CN115542672A - Focusing and leveling device and photoetching machine - Google Patents

Focusing and leveling device and photoetching machine Download PDF

Info

Publication number
CN115542672A
CN115542672A CN202110736679.0A CN202110736679A CN115542672A CN 115542672 A CN115542672 A CN 115542672A CN 202110736679 A CN202110736679 A CN 202110736679A CN 115542672 A CN115542672 A CN 115542672A
Authority
CN
China
Prior art keywords
detection
mirror unit
reflecting
component
focusing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110736679.0A
Other languages
Chinese (zh)
Inventor
彭俊
李道萍
孙建超
王晓庆
陈小娟
庄亚政
徐荣伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN202110736679.0A priority Critical patent/CN115542672A/en
Publication of CN115542672A publication Critical patent/CN115542672A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034Leveling
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7069Alignment mark illumination, e.g. darkfield, dual focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention provides a focusing and leveling device and a photoetching machine, wherein a scanning and reflecting assembly comprises a driving unit and a driving unit, the reflecting mirror unit is provided with one or at least two reflecting surfaces which are distributed circumferentially, the driving unit drives the reflecting mirror unit to rotate so as to scan and image a projection light spot on the surface of a substrate, inertia generated by the self-quality of the reflecting mirror unit is not needed to be overcome, the modulation frequency can be improved by improving the rotating speed, the detection signal-to-noise ratio of the focusing and leveling device is further improved, the measurement error is reduced, and when the reflecting mirror unit is provided with at least two reflecting surfaces, the light intensity modulation can be provided for multiple times by rotating the reflecting mirror unit for one circle, so that the modulation frequency is further improved.

Description

Focusing and leveling device and photoetching machine
Technical Field
The invention relates to the technical field of photoetching, in particular to a focusing and leveling device and a photoetching machine.
Background
In the exposure process of the lithography machine, factors such as thickness deviation, surface shape fluctuation of the silicon wafer and a projection objective (an illuminated object is formed into a bright and clear real image on a screen), inaccuracy of the position of a focal plane, non-repeatability and the like can cause defocusing or inclination of the silicon wafer relative to the focal plane of the objective. If the defocus or tilt of the wafer causes certain areas within the exposure field to be outside the effective depth of focus, the quality and yield of the integrated circuit will be severely affected. Therefore, the height and inclination of the silicon wafer surface relative to the focal plane of the projection objective must be measured by using a focusing and leveling device. In the whole exposure process, once the position of the silicon wafer deviates from the optimal focal plane, the position of the silicon wafer is adjusted through the workpiece table to be always positioned on the optimal focal plane of the projection objective so as to ensure that an image formed on the silicon wafer is clear.
In the focusing and leveling device with light intensity modulation, a single-sided scanning mirror is usually adopted to carry out high-speed reciprocating simple harmonic vibration, however, the single-sided scanning mirror needs to overcome inertia generated by the self-mass to repeatedly start and brake in the reciprocating process, so that the reciprocating frequency of the single-sided scanning mirror is limited to a certain extent, and can only reach 3 kHz-4 kHz. The modulation frequency of the light intensity modulation is twice of the reciprocating vibration frequency of the scanning reflector, and the reciprocating motion frequency of the scanning reflector is limited, so that the modulation frequency of the light intensity modulation cannot be further improved. The modulation frequency of the light intensity modulation is related to the detection signal-to-noise ratio and the measurement error of the focusing and leveling device, and if the modulation frequency is low, the detection signal-to-noise ratio is low, and the measurement error is large, so that the performance improvement of the focusing and leveling device adopting the light intensity modulation technology is greatly influenced.
Disclosure of Invention
The invention aims to provide a focusing and leveling device and a photoetching machine, and aims to solve the problems of low signal-to-noise ratio, large measurement error and the like of the focusing and leveling device caused by limited scanning frequency of the color of the existing single-sided scanning reflecting mirror.
