CN115581019A

CN115581019A - Extremely low temperature high density microwave low pass filter cluster subassembly

Info

Publication number: CN115581019A
Application number: CN202211387409.4A
Authority: CN
Inventors: 刘银银
Original assignee: Nanjing Hmc System Co ltd
Current assignee: Nanjing Hmc System Co ltd
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-01-06

Abstract

The invention discloses a very low temperature high density microwave low pass filter bundling assembly, which comprises a bundling main body, wherein the upper end of the bundling main body is an input end, the lower end of the bundling main body is an output end, a plurality of penetrating bundling cavities are arranged on the bundling main body, a low pass filter is arranged in the bundling cavities, the low pass filter comprises a filter shell, a PCB (printed circuit board), a first connector and a second connector, the PCB is arranged in the filter shell, the first connector and the second connector are positioned at two ends of the filter shell, and a separation strip is arranged at the lower end of the bundling main body and used for fixing the bundling main body and the low pass filter. The microwave low-pass filter arranges a plurality of microwave low-pass filters together through the bundling assembly, reduces the size and the use area of a device, is easy to process and assemble, realizes the purposes of small-sized high-density formation and stable and reliable performance of the device, and can work in a limit low-temperature non-magnetic environment by adopting a copper material.

Description

Extremely low temperature high density microwave low pass filter cluster subassembly

Technical Field

The invention belongs to the technical field of microwave low-pass filters, and particularly relates to a very-low-temperature high-density microwave low-pass filter cluster assembly.

Background

Quantum computing and its applications are the hot spots of international research. In quantum computing devices, microwave components are required for dilution refrigerators, where microwave low pass filters are essential components. However, with the development of qubits, more microwave components need to be applied to the existing dilution refrigerator, which increases a certain difficulty in allocating the internal space of the dilution refrigerator. The cluster component has the advantages of high integration, small volume, strong heat dissipation capability and the like, and is widely introduced into a quantum application high-density integration scheme.

Compared with the existing microwave low-pass filter, the microwave low-pass filter realizes small-size high-density formation, has a more compact structure, small device volume and small use area, is easy to process and assemble, and can still maintain excellent performance in a low-temperature limit nonmagnetic environment.

Disclosure of Invention

The invention aims to provide a very-low-temperature high-density microwave low-pass filter cluster assembly to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a very low temperature high density microwave low pass filter cluster component comprises

The cluster comprises a cluster main body, a plurality of groups of connecting rods and a plurality of groups of connecting rods, wherein the upper end of the cluster main body is an input end, the lower end of the cluster main body is an output end, and a plurality of penetrating cluster cavities are formed in the cluster main body;

the low-pass filter is arranged in the bundling cavity and comprises a filter shell, a PCB (printed circuit board), a first connector and a second connector, wherein the PCB is arranged in the filter shell, and the first connector and the second connector are positioned at two ends of the filter shell;

and the spacing bars are arranged at the lower end of the bundling main body and used for fixing the bundling main body and the low-pass filter.

Preferably, both ends of the bundling main body are provided with connecting lugs, and the connecting lugs are provided with connecting holes.

In any one of the above schemes, preferably, a groove is arranged on the division bar, the groove is matched with the low-pass filter, and screws are arranged at two ends of the division bar and connected with the connecting holes.

In any one of the above aspects, preferably, the bundle main body is made of a copper material.

In any of the above aspects, preferably, the filter housing is made of a copper material.

In any of the above aspects, preferably, the first connector and the second connector are made of a copper material.

In any of the above solutions, preferably, the inner conductors of the first connector and the second connector are soldered to the PCB.

In any of the above solutions, preferably, one of the connectors at the input end is an SSMP connector.

In any of the above solutions, preferably, the two connectors located at the output end are SSMP connectors.

The invention has the technical effects and advantages that: the extremely-low-temperature high-density microwave low-pass filter cluster component realizes high-density formation, can still maintain good performance in an extremely-low-temperature environment, has simple parts, is easy to assemble and mass production, has return loss below-20 dB in a 300K environment, and has out-of-band rejection below-30 dB in a 1.1-3.5GHz environment; in the extreme low-temperature 77K environment, the return loss can reach below-20 dB, and the out-of-band inhibition can reach below-30 dB at 1.1-3.5GHz, so that the index is still good.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a top view of the bundling body according to the present invention;

FIG. 3 is a schematic structural view of a division bar according to the present invention;

FIG. 4 is a schematic structural view of the screw of the present invention;

FIG. 5 is a schematic diagram of the structure of the low-pass filter according to the present invention;

FIG. 6 shows the test results of the present invention under the environment of 300K;

FIG. 7 shows the test results of the present invention under the environment of ultra-low temperature 77K with liquid nitrogen.

