CN115574660A - High-overload-resistant heterogeneous integrated structure of inertia micro-system component - Google Patents
High-overload-resistant heterogeneous integrated structure of inertia micro-system component Download PDFInfo
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- CN115574660A CN115574660A CN202211322457.5A CN202211322457A CN115574660A CN 115574660 A CN115574660 A CN 115574660A CN 202211322457 A CN202211322457 A CN 202211322457A CN 115574660 A CN115574660 A CN 115574660A
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- Prior art keywords
- microsystem
- inertial
- assembly
- heterogeneous integrated
- high overload
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41B—WEAPONS FOR PROJECTING MISSILES WITHOUT USE OF EXPLOSIVE OR COMBUSTIBLE PROPELLANT CHARGE; WEAPONS NOT OTHERWISE PROVIDED FOR
- F41B6/00—Electromagnetic launchers ; Plasma-actuated launchers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41F—APPARATUS FOR LAUNCHING PROJECTILES OR MISSILES FROM BARRELS, e.g. CANNONS; LAUNCHERS FOR ROCKETS OR TORPEDOES; HARPOON GUNS
- F41F1/00—Launching apparatus for projecting projectiles or missiles from barrels, e.g. cannons; Harpoon guns
Abstract
The invention discloses a high-overload-resistant heterogeneous integrated structure of an inertia microsystem assembly, which comprises a bottom buffer shell and a top rubber pad which are arranged in a metal shell of the inertia microsystem assembly, wherein an internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertia microsystem assembly. According to the invention, through a heterogeneous integrated structure of rubber and foam metal, the high overload resistance and vibration reduction characteristics of the inertia microsystem assembly and the assembly stability and reliability of an internal electronic system are realized.
Description
Technical Field
The invention relates to a high overload resistant heterogeneous integrated structure of an inertia microsystem assembly, and belongs to the technical field of inertia microsystem reliability design.
Background
Inertia microsystem subassembly is used in fields such as electromagnetism big gun, hypervelocity shell, and the pneumatic appearance of this type of ammunition is special and adopts the design of secondary caliber usually, therefore the space that inside is used for installing electronic components is extremely narrow and small. In order to ensure the survival and stable performance of the inertia microsystem assembly in the large overload and high dynamic environment such as an electromagnetic gun, an ultra-high speed gun and the like, high overload resistance protection and vibration isolation are considered at the same time, and the reliability and adaptability of the inertia microsystem assembly in the severe launching environment are ensured by adopting a high-density heterogeneous integration design.
The Chinese patent CN 109973585A composite protection structure of a high overload resistant test control circuit provides a composite protection structure of a high overload resistant test control circuit, which adopts a multi-layer shell and a composite buffer structure of various materials, a closed air damping cavity is arranged between a bottom plate and a top plate, the periphery of a test control circuit substrate is supported by a plurality of damping support columns made of soft plastic materials, and the test control circuit substrate has certain high overload resistance. The invention adopts the design of independent structures of various materials, so the problems of large integral structure size and complex assembly process exist, and the air damping cavity has high requirement on the structural tightness and is easy to generate the problem of low high overload resistance caused by air leakage caused by structural deformation under the high overload impact environment.
The invention provides an anti-impact damper taking rubber as a base body, which is provided by Chinese patent CN 111692258A 'an anti-impact rubber damper', wherein a mounting core and a mounting base are respectively bonded with an inner layer rubber body and an outer layer rubber body to be integrally formed, the mounting core and the mounting base are assembled in an interference assembly mode, and the damping and the anti-impact are realized by designing various moduli and hardness rubbers to be combined. The invention only adopts the rubber structure as the vibration damping core, and the shock resistance of the invention can not meet the application environment of acceleration overload of tens of thousands g. And the structure adopts a suspension and support mode, so that the required installation space is large.
The chinese utility model patent CN 216895538U "a little be used to lead with anti high spacing type shock absorber that overloads" provides a variety of adoption abnormal shape rubber structure's little be used to lead with anti high spacing type shock absorber that overloads, utilizes from top to bottom buffering damping pad and through optimizing system frequency such as adjustment shao shi hardness, area of contact, realizes anti high overload, designs damping pad and is used to lead the structure matching and realize spacingly. The invention has simple structure, easy assembly and certain impact resistance and vibration reduction effect. But only adopts single material and structure, and the overload resistance and the vibration reduction effect are relatively limited.
