CN115547800A - Shielding device and thin film deposition equipment with same - Google Patents
Shielding device and thin film deposition equipment with same Download PDFInfo
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- CN115547800A CN115547800A CN202110725711.5A CN202110725711A CN115547800A CN 115547800 A CN115547800 A CN 115547800A CN 202110725711 A CN202110725711 A CN 202110725711A CN 115547800 A CN115547800 A CN 115547800A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
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Abstract
The invention provides a film deposition device with a shielding device, which mainly comprises a reaction cavity, a bearing plate and a shielding device, wherein part of the shielding device and the bearing plate are positioned in the reaction cavity. The shielding device comprises two shielding plates and a driving device, wherein the driving device is connected with and drives the two shielding plates to swing towards opposite directions. The two shielding plates respectively comprise side surfaces facing each other, wherein the two side surfaces are respectively provided with a concave part and a convex part. When the deposition process is performed, the driving device drives the two shielding plates to move away from each other and switch to an open state. When the cleaning process is carried out, the driving device drives the two shielding plates to approach each other and switches to a shielding state, wherein the convex part of one shielding plate can enter the concave part of the other shielding plate, and the bearing plate can be effectively shielded.
Description
Technical Field
The invention relates to a film deposition device with a shielding device, which mainly completely shields a bearing disc through the shielding device so as to avoid polluting the bearing disc in the process of cleaning a processing chamber.
Background
Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment and are commonly used in integrated circuit, light emitting diode, display and other processes.
The deposition apparatus mainly includes a chamber and a wafer tray, wherein the wafer tray is located in the chamber and is used for carrying at least one wafer. For example, in physical vapor deposition, a target is disposed in the chamber, wherein the target faces the wafer on the wafer carrier. During physical vapor deposition, inert gas and/or reaction gas can be conveyed into the cavity, bias voltage is respectively applied to the target material and the wafer bearing plate, and the loaded wafer is heated through the wafer bearing plate.
The inert gas in the cavity forms ionized inert gas under the action of the high-voltage electric field, and the ionized inert gas is attracted by bias on the target material to bombard the target material. Target atoms or molecules sputtered from the target are attracted by the bias on the wafer carrier plate and deposit on the surface of the heated wafer to form a film on the surface of the wafer.
After a period of time, the inner surface of the chamber forms a deposition film, and thus the chamber needs to be periodically cleaned to prevent the deposition film from falling off during the process and further contaminating the wafer. Furthermore, oxides or other contaminants may also form on the surface of the target, and thus periodic cleaning of the target is also required. Generally, plasma ions are generally bombarded onto the target in the chamber through a burn-in process to remove oxides or other contaminants from the surface of the target.
When the chamber and the target are cleaned, the wafer carrying tray and the wafer in the chamber need to be taken out, or the wafer carrying tray needs to be isolated, so that the wafer carrying tray and the wafer are prevented from being polluted in the cleaning process.
Disclosure of Invention
Generally, after a certain period of time, the thin film deposition apparatus usually needs to be cleaned to remove the oxide or nitride on the thin film and the target deposited in the chamber. Particles generated during the cleaning process contaminate the carrier plate, thereby requiring isolation of the carrier plate from contaminants. The invention provides a shielding device and a film deposition device with the same. The shielding plate operated in the shielding state can completely shield the bearing disc so as to effectively avoid the pollution of particles generated when the cavity or the target material is cleaned on the bearing disc.
An objective of the present invention is to provide a thin film deposition apparatus with a shielding device, which mainly includes a reaction chamber, a carrier plate and a shielding device. The shielding device comprises a driving device and two shielding plates, wherein the driving device is connected with and drives the two shielding plates to respectively swing towards opposite directions, so that the two shielding plates are operated in an opening state and a shielding state.
