CN112803132A - Transmission line structure - Google Patents
Transmission line structure Download PDFInfo
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- CN112803132A CN112803132A CN201911113361.6A CN201911113361A CN112803132A CN 112803132 A CN112803132 A CN 112803132A CN 201911113361 A CN201911113361 A CN 201911113361A CN 112803132 A CN112803132 A CN 112803132A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
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Abstract
The invention relates to the technical field of electronics, and discloses a transmission line structure which comprises a dielectric layer, a first conductor layer and a second conductor layer; the dielectric layer is provided with the first conductor layer and the second conductor layer; the second conductor layer is arranged on the surface of the dielectric layer; the second conductor layer comprises a concave structure, and the resonance frequency of the transmission line structure can be improved by designing the size of the concave structure, so that the resonance frequency is higher than the highest working frequency; the second conductor layer is grounded; the above structure enables a signal to be transmitted between the first conductor layer and the second conductor layer. The transmission line structure provided by the invention has the characteristic of low heat leakage.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a transmission line structure.
Background
With the rapid development of electronic communication technology, some signal transmission lines need to work in some severe temperature environments, such as low temperature environments, whereas low temperature coaxial cables are commonly used in the prior art.
In the patent with publication number CN206471150U, a high temperature and low temperature resistant coaxial cable is provided, which comprises an inner conductor, an inner insulating layer, a shielding layer, an outer insulating layer and an outer sheath, wherein a polytetrafluoroethylene layer is further arranged between the inner conductor and the inner insulating layer; the inner insulating layer is a hollow fiber layer; a mica tape layer is further arranged between the outer insulating layer and the outer sheath. The polytetrafluoroethylene layer, the hollow fiber layer and the mica layer are adopted to cooperate, so that heat generated by electrifying in the inner conductor is absorbed, the heat cannot be transferred to other components of the cable, the possibility of spontaneous combustion of the cable is greatly reduced, and the influence of external environment temperature on the cable is prevented; meanwhile, the shielding performance, the anti-interference performance and the anti-attenuation performance are good. However, the low-temperature coaxial cable has long purchase period, large heat consumption, large occupied space, poor flexibility and high price.
In the prior art, there is also a flexible transmission line using microstrip lines or strip lines as a structure, which has the advantages of smaller occupied space, better flexibility, lower price, etc. The flexible transmission line is used as a signal transmission channel, so that the high-frequency and high-speed requirements can be met, and the miniaturization at a higher degree can be realized. However, the performance of the flexible transmission line commonly used in the market at present is designed and optimized in a room temperature environment, and when the flexible transmission line is used in a low-temperature environment, the flexibility is poor, heat leakage is large, and signal transmission is affected.
Disclosure of Invention
The invention aims to solve the technical problem of large heat leakage of a transmission line in a low-temperature working environment.
In order to solve the above technical problem, the present application discloses a transmission line structure, which includes a dielectric layer, a first conductor layer, and a second conductor layer;
the dielectric layer is provided with the first conductor layer and the second conductor layer;
the second conductor layer is arranged on the surface of the dielectric layer; the second conductor layer comprises a concave structure, and the concave structure is used for improving the resonant frequency of the transmission line structure in the transmission process, wherein the resonant frequency is higher than the highest working frequency;
the second conductive layer is grounded.
Optionally, the recessed structure is located outside the projection region;
the projection area is an area where the first conductor layer vertically projects on the second conductor layer.
Optionally, the second conductor layer includes at least two of the recessed structures;
the concave structures are arranged by taking the first conductor layer as a symmetry axis.
Optionally, the recessed structure is a square groove.
Optionally, the length of the side of the square groove is less than or equal to a quarter of the wavelength corresponding to the highest operating frequency.
Optionally, the second conductor comprises at least three of the square grooves;
the distance between the adjacent square grooves is less than or equal to one quarter of the wavelength corresponding to the highest working frequency;
the square groove is positioned on the same side of the first conductor layer.
Optionally, the material of the dielectric layer includes flexible materials such as polytetrafluoroethylene, polyimide, and liquid crystal polymer.
Optionally, the first conductor layer includes an alloy such as copper, beryllium copper, or stainless steel, and/or the second conductor layer includes an alloy such as copper, beryllium copper, or stainless steel.