Chinese invention patent CN 106153044A "a damping structure for micro-inertia measurement unit" proposes a damping structure for suspending a product through an elastic damping ring with a groove. The structure avoids the problem of poor rigidity of a distributed vibration damping design through an integral elastic vibration damping structure, and reduces the deviation of an elastic center and the center of a vibration damped product; and the cross section of the elastic vibration damping ring is symmetrical to the radial central axis, so that the radial rigidity and the axial rigidity of the system are ensured to be the same, the frequency range of the system is reduced, and the control of the amplification rate of the system on vibration is facilitated. The structure is fixed with the circular ring bulge of the product through the vibration reduction ring groove, and the possibility that the product and the external shell rotate relatively due to vibration exists in the working process, so that the system work is influenced.
In the prior art, the impact resistance and vibration reduction of micro-inertia products are mainly realized by material characteristics and structural design, and a hard-soft-hard sandwich structure or a supporting suspension structure of a damping cushion is designed by basically adopting a rubber material as a matrix. The material or the structure of single form can realize the anti high overload or the damping of certain degree, are difficult to the two to compromise, adopt composite construction then increase system's volume and installation space to promote the assembly degree of difficulty.
Disclosure of Invention
The invention aims to provide a high overload resistant heterogeneous integrated structure of an inertia microsystem assembly, which adopts a heterogeneous integrated structure design to combine good viscoelasticity characteristics of a rubber material with plastic energy absorption characteristics of foam metal, so as to realize the high overload resistance and vibration reduction characteristics of the inertia microsystem assembly and the assembly stability and reliability of an internal electronic system.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the invention provides a high overload resistant heterogeneous integrated structure of an inertia microsystem assembly, which comprises: a bottom buffer housing disposed within the metal shell of the inertial microsystem assembly;
the side surface of the bottom buffer shell is made of rubber;
the top of the bottom buffering shell is provided with a top rubber pad;
the internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertia microsystem assembly;
the bottom surface of the bottom buffering shell comprises a foam metal buffering structure and a rubber vibration damping structure.
Furthermore, the foam metal buffer structure and the rubber vibration damping structure are heterogeneously integrated in a mode that the rubber vibration damping structure is matched with the outer surface of the foam metal buffer structure in a surrounding mode.
Furthermore, the foam metal buffer structure is a round table structure with a small top and a large bottom.
Further, the bottom surface thickness of bottom buffering casing is greater than 6mm.
Furthermore, the bottom surface of the foam metal buffer structure and the metal shell of the inertia microsystem assembly are fixed by adopting an adhesive.
Furthermore, according to the internal electronic system structure of the inertia micro-system component, the internal cavity of the bottom buffer shell is designed in a matching mode.
Furthermore, according to the requirements of high overload resistance and shock absorption of the inertia microsystem assembly, rubber and foam metal with mechanical parameters meeting the requirements are selected.
The invention has the beneficial effects that:
according to the invention, through a heterogeneous integrated structure of rubber and foam metal, the high overload resistance and vibration reduction characteristics of the inertia microsystem assembly and the assembly stability and reliability of an internal electronic system are realized.
Drawings
FIG. 1 is a diagram of a high overload resistant heterogeneous integrated architecture for an inertial microsystem assembly according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a high overload resistant heterogeneous integrated structure of an inertial microsystem assembly according to an embodiment of the present invention;
wherein: 1. a metal housing cover plate; 2. a top rubber pad; 3. an electronic system; 4. a bottom buffer housing; 5. a metal housing; 41. an annular rubber vibration reduction structure; 42. a foam metal cushioning structure; 43. and (3) an adhesive.
Detailed Description
The invention is further described below. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
One embodiment of the invention provides a high overload resistant heterogeneous integrated structure of an inertia microsystem assembly, which is based on the design of a hard-soft-hard interlayer of the inertia microsystem assembly, wherein an external hard structure is a metal shell of the microsystem assembly, an internal hard structure is an electronic system, and the heterogeneous integrated structure is used as a soft interlayer to perform surrounding protection on the internal electronic system of the inertia microsystem assembly, so that high overload resistance and vibration reduction are realized.
The high overload resistant heterogeneous integrated structure of the inertia microsystem assembly provided by the embodiment is shown in fig. 1, and comprises a bottom buffer shell 4 arranged in a metal shell 5 of the inertia microsystem assembly;
the side surface of the bottom buffer shell 4 is made of rubber and is used for attenuating vibration and lateral impact borne by the inertia microsystem assembly in the launching process;
the internal cavity of the bottom buffer shell 4 is used for accommodating the electronic system 3 of the inertia microsystem assembly;
the top of the bottom buffer shell 4 is a top rubber pad 2.
The internal electronic system of the inertia micro-system component is protected in a surrounding way through a bottom buffer shell 4 and a top rubber pad 2. The upper part of the top rubber pad 2 is a metal shell cover plate 1.
According to the internal electronic system structure of the inertial microsystem assembly, the internal cavity of the bottom buffer shell is designed in a matching manner, and the overall structure of the bottom buffer shell is designed to be matched with the metal shell of the microsystem assembly, so that the surrounding type assembly of the electronic system is realized.