The two shielding plates respectively comprise a side surface, wherein the side surfaces of the two shielding plates are opposite, and at least one concave part and at least one convex part are respectively arranged on the opposite side surfaces of the two shielding plates. When the reaction cavity is cleaned, the driving device drives the two shielding plates to approach each other in a swinging mode, the convex part on the side surface of one shielding plate enters the concave part on the side surface of the other shielding plate, and an overlapping area is formed between the two shielding plates, so that the two shielding plates form a complete shielding component. When the deposition process is carried out, the driving device drives the two shielding plates to move away from each other in a swinging mode, and the thin film deposition can be carried out on the substrate in the reaction cavity.
An object of the present invention is to provide a thin film deposition apparatus with a shielding device, which mainly uses two shielding plates to form a complete shielding member, so as to reduce the space required for accommodating the shielding plates. In an embodiment of the present invention, the two shielding plates can swing in opposite directions in the accommodating space of the reaction chamber, wherein the two shielding plates can be operated in an open state or a shielding state in the accommodating space of the reaction chamber, so as to simplify the structure of the reaction chamber and reduce the volume of the reaction chamber.
It is an objective of the present invention to provide a thin film deposition apparatus having a shielding device, wherein a driving device is connected to and supports two shielding plates through two connecting arms, respectively, so as to reduce the load of the connecting arms. In addition, a shielding plate with larger thickness can be further used to prevent the shielding plate from generating high-temperature deformation when the film deposition equipment is cleaned, and the effect of shielding the bearing disc by the shielding plate is favorably improved.
In order to achieve the above object, the present invention provides a thin film deposition apparatus having a shielding device, comprising: a reaction chamber, comprising an accommodating space: a bearing disc positioned in the containing space and used for bearing at least one substrate; and a shielding device, comprising: the first shielding plate is positioned in the accommodating space and comprises a first inner side surface, wherein the first inner side surface comprises at least one convex part; the second shielding plate is positioned in the accommodating space and comprises a second inner side surface, wherein the second inner side surface comprises at least one concave part, and the convex part of the first inner side surface corresponds to the concave part of the second inner side surface; and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein a first inner side surface of the first shielding plate and a second inner side surface of the second shielding plate in the shielding state are close to each other, a convex part on the first inner side surface enters a concave part on the second inner side surface, and the first shielding plate and the second shielding plate shield the bearing disc.
The invention provides a shielding device, which is suitable for a thin film deposition device and comprises: a first shield plate, including a first inner side surface, wherein the first inner side surface includes at least one convex portion; the second shielding plate comprises a second inner side surface, wherein the second inner side surface comprises at least one concave part, and the convex part of the first inner side surface corresponds to the concave part of the second inner side surface; and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein a first inner side surface of the first shielding plate and a second inner side surface of the second shielding plate in the shielding state are close to each other, and a convex part on the first inner side surface enters a concave part on the second inner side surface.
The driving device comprises a shaft seal device and at least one driving motor, and the driving motor is connected with the first shielding plate and the second shielding plate through the shaft seal device.
The film deposition equipment and the shielding device are characterized in that the shaft sealing device comprises an outer pipe body and a shaft body, the outer pipe body comprises a space for accommodating the shaft body, the driving motor is connected with the first shielding plate through the outer pipe body and connected with the second shielding plate through the shaft body, and the shaft body and the outer pipe body are synchronously driven to rotate towards opposite directions.
The thin film deposition equipment and the shielding device comprise two sensing areas which are connected with a reaction cavity, the two sensing areas respectively comprise a sensing space which is in fluid connection with an accommodating space, the thickness of the two sensing areas is smaller than that of the reaction cavity, and the two sensing areas are respectively provided with at least one position sensing unit which is used for sensing a first shielding plate and a second shielding plate entering the sensing space.
The film deposition equipment and the shielding device comprise at least one position sensing unit arranged in the reaction cavity and used for sensing the positions of the first shielding plate and the second shielding plate.
The thin film deposition equipment and the shielding device are characterized in that the area of the first shielding plate is larger than that of the second shielding plate.
The beneficial effects of the invention are: when the reaction cavity is cleaned, the driving device can drive the first shielding plate and the second shielding plate to be close to each other and switch the first shielding plate and the second shielding plate into a shielding state to shield the bearing plate, so that the bearing plate is prevented from being polluted in the process of cleaning a film deposition machine.
