CN201096168Y - Shock-evading foot pad and electronic device possessing same - Google Patents
Shock-evading foot pad and electronic device possessing same Download PDFInfo
- Publication number
- CN201096168Y CN201096168Y CNU2007201826512U CN200720182651U CN201096168Y CN 201096168 Y CN201096168 Y CN 201096168Y CN U2007201826512 U CNU2007201826512 U CN U2007201826512U CN 200720182651 U CN200720182651 U CN 200720182651U CN 201096168 Y CN201096168 Y CN 201096168Y
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- China
- Prior art keywords
- diapire
- shock
- foot pad
- roof
- surrounding wall
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a damping foot rest and an electronic device with the damping foot rest. The damping foot rest is arranged on the bottom part of the electronic device, and comprises a casing and an elastic element which is arranged in the casing; the casing is integrally formed by pliable materials such as rubber. The construction of the damping floor mat is simple, and thus the production cost is saved.
Description
Technical field
The utility model relates to a kind of shock-absorbing foot pad, particularly relates to a kind of for the shock-absorbing foot pad that is installed in the electronic equipment bottom.
Background technique
Consult Fig. 1, Fig. 2, its a kind of " dismountable damping foot pad " for TaiWan, China application case number No. 92126025 has been announced the patent case, wherein, this damping foot pad 1 comprises a damping member 11, is plugged on the damping member 11 and the top is provided with an external thread section 121 support connecting piece 12 and and is socketed in the outer pressure spring 13 of damping member 11, this external thread section 121 of mat, this damping foot pad 1 can be assembled in the bottom of an electronic equipment 100 for being spirally connected, and utilizes this pressure spring 13 to reach the effect of shock-absorbing.
But it is complicated that the shortcoming of this damping foot pad 1 is its member, so cost of production is higher.
Practical model utility content
Therefore, the purpose of this utility model is to provide a kind of structure simply can save the damping foot pad of cost of production.
Another purpose of the present utility model is to provide a kind of electronic equipment with shock-absorbing foot pad, and this shock-absorbing foot cushion structure is simple, manufacturing is easier to and cost of production is lower.
The purpose of this utility model is achieved in that promptly providing a kind of shock-absorbing foot pad to comprise a housing and is contained in the interior elastic element of housing.This housing comprises up and down a roof separately and a diapire, is connected between this roof and this diapire and the connecting wall of local at least pliability distortion, and this roof, this diapire and this connecting wall define a space.This elastic element be subjected to this connecting wall to be contained in this space with surrounding and be connected to this roof and this diapire between.
The utility model also provides a kind of electronic equipment with shock-absorbing foot pad, it also has a casing and and is contained in the interior electronic component of this casing, this casing has a casing diapire and a plurality of depressed part that is arranged at this casing diapire, and these shock-absorbing foots pad promptly are embedded at these depressed parts.
Advantage of the present utility model is, by the setting of those shock-absorbing foots pad, makes electronic equipment have shock-proof effect, and in addition, the element of this shock-absorbing foot pad has only housing and elastic element, and is just fairly simple and can save cost of production on the composition member of integral body.
Description of drawings
Fig. 1 is the three-dimensional exploded view that existing TaiWan, China has been announced patent case a kind of " dismountable damping foot pad ";
Fig. 2 is a stereogram, and its this existing dismountable damping foot pad of explanation is installed in electronic equipment bottom;
Fig. 3 is the first preferred embodiment stereogram that the utlity model has the electronic equipment of shock-absorbing foot pad;
Fig. 4 is in this first preferred embodiment, the local face upwarding stereogram of this electronic equipment;
Fig. 5 is in this first preferred embodiment, the stereogram that this shock-absorbing foot pad is bottom-up;
Fig. 6 is in this first preferred embodiment, the three-dimensional cutaway view of this shock-absorbing foot pad;
Fig. 7 is in this first preferred embodiment, and this electronic equipment combines with this shock-absorbing foot pad, and the elastic element of this shock-absorbing foot pad by compression sectional view not;
Fig. 8 is in this first preferred embodiment, and this electronic equipment combines with this shock-absorbing foot pad, and the sectional view of the connecting wall local deformation of this shock-absorbing foot pad;
Fig. 9 is that this newly has in second preferred embodiment of electronic equipment of shock-absorbing foot pad, and the pressure spring of this shock-absorbing foot pad is by compression sectional view not; And
Figure 10 is in this second preferred embodiment, the pressure spring of this shock-absorbing foot pad sectional view by compression.
