CN213814763U - Universal type dilution refrigerator multi-channel extensible signal measuring device - Google Patents

Abstract

The utility model discloses a general type dilutes expanded type signal measurement device of refrigerator multichannel, the part is built in the dewar of dilution refrigerator, the dewar is according to the temperature of different levels, and top-down divide into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer, adopts the cold plate to separate between each layer, measuring device includes quantum chip, ultra-low temperature attenuator subassembly, ultra-low temperature low pass filter subassembly, parametric amplifier, ultra-low temperature integrated form direct current biasing ware, ultra-low temperature infrared filter subassembly, integrated form connector, ultra-low temperature circulator/isolator subassembly and integrated cable subassembly; the parametric amplifier, the ultra-low temperature circulator/isolator assembly, the ultra-low temperature integrated DC biaser are all disposed on the 100mK layer. The utility model discloses under the unchangeable prerequisite of refrigerator refrigerating capacity, the quantity of extension passageway and device by a wide margin realizes the quantum computation measurement of 100 bits.

Description

Universal type dilution refrigerator multi-channel extensible signal measuring device

Technical Field

The utility model relates to an expanded type signal measurement device of general type dilution refrigerator multichannel belongs to many bits quantum computing technology field.

Background

In recent years, with the continuous development of semiconductor technology, the size and the number of transistor devices integrated on a semiconductor chip are smaller and larger, the quantum effect caused by the electronic fluctuation is prominent, and the integrated circuit technology faces the technical limit. Moreover, despite the multiplied processing speed of computers, some problems remain that are not solved at all by computers today. For this reason, new computing techniques must be developed. Quantum computing, which has emerged at the end of the last century, is one of the solutions. Because quantum computing is based on quantum mechanics, the inherent parallelism makes it possible to solve problems that some classical computers cannot solve. Therefore, the method has important research significance and huge application prospect. At present, quantum computing has become a very popular research area today.

Since various quantum computing schemes have been proposed, superconducting qubits are currently the most rapidly developing scheme in quantum computing. With the rapid increase of qubit integration, the capacity requirements for cryocooler measurement systems are also expanding. The refrigerating capacity of the existing refrigerating machine only meets the requirement of 20Qubit quantum calculation. The expansion is carried out on the basis of the original refrigerating capacity, so that the refrigerating capacity can adapt to more quanta such as 100Qubit, the investment of a high dilution refrigerator is avoided, and the refrigerating capacity is an increasingly multi-user choice.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an expanded type signal measurement device of general type dilution refrigerator multichannel to solve the problem that refrigerator measurement system capacity is not enough among the prior art. Through the low temperature performance characteristics that combine different materials, structure, for the refrigerating output that adapts to current refrigerator, the utility model discloses a superconducting material that heat conduction performance is high reduces the size of key device, carries out appropriate transformation to the measurement system of refrigerator for 80 cables that the refrigerator bore extend to 240, and then satisfy the quantum computing system requirement within 100-Qubit.

The utility model discloses specifically adopt following technical scheme: a general type dilution refrigerator multichannel extensible signal measuring device is partially built in a Dewar of a dilution refrigerator, the Dewar is divided into a 300K layer, a 50K layer, a 4K layer, a 1K layer, a 100mK layer and a 10mK layer from top to bottom according to the temperatures of different levels, each layer is separated by a cold plate, and the measuring device comprises a quantum chip, an ultra-low temperature attenuator assembly, an ultra-low temperature low-pass filter assembly, a parameter amplifier, an ultra-low temperature integrated direct current bias device, an ultra-low temperature infrared filter assembly, an integrated connector, an ultra-low temperature circulator/isolator assembly and an integrated cable assembly; the 300K layers of cold discs are used as vacuum covers, each layer of cold discs is provided with a hot sink disc, and the integrated connector assembly penetrating plate is arranged on the hot sink discs;

the parametric amplifier, the ultra-low temperature circulator/isolator assembly, the ultra-low temperature integrated DC biaser are all disposed on the 100mK layer.

As a preferred embodiment, a shielding barrel and a shielding cover are arranged below the 10mK layer cooling plate, and the 10mK layer cooling plate and the shielding cover are connected through a first hanging rack; an aluminum cover is arranged below the shielding cover, an aluminum support is arranged inside the shielding barrel, and the aluminum support and the aluminum cover are connected through a second hanging frame; a quantum chip printed board is arranged above the aluminum support, and a copper plate is arranged below the aluminum support; the quantum chip is fixedly sealed on the quantum chip printed board, and a shielding box is arranged above the quantum chip; the quantum chip printed board is provided with a plurality of multi-channel integrated sockets, and the quantum chip and the multi-channel integrated sockets are connected through a wire on the quantum chip printed board; the ultra-low temperature infrared filter assembly penetrating plate is arranged on the aluminum cover and the shielding cover, a multi-core adapter is arranged below the ultra-low temperature infrared filter assembly, and the multi-core adapter is fixedly connected to the aluminum cover; the integrated connector subassembly below on 10mK layer is equipped with ultra-low temperature attenuator subassembly, ultra-low temperature low pass filter subassembly in proper order, 10mK layer integrated connector ultra-low temperature attenuator subassembly ultra-low temperature low pass filter subassembly is to inserting the formula and connecting.

