CN112145614B

CN112145614B - Buffer for electronic equipment

Info

Publication number: CN112145614B
Application number: CN202011131807.0A
Authority: CN
Inventors: 林韦廷; 黄国渊
Original assignee: Hefei Lianbao Information Technology Co Ltd
Current assignee: Hefei Lianbao Information Technology Co Ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2022-04-12
Anticipated expiration: 2040-10-21
Also published as: CN112145614A

Abstract

The embodiment of the disclosure provides a buffer for electronic equipment, which comprises a first buffer structure, a motion structure, a second buffer structure and a foot pad structure, wherein the first buffer structure, the motion structure, the second buffer structure and the foot pad structure are sequentially arranged from top to bottom; the first buffer structure and the foot pad structure are connected with the fixing plate; the first buffer structure and the moving structure form a first air cavity, and the moving structure and the foot pad structure form a second air cavity. The first air cavity that this disclosed embodiment formed through first buffer structure and motion structure and the second air cavity that motion structure and callus on the sole structure formed, and then form secondary damping vibration attenuation, can break through the restriction that relies on the limited damping that material or single loculus produced among the prior art, can satisfy electronic equipment and reach effective anti-vibration's purpose under the strong vibration environment, improved electronic equipment's vibration resistance.

Description

Buffer for electronic equipment

Technical Field

The present disclosure relates to the field of vibration-proof technologies for electronic devices, and in particular, to a buffer for an electronic device.

Background

At present, the use environment of electronic equipment is not mainly static use as the prior art, and more electronic equipment is used in moving or under vibration environment, such as environment of trains, automobiles and the like, and office work, entertainment and the like are carried out by utilizing notebook computers, tablet computers and the like. Accordingly, higher requirements are placed on the vibration resistance of the electronic device in the use scenario.

In order to improve the anti-vibration performance of the electronic device, in the prior art, a vibration damping pad is usually disposed at a contact portion between the electronic device and a vibration source, and the vibration damping pad is generally made of an elastic material, such as a solid rubber body, and the anti-vibration performance of the electronic device in a strong vibration environment cannot be satisfied only by the above structure.

Disclosure of Invention

In view of this, the embodiments of the present disclosure provide a buffer for an electronic device to solve the problem that effective vibration resistance of the electronic device in a strong vibration environment cannot be ensured in the prior art.

In one aspect, an embodiment of the present disclosure provides a buffer for an electronic device, which includes a first buffer structure, a moving structure, a second buffer structure, and a foot pad structure, which are sequentially arranged from top to bottom; the first buffer structure and the foot pad structure are both connected with the fixing plate;

the first buffer structure and the moving structure form a first air cavity, and the moving structure and the foot pad structure form a second air cavity.

In some embodiments, the first buffer structure comprises an air cavity component and a first buffer component;

the air cavity assembly is fixedly connected with one end of the first buffer assembly, and the moving structure is connected with the other end of the first buffer assembly.

In some embodiments, the air cavity assembly is provided with a first air hole for communicating the first air cavity with an external space.

In some embodiments, a second air hole is provided on the moving structure; which is used for communicating the first air cavity with the second air cavity.

In some embodiments, the second cushioning structure is a variable stiffness structure; the first buffer components are all variable rigidity components.

In some embodiments, the first cushioning structure further comprises a second cushioning component;

the second buffer component is attached to the air cavity component.

In some embodiments, the bumper further comprises a sealing structure; the sealing structure is between the exercise structure and the footbed structure.

In some embodiments, the first cushioning component, the second cushioning component, and the sealing structure are all viscoelastic materials.

In some embodiments, the second cushioning structure is provided with a first through hole, the moving structure is provided with a second through hole, and the foot pad structure is provided with a first protrusion; the motion structure, the second buffer structure and the foot pad structure are connected through the first through hole, the second through hole and the first protrusion.

In some embodiments, the foot pad structure is clamped in the hollow-out part of the fixing plate; and a third through hole arranged on the first buffer structure is connected with the second bulge of the fixed plate.