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present utility model, in the detailed description of following cooperation two preferred embodiments with reference to the accompanying drawings, can clearly present.
Consult Fig. 3, Fig. 4, first preferred embodiment that the utlity model has the electronic equipment 2 of shock-absorbing foot pad 3 can be a notebook computer or CD player or the like, and this electronic equipment 2 comprises a casing 21 and is contained in a plurality of electronic components 20 in the casing 21.Wherein, if this electronic equipment 2 is a notebook computer, then these electronic components 20 can comprise central processing unit (CPU), host board, Winchester disk drive or the like, if this electronic equipment 2 is a CD player, then these electronic components 20 can comprise read head, circuit board, linking route or the like.Casing 21 has a casing diapire 211 and a plurality of depressed part 22 that is located at casing diapire 211.Each depressed part 22 have a surrounding wall 222 that is connected with casing diapire 211 and by this surrounding wall 222 in interior diapire 221, a stop member 223 that defines that casing diapire 211 centers on, in the present embodiment, corners that 223 of this stop members are connected with interior diapire 221 at surrounding wall 222 and in the form of a ring, it acts on explanation after a while.
As Fig. 5, Fig. 6, shown in Figure 7, those shock-absorbing foots pad 3 are that correspondence is installed in those depressed parts 22, and each shock-absorbing foot pad 3 comprises a housing 31 and an elastic element 32.
This housing 31 can be that the rubber material is one-body molded to be made, this housing 31 comprises that diapire 312 and that a roof 311, is interval in roof 311 belows is connected the connecting wall 313 between roof 311 and the diapire 312, above-mentioned roof 311, diapire 312 and connecting wall 313 define in a space 310 can be contained in for elasticity element 32, and connecting wall 313 local force-applied generation flexible deformations.
In the present embodiment, connecting wall 313 comprises in the surrounding wall portion 314, a joint and joint once.Last joint comprises a plurality of spaced apart around the last linkage section 315,315 ' that is connected roof 311 outer rims, following joint comprises a plurality of spaced apart around the following linkage section 316 that is connected diapire 312 outer rims, surrounding wall portion 314 is connected with roof 311 and diapire 312 with following linkage section 316 by linkage section 315 on those respectively, and go up in twos and define a upper vent hole 317 between the linkage section 315, descend in twos and define vent 318 between the linkage section 316.In addition, in the present embodiment, diapire 312 also has one with respect to those bumps 3120 that descends linkage sections 316 more down to protrude, when this electronic equipment 2 with shock-absorbing foot pad 3 is placed on the surface 200, and bump 3120 contact surfaces 200 of those shock-absorbing foots pad 3.
This elastic element 32 can be a pressure spring, and it is contained in the space 310 and the top is connected to roof 311 belows, and the bottom then is connected on the diapire 312.What replenish some explanation is, in the present embodiment, as shown in Figure 6, is to make wherein that linkage section 315 ' is not connected with surrounding wall portion 314 on one, and thus, roof 311 just can be raised by the part and make space 310 openings, and in elastic element 32 is contained in.When housing 31 was subjected to the strength of relative extruding up and down, elastic element 32 all was extruded with space 310, and linkage section 315 produces flexible deformations and makes roof 311 and diapire 312 relative proximities with following linkage section 316 on those.Certainly, when housing 31 integral body are that rubber is when one-body molded, in the process that is extruded, the roof 311 of housing 31, diapire 312 or other positions also may produce distortion slightly, but as shown in Figure 6, in the present embodiment, because the thickness of the tangible more upper and lower linkage section 315,316 of the thickness of surrounding wall portion 314 is big, and the direction of surrounding wall portion 314 is parallel with the direction of extruding, therefore, in first preferred embodiment, when housing 31 was squeezed, last linkage section 315 can produce the flexible deformation earlier with following linkage section 316.
