CN110661072A - Ka-band waveguide power divider - Google Patents
Ka-band waveguide power divider Download PDFInfo
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- CN110661072A CN110661072A CN201911064750.4A CN201911064750A CN110661072A CN 110661072 A CN110661072 A CN 110661072A CN 201911064750 A CN201911064750 A CN 201911064750A CN 110661072 A CN110661072 A CN 110661072A
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- metal
- power divider
- metal cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
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Abstract
The application discloses a Ka-band waveguide power divider, which comprises a metal cavity, a printed board substrate, a metal cover plate and three coaxial connectors; three small holes are formed in the periphery of the metal cavity and used for fixing the coaxial connector, and the printed board substrate is arranged inside the metal cavity; one side of the metal cavity is provided with an opening, and the cover plate covers the opening to seal the metal cavity. The power divider disclosed by the invention has the advantages of high Q value, low radiation loss and high power capacity of metal waveguide, also has the advantages of convenient integration, processing and low cost of microstrip lines, and has wide application prospect in the technical field of radio frequency communication.
Description
Technical Field
The application relates to the field of microwave devices, in particular to a Ka-band waveguide power divider.
Background
The first generation of microwave and millimeter wave systems mainly use metal waveguides as media for transmitting electromagnetic waves. The metal waveguide has the advantages of low loss, high Q value, large power capacity, good temperature stability, strong mechanical structure and the like, but as the microwave and millimeter wave systems develop towards miniaturization, light weight, multiple functions, high reliability and low cost, the metal waveguide is a three-dimensional structure, is difficult to have advantages in system integration with miniaturization requirements, is difficult to realize light weight, and has higher processing difficulty and manufacturing cost.
The substrate integrated waveguide is a novel microwave millimeter wave planar waveguide structure, and has the advantages of high Q value, low radiation loss and high power capacity of metal waveguide, and also has the advantages of processing microstrip lines and low cost. Therefore, the substrate integrated waveguide technology gradually receives attention and research of more scholars at home and abroad. The existing power divider generally has the problems of limited power capacity, low integration level and large volume, so a novel power divider needs to be provided to solve the problems.
Disclosure of Invention
The invention aims to provide a Ka-band waveguide power divider to solve the problems of limited power capacity, low integration level and large volume of the conventional power divider.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the invention provides a Ka-band waveguide power divider, which comprises a metal cavity, a printed board substrate, a metal cover plate and three coaxial connectors, wherein the metal cavity is provided with a plurality of through holes;
three small holes are formed in the periphery of the metal cavity and used for fixing the coaxial connector, and the printed board substrate is arranged inside the metal cavity; one side of the metal cavity is provided with an opening, and the metal cover plate covers the opening to seal the metal cavity;
the printed board substrate comprises a copper substrate; the copper base plate is the type of protruding font, the upper portion of copper base plate is the microwave input port, the copper base plate left and right sides respectively opens has a plurality of continuous via holes, the copper base plate lower part is the microwave output end, the microwave output end is divided into two microwave delivery outlets of equidimension by one row of via hole, the microwave input port with the port size of microwave delivery outlet equals, copper base plate middle part is equipped with two independent metal via holes of bilateral symmetry.
Preferably, the dielectric constant of the dielectric layer of the printed board substrate is 2.2, the thickness of the dielectric layer is 0.254mm, and the thickness of the metal layer on the surface of the printed board substrate is 0.018 mm.
Preferably, the outer circumference of the metal cavity is 37.7mm in length, 23.2mm in width and 10mm in height;
the length of the metal cover plate is 37.7mm, the width is 23.2mm, and the thickness is 1 mm.
Preferably, the port widths of the microwave input port and the microwave output port are 5.5 mm.
Preferably, the length of the row of vias separating the microwave output ends is 2.4 mm.
Preferably, the continuous via holes on the left side and the right side of the copper substrate sequentially comprise from top to bottom: a first row of longitudinal through holes, a second row of transverse through holes and a third row of longitudinal through holes; independent metal via hole and homonymy the third row is indulged the distance of via hole and is 1mm, and homonymy the distance of second row horizontal via hole is 2 mm.
Preferably, the diameter of the small hole is 2.6 mm.
Preferably, the coaxial connector is a SMA connector of type 2.92-KFD.
Preferably, the coaxial connector penetrates through small holes on the periphery of the metal cavity and is welded on the printed board substrate.
Preferably, the cover plate and the metal cavity are made of silver aluminum plating materials.
The invention has the beneficial effects that: the power divider provided by the invention comprises a metal cavity, a printed board substrate, a metal cover plate and a coaxial connector, wherein a through hole at a special position is arranged on the printed board substrate, and radio frequency one-to-two is completed through an integrated waveguide to realize power division or combination of Ka-band microwaves.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. In the drawings:
fig. 1 illustrates an internal structure diagram of a power divider in an embodiment of the present application;
fig. 2 is a schematic diagram illustrating an overall structure of a power divider according to an embodiment of the present application;
fig. 3 illustrates a schematic diagram of a printed board substrate according to an embodiment of the present application.