According to the embodiment of the disclosure, the first buffer structure and the first air cavity formed by the motion structure and the second air cavity formed by the motion structure and the foot pad structure form secondary damping vibration attenuation, so that the limitation of limited damping generated by materials or a single small cavity in the prior art can be broken through, the purpose of effective vibration resistance of electronic equipment under a strong vibration environment can be met, and the vibration resistance of the electronic equipment is improved.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a buffer provided in the present disclosure;

FIG. 2 is a schematic structural diagram of a first buffer structure in a buffer according to the present disclosure;

FIG. 3 is a schematic diagram of a kinematic structure in a damper provided by the present disclosure;

FIG. 4 is a schematic structural view of a foot pad structure in a bumper provided by the present disclosure;

FIG. 5 is a schematic structural diagram of a second buffer structure in a buffer according to the present disclosure;

FIG. 6 is a schematic center sectional view of a bumper provided by the present disclosure in a first axial direction;

FIG. 7 is a schematic center sectional view of a bumper provided by the present disclosure in a second axial direction;

fig. 8 is a schematic view of a state of a buffer provided by the present disclosure in a case where an electronic device is under a static deadweight;

fig. 9 is a schematic state diagram of a buffer provided in the present disclosure in a case where an electronic device is impacted by an external force.

Reference numerals:

1-a first buffer structure; 2-a second buffer structure; 3-a kinematic structure; 4-a foot pad structure; 5, fixing a plate; 6-a first air cavity; 7-a second air cavity; 8-a sealing structure; 11-a third via; 12-an air cavity assembly; 13-a first cushioning component; 14-a second cushioning component; 121-a first air hole; 21-a first via; 31-a second via; 32-a second air hole; 41-a first projection; 51-a hollowed-out; 52-second projection.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described below clearly and completely with reference to the accompanying drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

To maintain the following description of the embodiments of the present disclosure clear and concise, a detailed description of known functions and known components have been omitted from the present disclosure.

As shown in fig. 1, a schematic structural diagram of a buffer provided in the embodiment of the present disclosure is that the buffer may be disposed on any fixing plate 5 on an electronic device, where the fixing plate 5 may be a housing on a bottom end surface of the electronic device, and may also be a plate-shaped body fixed on the housing. Specifically, the buffer includes first buffer structure 1, motion structure 3, second buffer structure 2 and callus on the sole structure 4 by setting gradually from top to bottom, wherein, first buffer structure 1 motion structure 3 second buffer structure 2 with callus on the sole structure 4 interconnect and fix on fixed plate 5.

With further reference to fig. 2-5, fig. 2-5 are schematic structural views of the first cushioning structure 1, the moving structure 3, the second cushioning structure 2, and the foot pad structure 4, respectively.

Specifically, a first protrusion 41 is arranged on the foot pad structure 4, a first through hole 21 matched with the first protrusion 41 is arranged on the second buffer structure 2, and a second through hole 31 matched with the first protrusion 41 is arranged on the moving structure 3, so that the moving structure 3, the second buffer structure 2 and the foot pad structure 4 are connected through the first through hole 21, the second through hole 31 and the first protrusion 41, and the second buffer structure 2 and the moving structure 3 can be sleeved on the foot pad structure 4; preferably, the first protrusion 41 is cylindrical, and the first through hole 21 and the second through hole 31 are circular, but the embodiment of the present disclosure is not limited thereto, that is, the first protrusion 41 may also be polygonal cylindrical, and the shape of the first through hole 21 and the second through hole 31 may correspond to the cross-sectional shape of the first protrusion 41.

In the assembling process, the second buffer structure 2 is firstly sleeved on the first protruding portion 41 of the foot pad structure 4 through the first through hole 21, then the moving structure 3 is sleeved on the first protruding portion 41 of the foot pad structure 4 through the second through hole 31, and the moving structure 3 and the foot pad structure 4 are subjected to hot melting combination through a hot melting column, so that the moving structure 3, the second buffer structure 2 and the foot pad structure 4 are connected. Of course, the moving structure 3, the second cushioning structure 2 and the foot pad structure 4 may also be connected in other ways.