Consult Fig. 4 and Fig. 7, each shock-absorbing foot pad 3 is to be embedded in depressed part 22 with its housing 31 tightly, and when shock-absorbing foot pad 3 is embedded in depressed part 22, housing 31 top periphery are connected to stop member 223 belows, housing 31 center of top zones then are interval in interior diapire 221 belows, in the present embodiment, housing 31 top periphery are meant surrounding wall portion 314 apical margins, and housing 31 center of top zones then are meant roof 311.Thus, this stop member 223 can embed the degree of depth of depressed part 22 on the one hand in order to restriction housing 31, on the other hand, then is to allow the roof 311 of housing 31 be interval in interior diapire 221 belows.
Consult Fig. 7, Fig. 8, therefore, when this electronic equipment 2 that is equiped with shock-absorbing foot pad 3 is placed on the surface 200 (on desktop), and when being subjected to the pressure (or shock-absorbing foot pad 3 bears the weight of electronic equipment 2) of above-below direction, the bump 3120 of diapire 312 is subjected to surface 200 reaction force and up roof 311 is contiguous relatively, and extruding space 310 is compression elastic element 32 simultaneously, reach the effect of shock-absorbing, buffering thus, and when linkage section under those 316 produced flexible deformations, the gas in space 310 was extruded housing 31 by following vent 318.
In addition, because present embodiment stop member 223 in the form of a ring, make and still leave one between the interior diapire 221 of roof 311 and depressed part 22 at interval, and roof 311 outer rims are to be connected with surrounding wall portion 314 by linkage section on those 315, therefore, if what this elastic element 32 was selected for use is the bigger pressure spring of elasticity coefficient K value, when diapire 312 is subjected to surface 200 reaction force toward top offset, pressure spring 32 compressed amounts are less, roof 311 then is to be compressed up ejection and make that linkage section 315 produces flexible deformations on those of spring 32, originally the gas in this interval is then pushed by roof 311 and flows to space 310 downwards through upper vent hole 317 (see figure 6)s, down flows out housing 31 by following vent 318 (see figure 5)s again.
Consult Fig. 9, Figure 10, second preferred embodiment of the present utility model and the first preferred embodiment difference are, this connecting wall 313 ' is to comprise that one is connected the surrounding wall 314 ' between roof 311 ' and the diapire 312 ', and the local segment 3141 ' thinner thickness of this surrounding wall 314 ', therefore, when this shock-absorbing foot pad 3 ' is squeezed, be the generation flexible deformation of local segment 3141 ' elder generation by surrounding wall 314 ' thinner thickness.
And in the present embodiment, diapire 312 ' is provided with those vents 318 ' down equally with the joint of surrounding wall portion 314 '.
In second preferred embodiment, the combination of this shock-absorbing foot pad 3 ' and electronic equipment can be shown in first preferred embodiment be combined in each depressed part 22 (see figure 4) of electronic equipment 2 in the drive fit mode, perhaps, also its roof 311 ' can be made its bottom attached to electronic equipment 1 by the mode of pasting.
As shown in the above, in the utility model, setting by those shock-absorbing foots pad 3, make electronic equipment 2 have shock-proof effect, in addition, this shock-absorbing foot pad 3,3 ' element have only housing 31 and elastic element 32, and housing 31 is that the rubber material is one-body molded, therefore, existing compared to Fig. 1, just fairly simple and can save cost of production on the composition member of integral body.