In a preferred embodiment, the ultra-low temperature low pass filter assembly is connected to the ultra-low temperature infrared filter assembly through a flexible cable braided by tin-impregnated copper; the multi-core adapter is connected to the multi-channel integrated socket through a tin-impregnated copper braided flexible cable.

As a preferred embodiment, the integrated connector assembly adopts a 13-core combined plug module, and includes a first heat sink plate, an SSMP connector, an SSMP installation clamping groove, a first installation screw hole, and a connector installation hole, wherein an external thread is provided on a housing of the SSMP connector, and an SSMP installation clamping groove convenient for installation of a torque wrench is provided at a joint of the SSMP connector; a plurality of connector mounting holes are formed in the hot sink plate, and an internal thread matched with the external thread of the SSMP connector shell is formed in each connector mounting hole; the SSMP connector rotates to the inside of the heat sink plate to complete installation; the heat sink plate is provided with a plurality of first mounting screw holes, and the integrated connector assembly is connected with other assemblies and then fixed through screws mounted in the first mounting screw holes.

As a preferred embodiment, the integrated cable assembly comprises any one or more of the following: stainless steel cable assemblies for 300K and 50K layers; niobium-titanium cable components for 4K layers and below; silver-plated copper flexible cables woven with conventional tin-impregnated copper in a 10mK layer were used.

As a preferred embodiment, the niobium-titanium cable assembly comprises a second heat sink plate, a niobium-titanium cable, a second mounting screw hole, a second mounting screw and a cable connector, wherein the cable connector adopts an SSMP connector, two groups of niobium-titanium cable assemblies are connected with one group of integrated connector assemblies in an opposite insertion manner, and the second mounting screw penetrates through the second mounting screw hole to be connected with the integrated connector assemblies; the niobium-titanium cable is provided with a bending area in the middle part and is used for preventing the niobium-titanium cable from being broken due to shortening at ultralow temperature after being bent.

As a preferred embodiment, the ultra-low temperature circulator/isolator assembly comprises a third mounting screw, a third upper cover plate, an ultra-low temperature circulator, a cavity, a third lower cover plate, an ultra-low temperature isolator, a baffle plate, a boss, a third mounting hole and a threaded hole;

a third upper cover plate is arranged on the upper side of the cavity, a third lower cover plate is arranged on the lower side of the cavity, third through mounting holes are formed in the third upper cover plate and the third lower cover plate, and threaded holes are formed in the cavity corresponding to the third mounting holes; the cavity, the third upper cover plate and the third lower cover plate are detachably connected through third mounting screws; a baffle is arranged in the middle of the cavity, the baffle divides the cavity into an upper layer and a lower layer, a boss is arranged in the center of the baffle, the upper end face of the boss and the upper surface of the cavity are in the same plane, and the lower end face of the boss and the lower surface of the cavity are in the same plane; the cavity with be equipped with a plurality of ultra-low temperature isolator and a plurality of ultra-low temperature circulator between the third upper cover plate, the cavity with be equipped with a plurality of ultra-low temperature isolator and a plurality of ultra-low temperature circulator under the third between the apron, ultra-low temperature circulator and ultra-low temperature isolator distribute around the boss inside the cavity.

As a preferred embodiment, the ultra-low temperature integrated dc biaser comprises: the fourth upper cover plate, the direct current biaser printed board, the direct current biaser cavity, the front side connector, the fourth lower cover plate, the rear side connector, the separation plate, the baffle and the lead;

the direct current biaser cavity is detachably connected with the fourth upper cover plate and the fourth lower cover plate; the direct current biaser cavity is an I-shaped cavity which is laterally placed, a partition plate is arranged in the direct current biaser cavity, and the direct current biaser cavity is divided into an upper layer and a lower layer by the partition plate; the upper layer of the cavity of the direct current biaser is provided with a plurality of baffles which divide the upper layer of the cavity of the direct current biaser into a plurality of chambers; a plurality of front side connectors for signal transmission are arranged on the front side of the direct current biaser cavity, and the front side connectors are fixed on the front side of the direct current biaser cavity; the direct current biaser comprises a direct current biaser cavity, and is characterized in that a plurality of rear side connectors for signal transmission are arranged on the rear side of the direct current biaser cavity, the rear side connectors are fixed on the rear side of the direct current biaser cavity, each cavity of the direct current biaser cavity is correspondingly configured with the front side connector and the rear side connector one by one, a direct current biaser printed board is arranged in each cavity, and the front side connector and the rear side connector are welded on the corresponding direct current biaser printed boards.

As a better embodiment, a through hole is formed in the left side of the partition plate and is communicated with the upper layer and the lower layer of the cavity of the direct current biaser, and a groove for wiring is formed in the baffle; a micro-rectangular electric connector is arranged on the left side of the cavity of the direct current biaser, and one end of the micro-rectangular electric connector is connected with a lead; and the lead provides direct current bias voltage for the printed board of the direct current biaser through the through hole of the separation plate and the groove of the baffle plate.