Optionally, the first conductive layer is disposed on the top of the dielectric layer, and the second conductive layer is disposed on the bottom of the dielectric layer.
Optionally, two of the second conductor layers are included;
one second conductor layer is arranged at the top of the dielectric layer, and the other second conductor layer is arranged at the bottom of the dielectric layer;
the first conductor layer is arranged in the dielectric layer.
Adopt above-mentioned technical scheme, the transmission line structure that this application discloses has following beneficial effect:
the transmission line structure comprises a dielectric layer, a first conductor layer and a second conductor layer, wherein the dielectric layer is provided with the first conductor layer and the second conductor layer, the second conductor layer is arranged on the surface of the dielectric layer, and the transmission line structure formed by the above steps has the advantages of small occupied space and low cost;
the second conductor layer is provided with a concave structure, the current distribution of the second conductor layer, namely the grounding layer, is changed, the design of the concave structure can bring resonance, but the size of the concave structure is optimally designed, so that the resonance frequency band of the concave structure can be far away from the used frequency range, the transmission performance of the transmission line structure under a certain bandwidth is ensured, and the heat leakage under a low-temperature environment can be reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a transmission line structure according to an alternative embodiment of the present application;
FIG. 2 is a schematic diagram of a transmission line structure according to another alternative embodiment of the present application;
FIG. 3 is a perspective view of a transmission line structure in an alternative embodiment of the present application;
FIG. 4 is a top view of a second conductor layer of the present application;
fig. 5 is a schematic diagram illustrating a comparison between transmission characteristics of a transmission line structure and a standard microstrip line in a 12GHz bandwidth according to a first alternative embodiment of the present application;
fig. 6 is a schematic diagram illustrating a comparison between transmission characteristics of a transmission line structure and a standard microstrip line in a 12GHz bandwidth according to a second alternative embodiment of the present application;
FIG. 7 is a schematic diagram of transmission characteristics of a standard stripline in a 12GHz bandwidth in a third alternative embodiment of the present application;
FIG. 8 is a schematic diagram of transmission characteristics of a transmission line structure in a bandwidth of 12GHz according to a third alternative embodiment of the present application;
FIG. 9 is a schematic diagram of the transmission characteristics of a standard stripline in a bandwidth of 12GHz in a fourth alternative embodiment of the present application;
fig. 10 is a schematic diagram of transmission characteristics of a transmission line structure in a bandwidth of 12GHz in a fourth alternative embodiment of the present application.
The following is a supplementary description of the drawings:
1-a first conductor layer; 2-a dielectric layer; 3-a second conductor layer; 301-upper layer; 302-lower layer; 4-a recessed structure; 5-projection area.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the present application. In the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a transmission line structure in an optional embodiment of the present application. The application discloses a transmission line structure, which comprises a dielectric layer 2, a first conductor layer 1 and a second conductor layer 3, wherein the dielectric layer 2 is provided with the first conductor layer 1 and the second conductor layer 3, the second conductor layer 3 is arranged on the surface of the dielectric layer 2, and signals can be transmitted between the first conductor layer 1 and the second conductor layer 2; the transmission line structure formed by the method has the advantages of small occupied space and low cost;
the second conductor layer 3 is formed with the recessed structure 4, the current distribution of the second conductor layer 3, namely the ground layer, is changed, the recessed structure 4 can bring resonance, but the size of the recessed structure is optimally designed, so that the resonance frequency band can be far away from the used frequency range, the transmission performance of the transmission line structure under a certain bandwidth is ensured, and the heat leakage under a low-temperature environment can be reduced.
In an alternative embodiment, as shown in fig. 1, the first conductive layer 1 is disposed on the top of the dielectric layer 2, and the second conductive layer 3 is disposed on the bottom of the dielectric layer 2; the structure has the advantages of small volume, light weight, wide use frequency band, high reliability, low manufacturing cost and the like.
In another alternative embodiment, as shown in fig. 2, fig. 2 is a schematic structural diagram of a transmission line structure in another alternative embodiment of the present application. Including two these second conductor layer 3, the top of this dielectric layer 2 is located to one this second conductor layer 3, and the bottom of this dielectric layer 2 is located to another this second conductor layer 3, and this first conductor layer 1 is located in this dielectric layer 2, and this structure has advantages such as small, light in weight, frequency bandwidth, Q value height, simple process, low cost.