Further, the first buffer structure 1 covers the moving structure 3 and realizes that the buffer of the embodiment of the present disclosure is installed on the fixing plate 5, so that the first buffer structure 1 and the foot pad structure 4 are both connected with the fixing plate 5. Specifically, in order to facilitate connection between the foot pad structure 4 and the fixing plate 5, a hollow portion 51 is disposed on the fixing plate 5, and the foot pad structure 4 is clamped in the hollow portion 51 of the fixing plate 5; the shape and size of the hollow part 51 can be adjusted according to the shape and size of the foot pad structure 4; in order to facilitate the connection between the first buffer structure 1 and the fixed plate 5, a second protrusion 52 is disposed on the fixed plate 5, a third through hole 11 is disposed on the first buffer structure 1, and the first buffer structure 1 is mounted on the fixed plate 5 through the connection between the third through hole 11 and the second protrusion 52.

In the assembling process, the foot pad structure 4 is connected in the hollow part 51 of the fixing plate 5, the second buffer structure 2 and the moving structure 3 are sequentially connected with the foot pad structure 4, finally, the first buffer structure 1 is connected with the moving structure 3, the third through hole 11 of the first buffer structure 1 is sleeved on the second protruding part 52 of the fixing plate 5, and the first buffer structure 1 and the fixing plate 5 are subjected to hot melting combination through hot melting columns, so that the buffer is installed on the fixing plate 5. It should be noted that, during the installation process, not only the connection manner of using the heat-melting column to perform heat-melting bonding is used, but also other connection manners may be used to achieve the connection between the moving structure 3 and the foot pad structure 4, and the connection between the first buffer structure 1 and the fixing plate 5.

Referring to fig. 2 and 3, the first buffer structure 1 includes an air cavity assembly 12, a first recess is formed in the middle of the air cavity assembly 12, a first buffer assembly 13 is disposed in the recess, the first buffer assembly 13 may be a trapezoid structure, an outer end surface of the first buffer assembly 13 abuts against the moving structure 3, a second recess is formed in the middle of the moving structure 3, and the first buffer structure 1 and the moving structure 3 are mutually covered so that a first cavity 6 is formed between the first recess and the second recess. As shown with reference to fig. 3 and 4, the foot-pad structure 4 has a third recess in its central portion, which forms a second cavity 7 when the mobile structure 3 is closed over the foot-pad structure 4. Further, embodiments of the present disclosure also provide fig. 6 and 7, fig. 6 is a schematic central cross-sectional view of a bumper provided by the present disclosure in a first axial direction; FIG. 7 is a schematic center sectional view of a bumper provided by the present disclosure in a second axial direction; so that the first cavity 6 and the second cavity 7 can be clearly illustrated.

Further, a first air hole 121 is arranged on the air cavity assembly 12 and is used for communicating the first cavity 6 with the external space; the moving structure 3 is provided with a second air hole 32, which is used for communicating the first cavity 6 and the second cavity 7.

With continued reference to fig. 2, the first cushioning structure 1 further comprises a second cushioning component 14; the second buffer assembly 14 is attached to the air cavity assembly 12 except the first recess, i.e. the second buffer assembly 14 is interposed between the air cavity assembly 12 and the moving structure 3. The second buffer assembly 14 is made of an elastic material, so that the vibration-avoiding and buffering performance can be improved to a certain extent; and a certain viscosity is generated between the air cavity assembly 12 and the moving structure 3 in the installation process, so that the sealing performance of the first cavity 6 is ensured.