In order to achieve the above object, the present invention provides a focusing and leveling device, comprising:
an illumination assembly for emitting a detection beam;
the projection slit component is used for transmitting the detection light beam and forming a plurality of projection light spots;
the scanning reflection assembly comprises a driving unit and a reflecting mirror unit, wherein the reflecting mirror unit is provided with one or at least two reflecting surfaces which are distributed circumferentially, the driving unit drives the reflecting mirror unit to rotate along a preset direction and projects and images the projection light spots on the surface of a substrate, and the projection light spots are reflected by the surface of the substrate to form detection light spots;
the detection slit component is used for transmitting the detection light spots and forming mark light spots; and (c) a second step of,
a detector assembly for detecting the energy of the marker spot.
Optionally, when the plurality of projection light spots are entirely incident to the center of the reflecting surface, the energy of the marker light spot detected by the detector assembly is maximum.
Optionally, a time between when the plurality of projection light spots are just incident on the reflection surface and when the plurality of projection light spots completely leave the reflection surface is one scanning period, and scanning periods corresponding to the reflection surfaces are all equal.
Optionally, the widths of the reflection surfaces along the scanning direction are equal, and the driving unit drives the mirror unit to rotate at a constant speed.
Optionally, the widths of the reflecting surfaces along the scanning direction are different, and the driving unit drives the mirror unit to rotate at a non-uniform speed.
Optionally, the reflecting mirror unit is a prism, a frustum of a pyramid, or a pyramid, and at least one side surface of the prism, the frustum of a pyramid, or the pyramid is the reflecting surface.
Optionally, the mirror unit has protrusions distributed along the circumferential direction, and at least one exposed surface of the protrusions is the reflecting surface.
Optionally, the protrusions are prisms, prismatic stages, or pyramids.
Optionally, the method further includes:
the projection imaging component is positioned between the projection slit component and the scanning reflection component and is used for carrying out relay amplification on the projection light spot and then enabling the projection light spot to be incident on the substrate; and (c) a second step of,
the detection imaging component is positioned between the scanning reflection component and the detection slit component and is used for carrying out relay amplification on the detection light spot and then transmitting the detection light spot into the detection slit component; and the number of the first and second groups,
and the relay imaging component is positioned between the detection slit component and the detector component and is used for carrying out relay amplification on the marked light spots and then transmitting the marked light spots into the detector component.
Optionally, the method further includes:
the first reflecting mirror is positioned between the scanning reflecting assembly and the detection imaging assembly and used for reflecting the detection light spots to the detection imaging assembly; and the number of the first and second groups,
and the second reflector is positioned between the detection imaging component and the detection slit component and is used for reflecting the detection light spot subjected to relay amplification by the detection imaging component into the detection slit component.
Optionally, the detector assembly outputs an electrical signal representing the energy of the marker spot, and calculates the defocus Δ Z of the substrate by using the following formula:
Figure BDA0003141802130000031
Figure BDA0003141802130000032
Figure BDA0003141802130000033
wherein θ is an incident angle of the projection light spot incident on the surface of the substrate; β is the magnification of the probe spot from the substrate to the probe slit assembly; f is the focal length of the mirror unit to the substrate; a is the amplitude of an electric signal output by the detector assembly when the projection light spot just enters one reflecting surface; and B is the amplitude of the electric signal output by the detector assembly when the projection light spot completely leaves the reflecting surface.
The invention also provides a photoetching machine which comprises the focusing and leveling device.
In the focusing and leveling device and the photoetching machine provided by the invention, the scanning and reflecting assembly comprises a driving unit and a driving unit, the reflecting mirror unit is provided with one or at least two reflecting surfaces which are distributed circumferentially, the driving unit drives the reflecting mirror unit to rotate so as to scan and image a projection light spot on the surface of a substrate, inertia generated by the self-mass of the reflecting mirror unit is not needed to be overcome, the modulation frequency can be improved by improving the rotating speed, the detection signal-to-noise ratio of the focusing and leveling device is further improved, the measurement error is reduced, and when the reflecting mirror unit is provided with at least two reflecting surfaces, the light intensity modulation can be provided for multiple times by rotating the reflecting mirror unit for one circle, so that the modulation frequency is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a focusing and leveling device according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a mirror unit according to an embodiment of the present invention;
fig. 3 is a graph showing a variation of displacement Δ L between a projection light spot and a detection light spot with time according to an embodiment of the present invention;
FIG. 4 is a graph of electrical signal output by the detector assembly over time for the three scan cycles of FIG. 3;
FIG. 5 is a schematic view of a mirror unit according to a second embodiment of the present invention;
fig. 6 is a schematic view of a mirror unit according to a third embodiment of the present invention;
fig. 7 is a schematic view of a mirror unit according to a fourth embodiment of the present invention;
wherein the reference numerals are:
101-a lighting assembly; 102-a projection slit assembly; 103-a projection imaging assembly; 104-a mirror unit; 105-a substrate; 106-a first mirror; 107-detecting an imaging component; 108-a second mirror; 109-a detection slit component; 110-a relay imaging assembly; 120-a detector assembly; 200-projection objective.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is provided for the purpose of facilitating and clearly illustrating embodiments of the present invention.