In an alternative embodiment, as shown in fig. 3, fig. 3 is a perspective view of a transmission line structure in an alternative embodiment of the present application. The recessed structure 4 is located outside the projection region 5, and the projection region 5 is a region where the first conductive layer 1 is vertically projected on the second conductive layer 3; that is to say, the recessed structure 4 does not intersect with the projection of the first conductor layer 1, and the structural design brings resonance, but by optimally designing the size of the recessed structure, the resonance frequency band can be far away from the used frequency range, the influence of the resonance frequency on signal transmission is reduced, and the heat leakage is also reduced.
In an alternative embodiment, as shown in fig. 4, fig. 4 is a top view of the second conductor layer 3 of the present application; the second conductor comprises at least two such recessed structures 4; the at least two recessed structures 4 are arranged along the first conductor layer 1 as a symmetry axis, the structure has the function of reducing heat leakage, and the symmetrical arrangement mode is not only beneficial to the processing of the structure, but also beneficial to the structural design of different heat leakage values of transmission lines with different requirements.
In an alternative embodiment, as shown in fig. 4, the recessed structure 4 is a square groove, and the square structure is convenient for design and processing; in an alternative embodiment, an empirical value is obtained by using software simulation, and when the side length of the square groove is not more than one quarter of the wavelength corresponding to the highest working frequency, the heat leakage value of the transmission line is low; in another alternative embodiment, as shown in fig. 4, the second conductor includes at least three of the square grooves; an empirical value is obtained through software simulation, when the distance between the adjacent square grooves does not exceed one quarter of the wavelength corresponding to the highest working frequency, and the adjacent square grooves are positioned on the same side of the first conductor layer 1, the electrical performance of the transmission line is ensured, and the heat leakage is greatly reduced.
In an optional embodiment, the material of the dielectric layer 2 includes flexible materials such as polytetrafluoroethylene, polyimide, or liquid crystal polymer, which not only can ensure good performance at low temperature, but also has the advantages of flexibility and bendability, and the flexible transmission line is more suitable for long-distance interconnection at low temperature and room temperature and has a larger application space.
In an alternative embodiment, the first conductor layer 1 may be made of copper, which has the advantages of good ductility, high thermal conductivity, and low electrical resistance, and may also be made of beryllium copper or stainless steel with low thermal conductivity, or in another alternative embodiment, the second conductor layer 3 is made of copper, and may also be made of beryllium copper with low thermal conductivity or stainless steel, which may further reduce heat leakage.
Example 1
As shown in fig. 1, the transmission line structure is a microstrip structure, that is, the first conductor layer 1 is disposed on the top of the dielectric layer 2, and the second conductor layer 3 is disposed on the bottom of the dielectric layer 2; the dielectric layer 2 is polyimide with the thickness of 0.1 mm; the recessed structure 4 is a periodic structure formed by square grooves with the side length of 2.6mm, the square grooves are positioned at the outer side of the projection area 5, and the projection area 5 is an area where the first conductor layer 1 is vertically projected on the second conductor layer 3; the square grooves are arranged along the first conductor layer 1 as a symmetry axis; the distance between the adjacent square grooves on the same side of the first conductor layer 1 is 0.6mm, and the distance between two rows of square grooves is 1.7 mm;
wherein the bandwidth of the transmission performance is 12 GHz; the temperature change of the heat leakage performance is 4.2K-40K; the length of the first conductor layer 1 is 100mm, and the length of the transmission line of the standard microstrip line is 100 mm.
In an alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is copper, and the thickness is 18 μm; as shown in fig. 5, fig. 5 is a schematic diagram illustrating a comparison between a transmission line structure and a standard microstrip line in a first alternative embodiment of the present application for transmission characteristics within a bandwidth of 12 GHz; the solid line shows the transmission characteristic curve of the standard microstrip line in the 12GHz bandwidth, and the dotted line shows the transmission characteristic curve of the transmission line structure in the 12GHz bandwidth, as can be seen from fig. 5, when the bandwidth is 10GHz, the transmission loss of the standard microstrip line is about 1.0dB, and the transmission loss of the transmission line structure provided by the present application is about 1.3dB, it can be seen that, when the bandwidth is 10GHz, the transmission line structure provided by the present application is only increased by 0.3dB compared with the loss of the transmission line of the standard microstrip line, and the influence of the concave structure 4 on the transmission performance is not great.