With continued reference to fig. 3, the damper in the disclosed embodiment further includes a sealing structure 8; the sealing structure 8 is located between the moving structure 3 and the foot pad structure 4, that is, can be attached to the moving structure 3 and the foot pad structure 4, respectively. The sealing structures 8 are made of elastic materials, so that the vibration-avoiding and buffering performance can be improved; moreover, certain viscosity is generated between the moving structure 3 and the foot pad structure 4 in the installation process, so that the tightness of the second cavity 7 is ensured.

The second buffer component 14 and the sealing structure 8 arranged in the buffer provided by the embodiment of the disclosure can not only improve the performance of vibration isolation and buffering by using the characteristics of the viscoelastic material, but also ensure the sealing performance of the first cavity 6 and the second cavity 7, thereby further improving the performance of vibration isolation and buffering.

Referring to fig. 5, the second buffer structure 2 includes a middle portion, a first support portion and a second support portion, which are respectively connected to both sides of the middle portion and raise the middle portion, such that the first support portion or the second support portion is inclined at a certain angle from the middle portion.

The second buffer structure 2 and the first buffer assembly 13 in the embodiment of the present disclosure are made of elastic materials, but may also be made of other materials capable of generating deformation, and may also have a certain viscosity for facilitating installation. Further, the second buffer structure 2 is a variable-rigidity structure, the first buffer assembly 13 is a variable-rigidity assembly, the second buffer structure 2 and the first buffer assembly 13 deform when being subjected to an external force, and the rigidity of the second buffer structure 2 and the first buffer assembly 13 changes based on the degree of deformation. The outer contours of the second buffer structure 2 and the first buffer assembly 13 both have a certain slope, that is, the outer contours of the second buffer structure 2 and the first buffer assembly 13 both have a certain slope based on a horizontal plane or a vertical plane, and when the second buffer structure 2 and the first buffer assembly 13 are deformed under the action of an external force, the slopes of the outer contours of the second buffer structure 2 and the first buffer assembly 13 change accordingly.

For example, when the electronic device is supported by the buffer, in the case that the electronic device is under a static self-weight, as shown in fig. 8, the second buffer structure 2 and the first buffer assembly 13 are schematic diagrams of a state of the buffer in the case that the electronic device is under a static self-weight, and can provide a high rigidity and a stable support for the electronic device; under the condition that the electronic device is impacted by the external acting force, as shown in fig. 9, the state diagram of the buffer under the condition that the electronic device is impacted by the external acting force is shown, the slopes of the second buffer structure 2 and the first buffer component 13 both change, and accordingly, the rigidity of the second buffer structure 2 and the first buffer component 13 is reduced, and along with the increase of the external acting force, the rigidity of the second buffer structure 2 and the first buffer component 13 is reduced, so that the second buffer structure 2 and the first buffer component 13 can better absorb the vibration generated by the impact of the external acting force, and the effect of buffering and avoiding vibration is achieved. It is worth to be noted that the external acting force sequentially passes through the second buffer structure 2 and the first buffer component 13, that is, the second buffer structure 2 and the first buffer component 13 utilize the characteristic of the self rigidity stress change, so as to realize the quasi-zero dynamic stiffness characteristic, that is, when the external acting force is larger, the rigidity of the second buffer structure 2 and the first buffer component 13 is smaller, the slope of the second buffer structure 2 and the first buffer component 13 is closer to 0, and the shock absorption and buffering effect is better; the problem that contradiction exists between the rigidity high-low requirements of supporting and vibration isolation buffering in the prior art is solved, supporting force, low natural frequency vibration isolation and buffering capacity are considered, and the transmission performance of vibration generated by impact of external acting force on electronic equipment is remarkably improved.

Of course, the thicknesses and slopes of the second buffer structure 2 and the first buffer assembly 13 may be specifically set according to actual requirements of electronic equipment, specific use environments, and the like, so that the second buffer structure 2 and the first buffer assembly 13 can achieve a vibration-damping effect meeting the requirements. Since the weight of the electronic device is equal to that of the electronic device linked to the first buffer assembly 13, the vibration isolation and buffering performance of the buffer is better when the first buffer assembly 13 is smaller than that of the second buffer structure 2. Therefore, when the vibration shock wave is transmitted, the second buffer structure 2 and the first buffer assembly 13 can absorb and temporarily store energy well by matching with the excitation force or displacement transmitted by the environment and the first cavity 6 and the second cavity 7, and meanwhile, the air resistance of the first cavity 6 and the second cavity 7 can consume the transmitted energy wave, so that the vibration shock wave is stable, and the good vibration-avoiding buffer effect is achieved.

