CN112803132B - Transmission line structure - Google Patents
Transmission line structure Download PDFInfo
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- CN112803132B CN112803132B CN201911113361.6A CN201911113361A CN112803132B CN 112803132 B CN112803132 B CN 112803132B CN 201911113361 A CN201911113361 A CN 201911113361A CN 112803132 B CN112803132 B CN 112803132B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
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Abstract
The invention relates to the technical field of electronics, and discloses a transmission line structure which comprises a dielectric layer, a first conductor layer and a second conductor layer; the dielectric layer is provided with the first conductor layer and the second conductor layer; the second conductor layer is arranged on the surface of the dielectric layer; the second conductor layer comprises a concave structure, and the resonant frequency of the transmission line structure can be improved by designing the size of the concave structure so that the resonant frequency is higher than the highest working frequency; the second conductor layer is grounded; the structure can enable signals to be transmitted between the first conductor layer and the second conductor layer. The transmission line structure provided by the invention has the characteristic of low heat leakage.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a transmission line structure.
Background
Under the rapid development of electronic communication technology, some signal transmission lines need to operate in some severe temperature environments, such as low temperature environments, and low temperature coaxial cables are commonly used in the prior art.
In the patent with publication number CN206471150U, there is provided a high-temperature and low-temperature resistant coaxial cable, which comprises an inner conductor, an inner insulating layer, a shielding layer, an outer insulating layer and an outer sheath, wherein a polytetrafluoroethylene layer is arranged between the inner conductor and the inner insulating layer; the inner insulating layer is a hollow fiber layer; and a layer of mica tape is arranged between the outer insulating layer and the outer sheath. According to the cable, the polytetrafluoroethylene layer, the hollow fiber layer and the mica layer are adopted to cooperate, so that heat generated by electrifying from the inside of the inner conductor is absorbed, the heat cannot be transferred to other components of the cable, the possibility of spontaneous combustion of the cable is greatly reduced, and the influence of external environment temperature on the cable is prevented; meanwhile, the shielding performance, the anti-interference performance and the anti-attenuation performance are good. But the low-temperature coaxial cable has long purchase period, large heat consumption, large occupied space, poor flexibility and high price.
In the prior art, a microstrip line or a strip line is used as a flexible transmission line of a structure, and the flexible transmission line has the advantages of smaller occupied space, better flexibility, lower price and the like. The flexible transmission line is used as a signal transmission channel, so that not only can the high-frequency and high-speed requirements be realized, but also the miniaturization of a higher degree can be realized. However, the performance of the flexible transmission line commonly used in the market at present is designed and optimized for use in a room temperature environment, and when the flexible transmission line is used in a low-temperature environment, the flexibility is poor, heat leakage is large, and signal transmission is affected.
Disclosure of Invention
The invention aims to solve the technical problem of large heat leakage of a transmission line in a low-temperature working environment.
In order to solve the technical problems, the application discloses a transmission line structure, which comprises a dielectric layer, a first conductor layer and a second conductor layer;
the dielectric layer is provided with the first conductor layer and the second conductor layer;
the second conductor layer is arranged on the surface of the dielectric layer; the second conductor layer comprises a concave structure, wherein the concave structure is used for improving the resonance frequency of the transmission line structure in the transmission process, and the resonance frequency is higher than the highest working frequency;
the second conductor layer is grounded.
Optionally, the recessed structure is located outside the projection area;
the projection area is an area where the first conductor layer is vertically projected on the second conductor layer.
Optionally, the second conductor layer includes at least two of the recess structures;
the concave structure is arranged by taking the first conductor layer as a symmetry axis.
Optionally, the recess structure is a square recess.
Optionally, the side length of the square groove is less than or equal to one quarter of the wavelength corresponding to the highest operating frequency.
Optionally, the second conductor comprises at least three of the square recesses;
the distance between the adjacent square grooves is smaller than or equal to one quarter of the wavelength corresponding to the highest working frequency;
the square groove is positioned on the same side of the first conductor layer.
Optionally, the material of the dielectric layer includes flexible materials such as polytetrafluoroethylene, polyimide, and liquid crystal polymer.
Optionally, the first conductor layer comprises an alloy of copper, beryllium copper, or stainless steel, and/or the second conductor layer comprises an alloy of copper, beryllium copper, or stainless steel.
Optionally, the first conductor layer is disposed on top of the dielectric layer, and the second conductor layer is disposed on bottom of the dielectric layer.
Optionally, two of the second conductor layers are included;
one second conductor layer is arranged on the top of the dielectric layer, and the other second conductor layer is arranged on the bottom of the dielectric layer;
the first conductor layer is arranged in the dielectric layer.