Example one
Fig. 1 is a schematic structural diagram of a focusing and leveling device provided in this embodiment. As shown in fig. 1, the focusing and leveling apparatus provided in this embodiment includes an illumination assembly 101, a projection slit assembly 102, a projection imaging assembly 103, a scanning reflection assembly, a first reflection mirror 106, a detection imaging assembly 107, a second reflection mirror 108, a detection slit assembly 109, a relay imaging assembly 110, and a detector assembly 120, which are sequentially disposed along an optical path.
With continued reference to fig. 1, the illumination assembly 101 may emit a detection beam, which may be an ultraviolet beam, a visible beam, an infrared beam, or a broadband beam mixed by the above three bands. The detection beam may be a parallel beam passing through preliminary collimation.
The projection slit assembly 102 has a plurality of parallel first slits, or it can be understood that the projection slit assembly 102 includes a first plate-shaped structure that is opaque to light and the first slits are opened on the first plate-shaped structure. And the detection light beams form a plurality of projection light spots after penetrating through the first slits, each first slit corresponds to one projection light spot, and the shape and position distribution of the projection light spots correspond to the shape and position distribution of the first slits.
Alternatively, the first slit may be a through hole with a square shape, a rectangular shape, or other possible shapes, and the first plate-like structure may be disposed perpendicular to the light path, or may be disposed obliquely with respect to the light path, which is not limited in the present invention.
Further, the projection imaging component 103 may include one or several refractive lenses or reflective lenses for performing relay amplification on the projection light spot. Of course, the projection imaging component 103 may further include an optical lens with a special adjusting function, such as a wedge plate, a parallel flat plate, an aspherical mirror, or a free-form surface mirror, for adjusting the imaging quality of the projection imaging component 103. Optionally, the projection imaging assembly 103 may further include a diaphragm for adjusting the size of the field of view of the projection light spot.
Fig. 2 is a schematic diagram of the mirror unit 104 provided in this embodiment. As shown in fig. 1 and fig. 2, the scanning reflection assembly includes a driving unit (not shown) and a mirror unit 104, the mirror unit 104 has one or at least two reflection surfaces distributed circumferentially, the driving unit drives the mirror unit 104 to rotate along a predetermined direction and projects and images the projection light spot amplified by the projection imaging assembly 103 onto the surface of a substrate 105, and the projection light spot is reflected by the surface of the substrate 105 to form a detection light spot.
The substrate 105 is located below the projection objective 200, and if the surface shape of the substrate 105 is uneven, the projection light spot projected on a certain position of the surface of the substrate 105 will not be reflected on the best focal plane of the projection objective 200, so that the detection light spot is distorted, and the substrate 105 will be out of focus at this position.
With continued reference to fig. 1 and 2, in the present embodiment, the reflector unit 104 is a prism, each side of the prism is a reflective surface, and fig. 2 shows an octagonal prism, that is, the reflector unit 104 has eight reflective surfaces. When the driving unit drives the mirror unit 104 to rotate along the predetermined direction, the projection light spots swing according to a certain rule, wherein the time from the moment that a plurality of projection light spots are incident on a reflecting surface to the moment that the plurality of projection light spots completely leave the reflecting surface is a scanning period T.
Further, the mirror unit 104 is a regular prism, and the width of each side surface of the regular prism in the scanning direction is equal, so that the width of each reflecting surface of the mirror unit 104 in the scanning direction is equal. The driving unit drives the mirror unit 104 to rotate at a constant speed, so that the scanning period T corresponding to each of the reflecting surfaces is equal.