In practical use, when the electronic device receives impact of an external acting force, the foot pad structure 4 is subjected to the external force transmitted by the fixing plate 5, the foot pad structure 4 is stressed to drive the moving structure 3 to reciprocate up and down, when the moving structure 3 moves upwards, air in the second air cavity 7 flows out to the first cavity 6 through the second air hole 32, and a certain air flow resistance is formed in the process of passing through the second air hole 32; then, the air in the first cavity 6 is increased, so that the air in the first cavity 6 flows out to the external space through the first air hole 121, and a certain air flow resistance is also formed in the process of passing through the first air hole 121; the air flow resistance formed by the first air hole 121 and the second air hole 32 and the damping of the air itself can consume a certain external acting force, and the vibration absorption and buffering effects are achieved. In the process that the moving structure 3 reciprocates up and down, the second buffer structure 2 and the first buffer assembly 13 can be assisted to consume the stored energy, so that better effects of stabilizing energy consumption, absorbing energy, consuming energy and releasing energy stably are provided, and a good damping effect is formed.

Moreover, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments based on the disclosure with equivalent elements, modifications, omissions, combinations (e.g., of various embodiments across), adaptations or alterations. The elements of the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.

The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more versions thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the foregoing detailed description, various features may be grouped together to streamline the disclosure. This should not be interpreted as an intention that a disclosed feature not claimed is essential to any claim. Rather, the subject matter of the present disclosure may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations.

The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The above embodiments are merely exemplary embodiments of the present disclosure, which is not intended to limit the present disclosure, and the scope of the present disclosure is defined by the claims. Various modifications and equivalents of the disclosure may occur to those skilled in the art within the spirit and scope of the disclosure, and such modifications and equivalents are considered to be within the scope of the disclosure.

Claims

1. A buffer for electronic equipment is characterized by comprising a first buffer structure, a motion structure, a second buffer structure and a foot pad structure which are sequentially arranged from top to bottom; the first buffer structure and the foot pad structure are both connected with the fixing plate;

the first buffer structure and the moving structure form a first air cavity, and the moving structure and the foot pad structure form a second air cavity;

the foot pad structure is stressed to drive the moving structure to do up-and-down reciprocating motion.

2. The damper of claim 1, wherein the first damping structure includes an air cavity assembly and a first damping assembly;

3. The damper of claim 2, wherein the air chamber assembly is provided with a first air hole for communicating the first air chamber with an external space.

4. A damper according to claim 3, wherein the moving structure is provided with a second air hole; which is used for communicating the first air cavity with the second air cavity.

5. The damper of claim 2, wherein the second damping structure is a variable stiffness structure; the first cushioning component is a variable stiffness component.

6. The damper of claim 2, wherein the first damping structure further comprises a second damping component;

the second buffer component is attached to the air cavity component.

7. A damper in accordance with claim 6 further comprising a sealing structure; the sealing structure is between the exercise structure and the footbed structure.

8. The damper of claim 7, wherein the first damping assembly, the second damping assembly, and the sealing structure each comprise a viscoelastic material.

9. A damper according to claim 1, wherein the second damping structure is provided with a first through hole, the moving structure is provided with a second through hole, and the foot pad structure is provided with a first protrusion; the motion structure, the second buffer structure and the foot pad structure are connected through the first through hole, the second through hole and the first protrusion.

10. The buffer of claim 1, wherein the foot pad structure is clamped in the hollow portion of the fixing plate; and a third through hole arranged on the first buffer structure is connected with the second bulge of the fixed plate.