CN118034465A - Miniaturized no cable multi-slot VPX machine case - Google Patents
Miniaturized no cable multi-slot VPX machine case Download PDFInfo
- Publication number
- CN118034465A CN118034465A CN202311844127.7A CN202311844127A CN118034465A CN 118034465 A CN118034465 A CN 118034465A CN 202311844127 A CN202311844127 A CN 202311844127A CN 118034465 A CN118034465 A CN 118034465A
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- Prior art keywords
- slot
- assembly
- miniaturized
- case body
- backboard
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- 230000017525 heat dissipation Effects 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention provides a miniaturized cable-free multi-slot VPX chassis, which comprises: the device comprises a front panel, a functional board card, a case body, a back panel assembly, an IO panel assembly and a back panel; the case body is of an integrated structure; the front panel is arranged outside the front end of the case body; the rear panel is arranged outside the rear end of the case body; the backboard component is arranged at the rear end of the interior of the case body; the functional board card is arranged on the slot at one end of the backboard component and is electrically connected with the slot at one end of the backboard component; the IO board assembly is arranged at the other end of the backboard assembly and is electrically connected with the other end of the backboard assembly. The technical content disclosed by the invention has the characteristics of miniaturization and light weight. The integrated device can greatly meet the requirement of the integration of the prior device, and can be provided with more board cards on the premise of ensuring the miniaturization of the device, thereby realizing the characteristic that one device can meet various requirements at the same time.
Description
Technical Field
The invention belongs to the technical field of cabinets, and particularly relates to a miniaturized cable-free multi-slot VPX cabinet.
Background
The requirements for the VPX chassis are becoming higher and higher, so that the requirements for miniaturization and weight saving are becoming more and more important. Based on the thinking of the integration of the prior equipment, the realization of multifunctional operation is required in one equipment, so that a plurality of functional boards are required to be installed in one equipment at the same time, and a plurality of different functions are respectively realized.
The traditional equipment internal interconnection relationship generally adopts a welding cable form or adopts the switching of a connector cable so as to realize the interconnection signal interaction between boards, thereby generating the problems of larger overall size, complicated internal installation, larger signal loss and the like of the equipment.
Therefore, how to provide a miniaturized cable-free multi-slot VPX chassis is a technical problem to be solved in the art.
Disclosure of Invention
The invention aims to provide a miniaturized cable-free multi-slot VPX chassis.
According to the invention, a miniaturized cable-free multi-slot VPX chassis is provided, which comprises a front panel, a functional board card, a chassis box body, a back panel assembly, an IO board assembly and a back panel;
The case body is of an integrated structure; the front panel is arranged outside the front end of the case body; the rear panel is arranged outside the rear end of the case body; the backboard component is arranged at the rear end of the interior of the case body; the functional board card is arranged on the slot at one end of the backboard component and is electrically connected with the slot at one end of the backboard component; the IO board assembly is arranged at the other end of the backboard assembly and is electrically connected with the other end of the backboard assembly.
Optionally, the chassis further includes: an opposite-plug connector;
the IO board assembly is electrically connected with the other end of the backboard assembly through the opposite-plug connector.
Optionally, the chassis further includes: a grounding assembly;
the ground assembly is mounted on the rear panel.
Optionally, two sides of the case body of the case are provided with weight-reducing heat dissipation grooves.
Optionally, the installation contact surfaces of the front panel 1 and the rear panel and the chassis box body are designed with conductive rubber strips.
Optionally, the back board assembly is designed with four slots, and can be connected with four functional board cards.
Optionally, the module upper cover of the functional board card is an aluminum cold plate.
Optionally, the module upper cover of the functional board card is an aluminum alloy steam cavity vapor chamber.
According to the technical content disclosed by the invention, the method has the following beneficial effects: has the characteristics of miniaturization and light weight. The integrated device can greatly meet the requirement of the integration of the prior device, and can be provided with more board cards on the premise of ensuring the miniaturization of the device, thereby realizing the characteristic that one device can meet various requirements at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a front view of a miniaturized cableless multi-slot VPX chassis according to an embodiment;
FIG. 2 is a side view of a miniaturized cableless multi-slot VPX chassis according to an embodiment;
fig. 3 is a schematic diagram of a functional board card according to an embodiment.
Reference numerals illustrate: the device comprises a front panel, a 2-functional board card, a 21-module upper cover, a 22-module lower cover, a 23-pull-out aid, a 24-locking assembly, a 25-PCB board card, a 26-VPX connector module, a 3-chassis box, a 4-backboard assembly, a 5-IO board assembly, a 6-plug-in connector, a 7-grounding assembly and an 8-rear panel.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
According to the present invention, as shown in fig. 1 and 2, there is provided a miniaturized cableless multi-slot VPX chassis, including a front panel 1, a function board card 2, a chassis box 3, a back panel assembly 4, an IO board assembly 5, and a back panel 8;
The case body 3 is of an integrated structure and can be produced in a welding mode or a splicing mode according to actual conditions; the front panel 1 is arranged outside the front end of the case body 3; the rear panel 8 is arranged outside the rear end of the case body 3; the backboard component 4 is arranged at the rear end of the interior of the chassis box body 3 and provides electrical connection for the functional board card 2 inside; the functional board card 2 is arranged on a slot at one end of the backboard component 4 and is electrically connected with the slot at one end of the backboard component 4; the IO board assembly 5 is installed at the other end of the backboard assembly 4 and is electrically connected with the other end of the backboard assembly 4.