In the figure: 1. a bundling main body; 2. a bundling cavity; 3. connecting holes; 4. a low-pass filter; 5. a screw; 6. a parting strip; 7. a groove; 8. a first connector; 9. a filter housing; 10. and a second connector.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

The invention provides a very low temperature high density microwave low pass filter cluster assembly as shown in figures 1-5, comprising

The bundling device comprises a bundling main body 1, wherein the bundling main body 1 is made of copper materials, the upper end of the bundling main body is an input end, the lower end of the bundling main body is an output end, a plurality of penetrating bundling cavities 2 are arranged on the bundling main body 1, connecting lugs are arranged at two ends of the bundling main body 1, and connecting holes 3 are arranged on the connecting lugs;

the low-pass filter 4 is arranged in the bundling cavity 2, the low-pass filter 4 comprises a filter shell 9, a PCB (printed circuit board), a first connector 8 and a second connector 10, the first connector 8 and the second connector 10 are made of copper materials, the PCB is arranged inside the filter shell 9, inner conductors of the first connector 8 and the second connector 10 are welded with the PCB, the first connector 8 and the second connector 10 are located at two ends of the filter shell 9, the first connector 8 is located at an input end, the second connector 10 is located at an output end, the first connector 8 is an SSMP connector, the second connector 10 is an SSMP connector, and the filter shell 9 is made of copper materials;

a spacing strip 6 arranged at the lower end of the bundling main body 1 for fixing the bundling main body 1 and the low-pass filter 4, a groove 7 is arranged on the spacing strip 6, the groove 7 is matched with the low-pass filter 4, two ends of the spacing strip 6 are provided with screws 5, the screws 5 are connected with the connecting holes 3,

the invention adopts the copper high-density microwave low-pass filter cluster component, so that the microwave low-pass filter still keeps good performance in the extreme low-temperature environment, and the low-temperature index of the whole device is ensured. The cluster assembly is adopted to reduce the volume of the device, reduce the occupied area and facilitate the processing and installation. The structural design of the microwave low-pass filter cluster component ensures that the whole structure of the microwave low-pass filter is very firm and reliable; and the parts forming the microwave low-pass filter are simple, and are easy to assemble, debug and produce in large batch.

By comparing fig. 6 and fig. 7, the device still has excellent performance indexes under low temperature environment. The test results for the SSMP-630M low pass filter bundle component are shown in fig. 6 and 7, with the dashed line at 630MHz. In FIG. 6, the return loss is below-20 dB in the 300K environment, and the out-of-band rejection is below-30 dB in the 1.1-3.5GHz environment; in FIG. 7, the return loss can reach below-20 dB in the extreme low temperature 77K environment, the out-of-band rejection can reach below-30 dB in the 1.1-3.5GHz environment, and all indexes are still good.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. The utility model provides a microwave low pass filter tied in a bundle subassembly of utmost point low temperature high density which characterized in that: comprises that

The cluster tool comprises a cluster main body (1), wherein the upper end of the cluster main body is an input end, the lower end of the cluster main body is an output end, and a plurality of penetrating cluster cavities (2) are arranged on the cluster main body (1);

the low-pass filter (4) is arranged in the bundling cavity (2), the low-pass filter (4) comprises a filter shell (9), a PCB (printed circuit board), a first connector (8) and a second connector (10), the PCB is arranged inside the filter shell (9), and the first connector (8) and the second connector (10) are located at two ends of the filter shell (9);

and the division bar (6) is arranged at the lower end of the bundling main body (1) and is used for fixing the bundling main body (1) and the low-pass filter (4).

2. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the two ends of the bundling main body (1) are provided with connecting lugs, and connecting holes (3) are formed in the connecting lugs.

3. The very low temperature high density microwave low pass filter cluster assembly of claim 2, wherein: be provided with recess (7) on parting bead (6), recess (7) and low pass filter (4) match, the both ends of parting bead (6) are provided with screw (5), screw (5) are connected with connecting hole (3).

4. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the bundling main body (1) is made of copper materials.

5. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the filter housing (9) is made of a copper material.

6. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the first connector (8) and the second connector (10) are made of copper materials.

7. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: and the inner conductors of the first connector (8) and the second connector (10) are welded with the PCB.

8. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the first connector (8) is positioned at the input end and is an SSMP connector.

9. The very low temperature high density microwave low pass filter cluster assembly of claim 1, wherein: the second connector (10) is positioned at the output end and is an SSMP joint.