CN220401451U

CN220401451U - Compact charging power supply with internal PCB stacked structure

Info

Publication number: CN220401451U
Application number: CN202321626048.4U
Authority: CN
Inventors: 刘志勇
Original assignee: Shenzhen Yixinda Technology Co ltd
Current assignee: Shenzhen Yixinda Technology Co ltd
Priority date: 2023-06-26
Filing date: 2023-06-26
Publication date: 2024-01-26
Anticipated expiration: 2033-06-26

Abstract

The utility model discloses a compact charging power supply with an internal PCB stacked structure, which comprises a double-layer circuit assembly formed by a first PCB assembly and a second PCB assembly, wherein the first PCB assembly comprises a first PCB board and a first element group arranged on one side of the first PCB board, a connecting area is arranged on the other side of the first PCB board, a plug seat is arranged on the connecting area, the second PCB assembly comprises a second PCB board provided with a second element group and a plug terminal, the plug terminal corresponds to the plug seat, the first PCB assembly and the second PCB assembly form a double-layer PCB structure through the cooperation of the plug seat and the plug terminal, and the first PCB assembly and the second PCB assembly are respectively a low-voltage board and a high-voltage board. The utility model solves the problems that the internal structure of the power supply in the prior art is unfavorable for adapting to the shell with smaller internal size and is limited by the structure which can not meet the high-power use requirement.

Description

Compact charging power supply with internal PCB stacked structure

Technical Field

The utility model relates to the field of power supply structures, in particular to a compact charging power supply with an internal PCB stacking structure.

Background

At present, a special power supply is arranged in various electric equipment, particularly in electric equipment which needs to be specially input and output. For example, the panel power supply of the American standard is connected with electric equipment at one end and input and output ends at the other end. The power supply employs a tiled electrical component arrangement within which all components are loaded via a single layer PCB and placed in a housing. Because of the structure limited by the single-layer board, the power supply cannot be compact and is suitable for high power, so that the prior proposal occupies comparatively small space and has poor adaptability. In addition, because the space size of the American standard is smaller, if the traditional tiling scheme is adopted, the requirement cannot be met, and the circuit board cannot be loaded into the limited American standard size equipment.

In view of this, this technical scheme provides a compact charging source who possesses inside PCB stack formula structure, and it adopts the PCB of two-layer plug-in type structure, will be responsible for the high-pressure board of high-pressure part, and the separation of two PCBs that are responsible for low pressure output to adopt to pile up stitch plug-in type structure, not only solved tiling type PCB occupation space's problem, also possess the characteristics that satisfy high-power use demand.

Disclosure of Invention

The technical scheme aims to solve one of the technical problems in the related technology at least to a certain extent. Therefore, the main purpose of the present utility model is to provide a compact charging power supply with an internal PCB stacked structure, which aims to solve the problems that the internal structure of the power supply in the prior art is not beneficial to adapting to a housing with smaller internal size, and the structure is limited to be unable to meet the high-power use requirement.

In order to achieve the above object, the present utility model provides a compact charging power supply having an internal PCB stacked structure, comprising a dual-layer circuit assembly composed of a first PCB assembly and a second PCB assembly,

the first PCB component comprises a first PCB board and a first element group arranged on one side of the first PCB board, a connecting area is arranged on the other side of the first PCB board, a plug-in seat is arranged on the connecting area,

the second PCB assembly comprises a second PCB board provided with a second element group and a plug-in terminal, the plug-in terminal corresponds to the plug-in seat,

the first PCB component and the second PCB component are matched through the plug seat and the plug terminal to form a double-layer PCB structure, and the first PCB component and the second PCB component are respectively a low-voltage board and a high-voltage board.

As a still further aspect of the present utility model, a mounting assembly is provided outside the dual-layer circuit assembly, the mounting assembly includes a base, and a cover disposed on one side of the base, and a space formed between the base and the cover encapsulates the dual-layer circuit assembly.

As a still further aspect of the utility model, the base is provided with clamping grooves on two sides inside, the cover is provided with buckles on two sides outside, and the cover and the base are detachably connected in a clamping manner through the cooperation of the buckles and the clamping grooves.

As a still further aspect of the present utility model, the mounting assembly further includes fixing locations disposed at both sides of the base.

As a still further aspect of the present utility model, the second PCB assembly area is less than half of the first PCB assembly area.

As a still further aspect of the present utility model, the number of the sockets and the number of the socket terminals are three.

As a still further aspect of the present utility model, the dual-layer circuit assembly further includes an interface disposed between the first PCB and the second PCB, the interface being connected to the outside through an opening disposed on the mounting assembly.

The beneficial effects of the utility model are as follows:

the compact charging power supply with the internal PCB stacked structure provided by the utility model adopts a double-layer circuit structure design to separate the low-voltage board from the high-voltage board, so that the problem that the horizontal space occupies more is solved, the whole product is small and exquisite, meanwhile, the working heat is dispersed, and the service life is prolonged. In addition, due to the adoption of the high-low pressure plate separation type structure, the voltage load capacity is increased, various electricity requirements are met, and the device can be adapted to various specifications of mounting components.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the utility models in the prior art, the following description will briefly explain the embodiments or the drawings needed in the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the technical solutions of the present utility model, and other drawings can be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of a mounting housing structure in the present utility model.

Fig. 2 is a schematic diagram of an internal dual-layer circuit assembly of the present utility model with the mounting housing opened.