As a better embodiment, the ultra-low temperature infrared filter assembly comprises an ultra-low temperature infrared filter, a heat sink disc upper cavity, a heat sink disc lower cavity, a fifth mounting screw hole, ultra-low temperature infrared filter mounting holes, an ultra-low temperature infrared filter connector and assembly mounting screws, wherein the heat sink disc upper cavity and the heat sink disc lower cavity are detachably connected through the fifth mounting screw, the heat sink disc upper cavity and the heat sink disc lower cavity are respectively provided with a plurality of ultra-low temperature infrared filter mounting holes, the ultra-low temperature infrared filter is mounted in the ultra-low temperature infrared filter mounting holes in the heat sink disc, and the ultra-low temperature infrared filter connector adopts an SSMP connector; a fifth through mounting screw hole is formed in the cavity of the hot sink plate, and the fifth mounting screw is connected with the fifth mounting screw hole; the assembled ultralow-temperature integrated infrared filter is connected with the integrated connector component in a plug-in mode.

The utility model discloses the beneficial effect who reaches: first, the utility model discloses an extensible type signal measurement device of general type dilution refrigerator multichannel lets the refrigerator can adapt to more qubits, for example 100-Qubit, has avoided the input of high dilution refrigerator. Second, the utility model discloses a after the device modularization, measuring device overall structure in the refrigerator dewar becomes very clear and clean and tidy, has simplified the installation of system greatly, has made things convenient for the system maintenance in later stage. Third, the utility model discloses the processing of integrating has been carried out to connector on the heat sink plate, for two kinds of connector modules have been designed to the integrated form connector, have expanded connector quantity on the heat sink plate has satisfied the installation of modularization device, and the later maintenance and the change of connector. Fourth, the utility model discloses integrated form connector of integrated on the vacuum lid adopts the design of gas tightness connector, guarantees entire system's gas tightness requirement. Fifth, the utility model discloses an integrated form cable subassembly, ultra-low temperature attenuator, ultra-low temperature low pass filter, ultra-low temperature infrared filter adopt same combination plug design, the adaptation of being convenient for with integrated form connector. Sixth, the utility model discloses a quantum chip seals admittedly on quantum chip printing board to adopt the encapsulation of shielding box, reduce external magnetic field to the interference of quantum chip. Seventh, the utility model discloses a quantum chip adopts high dielectric constant panel, increases wiring density, reduces the chip area. Eighth, the utility model discloses a quantum chip adopts multiply wood structure, increases the isolation between the transmission line. The multi-channel integrated socket is arranged on the periphery of the quantum chip and connected with the quantum chip, and the number of the sockets meets the use requirement of a 100Qubit quantum chip. Ninth, the utility model discloses a 10mK layer below is equipped with the shielding bucket, further reduces the interference of external magnetic field to quantum chip, the shielding effect of shielding bucket for reaching the preferred, the utility model discloses an add one deck aluminium system shielding bucket in the shielding bucket to increase the magnetic screen material upper cover. Tenth, the utility model discloses a measuring device includes parametric amplifier, parametric amplifier ultra-low temperature circulator with ultra-low temperature isolator places on 100mK layer, keeps away from quantum chip, reduces the interference of reading out to the qubit, places the shielding box for quantum chip and vacates sufficient space.

Drawings

Fig. 1 is a schematic view showing a 13-core combination plug module according to the present invention;

fig. 2 is a schematic structural diagram of an integrated niobium-titanium cable assembly according to the present invention;

FIG. 3 is an enlarged partial schematic view at H in FIG. 2;

FIG. 4 is a schematic view of FIG. 2 taken along line A;

FIG. 5 is a schematic structural view of the ultra-low temperature circulator/isolator assembly of the present invention;

fig. 6 is a schematic structural diagram of the ultra-low temperature integrated dc bias device of the present invention;

fig. 7 is a schematic structural diagram of the ultra-low temperature integrated infrared filter assembly of the present invention;

fig. 8 is the internal layout diagram of the 10mK layer shielding barrel of the present invention.