Claims (16)
1. shock-absorbing foot pad, it is characterized in that, comprise: housing and elastic element, this housing comprises up and down roof separately and diapire, is connected between this roof and this diapire and the connecting wall of local at least pliability distortion, this roof, this diapire and this connecting wall define the space, this elastic element, be subjected to this connecting wall to be contained in this space with surrounding and be connected to this roof and this diapire between.
2. according to the described shock-absorbing foot pad of claim 1, it is characterized in that, this connecting wall comprises the surrounding wall that is connected between this roof and this diapire, and this elastic element is to be subjected in this surrounding wall is enclosed in, and this surrounding wall local segment thinner thickness and force-applied generation flexible deformation.
3. according to the described shock-absorbing foot pad of claim 1, it is characterized in that, this connecting wall comprises surrounding wall portion and following joint, this time joint is provided with around this diapire outer rim, this surrounding wall portion apical margin is connected with this roof, this surrounding wall portion is connected with this diapire by this time joint, this elastic element is to be subjected in this surrounding wall portion is enclosed in, and this diapire has the bump that more down protrudes with respect to linkage section under those, when this diapire is squeezed, this elastic element is compressed, and this time joint produces the flexible deformation.
4. according to the described shock-absorbing foot pad of claim 3, it is characterized in that this time joint comprises a plurality of linkage sections down, linkage section is spaced apart around this diapire outer rim setting down for those, and descends in twos to define down vent between the linkage section.
5. according to claim 3 or 4 described shock-absorbing foots pad, it is characterized in that, this connecting wall more comprises joint, should go up joint and comprise a plurality of last linkage sections that connect around this roof outer rim, this surrounding wall portion is connected with this roof by linkage section on those, goes up in twos and defines upper vent hole between the linkage section.
6. according to claim 1,2,3 or 4 described shock-absorbing foots pad, it is characterized in that this housing is formed in one.
7. according to the described shock-absorbing foot pad of claim 5, it is characterized in that this housing is formed in one.
8. electronic equipment with shock-absorbing foot pad, comprise: casing, a plurality of electronic component and a plurality of shock-absorbing foot pad is characterized in that this casing has casing diapire and a plurality of depressed part that is arranged at this casing diapire; These a plurality of electronic components are contained in this casing; These a plurality of shock-absorbing foots pad are embedded at this depressed part respectively, respectively this shock-absorbing foot pad comprises housing and elastic element, this housing, comprise up and down roof separately and diapire, is connected between this roof and this diapire and the connecting wall of local at least pliability distortion, this roof, this diapire and this connecting wall center on and define the space; This elastic element, be subjected to this connecting wall to be contained in this space with surrounding and be connected to this roof and this diapire between.
9. according to the described electronic equipment of claim 8 with shock-absorbing foot pad, it is characterized in that, respectively this depressed part have the depressed part surrounding wall that is arranged at this casing diapire, by this depressed part surrounding wall in this casing diapire around the interior diapire that defines, when this housing was embedded at this depressed part, this roof was interval in diapire below in this.
10. according to the described electronic equipment of claim 9 with shock-absorbing foot pad, it is characterized in that, respectively this depressed part more comprises the stop member that is arranged at this depressed part surrounding wall inboard, this stop member is ring-like, when this shock-absorbing foot pad is embedded at this depressed part, this case top periphery be connected to this stop member and middle section at interval in this below diapire.
11. according to the described electronic equipment of claim 8 with shock-absorbing foot pad, it is characterized in that, this connecting wall comprises the surrounding wall that is connected between this roof and this diapire, and this elastic element is to be subjected in this surrounding wall is enclosed in, and this surrounding wall local segment thinner thickness and force-applied generation flexible deformation.
12. according to the described electronic equipment of claim 8 with shock-absorbing foot pad, it is characterized in that, this connecting wall comprises surrounding wall portion and following joint, this time joint is provided with around this diapire outer rim, this surrounding wall portion apical margin is connected with this roof, this surrounding wall portion is connected with this diapire by this time joint, this elastic element is to be subjected in this surrounding wall portion is enclosed in, and this diapire has the bump that more down protrudes with respect to linkage section under those, when this diapire is squeezed, this elastic element is compressed, and this time joint produces the flexible deformation.