By adopting the technical scheme, the transmission line structure disclosed by the application has the following beneficial effects:
the transmission line structure comprises a dielectric layer, a first conductor layer and a second conductor layer, wherein the dielectric layer is provided with the first conductor layer and the second conductor layer, and the second conductor layer is arranged on the surface of the dielectric layer;
the second conductor layer is provided with a concave structure, so that the current distribution of the second conductor layer, namely the grounding layer, is changed, the design of the concave structure brings resonance, but the resonance frequency band of the concave structure is far away from the frequency range by optimally designing the size of the concave structure, so that the transmission performance of the transmission line structure under a certain bandwidth is ensured, and the heat leakage under a low-temperature environment can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a transmission line structure according to an alternative embodiment of the present application;
fig. 2 is a schematic structural view of a transmission line structure according to another alternative embodiment of the present application;
FIG. 3 is a perspective view of a transmission line structure in an alternative embodiment of the present application;
FIG. 4 is a top view of a second conductor layer of the present application;
FIG. 5 is a schematic diagram showing transmission characteristics of a transmission line structure and a standard microstrip line within a 12GHz bandwidth according to a first alternative embodiment of the present application;
FIG. 6 is a schematic diagram showing transmission characteristics of a transmission line structure and a standard microstrip line within a 12GHz bandwidth according to a second alternative embodiment of the present application;
FIG. 7 is a schematic diagram of transmission characteristics of standard striplines within a 12GHz bandwidth in a third alternative embodiment of the present application;
fig. 8 is a schematic diagram of transmission characteristics of a transmission line structure within a 12GHz bandwidth according to a third alternative embodiment of the present application;
fig. 9 is a schematic diagram of transmission characteristics of a standard stripline in a 12GHz bandwidth in a fourth alternative embodiment of the present application;
fig. 10 is a schematic diagram of transmission characteristics of a transmission line structure within a 12GHz bandwidth according to a fourth alternative embodiment of the present application.
The following supplementary explanation is given to the accompanying drawings:
1-a first conductor layer; 2-a dielectric layer; 3-a second conductor layer; 301-upper layer; 302-lower layer; 4-a concave structure; 5-projection area.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the present application. In the description of the present application, it should be understood that the terms "upper," "lower," "top," "bottom," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the apparatus or elements in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may include one or more of the feature, either explicitly or implicitly. Moreover, the terms "first," "second," and the like, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a transmission line structure in an alternative embodiment of the present application. The application discloses a transmission line structure, which comprises a medium layer 2, a first conductor layer 1 and a second conductor layer 3, wherein the medium layer 2 is provided with the first conductor layer 1 and the second conductor layer 3, the second conductor layer 3 is arranged on the surface of the medium layer 2, and signals can be transmitted between the first conductor layer 1 and the second conductor layer 2; the transmission line structure formed by the method has the advantages of small occupied space and low cost;
the second conductor layer 3 is provided with the concave structure 4, so that the current distribution of the second conductor layer 3, namely the ground layer, is changed, the concave structure 4 can bring resonance, but the resonance frequency band of the concave structure can be far away from the frequency range by optimally designing the size of the concave structure, thereby not only ensuring the transmission performance of the transmission line structure under a certain bandwidth, but also reducing the heat leakage under a low-temperature environment.
In an alternative embodiment, as shown in fig. 1, the first conductor layer 1 is disposed on top of the dielectric layer 2, and the second conductor layer 3 is disposed on the bottom of the dielectric layer 2; the structure has the advantages of small volume, light weight, wide use frequency band, high reliability, low manufacturing cost and the like.
In another alternative embodiment, as shown in fig. 2, fig. 2 is a schematic structural diagram of a transmission line structure in another alternative embodiment of the present application. The structure comprises two second conductor layers 3, wherein one second conductor layer 3 is arranged at the top of the medium layer 2, the other second conductor layer 3 is arranged at the bottom of the medium layer 2, and the first conductor layer 1 is arranged in the medium layer 2.
In an alternative embodiment, as shown in fig. 3, fig. 3 is a perspective view of a transmission line structure in an alternative embodiment of the present application. The concave structure 4 is located outside the projection area 5, and the projection area 5 is an area where the first conductor layer 1 is vertically projected on the second conductor layer 3; that is to say, the concave structure 4 does not intersect with the projection of the first conductor layer 1, and the structural design brings resonance, but by optimally designing the size of the concave structure, the resonance frequency band of the concave structure can be far away from the frequency range used, so that the influence of the resonance frequency on signal transmission is reduced, and the effect of reducing heat leakage is also achieved.