Drawings
FIG. 1 is a schematic side sectional view of a thin film deposition apparatus having a shielding apparatus according to an embodiment of the present invention in a shielding state.
FIG. 2 is a schematic perspective view illustrating an embodiment of a shielding apparatus of a thin film deposition device according to the present invention in an open state.
FIG. 3 is a schematic perspective view illustrating an embodiment of a shielding apparatus of a thin film deposition apparatus according to the present invention in a shielding state.
FIG. 4 is an enlarged cross-sectional view of a portion of the shielding device of the present invention in an embodiment not in a shielding state.
Fig. 5 is an enlarged cross-sectional view of a portion of an embodiment of the shielding device of the present invention in a shielding state.
Fig. 6 is an enlarged cross-sectional view of a portion of a shielding device according to another embodiment of the present invention, which is not operated in a shielding state.
Fig. 7 is a schematic perspective cross-sectional view of a driving device of a shielding device according to an embodiment of the present invention.
FIG. 8 is a top view of the thin film deposition apparatus having a shielding device according to an embodiment of the present invention in an open state.
FIG. 9 is a top view of the thin film deposition apparatus having a shielding apparatus according to an embodiment of the present invention in a shielding state.
FIG. 10 is a plan view showing still another embodiment of the thin film deposition apparatus having a shielding device according to the present invention, which is operated in an open state.
Description of reference numerals: 10, thin film deposition equipment; 100, a shielding device; 11, a reaction cavity; 111, a stopper; 112, opening; 113 sensing region; 12, an accommodating space; sensing space 120; 121, cleaning a space; 13, a bearing disc; 141 first connecting arm; 143 a second connecting arm; 15, a shielding member; 151: a first shield plate; 1511 a first inner side; 1513 a first outer side; 1515 a convex part; 152, spacing space; 153 a second shielding plate; 1531 second medial side; 1533 a second outer side; 1535 a recess; 154, a gap; 161 target material; 163 a substrate; 17, a driving device; 171, a driving motor; 173, a shaft seal device; 1731, outer tube body; 1732: space; 1733, a shaft body; 19: a position sensing unit.
Detailed Description
Please refer to fig. 1, which is a schematic side sectional view illustrating an embodiment of a thin film deposition apparatus with a shielding apparatus according to the present invention operating in a shielding state. As shown in the figure, the thin film deposition apparatus 10 mainly includes a reaction chamber 11, a carrying tray 13 and a shielding device 100, wherein the reaction chamber 11 includes an accommodating space 12 for accommodating the carrying tray 13 and a part of the shielding device 100.
The susceptor 13 is disposed in the accommodating space 12 of the reaction chamber 11 and is used for supporting at least one substrate 163. Taking the film deposition apparatus 10 as a physical vapor deposition chamber as an example, a target 161 is disposed in the reaction chamber 11, wherein the target 161 faces the substrate 163 and the susceptor 13. For example, the target 161 may be disposed on the upper surface of the reaction chamber 11 and face the susceptor 13 and/or the substrate 163 in the accommodating space 12.
Referring to fig. 2 and fig. 3, the shielding apparatus 100 includes a first shielding plate 151, a second shielding plate 153 and a driving device 17, wherein the first shielding plate 151 and the second shielding plate 153 are located in the accommodating space 12. The driving device 17 is connected to the first shielding plate 151 and the second shielding plate 153, and drives the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, for example, the first shielding plate 151 and the second shielding plate 153 swing synchronously around the driving device 17.
In an embodiment of the present invention, the driving device 17 is connected to a first connecting arm 141 and a second connecting arm 143, and is connected to the first shielding plate 151 and the second shielding plate 153 through the first connecting arm 141 and the second connecting arm 143, respectively, wherein the driving device 17 drives the first shielding plate 151 and the second shielding plate 153 to swing or rotate in opposite directions through the first connecting arm 141 and the second connecting arm 143, respectively.