In another alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, and the thickness is 18 μm; as shown in fig. 6, fig. 6 is a schematic diagram illustrating a comparison between a transmission line structure and a standard microstrip line in a second alternative embodiment of the present application for transmission characteristics within a bandwidth of 12 GHz; the solid line shows the transmission characteristic curve of the standard microstrip line in the 12GHz bandwidth, and the dotted line shows the transmission characteristic curve of the transmission line structure in the 12GHz bandwidth, as can be seen from fig. 5, when the bandwidth is 10GHz, the transmission loss of the standard microstrip line is about 1.1dB, and the transmission loss of the transmission line structure provided by the present application is about 1.4dB, it can be seen that, when the bandwidth is 10GHz, the transmission line structure provided by the present application is only increased by 0.3dB compared with the loss of the transmission line of the standard microstrip line, and the influence of the concave structure 4 on the transmission performance is not great.
The method comprises the following steps of respectively carrying out low-temperature heat leakage experiments on a standard microstrip line and the transmission line structure, wherein the first conductor layer 1 and the second conductor layer 3 are made of copper, and the standard microstrip line and the transmission line structure are made of beryllium copper, and the first conductor layer 1 and the second conductor layer 3 are made of beryllium copper: firstly, testing a bare machine of the refrigerating machine, namely testing the state without a transmission line, testing the lowest temperature of the bare machine, controlling the primary temperature and the secondary temperature by heating, and testing the heat productivity of the secondary heating plate at the moment when the primary temperature and the secondary temperature are respectively stabilized at 40K and 4.2K, namely the refrigerating capacity A in the state;
secondly, under the same working condition, a plurality of transmission lines connected with the first stage and the second stage are arranged in the refrigerating machine, the temperature of the first stage and the temperature of the second stage are controlled by heating, and when the temperature of the first stage and the temperature of the second stage are respectively stabilized at 40K and 4.2K, the heating value of the second stage heating plate at the moment is tested, namely the refrigerating capacity B under the state;
and finally, the difference value of A and B is the cold loss caused by the introduction of the transmission line, and the heat leakage caused by a single transmission line is obtained by dividing the difference value by the number of the transmission lines.
As a result, the heat leakage of the standard microstrip line in which the first conductor layer 1 and the second conductor layer 3 are made of copper was 52mW, and the heat leakage of the transmission line structure in which the first conductor layer 1 and the second conductor layer 3 are made of copper was 27mW, which was reduced by 25mW and was almost doubled compared to the standard microstrip line in which copper is used as a conductor.
The heat leakage of the standard microstrip line with beryllium copper as the first conductor layer 1 and the second conductor layer 3 is 0.7mW, and the transmission line structure with beryllium copper as the first conductor layer 1 and the second conductor layer 3 is 0.4mW, which is reduced by 0.3mW by nearly one time compared with the standard microstrip with beryllium copper as the conductor. From the above results, the transmission line structure provided by the present application has an effect of greatly reducing low-temperature heat leakage, and particularly when the first conductor layer 1 and the second conductor layer 3 are made of beryllium copper, the transmission line has a better low-heat leakage performance.
Example 2
The transmission line structure is a strip line structure, that is, the transmission line structure comprises two second conductor layers 3, one second conductor layer 3 is arranged at the top of the dielectric layer 2, the other second conductor layer 3 is arranged at the bottom of the dielectric layer 2, and the first conductor layer 1 is arranged in the dielectric layer 2; the dielectric layer 2 is made of liquid crystal polymer material and has the thickness of 0.2 mm; the recessed structure 4 is a periodic structure formed by square grooves with the side length of 2.6mm, the square grooves are positioned at the outer side of the projection area 5, and the projection area 5 is an area where the first conductor layer 1 is vertically projected on the second conductor layer 3; the square grooves are arranged along the first conductor layer 1 as a symmetry axis; the distance between the adjacent square grooves on the same side of the first conductor layer 1 is 0.6mm, and the distance between two rows of square grooves is 0.5 mm;
wherein the bandwidth of the transmission performance is 12 GHz; the temperature change of the heat leakage property was 4.2K-40K, the length of the first conductor layer 1 was 100mm, and the length of the transmission line of the standard strip line was 100 mm.