In an alternative embodiment, as shown in fig. 4, fig. 4 is a top view of the second conductor layer 3 of the present application; the second conductor comprises at least two such recess structures 4; at least two concave structures 4 are arranged along the first conductor layer 1 along a symmetry axis, the structure has the effect of reducing heat leakage, and the symmetrical arrangement mode is not only beneficial to processing the structure, but also beneficial to structural design of different heat leakage values of transmission lines with different requirements.
In an alternative embodiment, as shown in fig. 4, the concave structures 4 are square grooves, and the square structures are convenient to design and process; in an alternative embodiment, an empirical value is obtained by using software simulation, and the heat leak value of the transmission line is lower when the side length of the square groove is not more than one quarter of the wavelength corresponding to the highest operating frequency; in another alternative embodiment, as shown in fig. 4, the second conductor includes at least three such square recesses; an empirical value is obtained by using software simulation, and when the distance between the adjacent square grooves is not more than one quarter of the wavelength corresponding to the highest working frequency and the adjacent square grooves are positioned on the same side of the first conductor layer 1, the electric performance of the transmission line is ensured, and the heat leakage is greatly reduced.
In an alternative embodiment, the material of the dielectric layer 2 comprises flexible materials such as polytetrafluoroethylene, polyimide or liquid crystal polymer, and the materials not only can ensure good performance at low temperature, but also have the advantages of flexibility and bending, and the flexible transmission line is more suitable for interconnection at low temperature and long distance and has larger application space.
In an alternative embodiment, the first conductor layer 1 may be copper, which has the advantages of good ductility, high thermal conductivity and low electrical resistance, but may be an alloy such as beryllium copper or stainless steel with low thermal conductivity, and in another alternative embodiment, the second conductor layer 3 may be copper, but may be an alloy such as beryllium copper or stainless steel with low thermal conductivity, so that heat leakage may be further reduced.
Example 1
As shown in fig. 1, the transmission line structure is a microstrip structure, that is, the transmission line structure has the first conductor layer 1 disposed on the top of the dielectric layer 2, and the second conductor layer 3 disposed on the bottom of the dielectric layer 2; the dielectric layer 2 is polyimide with the thickness of 0.1mm; the concave structure 4 is a periodic structure formed by square grooves with the side length of 2.6mm, the square grooves are positioned at the outer side of the projection area 5, and the projection area 5 is an area where the first conductor layer 1 is vertically projected on the second conductor layer 3; the square grooves are arranged along the first conductor layer 1 along the symmetry axis; the spacing between adjacent square grooves on the same side of the first conductor layer 1 is 0.6mm, and the spacing between two rows of square grooves is 1.7mm;
wherein, the bandwidth of the transmission performance is 12GHz; the temperature change of the heat leakage performance is 4.2K-40K; the length of the first conductor layer 1 is 100mm and the length of the transmission line of a standard microstrip line is 100mm.
In an alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is copper, with a thickness of 18 μm; fig. 5 is a schematic diagram showing transmission characteristics of a transmission line structure and a standard microstrip line within a 12GHz bandwidth according to a first alternative embodiment of the present application; the solid line represents the transmission characteristic curve of the standard microstrip line in the 12GHz bandwidth, the dotted line is the transmission characteristic curve of the above transmission line structure in the 12GHz bandwidth, it can be seen from fig. 5 that when the bandwidth is 10GHz, the transmission loss of the standard microstrip line is about 1.0dB, and the transmission loss of the transmission line structure provided by the application is about 1.3dB, and it can be seen that when the bandwidth is 10GHz, the transmission line structure provided by the application is only 0.3dB larger than the loss of the transmission line of the standard microstrip line, and the influence of the concave structure 4 on the transmission performance is not great.
In another alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, with a thickness of 18 μm; fig. 6 is a schematic diagram showing transmission characteristics of a transmission line structure and a standard microstrip line within a 12GHz bandwidth according to a second alternative embodiment of the present application; the solid line represents the transmission characteristic curve of the standard microstrip line in the 12GHz bandwidth, the dotted line is the transmission characteristic curve of the above transmission line structure in the 12GHz bandwidth, it can be seen from fig. 5 that when the bandwidth is 10GHz, the transmission loss of the standard microstrip line is about 1.1dB, and the transmission loss of the transmission line structure provided by the application is about 1.4dB, and it can be seen that when the bandwidth is 10GHz, the transmission line structure provided by the application is only 0.3dB larger than the loss of the transmission line of the standard microstrip line, and the influence of the concave structure 4 on the transmission performance is not great.