The first shielding plate 151 and the second shielding plate 153 may be plate bodies, wherein the first shielding plate 151 and the second shielding plate 153 may have similar areas and shapes, for example, the first shielding plate 151 and the second shielding plate 153 may be semicircular plate bodies. When the driving device 17 drives the first shielding plate 151 and the second shielding plate 153 to close, the first shielding plate 151 and the second shielding plate 153 approach each other to form a disc-shaped shielding member 15, and the bearing tray 13 and/or the substrate 163 are shielded by the shielding member 15.
First inner side surface 1511 of first shield plate 151 includes at least one protrusion 1515, and second inner side surface 1531 of second shield plate 153 includes at least one recess 1535. The protrusion 1515 of the first interior side 1511 corresponds to the recess 1535 of the second interior side 1531, wherein the protrusion 1515 has a volume slightly less than the recess 1535. As shown in fig. 4, the protrusion 1515 is located at the middle of the first inner surface 1511 of the first shield plate 151, and the recess 1535 is located at the middle of the second inner surface 1531 of the second shield plate 153. As shown in fig. 6, the protrusion 1515 is located above the first inner surface 1511 of the first shielding plate 151, and the recess 1535 is also located above the second inner surface 1531 of the second shielding plate 153.
As shown in fig. 5, the first shielding plate 151 and the second shielding plate 153 according to the embodiment of the invention are operated in a shielding state, which may be defined as a first inner side surface 1511 of the first shielding plate 151 and a second inner side surface 1531 of the second shielding plate 153 approaching each other, wherein a gap 154 is formed between the first inner side surface 1511 of the first shielding plate 151 and the second inner side surface 1531 of the second shielding plate 153 in the shielding state.
In addition, when the first shielding plate 151 and the second shielding plate 153 are operated in the shielding state, the protrusion 1515 of the first inner side surface 1511 enters the recess 1535 of the second inner side surface 1531, wherein a gap 154 is also present between the protrusion 1515 and the recess 1535.
The gap 154 between the first inner side surface 1511 and the second inner side surface 1531 is less than a threshold, such as less than 1mm. Specifically, the first shielding plate 151 and the second shielding plate 153 do not directly contact each other, and the protrusion 1515 of the first shielding plate 151 and the recess 1535 of the second shielding plate 153 do not directly contact each other, so as to prevent particles generated by the first shielding plate 151 and the second shielding plate 153 during the contact process from contaminating the accommodating space 12 and/or the carrier tray 13 of the reaction chamber 11.
Taking the first shielding plate 151 and the second shielding plate 153 as semicircular plates, the first inner side surface 1511 of the first shielding plate 151 and the second inner side surface 1531 of the second shielding plate 153 are straight sides, and the first outer side surface 1513 of the first shielding plate 151 and the second outer side surface 1533 of the second shielding plate 153 are semicircular or arc sides.
The straight sides of the first inner surface 1511 of the first shielding plate 151 and the second inner surface 1531 of the second shielding plate 153 are only an embodiment of the invention, and are not intended to limit the scope of the invention. In practical applications, the first inner surface 1511 of the first shielding plate 151 and the second inner surface 1531 of the second shielding plate 153 may also have corresponding curved or saw-toothed sides.
In addition, the first shielding plate 151 and the second shielding plate 153 have similar areas and shapes, and are made of semicircular plates, which is only an embodiment of the present invention and is not limited by the scope of the present invention. In practical applications, the first shielding plate 151 and the second shielding plate 153 may be plates with different areas and shapes, and may also be plates with square, oval or any geometric shape, for example, the area of the first shielding plate 151 may be larger than that of the second shielding plate 153.
In an embodiment of the present invention, as shown in fig. 7, the driving device 17 includes at least one driving motor 171 and a shaft seal 173, wherein the driving motor 171 is connected to the first shielding plate 151 and the second shielding plate 153 by the shaft seal 173. The driving motor 171 is located outside the accommodating space 12 of the reaction chamber 11, and the shaft sealing device 173 passes through and is disposed in the reaction chamber 11, wherein a part of the shaft sealing device 173 is located in the accommodating space 12 of the reaction chamber 11.