The reference numerals in the figures have the following meanings: 1. the microwave oven comprises a metal cavity, 2, a printed board substrate, 3, a coaxial connector, 4, a welding part, 5, independent metal through holes, 6, through holes, 7, a metal cover plate, 8, a first row of longitudinal through holes, 9, a second row of transverse through holes, 10, a third row of longitudinal through holes, 11, a microwave input port, 12 and a microwave output port.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In order to more clearly describe the technical scheme of the invention, the left side in fig. 3 is specially defined as upper, and the right side is specially defined as lower.
The embodiment of the invention discloses a Ka-band waveguide power divider which comprises a metal cavity 1, a printed board substrate 2, a metal cover plate 7 and three coaxial connectors 3.
Three small holes are formed in the periphery of the metal cavity 1 and used for fixing the coaxial connector 3, and the printed board substrate 2 is arranged inside the metal cavity 1; one side of the metal cavity 1 is provided with an opening, and the metal cover plate 7 covers the opening to seal the metal cavity 1; one of the three small holes is a signal access hole, the other two small holes are signal access holes, the printed board substrate 2 is fixed inside the metal cavity 1 through screws, and the metal cover plate 7 is also fixed on the metal cavity 1 through screws. The internal structure of the power divider refers to fig. 1, and the overall structure of the power divider refers to fig. 2.
The printed board substrate 2 includes a copper substrate; the copper substrate is in a convex shape, the upper portion of the copper substrate is a microwave input port 11, a plurality of continuous through holes are formed in the left side and the right side of the copper substrate respectively, the lower portion of the copper substrate is a microwave output end, the microwave output end is divided into two microwave output ports 12 with the same size through a row of through holes 6, the port sizes of the microwave input port 11 and the microwave output ports 12 are equal, and two independent metal through holes 5 which are bilaterally symmetrical are formed in the middle of the copper substrate.
The microwave input port 11 and the microwave output port 12 are respectively connected with the coaxial connector 3, in the figure 3, the diameter d of a plurality of continuous through holes is 0.4mm, the pitch p of the through holes is 0.6mm, and the through holes are arranged at equal intervals; after one microwave signal is input into the power divider, the radio frequency is divided into two by one through the integrated waveguide, and then two microwave signals are output. The power divider is not limited to the two output ports disclosed in the embodiment, and a plurality of output ports may be provided to realize one-to-many signal division. The power divider can be reversely connected to realize signal combination, a plurality of signals are input and combined into one signal to be output, and the power divider works on 27-35 GHz Ka waves.
In a preferred embodiment, the dielectric layer of the printed substrate 2 has a dielectric constant of 2.2 and a thickness of 0.254mm, and the metal layer on the surface of the printed substrate 2 has a thickness of 0.018 mm.
In one embodiment, the metal chamber 1 has an outer circumference of 37.7mm in length, 23.2mm in width and 10mm in height.
The metal cover plate 7 had a length of 37.7mm, a width of 23.2mm and a thickness of 1 mm.
In one embodiment, as shown in FIG. 3, the port widths a of the microwave input port 11 and the microwave output port 12rIs 5.5 mm. When the port arThe larger the width of (a), the lower the transmission frequency, and the smaller the width of (b), the higher the transmission frequency, which deviates from the designed range of 27 to 35 GHz.
In one embodiment, as shown in fig. 3, the length L3 of the row of vias 6 separating the microwave output ends is 2.4 mm. Larger and smaller L3 results in larger reflection coefficient and larger insertion loss.
In a preferred embodiment, the continuous via holes on the left and right sides of the copper substrate sequentially comprise from top to bottom: the distance L2 between the independent metal via hole 5 and the third row of vertical via holes 10 on the same side is 1mm, and as shown in FIG. 3, the distance L1 between the independent metal via hole 5 and the second row of horizontal via holes 9 on the same side is 2 mm. Increasing the size of L1 and L2 both leads to an increase in reflection coefficient and an increase in insertion loss.
In one embodiment, the orifice diameter is 2.6 mm. The coaxial connector 3 can partially pass through the small hole and be fixed at the position of the small hole, and the coaxial connector 3 is fixed on the side wall of the metal cavity 1 through a screw.
In one embodiment, the coaxial connector 3 is a SMA connector type 2.92-KFD.
In one embodiment, the coaxial connector 3 is inserted through a small hole on the periphery of the metal cavity 1 and soldered to the printed board substrate 2.