The meanings of the symbols in the figures: 101-a first hot sink plate; 102-SSMP connector; 103-SSMP mounting card slot; 104-a first mounting screw hole; 105-connector mounting holes; 201-a second hot sink plate; 202-niobium titanium cable; 203-a second mounting screw hole; 204-a second mounting screw; 205-cable connector; 301-third mounting screws; 302-a third upper cover plate; 303-ultra low temperature circulator; 304-a cavity; 305-a third lower cover plate; 306-ultra low temperature separator; 307-baffles; 308-a boss; 309-third mounting hole; 310-a threaded hole; 311-pins; 312-pin hole; 313 — a first port; 314-a second port; 315-third port; 401-fourth mounting screw; 402-a fourth upper cover plate; 403-capacitance; 404-tapered inductor; 405-a dc biaser printed board; 406-a fourth pin hole; 407-a dc biaser cavity; 408-a front side connector; 409-front side connector fastening screw; 410-micro rectangular electrical connectors; 411-micro rectangular electrical connector fastening screws; 412-fourth pin; 413-a fourth lower cover plate; 414-tapered inductance; 415-a capacitance; 416-lower cover plate fastening screws; 417-rear side connector fastening screw; 418-rear side connector; 419-lower dc biaser printed board; 420-a partition plate; 421-a baffle plate; 422-conducting wire; 501-ultralow temperature infrared filter; 502-heat sink plate upper cavity; 503-heat sink plate lower cavity; 504-fifth mounting screw; 505-a fifth mounting screw hole; 506-ultralow temperature infrared filter mounting holes; 507-ultralow temperature infrared filter joint; 508-component mounting screws; 601-10mK cold plate; 602-a shield can; 603-a shield cover; 604-a first pylon; 605-aluminum support; 606-quantum chip printed boards; 607-copper plate; 608-quantum chip; 609-a shielding box; 610-shield box mounting screws; 611-mounting screw holes of the shielding box; 612-multi-channel integrated socket; 613-aluminum cover; 614-shield cover mounting screws; 615-a second pylon; 616-an ultra-low temperature infrared filter assembly; 617-dip tin copper braided flexible cable; 618-ultra low temperature attenuator assembly; 619-an ultra-low temperature low pass filter assembly; 620-component mounting screws; 621-a multi-core adapter; 622-mounting screws; 623-10mK layer integrated connector assembly; 624-shield cover mounting screw holes.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In the description of the present invention, it should be understood that the terms "upper", "middle", "lower", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Example 1: the utility model provides a general dilution refrigerator multi-channel expandable signal measuring device, wherein a low-temperature part is built in a Dewar of the dilution refrigerator; the dewar is according to the temperature of different levels, and top-down can be divided into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer, adopts the cold dish to separate between every layer, measuring device includes quantum chip, ultra-low temperature attenuator subassembly, ultra-low temperature low pass filter subassembly, parametric amplifier, ultra-low temperature integrated form direct current bias ware, ultra-low temperature infrared filter subassembly, integrated form connector component, ultra-low temperature circulator/isolator subassembly and integrated cable assembly. The ultra-low temperature circulator/isolator assembly prevents reflected signals from being fed into the quantum chip, and improves matching of input and output of the chip and signal interference. The ultra-low temperature direct current biaser adds direct current bias to the radio frequency output signal. The ultra-low temperature circulator/isolator assembly is packaged by adopting a magnetic shielding material, and the influence of the magnetic field of the ultra-low temperature circulator/isolator assembly on the outside is effectively reduced.

Optionally, the low-temperature part of the measuring device is designed in vacuum; a 300K layer cold plate is used as a vacuum cover; heat sink discs are arranged on the temperature layer cold discs; the through plate is arranged on the hot sink plate; the integrated cable assembly is divided into three types, one being a stainless steel cable used in 50K and room temperature layers, the other being a NbTi (niobium titanium) cable suitable for 4K layers and below and the last being a silver-plated copper flexible cable braided with conventional tin-impregnated copper used in 10mK layers. The application of the stainless steel cable assembly in 50K and 300K layers can reduce the heat conduction effect from room temperature to 50K layers. The inner diameter of the NbTi cable assembly is as small as possible. The NbTi cable component is in a superconducting state below a 4K layer, and the minimum signal attenuation and thermal noise influence are ensured. The flexible cable assembly woven by the tin-impregnated copper is convenient to bend and is convenient to connect with a 10mK layer of wiring with limited space.

Optionally, the working temperature of the ultralow temperature device is as low as-273 ℃; the ultralow temperature devices are all miniaturized integrated devices; the ultra-low temperature integrated direct current biaser adopts a cavity-divided design; the printed board of the ultralow temperature integrated direct current biaser adopts a high dielectric constant board; the ultra-low temperature integrated direct current bias device cavity is made of nonmagnetic copper; the ultra-low temperature circulator/isolator assembly is encapsulated with an iron-nickel alloy.

The NbTi cable component is below a 4K temperature layer, has superconducting characteristics, small inner diameter and good surface heat sink effect; the integrated connector components are SSMP connectors; the SSMP joint is made of non-magnetic beryllium bronze; the SSMP connector has the advantages of small volume, stable connection, best pluggable frequency in the miniature connector, mature technology and capability of effectively transferring heat on a device to the heat sink plate. The integrated connector assembly integrated on the vacuum cover adopts an air tightness design; the integrated connector assembly can be broken down into 12-core and 13-core combination plug designs.

Optionally, the integrated cable assembly, the ultra-low temperature attenuator assembly, the ultra-low temperature low-pass filter assembly, the ultra-low temperature infrared filter assembly and the integrated connector assembly all adopt the same combined plug design; the parametric amplifier, the ultra-low temperature circulator/temperature isolator assembly and the ultra-low temperature integrated direct current biaser are all placed on a 100mK layer.

The quantum chip test circuit board uses a plurality of layers of high dielectric constant plates and an optimized wiring structure to improve crosstalk between signal lines; the quantum chip is provided with four multi-channel integrated sockets connected with the quantum chip, and the requirement of up to 100-bit quantum computation is met. A shielding box is arranged above the quantum chip; an electromagnetic signal shielding barrel is arranged below the 10mK layer, and a special magnetic shielding material mu-metal is adopted, so that the diameter and the high ratio of the magnetic shielding structure are required to be kept more than 1: 4. In view of the 10mK temperature layer height limitation of the dilution refrigerator, in order to achieve a better magnetic shielding effect, a shielding cover is added on the top of the shielding barrel, and the shielding of external magnetic field energy is realized. The shielding barrel is additionally provided with the layer of aluminum shielding barrel inside the shielding barrel, and the purpose is to utilize the superconducting property of aluminum, so that an external weak magnetic field cannot penetrate through the shielding barrel inside an aluminum shell, and the shielding of external electromagnetic signals is further enhanced.