The shaft seal 173 includes an outer body 1731 and a shaft 1733. The outer tube 1731 includes a space 1732 for accommodating the shaft 1733, wherein the outer tube 1731 and the shaft 1733 are coaxially disposed, and the outer tube 1731 and the shaft 1733 can rotate relatively. The outer tube 1731 is connected to the first connecting arms 141, and is connected to the first shielding plate 151 via the first connecting arms 141 to drive the first shielding plate 151 to swing. The shaft 1733 is connected to the second connecting arm 143, and is connected to and drives the second shielding plate 153 to swing via the second connecting arm 143. In another embodiment of the present invention, the shaft seal device 173 may be a magnetic fluid shaft seal.
In an embodiment of the invention, as shown in fig. 7, the number of the driving motors 171 may be two, and the two driving motors 171 are respectively connected to the outer tube 1731 and the shaft 1733 of the sealing device 173 and respectively drive the outer tube 1731 and the shaft 1733 to synchronously rotate in opposite directions, so as to respectively drive the first shielding plate 151 and the second shielding plate 153 to swing in different directions through the outer tube 1731 and the shaft 1733.
In another embodiment of the present invention, the number of the driving motors 171 may be one, and the first shielding plate 151 and the second shielding plate 153 are connected and driven to synchronously swing in opposite directions through a connecting mechanism via the first connecting arm 141 and the second connecting arm 143, respectively.
Specifically, the thin film deposition apparatus 10 and/or the shielding device 100 of the present invention can operate in two states, an on state and a shielding state, respectively. As shown in fig. 2 and 9, the driving device 17 can drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, so that the first shielding plate 151 and the second shielding plate 153 are separated from each other and operated in an open state. A space 152 is formed between the first shielding plate 151 and the second shielding plate 153 when the target 161 is operated in the open state, so that the first shielding plate 151 and the second shielding plate 153 are not present between the target 161 and the susceptor 13 and the substrate 163.
The susceptor 13 and the substrate 163 may then be driven toward the target 161, and the gas, such as inert gas, in the accommodating space 12 may impact the target 161 to deposit a thin film on the surface of the substrate 163.
In an embodiment of the present invention, as shown in fig. 1, a stopper 111 may be disposed in the accommodating space 12 of the reaction chamber 11, wherein one end of the stopper 111 is connected to the reaction chamber 11, and the other end of the stopper 111 forms an opening 112. When the carrier plate 13 approaches the target 161, it enters or contacts the opening 112 formed by the stopper 111. The reaction chamber 11, the supporting plate 13 and the stopper 111 separate a reaction space in the accommodating space 12, and deposit a thin film on the surface of the substrate 163 in the reaction space, thereby preventing the formation of a deposited thin film on the surfaces of the reaction chamber 11 and the supporting plate 13 outside the reaction space.
Further, as shown in fig. 3 and 9, the driving device 17 may drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions, so that the first shielding plate 151 and the second shielding plate 153 approach each other and operate in a shielding state. The closed first shielding plate 151 and the second shielding plate 153 form a shielding member 15, wherein the shielding member 15 is located between the target 161 and the susceptor 13 and is used for shielding the susceptor 13 to isolate the target 161 from the susceptor 13.
The shielding member 15 can separate a cleaning space 121 in the accommodating space 12, wherein the cleaning space 121 partially overlaps or is close to the reaction space. A burn-in process may be performed in the cleaning space 121 to clean the target 161 and the reaction chamber 11 and/or the stopper 111 in the cleaning space 121, and remove oxide, nitride or other contaminants on the surface of the target 161 and the deposited film on the surface of the reaction chamber 11 and/or the stopper 111.
During the cleaning process of the thin film deposition apparatus 10, the susceptor 13 and/or the substrate 163 are shielded or isolated by the shielding member 15 to prevent the substances generated during the cleaning process from contaminating or depositing on the surface of the susceptor 13 and/or the substrate 163.
Specifically, in the present invention, the first shielding plate 151 and the second shielding plate 153 form the shielding member 15, and the first connecting arm 141 and the second connecting arm 143 respectively support the weight of the first shielding plate 151 and the second shielding plate 153, so that the burden on the first connecting arm 141 and the second connecting arm 143 can be reduced.