In an alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is copper, and the thickness is 18 μm; as shown in fig. 7, fig. 7 is a schematic diagram of transmission characteristics of a standard stripline in a 12GHz bandwidth in a third alternative embodiment of the present application; as can be seen from fig. 7, when the bandwidth is 10GHz, the transmission loss of the standard strip line is about 2.0dB, as shown in fig. 8, and fig. 8 is a schematic diagram of the transmission characteristics of the transmission line structure in the third alternative embodiment of the present application within the bandwidth of 12 GHz; as can be seen from fig. 8, when the bandwidth is 10GHz, the transmission loss of the transmission line structure is about 2.0dB, and it can be seen that, when the bandwidth is 10GHz, the transmission line structure provided by the present application has the same loss as that of a standard stripline transmission line, and the influence of the concave structure 4 on the transmission performance is not great.
In another alternative embodiment, the material of the first conductor layer 1 and the second conductor layer 3 is beryllium copper, and the thickness is 18 μm; as shown in fig. 9, fig. 9 is a schematic diagram of transmission characteristics of a standard stripline in a bandwidth of 12GHz in a fourth alternative embodiment of the present application; as can be seen from fig. 9, when the bandwidth is 10GHz, the transmission loss of the standard strip line is about 3.5dB, as shown in fig. 10, and fig. 10 is a schematic diagram of the transmission characteristics of the transmission line structure in the fourth alternative embodiment of the present application within the bandwidth of 12 GHz; as can be seen from fig. 10, when the bandwidth is 10GHz, the transmission loss of the transmission line structure in the fourth alternative embodiment of the present application is about 3.5dB, and it can be seen that, when the bandwidth is 10GHz, the transmission line structure provided by the present application has the same loss as that of a standard microstrip line transmission line, and the influence of the concave structure 4 on the transmission performance is not great.
The heat leakage test was performed on the above four transmission lines at the same time, and as a result, the heat leakage of the standard stripline in which the first conductor layer 1 and the second conductor layer 3 were made of copper was 90mW, and the heat leakage of the above transmission line structure in which the first conductor layer 1 and the second conductor layer 3 were made of copper was 46mW, which was reduced by 44mW by approximately one time as compared with the standard stripline in which copper was used as a conductor.
The heat leakage of the standard stripline in which the first conductor layer 1 and the second conductor layer 3 were made of beryllium copper was 1.2mW, and the heat leakage of the above-described transmission line structure in which the first conductor layer 1 and the second conductor layer 3 were made of beryllium copper was 0.7mW, which was reduced by approximately one time by 0.5mW as compared with the standard stripline in which beryllium copper was used as a conductor.
According to the analysis of the results, the transmission line structure provided by the application has the effect of reducing low-temperature heat leakage, and particularly when the first conductor layer 1 and the second conductor layer 3 are made of beryllium copper, the transmission line has better low-heat leakage performance.
To sum up, the application provides a transmission line structure, the transmission line type can be microstrip line class structure, also can be stripline class structure, usable polytetrafluoroethylene, polyimide and liquid crystal polymer material under the extreme low temperature are selected for use to the medium, first conductor layer 1 and second conductor layer 3 select alloys such as copper, beryllium copper or stainless steel, the shaping has concave structure 4 on the second conductor layer 3, this concave structure 4 can bring the resonance into, but through the size of this concave structure of optimal design, can make its resonance frequency band keep away from the frequency range who uses, and should have under the little prerequisite of transmission performance influence of this concave structure 4 to this transmission line structure, can greatly reduce and leak heat.