Example 2: as shown in fig. 1, the integrated connector assembly of the present invention employs a 13-core modular plug module. The SSMP hot sink comprises a first hot sink plate 101, an SSMP connector 102, an SSMP mounting clamping groove 103, a first mounting screw hole 104 and a connector mounting hole 105. The internal structure of SSMP connector 102 and its connectors are consistent with standard SSMP connectors. An outer thread is arranged on the shell of the SSMP connector 102, and an SSMP mounting clamping groove 103 convenient for mounting a torque wrench is arranged at the joint. The first heat sink plate 101 has 26 connector mounting holes 105 formed therein, each connector mounting hole having internal threads that mate with the threads of the shell of the SSMP connector 102. When the device is installed, the SSMP connector 102 is rotated into the first heat sink plate 101 by using a special wrench. The first heat sink plate 101 is provided with 2 first mounting screw holes 104, and the integrated connector assembly can be fixed by screws mounted in the first mounting screw holes 104 after being connected with other assemblies. The integration manner of the integrated connector assembly includes but is not limited to this embodiment.

Example 3: as shown in fig. 2, fig. 3 and fig. 4, the integrated niobium-titanium cable assembly of the present invention includes a second heat sink plate 201, a niobium-titanium cable 202, a second mounting screw hole 203, a second mounting screw 204, and a cable connector 205. The cable connector 205 is an SSMP connector, and the two sets of integrated niobium-titanium cable assemblies can be connected with one set of integrated connector assembly in a plug-in manner, and the second mounting screw 204 is connected with the first mounting screw hole 104 through the second mounting screw hole 203. The niobium-titanium cable 202 is provided with a bending region H in the middle portion, and the niobium-titanium cable 202 can be prevented from being broken due to shortening at ultralow temperature after bending. The integrated stainless steel cable assembly employs a connection structure identical to that of the present embodiment.

Example 4: as shown in fig. 5, the ultra-low temperature circulator/isolator assembly of the present invention includes a third mounting screw 301, a third upper cover plate 302, an ultra-low temperature circulator 303, a cavity 304, a third lower cover plate 305, an ultra-low temperature isolator 306, a baffle 307, a boss 308, a third mounting hole 309, a threaded hole 310, a pin 311, a pin hole 312, a first port 313, a second port 314, and a third port 315.

The upside of the cavity 304 is provided with a third upper cover plate 302, the underside of the cavity 304 is provided with a third lower cover plate 305, the third cover plate 302 and the third lower cover plate 305 are both provided with a through third mounting hole 309, and the cavity 304 is provided with a threaded hole 310 corresponding to the third mounting hole. The cavity 304 and the third upper cover plate 302 and the third lower cover plate 305 are detachably connected by a third mounting screw 301. The middle of the cavity 304 is provided with a baffle 307, the cavity 304 is divided into an upper layer and a lower layer by the baffle 307, and the center of the baffle 307 is provided with a boss 308. The upper end surface of the boss 308 and the upper surface of the cavity 304 are in the same plane, and the lower end surface of the boss 308 and the lower surface of the cavity 304 are in the same plane. Be equipped with 2 ultra-low temperature separators 306 and 1 ultra-low temperature circulator 303 between cavity 304 and third upper cover plate 302, be equipped with 2 ultra-low temperature separators 306 and 1 ultra-low temperature circulator 303 between cavity 304 and the third lower cover plate 305, ultra-low temperature circulator 303 and ultra-low temperature separator 306 are around boss 308 distribution inside cavity 304. The third mounting screw 301 is made of a non-magnetic copper material, and the cavity 304, the third upper cover plate 302 and the third lower cover plate 305 are made of iron-nickel soft magnetic alloy, so that a magnetic field inside the component can be effectively shielded inside the cavity 304, and the influence on the outside is reduced. The upper surface and the lower surface of the cavity 304 are respectively provided with a pin 311, the corresponding positions of the third upper cover plate 302 and the third lower cover plate 305 are provided with pin holes 312, and the pins 311 are matched with the pin holes 312 to prevent the displacement between the cavity 304 and the third upper cover plate 302 and the third lower cover plate 305 in the mounting and locking process.

Example 5: as shown in fig. 6, the ultra-low temperature integrated dc offset device of the present invention includes a fourth mounting screw 401, a fourth upper cover plate 402, an upper capacitor 403, an upper tapered inductor 404, a dc offset device printed board 405, an upper cover plate pin hole 406, a dc offset device cavity 407, a front side connector 408, a front side connector fastening screw 409, a micro-rectangular electrical connector 410, a micro-rectangular electrical connector fastening screw 411, a lower cover plate pin 412, a fourth lower cover plate 413, a lower tapered inductor 414, a lower capacitor 415, a lower cover plate fastening screw 416, a rear side connector fastening screw 417, a rear side connector 418, a lower dc offset device printed board 419, a separation plate 420, and a baffle 421; and a conductive line 422.