In addition, the thickness or weight of the first shielding plate 151 and the second shielding plate 153 may be further increased to prevent the first and second shielding plates 151/153 from being deformed at a high temperature during the cleaning of the thin film deposition apparatus 10, and plasma or contamination during the cleaning may be prevented from contacting the lower susceptor 13 or the substrate 163 through the deformed first and second shielding plates 151 and 153.
The shielding member 15 is divided into two first shielding plates 151 and second shielding plates 153 which can be connected and separated from each other, which is more favorable for reducing the receiving space required by the first shielding plates 151 and the second shielding plates 153 in the open state, and can simplify or adjust the structure of the reaction chamber 11.
In an embodiment of the invention, as shown in fig. 8 and 9, the first shielding plate 151 and the second shielding plate 153 can be operated in an open state and a shielding state in the accommodating space 12 of the reaction chamber 11, without additionally providing one or more storage chambers for storing the shielding plates in the open state. For example, the volume of the reaction chamber 11 and/or the accommodating space 12 may be slightly larger than the original volume, so that the first shielding plate 151 and the second shielding plate 153 can be opened or closed in the accommodating space 12 of the reaction chamber 11.
In an embodiment of the invention, a plurality of position sensing units 19 may be further disposed on the reaction chamber 11, wherein the position sensing units 19 face the accommodating space 12 and are configured to sense positions of the first shielding plate 151 and the second shielding plate 153 to determine whether the first shielding plate 151 and the second shielding plate 153 are in an open state. The position sensing unit 19 may be a light sensing unit, for example.
In practical applications, the position of the position sensing unit 19 can be adjusted, wherein the first shielding plate 151 and the second shielding plate 153 are opened to a specific angle and then sensed by the position sensing unit 19. Then, the susceptor 13 can approach the target 161 to avoid collision of the susceptor 13 with the first shielding plate 151 and the second shielding plate 153.
In practical applications, the position of the masking device 100 in the reaction chamber 11 can be adjusted according to other mechanisms or configurations of the moving line on the thin film deposition apparatus 10. Taking the accommodating space 12 of the reaction chamber 11 as a square, as shown in fig. 8 and 9, the driving device 17 of the shielding device 100 may be disposed at a side of the reaction chamber 11 and/or the accommodating space 12. As shown in fig. 10, the driving device 17 of the shielding device 100 may also be disposed at a corner of the reaction chamber 11 and/or the accommodating space 12, so as to facilitate disposing mechanisms such as a substrate feeding port and an exhaust line at a side of the reaction chamber 11.
In an embodiment of the invention, the reaction chamber 11 may be connected to two sensing regions 113, wherein the sensing regions 113 protrude from a side surface of the reaction chamber 11, and the thickness of the sensing regions 113 is smaller than that of the reaction chamber 11. The two sensing regions 113 respectively include a sensing space 120, and the sensing space 120 of the sensing regions 113 is fluidly connected to the accommodating space 12 of the reaction chamber 11, wherein the thickness or height of the sensing space 120 is smaller than that of the accommodating space 12. When the first shielding plate 151 and the second shielding plate 153 are operated in the open state, a portion of the first shielding plate 151 and a portion of the second shielding plate 153 enter the two sensing spaces 120 fluidly connected to the accommodating space 12, respectively, wherein the areas of the first shielding plate 151 and the second shielding plate 153 located in the sensing spaces 120 are smaller than the areas of the first shielding plate 151 and the second shielding plate 153 located in the accommodating space 12.
As shown in fig. 10, two sensing regions 113 are respectively disposed on two adjacent sides of the reaction chamber 11, and at least one position sensing unit 19 is respectively disposed on the two sensing regions 113 for sensing the first shielding plate 151 and the second shielding plate 153 entering the sensing space 120.
The invention has the advantages that:
when the reaction cavity is cleaned, the driving device can drive the first shielding plate and the second shielding plate to be close to each other and switch the first shielding plate and the second shielding plate into a shielding state to shield the bearing plate, so that the bearing plate is prevented from being polluted in the process of cleaning a film deposition machine.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, i.e., all equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention described in the claims should be included in the scope of the present invention.