The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A transmission line structure characterized by: the conductive layer structure comprises a dielectric layer (2), a first conductive layer (1) and a second conductive layer (3);
the dielectric layer (2) is provided with the first conductor layer (1) and the second conductor layer (3);
the second conductor layer (3) is arranged on the surface of the dielectric layer (2); the second conductor layer (3) comprises a recessed structure (4), and the recessed structure (4) is used for improving the resonant frequency of the transmission line structure in the transmission process, wherein the resonant frequency is higher than the highest working frequency;
the second conductor layer (3) is grounded.
2. The transmission line structure according to claim 1, characterized in that: the recessed structure (4) is located outside the projection area (5);
the projection area (5) is an area where the first conductor layer (1) is vertically projected on the second conductor layer (3).
3. The transmission line structure according to claim 1, characterized in that: the second conductor layer (3) comprises at least two of the recessed structures (4);
the concave structures (4) are arranged by taking the first conductor layer (1) as a symmetry axis.
4. The transmission line structure according to claim 1, characterized in that: the concave structure (4) is a square groove.
5. The transmission line structure of claim 4, wherein: the side length of the square groove is less than or equal to one fourth of the wavelength corresponding to the highest working frequency.
6. The transmission line structure of claim 5, wherein: the second conductor comprises at least three square grooves;
the distance between the adjacent square grooves is less than or equal to one quarter of the wavelength corresponding to the highest working frequency;
the square grooves are located on the same side of the first conductor layer (1).
7. The transmission line structure according to claim 1, characterized in that: the dielectric layer (2) is made of flexible materials such as polytetrafluoroethylene, polyimide, liquid crystal polymer and the like.
8. The transmission line structure according to claim 1, characterized in that: the first conductor layer (1) comprises an alloy such as copper, beryllium copper or stainless steel, and/or the second conductor layer (3) comprises an alloy such as copper, beryllium copper or stainless steel.
9. The transmission line structure according to claim 1, characterized in that: the first conductor layer (1) is arranged at the top of the dielectric layer (2), and the second conductor layer (3) is arranged at the bottom of the dielectric layer (2).
10. The transmission line structure according to claim 1, characterized in that: comprises two of said second conductor layers (3);
one second conductor layer (3) is arranged at the top of the dielectric layer (2), and the other second conductor layer (3) is arranged at the bottom of the dielectric layer (2);
the first conductor layer (1) is arranged in the dielectric layer (2).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114709581A (en) * | 2022-05-31 | 2022-07-05 | 深圳小米通讯技术有限公司 | Electromagnetic wave transmission method, transmission line and terminal device |
| WO2024061107A1 (en) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | Transmission line, feed network and antenna apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514554A (en) * | 2016-01-07 | 2016-04-20 | 北京同方吉兆科技有限公司 | Inverted microstrip line structure suitable for high power transmission |
| KR20170023669A (en) * | 2015-08-24 | 2017-03-06 | 순천향대학교 산학협력단 | Multi-layer microstrip transmission line with defected ground structures and wireless circuit apparatus with the same |
| CN108206674A (en) * | 2016-12-19 | 2018-06-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | Doherty amplifiers with defect ground structure |
-
2019
- 2019-11-14 CN CN201911113361.6A patent/CN112803132B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170023669A (en) * | 2015-08-24 | 2017-03-06 | 순천향대학교 산학협력단 | Multi-layer microstrip transmission line with defected ground structures and wireless circuit apparatus with the same |
| CN105514554A (en) * | 2016-01-07 | 2016-04-20 | 北京同方吉兆科技有限公司 | Inverted microstrip line structure suitable for high power transmission |
| CN108206674A (en) * | 2016-12-19 | 2018-06-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | Doherty amplifiers with defect ground structure |
Non-Patent Citations (2)
| Title |
|---|
| JIN ZHANG ET AL.: "High-Performance Low-Pass Filter Using Stepped Impedance Resonator and Defected Ground Structure", 《ELECTRONICS》 * |
| RAJSHRI C. MAHAJAN ET AL: "Design and implementation of defected ground surface with modified co‑planar waveguide transmission line", 《RESEARCH ARTICLE》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114709581A (en) * | 2022-05-31 | 2022-07-05 | 深圳小米通讯技术有限公司 | Electromagnetic wave transmission method, transmission line and terminal device |
| WO2024061107A1 (en) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | Transmission line, feed network and antenna apparatus |
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| CN112803132B (en) | 2023-04-25 |
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