Fig. 3 is a schematic diagram of the overall structure of a dual-layer circuit assembly according to the present utility model.

Fig. 4 is a schematic diagram of a dual-layer circuit assembly according to the present utility model.

Fig. 5 is a schematic view of another view of a dual-layer circuit assembly according to the present utility model.

[ Main part/Assembly reference numerals Specification Table ]

Detailed Description

The following are provided:

please refer to FIG. 1-

The main structure comprises:

a dual-layer circuit assembly 1 consisting of a first PCB assembly 10 and a second PCB assembly 11,

the first PCB assembly 10 includes a first PCB 100, and a first component set 101 disposed on one side of the first PCB 100, a connection area 102 disposed on the other side of the first PCB 100, a socket 103 disposed on the connection area 102,

the second PCB assembly 11 comprises a second PCB board 110 provided with a second component set 111 and a plug terminal 112, the plug terminal 112 corresponding to the socket 103,

the first PCB assembly 10 and the second PCB assembly 11 form a double-layer PCB structure through the cooperation of the socket 103 and the socket terminal 112, and the first PCB assembly 10 and the second PCB assembly 11 are respectively a low-voltage board and a high-voltage board.

The working principle is as follows:

when the first PCB assembly 10 is installed, the first PCB assembly is first oriented, and the socket 103 may be disposed on one side of the first component set 101 or on the other side. After the direction of the socket 103 is determined, the socket terminals 112 of the second PCB assembly 11 are connected to the socket 103, so that the two PCBs are connected. After the double-layer circuit assembly 1 is mounted in a surprise, the double-layer circuit assembly can be mounted in a shell of the mounting assembly 2. In operation, the first PCB assembly 10 is responsible for low voltage operation and may be considered as weak current, while the second PCB assembly 11 acts as a high voltage board complex power operation. In addition, the double-layer circuit structural design separates the low-voltage board from the high-voltage board, so that the problem that the horizontal space occupies more is solved, the whole product is small and exquisite, meanwhile, the working heat is dispersed, and the service life is prolonged.

In a preferred embodiment of the utility model: the double-layer circuit assembly 1 is externally provided with a mounting assembly 2, the mounting assembly 2 comprises a base 20 and a housing 21 arranged on one side of the base 20, and a space formed between the base 20 and the housing 21 encapsulates the double-layer circuit assembly 1.

The mounting assembly 2 can be made small and exquisite and accords with the corresponding specification and size due to the adoption of the double-layer or stacked circuit assembly.

In a preferred embodiment of the utility model: the base 20 is internally provided with clamping grooves 24 at two sides, the housing 21 is externally provided with buckles 23 at two sides, and the housing 21 is detachably connected with the base 20 in a clamping manner through the cooperation of the buckles 23 and the clamping grooves 24.

The buckle 23 type design which is easy to assemble, disassemble and maintain is adopted, and the installation and maintenance are easy to realize through the matching of the buckle 23 and the clamping groove 24.

In a preferred embodiment of the utility model: the mounting assembly 2 further includes fixing locations 22 disposed on either side of the base 20.

The screw connection to the external device may be made through the fixing bits 22.

In a preferred embodiment of the utility model: the second PCB assembly 11 has an area smaller than half of the first PCB assembly 10.

The second PCB assembly 11 retains only the high voltage components and PCB boards, and the size of the second PCB assembly 11 is minimized because it is only necessary to separate it from the lower voltage version of the bottom.

In a preferred embodiment of the utility model: the number of the sockets 103 and the terminals 112 is three.

The first PCB assembly 10 and the second PCB assembly 11 may be wire soldered or otherwise electrically connected, in addition to a plug-in connection.

In a preferred embodiment of the utility model: the dual-layer circuit assembly 1 further includes an interface 113 disposed between the first PCB 100 and the second PCB 110, and the interface 113 is connected to the outside through an opening disposed on the mounting assembly 2.

The foregoing is only a preferred embodiment of the technical solution of the present utility model, and is not intended to limit the scope of the technical solution of the present utility model, and all the equivalent structural changes made by the technical solution specification and the attached drawings or the direct/indirect application in other related technical fields are included in the scope of the technical solution of the present utility model.

Claims

1. A compact charging power supply with an internal PCB stacked structure is characterized by comprising

A double-layer circuit assembly composed of a first PCB assembly and a second PCB assembly,

2. The compact charging power supply with internal PCB stacked structure according to claim 1, wherein a mounting assembly is provided outside the double-layer circuit assembly, the mounting assembly includes a base and a cover provided at one side of the base, and a space formed between the base and the cover encapsulates the double-layer circuit assembly.

3. The compact charging power supply with the internal PCB stacked structure of claim 2, wherein the two sides in the base are provided with clamping grooves, the two sides outside the cover are provided with buckles, and the cover and the base are detachably connected by matching the buckles with the clamping grooves.

4. The compact charging power supply with internal PCB stacking structure of claim 2, wherein said mounting assembly further comprises fixtures disposed on either side of said base.

5. The compact charging power supply with internal PCB stacking structure of claim 1, wherein the second PCB assembly area is less than half of the first PCB assembly.

6. The compact charging power supply with internal PCB stacked structure of claim 1, wherein the number of said sockets and said terminals is three.

7. The compact charging power supply with internal PCB stacked architecture of claim 2, wherein the dual layer circuit assembly further comprises an interface disposed between the first PCB and the second PCB, the interface being connected to the exterior through an aperture disposed on the mounting assembly.