In summary, the present application discloses a Ka-band waveguide power divider, which includes a metal cavity, a printed board substrate, a metal cover plate, and three coaxial connectors; three small holes are formed in the periphery of the metal cavity and used for fixing the coaxial connector, and the printed board substrate is arranged inside the metal cavity; one side of the metal cavity is provided with an opening, and the cover plate covers the opening to seal the metal cavity; the printed board substrate comprises a copper substrate; the microwave oven comprises a copper substrate, a microwave input port, a microwave output port and a microwave output port. The power divider disclosed by the invention has the advantages of high Q value, low radiation loss and high power capacity of metal waveguide, also has the advantages of convenient integration, processing and low cost of microstrip lines, and has wide application prospect in the technical field of radio frequency communication.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes, substitutions or improvements within the technical scope of the present invention, and all such changes, substitutions or improvements are included in the scope of the present invention.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Claims (10)
1. A Ka-band waveguide power divider is characterized by comprising a metal cavity, a printed board substrate, a metal cover plate and three coaxial connectors;
three small holes are formed in the periphery of the metal cavity and used for fixing the coaxial connector, and the printed board substrate is arranged inside the metal cavity; one side of the metal cavity is provided with an opening, and the metal cover plate covers the opening to seal the metal cavity;
the printed board substrate comprises a copper substrate; the copper base plate is the type of protruding font, the upper portion of copper base plate is the microwave input port, the copper base plate left and right sides respectively opens has a plurality of continuous via holes, the copper base plate lower part is the microwave output end, the microwave output end is divided into two microwave delivery outlets of equidimension by one row of via hole, the microwave input port with the port size of microwave delivery outlet equals, copper base plate middle part is equipped with two independent metal via holes of bilateral symmetry.
2. The power divider of claim 1, wherein the dielectric layer of the printed board substrate has a dielectric constant of 2.2 and a thickness of 0.254mm, and the thickness of the metal layer on the surface of the printed board substrate is 0.018 mm.
3. The power divider of claim 1, wherein the metal cavity has an outer circumference length of 37.7mm, a width of 23.2mm, and a height of 10 mm;
the length of the metal cover plate is 37.7mm, the width is 23.2mm, and the thickness is 1 mm.
4. The power divider of claim 1, wherein the port widths of the microwave input port and the microwave output port are 5.5 mm.
5. The power divider of claim 1, wherein a row of vias separating the microwave output ends is 2.4mm in length.
6. The power divider of claim 1, wherein the continuous via holes on the left and right sides of the copper substrate sequentially comprise, from top to bottom: a first row of longitudinal through holes, a second row of transverse through holes and a third row of longitudinal through holes; independent metal via hole and homonymy the third row is indulged the distance of via hole and is 1mm, and homonymy the distance of second row horizontal via hole is 2 mm.
7. The power divider of claim 1, wherein the aperture has a diameter of 2.6 mm.
8. The power divider of claim 1, wherein the coaxial connector is a SMA contact model 2.92-KFD.
9. The power divider of claim 1, wherein the coaxial connector is soldered to the printed board substrate through a small hole around the metal cavity.
10. The power divider of claim 1, wherein the cover plate and the metal cavity are made of silver aluminum plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911064750.4A CN110661072A (en) | 2019-11-04 | 2019-11-04 | Ka-band waveguide power divider |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911064750.4A CN110661072A (en) | 2019-11-04 | 2019-11-04 | Ka-band waveguide power divider |
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| CN110661072A true CN110661072A (en) | 2020-01-07 |
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| CN201911064750.4A Pending CN110661072A (en) | 2019-11-04 | 2019-11-04 | Ka-band waveguide power divider |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114976556A (en) * | 2022-05-23 | 2022-08-30 | 赛莱克斯微系统科技（北京）有限公司 | Micro-electromechanical system (MEMS) micro-coaxial power divider |
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| CN203326077U (en) * | 2013-06-27 | 2013-12-04 | 中国人民解放军理工大学 | Coplanar waveguide feed substrate integration waveguide broadband power divider |
| CN106374179A (en) * | 2016-09-21 | 2017-02-01 | 哈尔滨工业大学 | Via-hole-loaded half-mode substrate integrated waveguide power divider |
| CN106785288A (en) * | 2016-12-21 | 2017-05-31 | 中国航空工业集团公司雷华电子技术研究所 | A kind of three layers of multi-channel microwave power synthesis system based on substrate integration wave-guide |
| CN209487685U (en) * | 2019-02-20 | 2019-10-11 | 南京博翔电子有限公司 | A kind of moisture-proof microstrip power divider |
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2019
- 2019-11-04 CN CN201911064750.4A patent/CN110661072A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203326077U (en) * | 2013-06-27 | 2013-12-04 | 中国人民解放军理工大学 | Coplanar waveguide feed substrate integration waveguide broadband power divider |
| CN106374179A (en) * | 2016-09-21 | 2017-02-01 | 哈尔滨工业大学 | Via-hole-loaded half-mode substrate integrated waveguide power divider |
| CN106785288A (en) * | 2016-12-21 | 2017-05-31 | 中国航空工业集团公司雷华电子技术研究所 | A kind of three layers of multi-channel microwave power synthesis system based on substrate integration wave-guide |
| CN209487685U (en) * | 2019-02-20 | 2019-10-11 | 南京博翔电子有限公司 | A kind of moisture-proof microstrip power divider |
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| CN114976556A (en) * | 2022-05-23 | 2022-08-30 | 赛莱克斯微系统科技（北京）有限公司 | Micro-electromechanical system (MEMS) micro-coaxial power divider |
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Application publication date: 20200107 |