In some embodiments, the chassis further comprises: an opposite-plug connector 6;
The IO board assembly 5 is electrically connected with the other end of the backboard assembly 4 through the opposite plug connector 6, and high-efficiency signal interconnection transmission is provided for the whole machine.
The chassis further comprises: a grounding assembly 7;
the grounding assembly 7 is mounted on the rear panel 8 to provide a complete machine ground.
The two sides of the case body 3 of the case are provided with weight-reducing heat dissipation grooves, weight reduction is realized through the arrangement of the grooves, and a heat dissipation function can be realized; the weight of the whole equipment can be reduced, and the contact area between the outside of the whole equipment and the air can be increased so as to enhance part of convection heat transfer, and the bottom of the case is a contact position with an external radiating surface, which is a main radiating surface.
The installation contact surfaces of the front panel 1 and the rear panel 8 and the chassis box body 3 are designed with conductive rubber strips, so that the conductivity of the whole machine is enhanced, and the electromagnetic compatibility of the whole machine is enhanced.
The backboard component 4 is designed with four slots and can be connected with four functional board cards 2; but is not limited to, four slots may increase the device width according to the device needs, thereby increasing the number of slots.
As shown in fig. 3, the functional board card 2 includes: 21 on the module, a module lower cover 22, a pull-out aid 23, a locking assembly 24, a PCB board 25, a VPX connector module 26 and the like.
The module upper cover 21 of the functional board card 2 is an aluminum cold plate.
The module upper cover 21 of the functional board card 2 is an aluminum alloy steam cavity vapor chamber.
The IO board assembly 5 is composed of an IO board, an external connector and the like, and provides an external interface and power supply input for equipment.
In sum, the interconnection relation between the backboard inside the equipment and the IO board adopts a cableless mode to carry out internal interconnection and signal interaction, so that the internal installation space is greatly reduced. The whole volume of the equipment is smaller, the internal space is fully utilized, and the matching is tight. The equipment adopts the whole machine to conduct cold and dissipate heat, the bottom is an integral radiating surface, and a high-efficiency radiating way is provided for the internal high-power consumption board card.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A miniaturized cableless multi-slot VPX chassis, comprising: the device comprises a front panel, a functional board card, a case body, a back panel assembly, an IO panel assembly and a back panel;
The case body is of an integrated structure; the front panel is arranged outside the front end of the case body; the rear panel is arranged outside the rear end of the case body; the backboard component is arranged at the rear end of the interior of the case body; the functional board card is arranged on the slot at one end of the backboard component and is electrically connected with the slot at one end of the backboard component; the IO board assembly is arranged at the other end of the backboard assembly and is electrically connected with the other end of the backboard assembly.
2. The miniaturized cableless multi-slot VPX chassis according to claim 1, further comprising: an opposite-plug connector;
the IO board assembly is electrically connected with the other end of the backboard assembly through the opposite-plug connector.
3. The miniaturized cableless multi-slot VPX chassis according to claim 1, further comprising: a grounding assembly;
the ground assembly is mounted on the rear panel.
4. The miniaturized cableless multi-slot VPX chassis according to claim 1, wherein the two sides of the chassis body are provided with weight-reducing heat dissipation slots.
5. The miniaturized cableless multi-slot VPX chassis according to claim 1, characterized in that the mounting contact surfaces of the front panel 1 and the rear panel with the chassis body are designed with conductive rubber strips.
6. The miniaturized cableless multi-slot VPX chassis according to claim 1, wherein the backplane assembly is designed with four slots capable of connecting with four of the functional boards.
7. The miniaturized cableless multi-slot VPX chassis according to claim 1, wherein the module top cover of the functional board card is an aluminum cold plate.
8. The miniaturized cableless multi-slot VPX chassis according to claim 1, wherein the module upper cover of the functional board card is an aluminum alloy vapor chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311844127.7A CN118034465A (en) | 2023-12-28 | 2023-12-28 | Miniaturized no cable multi-slot VPX machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311844127.7A CN118034465A (en) | 2023-12-28 | 2023-12-28 | Miniaturized no cable multi-slot VPX machine case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118034465A true CN118034465A (en) | 2024-05-14 |
Family
ID=90988478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311844127.7A Pending CN118034465A (en) | 2023-12-28 | 2023-12-28 | Miniaturized no cable multi-slot VPX machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118034465A (en) |
-
2023
- 2023-12-28 CN CN202311844127.7A patent/CN118034465A/en active Pending
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