13., it is characterized in that this time joint comprises a plurality of linkage sections down according to the described electronic equipment with shock-absorbing foot pad of claim 12, linkage section is spaced apart around this diapire outer rim setting down for those, and descends in twos to define down vent between the linkage section.
14. according to claim 12 or 13 described electronic equipments with shock-absorbing foot pad, it is characterized in that, this connecting wall more comprises joint, should go up joint and comprise a plurality of last linkage sections that connect around this roof outer rim, this surrounding wall portion is connected with this roof by linkage section on those, goes up in twos and defines upper vent hole between the linkage section.
15., it is characterized in that this housing is formed in one according to claim 8～13 each described electronic equipment wherein with shock-absorbing foot pad.
16., it is characterized in that this housing is formed in one according to the described electronic equipment of claim 14 with shock-absorbing foot pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201826512U CN201096168Y (en) | 2007-10-24 | 2007-10-24 | Shock-evading foot pad and electronic device possessing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201826512U CN201096168Y (en) | 2007-10-24 | 2007-10-24 | Shock-evading foot pad and electronic device possessing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201096168Y true CN201096168Y (en) | 2008-08-06 |
Family
ID=39923221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201826512U Expired - Lifetime CN201096168Y (en) | 2007-10-24 | 2007-10-24 | Shock-evading foot pad and electronic device possessing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201096168Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131359A (en) * | 2010-01-14 | 2011-07-20 | 纬创资通股份有限公司 | Foot pad of portable electronic device |
| CN102623037A (en) * | 2011-02-01 | 2012-08-01 | 泰金宝电通股份有限公司 | Adjustable buffer and multimedia storage apparatus module group |
| US8278551B2 (en) | 2009-08-24 | 2012-10-02 | Wistron Corp. | Electronic device |
| CN101998781B (en) * | 2009-08-28 | 2013-01-02 | 纬创资通股份有限公司 | Electronic device |
| CN104772710A (en) * | 2015-05-04 | 2015-07-15 | 李跃东 | Roller-type automatic shot blasting machine elastic supporting foot |
| CN108633163A (en) * | 2017-03-17 | 2018-10-09 | 纬创资通股份有限公司 | Shock-proof structure of circuit board for electronic device and electronic device thereof |
| CN112145614A (en) * | 2020-10-21 | 2020-12-29 | 合肥联宝信息技术有限公司 | Buffer for electronic equipment |
-
2007
- 2007-10-24 CN CNU2007201826512U patent/CN201096168Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8278551B2 (en) | 2009-08-24 | 2012-10-02 | Wistron Corp. | Electronic device |
| CN101998781B (en) * | 2009-08-28 | 2013-01-02 | 纬创资通股份有限公司 | Electronic device |
| CN102131359A (en) * | 2010-01-14 | 2011-07-20 | 纬创资通股份有限公司 | Foot pad of portable electronic device |
| CN102623037A (en) * | 2011-02-01 | 2012-08-01 | 泰金宝电通股份有限公司 | Adjustable buffer and multimedia storage apparatus module group |
| CN104772710A (en) * | 2015-05-04 | 2015-07-15 | 李跃东 | Roller-type automatic shot blasting machine elastic supporting foot |
| CN108633163A (en) * | 2017-03-17 | 2018-10-09 | 纬创资通股份有限公司 | Shock-proof structure of circuit board for electronic device and electronic device thereof |
| CN108633163B (en) * | 2017-03-17 | 2019-11-26 | 纬创资通股份有限公司 | Shock-proof structure of circuit board for electronic device and electronic device thereof |
| CN112145614A (en) * | 2020-10-21 | 2020-12-29 | 合肥联宝信息技术有限公司 | Buffer for electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080806 |
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| CX01 | Expiry of patent term |