CN218997043U

CN218997043U - Ultra-low temperature high-density microwave attenuator bundling assembly

Info

Publication number: CN218997043U
Application number: CN202223018231.4U
Authority: CN
Inventors: 刘银银
Original assignee: Nanjing Hmc System Co ltd
Current assignee: Nanjing Hmc System Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-05-09
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses an extremely low temperature high density microwave attenuator bundling assembly, which comprises a bundling main body, wherein a cavity is arranged on the bundling main body; an attenuator disposed within the chamber; and one end of each connector is connected with two ends of the attenuator, and one end of each connector is positioned outside the chamber. The microwave attenuators are arranged together through the bundling component, the size and the occupied area of the device are reduced, the processing and the installation are easy, the purposes of small-size high-density integration and stable and reliable attenuation performance are realized, and the device can work in a limited low-temperature magnetic-free environment by adopting copper materials.

Description

Ultra-low temperature high-density microwave attenuator bundling assembly

Technical Field

The utility model belongs to the technical field of microwave attenuators, and particularly relates to an extremely low-temperature high-density microwave attenuator bundling assembly.

Background

In a quantum computing device, microwave components, particularly a microwave attenuator, are required to be used in a dilution refrigerator, and a low-noise microwave signal is required to be transmitted to a qubit. With the development of the quantum bit, the existing dilution refrigerator needs to apply more microwave components, so that the internal space of the dilution refrigerator is extremely tight. The advantages of high integration, high heat dissipation, no magnetism and the like of the cluster assembly have become the mainstream technology of a quantum application high-density integration scheme.

Compared with the existing microwave attenuator, the microwave attenuator provided by the utility model has the advantages that the small-sized high-density integration is realized, the structure is more compact, the volume and the use area of the device are reduced, the processing and the installation are easy, and the good performance can be maintained under the extreme temperature magnetic environment-free environment.

Disclosure of Invention

The utility model aims to provide an extremely low-temperature high-density microwave attenuator bundling assembly so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an ultra-low temperature high density microwave attenuator cluster assembly comprises

The bundling device comprises a bundling main body, wherein a cavity is arranged on the bundling main body;

an attenuator disposed within the chamber;

and one end of each connector is connected with two ends of the attenuator, and one end of each connector is positioned outside the chamber.

Preferably, the chamber is provided throughout the bundle body.

In any of the above schemes, preferably, the attenuator is provided with an attenuation cavity, two ends of the attenuation cavity are both provided with openings, an attenuation sheet is arranged in the attenuation cavity, and two ends of the attenuation sheet are respectively connected with the two connectors through welding pins.

In any of the above embodiments, it is preferable that the bonding wire is disposed in the attenuation chamber.

In any of the above embodiments, it is preferable that the bundle body is made of a copper material.

In any of the above embodiments, it is preferable that the attenuation chamber is made of a copper material.

In any of the above embodiments, it is preferable that the connector uses an air medium.

In any of the above aspects, preferably, the connector is made of a copper material.

In any of the above embodiments, it is preferable that the bonding wire is made of copper material.

The utility model has the technical effects and advantages that: the utility model realizes high density formation and can still maintain good performance in a non-magnetic environment at a limit low temperature. In addition, the whole device has simple parts, is easy to assemble and is easy for mass production. In 300K environment, the attenuation value reaches 0+ -0.5 dB, and the return loss reaches below-18 dB; when the environment is at the limit low temperature of 77K, the attenuation value reaches 0+/-0.7 dB, the echo loss can reach below-18 dB, and the index is still better

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a top view of the bundling body according to the present utility model;

fig. 3 is a schematic structural view of the attenuator and the connector of the present utility model.

In the figure: 1. a bundling body; 2. a connector; 3. a chamber; 4. an attenuator; 5. an attenuation sheet; 6. an attenuation chamber.

Detailed Description

The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

The utility model provides a bundling assembly of a very low temperature high density microwave attenuator, as shown in figures 1-3, comprising

The bundling main body 1 is made of copper materials, a cavity 3 is arranged on the bundling main body 1, and the cavity 3 is arranged to penetrate through the bundling main body 1;

an attenuator 4 disposed in the chamber 3 and located in the middle;

the two connectors 2, the connector 2 adopts air medium, the connector 2 is made by copper material, its one end is connected with the both ends of attenuator 4 respectively, and the one end of connector 2 is located the outside of cavity 3, be provided with decay chamber 6 on the attenuator 4, decay chamber 6 is made by copper material, and the both ends in decay chamber 6 all set up to the opening, the inside attenuation piece 5 and the welding needle of being provided with of decay chamber 6, the welding needle is made by copper material, the both ends of attenuation piece 5 are connected with two connectors 2 through the welding needle respectively.

The utility model adopts the ultra-low temperature high density microwave attenuator bundling component, so that the microwave attenuator still keeps good performance in the extreme low temperature environment, and the low temperature index of the whole bundling component is ensured. And a plurality of microwave attenuators are arranged together by adopting a bundling assembly, so that the volume and the use area of the device are reduced. The structural design of the microwave attenuator bundling assembly ensures that the whole structure of the microwave attenuator is very firm and reliable; and the parts forming the attenuator are simple, and the assembly and the debugging and the mass production are easy.

The device still has excellent performance indexes under the extreme low-temperature environment. In 300K environment, the attenuation value reaches 0+ -0.5 dB, and the return loss reaches below-18 dB; when the environment is at the limit low temperature of 77K, the attenuation value reaches 0+/-0.7 dB, the echo loss can reach below-18 dB, and all indexes are still better.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims

1. An extremely low temperature high density microwave attenuator bundling assembly which is characterized in that: comprising

A bundling main body (1), wherein a cavity (3) is arranged on the bundling main body (1);

an attenuator (4) provided in the chamber (3);

and one end of each connector (2) is connected with two ends of the attenuator (4), and one end of each connector (2) is positioned outside the chamber (3).

2. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 1, wherein: the cavity (3) is arranged to penetrate through the bundling main body (1).

3. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 1, wherein: the attenuator is characterized in that an attenuation cavity (6) is arranged on the attenuator (4), two ends of the attenuation cavity (6) are both provided with openings, an attenuation sheet (5) is arranged inside the attenuation cavity (6), and two ends of the attenuation sheet (5) are respectively connected with the two connectors (2) through welding needles.

4. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 3, wherein: the welding needle is arranged in the attenuation cavity (6).

5. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 1, wherein: the bundling main body (1) is made of copper materials.

6. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 3, wherein: the attenuation chamber (6) is made of copper material.

7. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 1, wherein: the connector (2) adopts an air medium.

8. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 1, wherein: the connector (2) is made of copper material.

9. The ultra-low temperature and high density microwave attenuator cluster assembly of claim 3, wherein: the welding needle is made of copper materials.