The low-temperature heat leakage experiment is carried out in a heat leakage test device on a standard microstrip line with a first conductor layer 1 and a second conductor layer 3 which are copper, the transmission line structure, and a standard microstrip line with a first conductor layer 1 and a second conductor layer 3 which are beryllium copper, and the transmission line structure, wherein the specific steps are as follows: firstly, testing bare metal of a refrigerator, namely testing a state without a transmission line, testing the lowest temperature of the bare metal, controlling the first-stage temperature and the second-stage temperature through heating, and testing the heating value of a second-stage heating plate at the moment when the first-stage temperature and the second-stage temperature are respectively stabilized at 40K and 4.2K, namely testing the refrigerating capacity A under the state;
secondly, under the same working condition, a plurality of transmission lines for connecting the primary and the secondary are arranged in the refrigerator, the primary and the secondary temperatures are controlled through heating, and when the primary and the secondary temperatures are respectively stabilized at 40K and 4.2K, the heating value of the secondary heating plate at the moment is tested, namely the refrigerating capacity B in the state;
finally, the difference between A and B is the cold loss caused by the introduction of the transmission line, and the number of the cold losses divided by the number of the cold losses is the heat leakage caused by a single transmission line.
As a result, the heat leakage of the standard microstrip line in which the first conductor layer 1 and the second conductor layer 3 are copper was 52mW, and the heat leakage of the transmission line structure in which the first conductor layer 1 and the second conductor layer 3 are copper was 27mW, which is reduced by 25mW and nearly doubled compared to the standard microstrip line in which copper is a conductor.
The leakage heat of the standard microstrip line with the first conductor layer 1 and the second conductor layer 3 being beryllium copper is 0.7mW, and the transmission line structure with the first conductor layer 1 and the second conductor layer 3 being beryllium copper is 0.4mW, which is reduced by 0.3mW and nearly doubled compared with the standard microstrip with the beryllium copper as a conductor. As can be seen from the above results, the transmission line structure provided in the present application has an effect of greatly reducing low-temperature heat leakage, and particularly when the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, the low-temperature heat leakage performance of the transmission line can be better.
Example 2
The transmission line structure is a strip line structure, that is, the transmission line structure comprises two second conductor layers 3, one second conductor layer 3 is arranged at the top of the dielectric layer 2, the other second conductor layer 3 is arranged at the bottom of the dielectric layer 2, and the first conductor layer 1 is arranged in the dielectric layer 2; the dielectric layer 2 is made of liquid crystal polymer material and has the thickness of 0.2mm; the concave structure 4 is a periodic structure formed by square grooves with the side length of 2.6mm, the square grooves are positioned at the outer side of the projection area 5, and the projection area 5 is an area where the first conductor layer 1 is vertically projected on the second conductor layer 3; the square grooves are arranged along the first conductor layer 1 along the symmetry axis; the spacing between adjacent square grooves on the same side of the first conductor layer 1 is 0.6mm, and the spacing between two rows of square grooves is 0.5mm;
wherein, the bandwidth of the transmission performance is 12GHz; the temperature change of the heat leakage performance is 4.2K-40K, the length of the first conductor layer 1 is 100mm, and the length of the transmission line of the standard strip line is 100mm.
In an alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is copper, with a thickness of 18 μm; as shown in fig. 7, fig. 7 is a schematic diagram illustrating transmission characteristics of standard striplines within a 12GHz bandwidth in a third alternative embodiment of the present application; as can be seen from fig. 7, when the bandwidth is 10GHz, the transmission loss of the standard stripline is about 2.0dB, as shown in fig. 8, and fig. 8 is a schematic diagram illustrating the transmission characteristics of the transmission line structure in the 12GHz bandwidth in the third alternative embodiment of the present application; as can be seen from fig. 8, the transmission loss of the transmission line structure is about 2.0dB when the bandwidth is 10GHz, and it can be seen that the transmission line structure provided in the present application has little influence on the transmission performance as the loss of the standard strip line transmission line when the bandwidth is 10 GHz.
In another alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, with a thickness of 18 μm; as shown in fig. 9, fig. 9 is a schematic diagram showing transmission characteristics of a standard stripline in a 12GHz bandwidth according to a fourth alternative embodiment of the present application; as can be seen from fig. 9, when the bandwidth is 10GHz, the transmission loss of the standard stripline is about 3.5dB, as shown in fig. 10, and fig. 10 is a schematic diagram showing the transmission characteristics of the transmission line structure in the 12GHz bandwidth in the fourth alternative embodiment of the present application; as can be seen from fig. 10, when the bandwidth is 10GHz, the transmission loss of the transmission line structure in the fourth alternative embodiment of the present application is about 3.5dB, and it can be seen that, when the bandwidth is 10GHz, the transmission line structure provided in the present application is the same as the loss of the standard microstrip line transmission line, and the impact of the concave structure 4 on the transmission performance is not great.