Claims (10)
1. A thin film deposition apparatus having a masking device, comprising:
a reaction cavity comprising a containing space;
a bearing disc positioned in the containing space and used for bearing at least one substrate; and
a shade device, comprising:
a first shielding plate located in the accommodating space and including a first inner side surface, wherein the first inner side surface includes at least one convex portion;
the second shielding plate is positioned in the accommodating space and comprises a second inner side surface, wherein the second inner side surface comprises at least one concave part, and the convex part of the first inner side surface corresponds to the concave part of the second inner side surface; and
and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein the first inner side surface of the first shielding plate and the second inner side surface of the second shielding plate in the shielding state are close to each other, the convex part on the first inner side surface enters the concave part on the second inner side surface, and the first shielding plate and the second shielding plate shield the bearing disc.
2. The apparatus of claim 1, wherein the driving device comprises a shaft sealing device and at least one driving motor, the driving motor is connected to the first shielding plate and the second shielding plate via the shaft sealing device.
3. The apparatus of claim 2, wherein the shaft seal device comprises an outer tube and a shaft, the outer tube includes a space for receiving the shaft, the driving motor is connected to the first shielding plate through the outer tube, and is connected to the second shielding plate through the shaft, and synchronously drives the shaft and the outer tube to rotate in opposite directions.
4. The thin film deposition apparatus with shielding apparatus of claim 1, comprising two sensing regions connected to the reaction chamber, wherein the two sensing regions respectively comprise a sensing space in fluid connection with the accommodating space, and the two sensing regions have a thickness smaller than that of the reaction chamber, and at least one position sensing unit is disposed in each of the two sensing regions for sensing the first shielding plate and the second shielding plate entering the sensing space.
5. The apparatus of claim 1, comprising at least one position sensing unit disposed in the reaction chamber and configured to sense positions of the first shielding plate and the second shielding plate.
6. The thin film deposition apparatus having a shielding device according to claim 1, wherein the first shielding plate has an area larger than that of the second shielding plate.
7. A masking device for a thin film deposition apparatus, comprising:
a first shield plate comprising a first inner side surface, wherein the first inner side surface comprises at least one convex part;
a second shielding plate, including a second inner side surface, wherein the second inner side surface includes at least one concave portion, and the convex portion of the first inner side surface corresponds to the concave portion of the second inner side surface; and
and the driving device is connected with the first shielding plate and the second shielding plate and respectively drives the first shielding plate and the second shielding plate to swing towards opposite directions so that the first shielding plate and the second shielding plate are switched between an opening state and a shielding state, wherein the first inner side surface of the first shielding plate and the second inner side surface of the second shielding plate in the shielding state are close to each other, and the convex part on the first inner side surface enters the concave part on the second inner side surface.
8. The shielding apparatus according to claim 7, wherein the driving apparatus comprises a shaft sealing apparatus and at least one driving motor, the driving motor connects the first shielding plate and the second shielding plate via the shaft sealing apparatus.
9. The shielding apparatus as claimed in claim 8, wherein the shaft sealing apparatus comprises an outer tube and a shaft, the outer tube includes a space for accommodating the shaft, the driving motor is connected to the first shielding plate through the outer tube, and is connected to the second shielding plate through the shaft, and synchronously drives the shaft and the outer tube to rotate in opposite directions.
10. A screening arrangement according to claim 7, wherein the area of the first screening plate is larger than the area of the second screening plate.
Priority Applications (1)
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CN202110725711.5A CN115547800A (en) | 2021-06-29 | 2021-06-29 | Shielding device and thin film deposition equipment with same |
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Application Number | Priority Date | Filing Date | Title |
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CN202110725711.5A CN115547800A (en) | 2021-06-29 | 2021-06-29 | Shielding device and thin film deposition equipment with same |
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CN115547800A true CN115547800A (en) | 2022-12-30 |
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CN202110725711.5A Pending CN115547800A (en) | 2021-06-29 | 2021-06-29 | Shielding device and thin film deposition equipment with same |
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2021
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