The dc biaser chamber 407 is removably coupled to the fourth upper cover plate 402 and the fourth lower cover plate 413. The direct current biaser cavity 407 is an i-shaped cavity placed on the side, a separation plate 420 is arranged in the direct current biaser cavity 407, and the direct current biaser cavity 407 is divided into an upper layer and a lower layer by the separation plate 420. The upper layer of the dc biaser chamber 407 is provided with 4 baffles 421, which divide the upper layer of the dc biaser chamber 407 into 5 chambers. A plurality of front side connectors 408 for signal transmission are provided on the front side of the dc biaser cavity 407, and the front side connectors 408 are fixed to the front side of the dc biaser cavity 407 by front side connector fastening screws 409. A rear connector 418 for signal transmission is arranged at the rear side of the dc biaser cavity 407, and the rear connector 418 is fixed at the rear side of the dc biaser cavity 407 by a rear connector fastening screw 417. Each configured in one-to-one correspondence with a front side connector 408 and a rear side connector 418. Inside the chamber is a dc biaser printed board 405, and a front side connector 408 and a rear side connector 418 are soldered to the corresponding dc biaser printed board 405. The number of chambers may be reduced or increased depending on the particular environment of use.

The left side of the partition plate 420 is provided with a through hole which is communicated with the upper layer and the lower layer of the direct current biaser cavity 407. The shield 421 is provided with a groove for wiring. A micro-rectangular electrical connector 410 is arranged on the left side of the dc biaser cavity 407, and the micro-rectangular electrical connector 410 is fixed on the left side of the dc biaser cavity 407 through a micro-rectangular electrical connector fastening screw 411. The micro-rectangular electrical connector 410 is connected at one end to a wire 422. The lead 422 supplies a dc bias voltage to the dc biaser printed board 505 through the through-hole of the partition plate 420 and the groove of the baffle 421.

The DC biaser is a three-port network device comprising a first port 313, a second port 314, a third port 315, which are a radio frequency port RF, a DC bias port DC and a radio frequency DC port RF & DC, respectively. The direct current biaser comprises a direct current biaser printed board 405, a conical inductor 404 (414) welded on the direct current biaser printed board 405 for adding direct current bias, isolating alternating current information and preventing high-frequency signals of a radio frequency port from leaking to a power supply system, and a capacitor 403 (415) used for inputting radio frequency signals and simultaneously preventing direct current bias voltage of the bias port from leaking to a subsequent circuit or a test instrument. The lower chamber structure and its arrangement are identical to the upper chamber and can be obtained by rotating the upper chamber structure and arrangement by 180 ° with respect to the separation plate 420. The tapered inductor 404 and capacitor 403 parameters may be determined by the particular device operating environment.

The direct current biaser cavity 407 and the pins on the fourth upper cover plate 402 are tightly matched with the corresponding upper cover plate pin holes 406 and detachably connected through a fourth mounting screw 401; the fourth lower cover 413 is implemented in the same manner as the fourth upper cover. The direct current biaser cavity 407 is made of non-magnetic copper materials, so that the deformation of the cavity in an ultralow temperature environment can be effectively reduced. The dielectric constant of the direct current bias device printed board 405 (409) is high, the width of lines on the direct current bias device printed board 405 can be effectively reduced, the size of the printed board is further reduced, the deformation of the direct current bias device printed board 405 in an ultralow temperature environment is reduced, and the electrical performance is deteriorated.

Example 6: as shown in fig. 7, the utility model discloses an ultra-low temperature integrated form infrared filter subassembly, including ultra-low temperature infrared filter 501, heat sink dish epicoele 502, heat sink dish cavity 503, fifth mounting screw 504, fifth mounting screw hole 505, ultra-low temperature infrared filter mounting hole 506, ultra-low temperature infrared filter connect 507, assembly fixing screw 508. The heat sink plate upper chamber 502 and the heat sink plate lower chamber 503 are removably connected by a fifth mounting screw 504. The upper heat sink plate cavity 502 and the lower heat sink plate cavity 503 are respectively provided with 13 mounting holes 506 for the ultra-low temperature infrared filter. The ultra-low temperature infrared filter 501 is arranged in an ultra-low temperature infrared filter mounting hole 506 in the heat sink plate, and the ultra-low temperature infrared filter joint 507 is an SSMP joint. A fifth through mounting screw hole 505 is formed in the cavity of the hot sink plate, and the fifth mounting screw 504 is connected with the fifth mounting screw hole 505. The fifth mounting screw 504 is a hollow structure with a layer of threads inside. The assembled ultra-low temperature integrated infrared filter assembly is plug-connected to the integrated connector assembly, and the assembly mounting screws 508 are connected to the first mounting screw holes 104 of the integrated connector assembly through the interior of the fifth mounting screws 504.

The appearance structure and the heat sink disc plug-in components of the ultra-low temperature attenuator component and the ultra-low temperature low-pass filter component are completely consistent with the appearance structure and the heat sink disc plug-in components of the ultra-low temperature integrated infrared filter component, and corresponding components can be obtained by replacing the ultra-low temperature infrared filter with the ultra-low temperature attenuator and the ultra-low temperature low-pass filter, which is not described herein again.