Referring to fig. 2, the bottom surface of the bottom cushion casing 4 includes a foam metal cushion structure 42 and a rubber vibration damping structure;
in this embodiment, the heterogeneous integration of the foam metal buffer structure on the bottom surface of the bottom buffer housing and the rubber vibration damping structure adopts an annular structure.
In a preferred embodiment, the foam metal buffer structure 42 is a circular truncated cone structure with a small top and a large bottom, and the outer ring is an annular rubber vibration reduction structure 41 matched with the circular truncated cone structure.
Because the foam metal is compressed from top to bottom, the smaller structure size is easy to excite the compression process and begin to absorb energy, the foam metal structure size is increased along with the increase of the compression process, the plastic deformation energy absorption is enhanced, a high overload impact peak curve can be matched, and high overload buffering is better realized. After high overload impact, the foam metal finishes plastic deformation energy absorption, and the radial size is increased due to the fact that the axial size is compressed, so that the surrounding annular rubber is squeezed. Because the foam metal is big end down, is the inclined plane with outer lane rubber and matches, the extrusion of foam metal to rubber makes rubber produce ascending motion and extrusion trend, consequently the inside electronics department system of inertia microsystem components can not produce the not hard up risk of assembly because of the compression of foam metal. In the carrier flight stage, the foam metal is compressed and then does not contact with an electronic system of the micro-system component, the rubber structures of the top rubber pad and the bottom buffer shell are in a full-surrounding state for the electronic part, and good vibration reduction is realized through the viscoelastic characteristics and thickness dimension design of the material.
It should be noted that, since the plastic deformation process of the foam metal compression requires a certain stroke to absorb the high overload impact energy, the bottom surface thickness of the bottom buffer shell is usually not less than 6mm.
As a preferred embodiment, the bottom surface of the metal foam cushioning structure is fixed to the metal housing of the inertial microsystem assembly by an adhesive 43, which further reduces the risk of displacement collision after the metal foam is compressed.
It should be noted that mechanical parameters, such as young's modulus, poisson's ratio, yield strength, etc., of the rubber material and the foam metal are adjusted to meet different requirements for resisting high overload and absorbing shock.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (7)
1. A high overload tolerant heterogeneous integrated structure of an inertial microsystem assembly, comprising: a bottom buffer housing disposed within the metal housing of the inertial microsystem assembly;
the side surface of the bottom buffer shell is made of rubber;
the top of the bottom buffering shell is provided with a top rubber pad;
the internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertia microsystem assembly;
the bottom surface of the bottom buffering shell comprises a foam metal buffering structure and a rubber vibration damping structure.
2. The high overload resistant heterogeneous integrated structure of an inertial microsystem assembly as claimed in claim 1, wherein the metal foam buffer structure and the rubber vibration damper structure are heterogeneous integrated in a manner that the rubber vibration damper structure is fitted around an outer surface of the metal foam buffer structure.
3. The high overload resistant heterogeneous integrated structure of an inertial microsystem assembly as claimed in claim 2, wherein the foam metal buffer structure is a truncated cone structure with a small top and a large bottom.
4. The high overload tolerant heterogeneous integrated structure of inertial microsystem components of claim 1, wherein the bottom buffer housing has a bottom thickness greater than 6mm.
5. The assembly of claim 1, wherein the bottom surface of the foam metal bumper structure is secured to the metal housing of the inertial microsystem assembly with an adhesive.
6. The high overload tolerant heterogeneous integrated structure of inertial microsystem assemblies as claimed in claim 1, wherein the internal cavity of the bottom buffer housing is designed to match with the internal electronics system structure of the inertial microsystem assembly.
7. The heterogeneous integrated structure of high overload resistance of the inertial microsystem assembly according to claim 1, wherein the rubber and the metal foam with mechanical parameters meeting the requirements are selected according to the requirements of high overload resistance and shock absorption of the inertial microsystem assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211322457.5A CN115574660A (en) | 2022-10-27 | 2022-10-27 | High-overload-resistant heterogeneous integrated structure of inertia micro-system component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211322457.5A CN115574660A (en) | 2022-10-27 | 2022-10-27 | High-overload-resistant heterogeneous integrated structure of inertia micro-system component |
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| Publication Number | Publication Date |
|---|---|
| CN115574660A true CN115574660A (en) | 2023-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211322457.5A Pending CN115574660A (en) | 2022-10-27 | 2022-10-27 | High-overload-resistant heterogeneous integrated structure of inertia micro-system component |
Country Status (1)
| Country | Link |
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| CN (1) | CN115574660A (en) |
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2022
- 2022-10-27 CN CN202211322457.5A patent/CN115574660A/en active Pending
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