives the threaded rod 303 to rotate, the threaded rod is matched with the threaded hole 305, and the connecting block 304 moves up and down to further drive the belt conveyor 102 to adjust the height.
When using a PCBA board solder joint test structure of this embodiment, when needs are adjusted during band conveyer 102 is high, at first start motor 302 drives threaded rod 303 rotates, with screw hole 305 cooperation makes connecting block 304 removes, and then drives band conveyer 102 height-adjusting, through the setting of above-mentioned structure, can be right band conveyer 102 carries out the altitude mixture control, and then satisfies more operational environment, has increased practicality and reliability, and it is more convenient right PCBA board 108 carries out the solder joint test.
Referring to fig. 10, the present invention further provides a method for testing a solder joint of a PCBA board, which is applied to the above-mentioned structure for testing a solder joint of a PCBA board, and includes the following steps:
s1: placing a plurality of the PCBA boards 108 on the belt conveyor 102;
s2: the PCBA board 108 is scanned by the infrared scanner 106, and a pressing unit is started to press the PCBA board 108 through the PLC 107;
s3: the first air cylinder 103 drives the supporting block 104 and the probes 105 to move downwards;
s4: the probe 105 tests whether the welding points of the PCBA board 108 have cold joint and false joint;
s5: when the insufficient soldering and the false soldering are detected, the labeling device 205 is started to label and mark the PCBA board 108, and then the PCBA board 108 is taken out.
The PCBA boards 108 are placed on the belt conveyor 102, the PCBA boards 108 are scanned by the infrared scanner 106, when the PCBA boards 108 pass through, the PLC 107 controls the second air cylinder 110 to extend out to drive the pressing block 111 and the limiting rod 112 to move downwards, the limiting rod 112 firstly enters the limiting hole 113 to limit a moving path and increase moving stability, then the pressing board moves downwards to contact with the upper portion of the PCBA boards 108 to press the PCBA boards 108, the first air cylinder 103 is started to drive the supporting block 104 and the probes 105 to move downwards, the probes 105 test whether the welding spots of the PCBA boards 108 have insufficient soldering and false soldering, and if the insufficient soldering and false soldering are detected, the labeling device 205 is started to label and mark the PCBA boards 108, and then the PCBA boards 108 are taken out, so that repeated testing is achieved.
While the above disclosure describes one or more preferred embodiments of the present invention, it is not intended to limit the scope of the claims to such embodiments, and one skilled in the art will understand that all or a portion of the processes performed in the above embodiments may be practiced without departing from the spirit and scope of the claims.
Claims (7)
1. A PCBA board welding spot test structure comprises a bracket and is characterized in that,
the device also comprises a test component;
the testing component comprises a belt conveyor, two pressing units, a first air cylinder, a supporting block, a plurality of probes, an infrared scanner and a PLC (programmable logic controller), wherein the belt conveyor is arranged below the support, the two pressing units are fixedly connected with the support and sequentially located on the inner top wall of the support, a plurality of PCBA (printed Circuit Board Assembly) boards are arranged on the belt conveyor, the first air cylinder is arranged on the inner top wall of the support, the supporting block is fixedly connected with the output end of the first air cylinder, the probes are sequentially arranged below the supporting block, and the infrared scanner and the PLC are fixedly connected with the belt conveyor and sequentially located above the belt conveyor.
2. The PCBA pad test structure as recited in claim 1,
the testing component further comprises a plurality of limiting blocks, the limiting blocks are fixedly connected with the belt conveyor and are sequentially distributed on the belt conveyor, and each PCBA board is respectively distributed between the corresponding two limiting blocks.
3. The PCBA board solder joint test structure as recited in claim 2,
the pressing unit comprises a second cylinder, a pressing block and a limiting rod, each limiting block is provided with a limiting hole, the second cylinder is fixedly connected with the support and is located on the inner top wall of the support, the pressing block is fixedly connected with the output end of the second cylinder, the pressing block is abutted against the upper portion of the PCBA plate, the limiting rod is fixedly connected with the pressing block and is located below the pressing block, and the limiting rod is matched with the limiting holes.
4. The PCBA pad test structure as recited in claim 3,
PCBA board solder joint test structure still includes the mark subassembly, the mark subassembly set up in on the belt conveyor.
5. The PCBA pad test structure as recited in claim 4,
the mark subassembly includes third cylinder, bracing piece, catch plate, backup pad, mobile unit and pastes the mark device, the third cylinder set up in band conveyer's one side, the both ends of bracing piece respectively with the below of third cylinder with band conveyer's one side fixed connection, the catch plate with the output fixed connection of third cylinder, the catch plate with PCBA looks mutual adaptation, the backup pad with band conveyer fixed connection, and be located band conveyer keeps away from one side of third cylinder, the mobile unit set up in the backup pad, paste the mark device set up in on the mobile unit.
6. The PCBA pad solder joint test structure as in claim 5,
the mobile unit includes slider and fourth cylinder, the backup pad has the spout, the slider with spout sliding connection, the fourth cylinder with backup pad fixed connection, and be located the top of backup pad, paste the mark device with slider fixed connection, and be located the top of slider, the output of fourth cylinder with paste mark device fixed connection, and be located paste the mark device and keep away from one side of PCBA board.
7. A PCBA (printed circuit board assembly) welding spot testing method is applied to the PCBA welding spot testing structure as recited in claim 6, and is characterized by comprising the following steps:
placing a plurality of the PCBA boards on the belt conveyor;
the PCBA is scanned by the infrared scanner, and a pressing unit is started by the PLC to tightly press the PCBA;
the first cylinder drives the supporting block and the probes to move downwards;
the probe tests whether the welding spots of the PCBA board have insufficient solder and false solder;
and when the insufficient soldering and the false soldering are detected, the labeling device is started to label and mark the PCBA, and then the PCBA is taken out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211350475.4A CN115598509A (en) | 2022-10-31 | 2022-10-31 | PCBA board welding spot test structure and test method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211350475.4A CN115598509A (en) | 2022-10-31 | 2022-10-31 | PCBA board welding spot test structure and test method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116298813A (en) * | 2023-04-04 | 2023-06-23 | 南京蓝联盟科技有限公司 | PCB board scanning testing arrangement |
| CN117890772A (en) * | 2024-03-18 | 2024-04-16 | 盐城市嘉鸿微电子有限公司 | Adjustable integrated circuit test fixture |
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| CN117890772A (en) * | 2024-03-18 | 2024-04-16 | 盐城市嘉鸿微电子有限公司 | Adjustable integrated circuit test fixture |
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Application publication date: 20230113 |