Example 7: fig. 8 is a schematic diagram of the internal layout of the shielding barrel with 10mK layer of the present invention, and a shielding barrel 602 and a shielding cover 603 are arranged below the 10mK cooling plate 601. The 10mK cold plate 601 is connected with the shielding cover 603 through a first hanging bracket 604. An aluminum cover 613 is arranged below the shielding cover 603, a shielding cover mounting screw hole 624 is arranged on the shielding cover 603, and the shielding cover mounting screw 614 is fixedly connected with the shielding cover 603 and the aluminum cover 613 through the shielding cover mounting screw hole 624. An aluminum support 605 is provided inside the shield barrel 602, and the aluminum support 605 and the aluminum cover 613 are connected by a second hanger 615. A quantum chip printed board 606 is arranged above the aluminum support 605, and a copper plate 607 is arranged below the aluminum support 605. The quantum chip 608 is sealed on the quantum chip printed board 606, and a shielding box 609 is arranged above the quantum chip 608. The aluminum support 605, the quantum chip printed board 606 and the copper plate 607 are all provided with 4 shielding box mounting screw holes 611, and the shielding box mounting screw holes 611 on the plate layers are on the same vertical line. The shield case 609 is fixed to the quantum chip printed board 606 by a shield case mounting screw 610 through a shield case mounting screw hole 611. The printed board 606 is provided with 4 multi-channel integrated sockets 612, and the quantum chip 608 is connected with the 60-core multi-channel integrated socket 612 through a wire on the quantum chip printed board 606. Ultra-low temperature infrared filter assembly 616 is mounted on aluminum cover 613 and shield cover 603. A multi-core adapter 621 with 13-core to 60-core is arranged below the ultra-low temperature infrared filter assembly 616, and is fixedly connected to the aluminum cover 613 through a mounting screw 622. The multi-conductor adapter 621 is connected to the multi-channel integrated socket 612 by a tinned copper braided flex cable 617. An ultra-low temperature attenuator component 618 and an ultra-low temperature low pass filter component 619 are sequentially arranged below the 10mK layer integrated connector component 623. The 10mK layer integrated connector assembly 623, the ultra-low temperature attenuator assembly 618, and the ultra-low temperature low pass filter assembly 619 are plug-connected and connected by assembly mounting screws 620. The ultra-low temperature low pass filter assembly 619 is connected to the ultra-low temperature infrared filter assembly 616 by a tinned copper braided flex cable 617.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (10)

1. A general type dilution refrigerator multichannel extensible signal measuring device is partially built in a Dewar of a dilution refrigerator, the Dewar is divided into a 300K layer, a 50K layer, a 4K layer, a 1K layer, a 100mK layer and a 10mK layer from top to bottom according to the temperatures of different levels, and each layer is separated by a cold plate; the 300K layers of cold discs are used as vacuum covers, each layer of cold discs is provided with a hot sink disc, and the integrated connector assembly penetrating plate is arranged on the hot sink discs;

the parametric amplifier, the ultra-low temperature circulator/isolator assembly, the ultra-low temperature integrated DC biaser are all disposed on the 100mK layer.

2. The multi-channel expandable signal measuring device of the general dilution refrigerator according to claim 1, wherein a shielding barrel and a shielding cover are arranged below the 10mK layer cooling plate, and the 10mK layer cooling plate and the shielding cover are connected through a first hanging frame; an aluminum cover is arranged below the shielding cover, an aluminum support is arranged inside the shielding barrel, and the aluminum support and the aluminum cover are connected through a second hanging frame; a quantum chip printed board is arranged above the aluminum support, and a copper plate is arranged below the aluminum support; the quantum chip is fixedly sealed on the quantum chip printed board, and a shielding box is arranged above the quantum chip; the quantum chip printed board is provided with a plurality of multi-channel integrated sockets, and the quantum chip and the multi-channel integrated sockets are connected through a wire on the quantum chip printed board; the ultra-low temperature infrared filter assembly penetrating plate is arranged on the aluminum cover and the shielding cover, a multi-core adapter is arranged below the ultra-low temperature infrared filter assembly, and the multi-core adapter is fixedly connected to the aluminum cover; the integrated connector subassembly below on 10mK layer is equipped with ultra-low temperature attenuator subassembly, ultra-low temperature low pass filter subassembly in proper order, 10mK layer integrated connector ultra-low temperature attenuator subassembly ultra-low temperature low pass filter subassembly is to inserting the formula and connecting.

3. The universal dilution refrigerator multichannel scalable signal measurement device according to claim 2, wherein the ultra-low-temperature low-pass filter assembly is connected to the ultra-low-temperature infrared filter assembly through a flexible cable braided by tin-impregnated copper; the multi-core adapter is connected to the multi-channel integrated socket through a tin-impregnated copper braided flexible cable.

4. The multi-channel expandable signal measuring device for the general dilution refrigerator according to claim 1, wherein the integrated connector assembly adopts a 13-core combined plug module, and comprises a first heat sink plate, an SSMP connector, an SSMP installation clamping groove, a first installation screw hole and a connector installation hole, wherein an external thread is arranged on a shell of the SSMP connector, and an SSMP installation clamping groove convenient for a torque wrench to install is arranged at a joint of the SSMP connector; a plurality of connector mounting holes are formed in the hot sink plate, and an internal thread matched with the external thread of the SSMP connector shell is formed in each connector mounting hole; the SSMP connector rotates to the inside of the heat sink plate to complete installation; the heat sink plate is provided with a plurality of first mounting screw holes, and the integrated connector assembly is connected with other assemblies and then fixed through screws mounted in the first mounting screw holes.

