CN218997037U

CN218997037U - Ultra-low temperature high density microwave infrared filter bundling assembly

Info

Publication number: CN218997037U
Application number: CN202222957002.2U
Authority: CN
Inventors: 刘银银
Original assignee: Nanjing Hmc System Co ltd
Current assignee: Nanjing Hmc System Co ltd
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-05-09
Anticipated expiration: 2032-11-07

Abstract

The utility model discloses an ultra-low temperature high-density microwave infrared filter bundling assembly which comprises a carrier plate, a bottom plate and an infrared filter, wherein a placing cavity is formed in the carrier plate, the infrared filter is placed in the placing cavity, the bottom of the infrared filter extends out of the placing cavity, the bottom plate is connected with the carrier plate, a groove is formed in the bottom plate and matched with the infrared filter, the infrared filter comprises a filter shell, an inner conductor arranged in the filter shell, a first connector and a second connector which are arranged at two ends of the filter shell, two ends of the inner conductor are fixed with the filter shell through insulating mediums, and an infrared absorbing material is arranged in the filter shell. The infrared filter adopts the high-matching infrared wave absorbing material as the main body of the infrared filter, and a plurality of infrared filters are arranged together by utilizing the bundling component, so that high-density formation is realized, the production and the assembly are easy, the stability performance can be kept under the extreme low-temperature magnetic environment-free environment, and the application requirements of the related systems at present can be well met.

Description

Ultra-low temperature high density microwave infrared filter bundling assembly

Technical Field

The utility model belongs to the technical field of microwave infrared filters, and particularly relates to an extremely low-temperature high-density microwave infrared filter bundling assembly.

Background

Microwave components are required in the process of researching the qubit by using a dilution refrigerator. In the experimental process, infrared light has great influence on the performance of components, so the microwave infrared filter is a necessary microwave component in the refrigerator. However, with the development of qubits, more microwave components need to be put into the dilution refrigerator, so that the internal space of the dilution refrigerator is extremely tight.

Compared with the existing microwave infrared filter, the utility model has the advantages of high integration, high heat dissipation, no magnetism and the like of the cluster component, can reduce the volume and the use area of the device, is easy to process and install, and can still maintain good performance under extremely low temperature magnetic environment.

Disclosure of Invention

The utility model aims to provide an extremely low-temperature high-density microwave infrared filter bundling assembly so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an ultra-low temperature high density microwave infrared filter bundling assembly comprises

The device comprises a carrier plate, a bottom plate and an infrared filter;

the support plate is provided with a placing cavity, the infrared filter is placed in the placing cavity, the bottom of the infrared filter extends out of the placing cavity, the bottom plate is connected with the support plate, the bottom plate is provided with a groove, and the groove is matched with the infrared filter;

the infrared filter comprises a filter shell, an inner conductor arranged in the filter shell, and a first connector and a second connector arranged at two ends of the filter shell, wherein the two ends of the inner conductor are fixed with the filter shell through insulating mediums, and an infrared absorption material is arranged in the filter shell.

Preferably, the first screw is arranged on the carrier plate.

In any of the above schemes, preferably, the bottom plate is provided with a second screw.

In any of the above schemes, the screw fixing device preferably further comprises a support column, threaded holes are formed in two ends of the support column, and the first screw and the second screw are connected with the threaded holes.

In any of the above schemes, preferably, the filter further comprises a cover plate and a baffle plate, wherein the cover plate comprises an upper cover plate and a lower cover plate, the upper cover plate is connected with the lower cover plate through a buckle, the cover plate is arranged on the outer surface of the infrared filter, and the baffle plate is arranged on the top end of the carrier plate.

In any of the above schemes, preferably, the cover plate, the baffle, the support, the carrier plate, the bottom plate and the filter housing are all made of copper materials.

In any of the above embodiments, preferably, the insulating medium material is polytetrafluoroethylene.

In any of the above embodiments, it is preferable that the infrared absorbing material is an infrared glue.

In any of the above embodiments, preferably, the inner conductor material is beryllium bronze.

The utility model has the technical effects and advantages that: the utility model realizes high dense formation, can still keep good performance in extremely low temperature environment, and in addition, the whole device has simple parts, is easy to assemble, is easy to produce in a large scale, and has attenuation value of below-60 dB and return loss of below-10 dB at 6GHz in 300K environment; in the environment of 77K at the extreme low temperature, the attenuation value at 6GHz is lower than-45 dB, and the return loss is lower than-10 dB, so that the index is still relatively good.

Drawings

FIG. 1 is a top view of the present utility model;

FIG. 2 is a schematic diagram of the structure of the present utility model;

FIG. 3 is a schematic view of the structure of the base plate of the present utility model;

FIG. 4 is a schematic diagram of an infrared filter according to the present utility model;

FIG. 5 is a schematic view of the structure of the cover plate of the present utility model;

fig. 6 is a schematic diagram of the structure of the infrared filter according to the present utility model.