As a result of the heat leakage experiments performed on the four transmission lines, the heat leakage of the standard strip line with the material of the first conductor layer 1 and the second conductor layer 3 being copper was 90mW, and the heat leakage of the transmission line structure with the material of the first conductor layer 1 and the second conductor layer 3 being copper was 46mW, which is reduced by 44mW and nearly doubled compared with the standard strip line with the copper as a conductor.
The material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, the heat leakage of the standard strip line is 1.2mW, the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, and the heat leakage of the transmission line structure is 0.7mW, and compared with the standard strip line taking the beryllium copper as a conductor, the heat leakage is reduced by 0.5mW and is nearly doubled.
According to the analysis of the results, the transmission line structure provided by the application has the effect of reducing low-temperature heat leakage, and particularly when the materials of the first conductor layer 1 and the second conductor layer 3 are beryllium copper, the low-temperature heat leakage performance of the transmission line can be better.
In summary, the present application provides a transmission line structure, the transmission line type may be a microstrip line structure, or a strip line structure, the medium is made of polytetrafluoroethylene, polyimide and liquid crystal polymer materials available at very low temperature, the first conductor layer 1 and the second conductor layer 3 are made of alloys such as copper, beryllium copper or stainless steel, the second conductor layer 3 is formed with a concave structure 4, the concave structure 4 can bring resonance, but by optimally designing the size of the concave structure, the resonance frequency band of the concave structure can be far away from the frequency range used, and the concave structure 4 can greatly reduce heat leakage on the premise that the transmission performance of the transmission line structure is not greatly affected.
The foregoing description of the preferred embodiments is provided for the purpose of illustration only and is not intended to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. A transmission line structure, characterized in that: comprises a dielectric layer (2), a first conductor layer (1) and a second conductor layer (3);
the dielectric layer (2) is provided with the first conductor layer (1) and the second conductor layer (3);
the second conductor layer (3) is arranged on the surface of the dielectric layer (2); the second conductor layer (3) comprises a concave structure (4), wherein the concave structure (4) is used for improving the resonance frequency of the transmission line structure in the transmission process, and the resonance frequency is higher than the highest working frequency;
the second conductor layer (3) is grounded;
the material of the dielectric layer (2) comprises polytetrafluoroethylene, polyimide or liquid crystal polymer; and the dielectric layer (2) is made of flexible materials;
the concave structure (4) is positioned outside the projection area (5);
the projection area (5) is an area where the first conductor layer (1) is vertically projected on the second conductor layer (3);
-said second conductor layer (3) comprises at least two of said recessed structures (4);
the concave structures (4) are arranged with the first conductor layer (1) as a symmetry axis.
2. The transmission line structure according to claim 1, characterized in that: the concave structure (4) is a square groove.
3. The transmission line structure according to claim 2, characterized in that: the side length of the square groove is smaller than or equal to one quarter of the wavelength corresponding to the highest working frequency.
4. A transmission line structure according to claim 3, characterized in that: -said second conductor layer (3) comprises at least three of said square recesses;
the distance between the adjacent square grooves is smaller than or equal to one quarter of the wavelength corresponding to the highest working frequency;
the square grooves are located on the same side of the first conductor layer (1).
5. The transmission line structure according to claim 1, characterized in that: the first conductor layer (1) comprises copper, beryllium copper or stainless steel and/or the second conductor layer (3) comprises copper, beryllium copper or stainless steel.
6. The transmission line structure according to claim 1, characterized in that: the first conductor layer (1) is arranged at the top of the dielectric layer (2), and the second conductor layer (3) is arranged at the bottom of the dielectric layer (2).
7. The transmission line structure according to claim 1, characterized in that: comprising two of said second conductor layers (3);
one second conductor layer (3) is arranged at the top of the dielectric layer (2), and the other second conductor layer (3) is arranged at the bottom of the dielectric layer (2);
the first conductor layer (1) is arranged in the dielectric layer (2).
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| CN114709581A (en) * | 2022-05-31 | 2022-07-05 | 深圳小米通讯技术有限公司 | Electromagnetic wave transmission method, transmission line and terminal device |
| CN117791072A (en) * | 2022-09-20 | 2024-03-29 | 华为技术有限公司 | Transmission line, feed network and antenna device |
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| CN105514554A (en) * | 2016-01-07 | 2016-04-20 | 北京同方吉兆科技有限公司 | Inverted microstrip line structure suitable for high power transmission |
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