5. A versatile dilution refrigerator multichannel extendible type signal measurement apparatus according to claim 1, wherein the integrated cable assembly comprises any one or more of: stainless steel cable assemblies for 300K and 50K layers; niobium-titanium cable components for 4K layers and below; silver-plated copper flexible cables woven with conventional tin-impregnated copper in a 10mK layer were used.

6. The multi-channel expandable signal measuring device for the general dilution refrigerator as claimed in claim 5, wherein the niobium-titanium cable assembly comprises a second heat sink plate, a niobium-titanium cable, a second mounting screw hole, a second mounting screw and a cable connector, the cable connector adopts SSMP connectors, two groups of niobium-titanium cable assemblies are connected with one group of the integrated connector assemblies in a plug-in mode, and the second mounting screw penetrates through the second mounting screw hole to be connected with the integrated connector assembly; the niobium-titanium cable is provided with a bending area in the middle part and is used for preventing the niobium-titanium cable from being broken due to shortening at ultralow temperature after being bent.

7. The multi-channel expandable signal measuring device of the universal dilution refrigerator according to claim 1, wherein the ultra-low temperature circulator/isolator assembly comprises a third mounting screw, a third upper cover plate, an ultra-low temperature circulator, a cavity, a third lower cover plate, an ultra-low temperature isolator, a baffle plate, a boss, a third mounting hole and a threaded hole;

a third upper cover plate is arranged on the upper side of the cavity, a third lower cover plate is arranged on the lower side of the cavity, third through mounting holes are formed in the third upper cover plate and the third lower cover plate, and threaded holes are formed in the cavity corresponding to the third mounting holes; the cavity, the third upper cover plate and the third lower cover plate are detachably connected through third mounting screws; a baffle is arranged in the middle of the cavity, the baffle divides the cavity into an upper layer and a lower layer, a boss is arranged in the center of the baffle, the upper end face of the boss and the upper surface of the cavity are in the same plane, and the lower end face of the boss and the lower surface of the cavity are in the same plane; the cavity with be equipped with a plurality of ultra-low temperature isolator and a plurality of ultra-low temperature circulator between the third upper cover plate, the cavity with be equipped with a plurality of ultra-low temperature isolator and a plurality of ultra-low temperature circulator under the third between the apron, ultra-low temperature circulator and ultra-low temperature isolator distribute around the boss inside the cavity.

8. The multi-channel scalable signal measurement device of the universal dilution refrigerator according to claim 1, wherein the ultra-low temperature integrated dc biaser comprises: the fourth upper cover plate, the direct current biaser printed board, the direct current biaser cavity, the front side connector, the fourth lower cover plate, the rear side connector, the separation plate, the baffle and the lead;

the direct current biaser cavity is detachably connected with the fourth upper cover plate and the fourth lower cover plate; the direct current biaser cavity is an I-shaped cavity which is laterally placed, a partition plate is arranged in the direct current biaser cavity, and the direct current biaser cavity is divided into an upper layer and a lower layer by the partition plate; the upper layer of the cavity of the direct current biaser is provided with a plurality of baffles which divide the upper layer of the cavity of the direct current biaser into a plurality of chambers; a plurality of front side connectors for signal transmission are arranged on the front side of the direct current biaser cavity, and the front side connectors are fixed on the front side of the direct current biaser cavity; the direct current biaser comprises a direct current biaser cavity, and is characterized in that a plurality of rear side connectors for signal transmission are arranged on the rear side of the direct current biaser cavity, the rear side connectors are fixed on the rear side of the direct current biaser cavity, each cavity of the direct current biaser cavity is correspondingly configured with the front side connector and the rear side connector one by one, a direct current biaser printed board is arranged in each cavity, and the front side connector and the rear side connector are welded on the corresponding direct current biaser printed boards.

9. The multi-channel expandable signal measuring device of the general dilution refrigerator according to claim 8, wherein a through hole is formed in the left side of the partition plate and is communicated with the upper layer and the lower layer of the cavity of the direct current biaser, and the baffle plate is provided with a groove for wiring; a micro-rectangular electric connector is arranged on the left side of the cavity of the direct current biaser, and one end of the micro-rectangular electric connector is connected with a lead; and the lead provides direct current bias voltage for the printed board of the direct current biaser through the through hole of the separation plate and the groove of the baffle plate.

10. The multi-channel expandable signal measuring device of the universal dilution refrigerator as claimed in claim 1, wherein the ultra-low temperature infrared filter assembly comprises an ultra-low temperature infrared filter, a heat sink upper chamber, a heat sink lower chamber, a fifth mounting screw hole, ultra-low temperature infrared filter mounting holes, an ultra-low temperature infrared filter connector and assembly mounting screws, the heat sink upper chamber and the heat sink lower chamber are detachably connected through the fifth mounting screw, the heat sink upper chamber and the heat sink lower chamber are respectively provided with a plurality of ultra-low temperature infrared filter mounting holes, the ultra-low temperature infrared filter is mounted in the ultra-low temperature infrared filter mounting holes inside the heat sink plate, and the ultra-low temperature infrared filter connector adopts an SSMP connector; a fifth through mounting screw hole is formed in the cavity of the hot sink plate, and the fifth mounting screw is connected with the fifth mounting screw hole; the assembled ultralow-temperature integrated infrared filter is connected with the integrated connector component in a plug-in mode.

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