In the figure: 1. a carrier plate; 11. a first screw; 12. a placement cavity; 2. a bottom plate; 21. a second screw; 22. a groove; 3. an infrared filter; 31. a filter housing; 32. a first connector; 33. a second connector; 34. an infrared absorbing material; 35. an insulating medium; 36. an inner conductor; 4. a support post; 5. and a cover plate.

Detailed Description

The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

The utility model provides a very low temperature high density microwave infrared filter bundling assembly as shown in figures 1-6, comprising

The infrared filter comprises a carrier plate 1, a bottom plate 2 and an infrared filter 3, wherein a first screw 11 is arranged on the carrier plate 1;

the support plate 1 is provided with a placing cavity 12, the infrared filter 3 is placed in the placing cavity 12, the bottom of the infrared filter 3 extends out of the placing cavity 12, the bottom plate 2 is connected with the support plate 1, the bottom plate 2 is provided with a groove 22, the groove 22 is matched with the infrared filter 3, and the bottom plate 2 is provided with a second screw 21;

the infrared filter comprises a support column (4), screw holes are formed in two ends of the support column (4), a first screw (11) and a second screw (21) are connected with the screw holes, the infrared filter further comprises a cover plate (5) and a baffle plate, the cover plate (5) comprises an upper cover plate and a lower cover plate, the upper cover plate is connected with the lower cover plate through a buckle, the cover plate (5) is arranged on the outer surface of the infrared filter (3), and the baffle plate is arranged on the top end of the carrier plate (1);

the infrared filter 3 comprises a filter shell 31, an inner conductor 36 arranged in the filter shell 31, a first connector 32 and a second connector 33 arranged at two ends of the filter shell 31, wherein two ends of the inner conductor 36 are fixed with the filter shell 31 through an insulating medium 35, the inner conductor 36 is made of beryllium bronze, the insulating medium 35 is made of polytetrafluoroethylene, an infrared absorbing material 34 is arranged in the filter shell 31, and the infrared absorbing material 34 is infrared glue.

The cover plate 5, the baffle, the support column 4, the carrier plate 1, the bottom plate 2 and the filter housing 31 are all made of copper materials.

Based on the above, the microwave infrared filter is formed by the infrared absorbing material 34 with special configuration, which is an integrated component, reduces the volume of the device, saves the occupied area, and is easy to produce and assemble and mass production. Due to the discontinuity of the intermediate infrared absorbing material 34 of the infrared filter 3, the influence on the transmission performance of the whole filter in the microwave frequency range is reduced, and the whole filter structural member is processed by copper materials, so that the structure is very stable and reliable, the infrared filter 3 still maintains good performance, and the performance index of the whole device in the extremely low temperature magnetic environment is ensured.

The device still has excellent performance index in a low-temperature environment, and the attenuation value at 6GHz is below-60 dB and the return loss is below-10 dB in a 300K environment; when the environment is at the extreme low temperature of 77K, the attenuation value at 6GHz is below-45 dB, the return loss is below-10 dB, and all indexes are still better.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims

1. An extremely low temperature high density microwave infrared filter bundling assembly which is characterized in that: comprising

The device comprises a carrier plate (1), a bottom plate (2) and an infrared filter (3);

the infrared filter is characterized in that a placing cavity (12) is formed in the carrier plate (1), the infrared filter (3) is placed in the placing cavity (12), the bottom of the infrared filter (3) extends out of the placing cavity (12), the bottom plate (2) is connected with the carrier plate (1), a groove (22) is formed in the bottom plate (2), and the groove (22) is matched with the infrared filter (3);

the infrared filter (3) comprises a filter shell (31), an inner conductor (36) arranged inside the filter shell (31), a first connector (32) and a second connector (33) arranged at two ends of the filter shell (31), wherein the two ends of the inner conductor (36) are fixed with the filter shell (31) through an insulating medium (35), and an infrared absorbing material (34) is arranged in the filter shell (31).

2. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 1, wherein: the first screw (11) is arranged on the carrier plate (1).

3. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 2, wherein: and a second screw (21) is arranged on the bottom plate (2).

4. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 3, wherein: the novel screw comprises a screw body, and is characterized by further comprising a support column (4), wherein threaded holes are formed in two ends of the support column (4), and the screw I (11) and the screw II (21) are connected with the threaded holes.

5. The ultra-low temperature high density microwave infrared filter cluster assembly according to claim 4, wherein: still include apron (5) and baffle, apron (5) are including upper cover plate and lower apron, and upper cover plate and lower apron pass through the buckle and connect, apron (5) set up at infrared filter (3) surface, the baffle sets up the top at carrier plate (1).

6. The ultra-low temperature high density microwave infrared filter cluster assembly according to claim 5, wherein: the cover plate (5), the baffle, the support posts (4), the carrier plate (1), the bottom plate (2) and the filter shell (31) are all made of copper materials.

7. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 1, wherein: the insulating medium (35) is made of polytetrafluoroethylene.

8. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 1, wherein: the infrared absorbing material (34) is an infrared glue.

9. The ultra-low temperature high density microwave infrared filter cluster assembly of claim 1, wherein: the inner conductor (36) is made of beryllium bronze.