Of course, the mirror unit 104 is not limited to a regular prism, and may be other irregular prisms. In this way, in order to ensure that the scanning periods T corresponding to each of the reflecting surfaces are equal, the driving unit may drive the reflecting mirror unit 104 to rotate at a non-uniform speed along the predetermined direction, for example, when the reflecting surface with a larger width along the scanning direction reflects the projection light spot, the driving unit may increase the rotation speed of the reflecting mirror unit 104; conversely, when the reflection surface having a smaller width in the scanning direction reflects the projection light spot, the driving unit may decrease the rotation speed of the mirror unit 104.
It is understood that the prism is not limited to an octagonal prism, and may be a triangular prism, a pentagonal prism, a hexagonal prism, or the like, which is not illustrated herein.
Further, the mirror unit 104 is not limited to have 8 reflecting surfaces, and may also have 1, 2, 3, or 4 reflecting surfaces, for example, when the mirror unit 104 is an octagonal prism, 8 side surfaces of the octagonal prism are not all the reflecting surfaces, but only a part of the side surfaces are the reflecting surfaces, and another part of the side surfaces are not the reflecting surfaces, but should not be limited thereto.
With continued reference to fig. 1, the substrate 105 may be a silicon wafer or other surface requiring surface shape measurement in a precision process flow.
Further, the first reflecting mirror 106 and the reflecting mirror unit 104 may be symmetrically distributed on two sides of the projection objective 200 for reflecting the detection light spot, and the first reflecting mirror 106 may turn the light path, so as to reduce the space occupied by the focusing and leveling device.
The detection imaging component 107 may include one or several refractive or reflective mirrors for relay magnification of the detection spot. Of course, the detection imaging component 107 may further include an optical lens with a special adjusting function, such as a wedge plate, a parallel flat plate, an aspherical mirror, or a free-form surface mirror, for adjusting the imaging quality of the detection imaging component 107. Optionally, the detection imaging assembly 107 may further include a diaphragm for adjusting the size of the field of view of the detection light spot.
It should be understood that, since the first reflecting mirror 106 turns the optical path, the detection imaging component 107 and the projection imaging component 103 are also symmetrically distributed on both sides of the projection objective 200.
Further, the second mirror 108 is configured to reflect the detection light spot after being relayed and amplified by the detection imaging component 107, and the second mirror 108 may also turn the light path, so as to reduce the space occupied by the focusing and leveling device.
It is understood that, as an alternative embodiment, the first mirror 106 and/or the second mirror 108 may be omitted; moreover, an additional optical element may be added to the optical path to turn the optical path, which is not illustrated here.
With continued reference to fig. 1, the detection slit assembly 109 has a plurality of second parallel slits, or it can be understood that the detection slit assembly 109 includes a second opaque plate-shaped structure and the second slits are opened on the second plate-shaped structure, and the detection light spot forms a mark light spot after passing through the second slits.
Optionally, the second slit may be a square or rectangular through hole, and the second plate-like structure may be disposed perpendicular to the light path, or may be disposed obliquely with respect to the light path, which is not limited in the present invention.
Further, the second slits and the first slits have corresponding shapes and position distributions, and the sizes of the second slits and the first slits in the scanning direction have a certain proportional relationship. When the reflector unit 104 rotates, the projection light spots swing according to a certain rule, and when the plurality of projection light spots are integrally incident to the center of the reflecting surface, the energy of the mark light spot is maximum.
The relay imaging assembly 110 may include one or several refractive lenses or reflective lenses for relay magnification of the marking spots. Of course, the relay imaging assembly 110 may further include an optical lens having a special adjusting function, such as a wedge plate, a parallel flat plate, an aspherical mirror, or a free-form surface mirror, for adjusting the imaging quality of the relay imaging assembly 110. Optionally, the detection imaging assembly 107 may further include a diaphragm for adjusting the size of the field of view of the marker spot.
The detector assembly 120 is configured to detect the energy of the marker spot and output an electrical signal indicative of the energy of the marker spot. The detector assembly 120 may be a sensor such as a photodetector.
Referring to fig. 1, according to Scheimpflug law (Scheimpflug Principle) of the focusing and leveling system, the defocus amount Δ Z of the substrate 105 and the displacements Δ L of the projection light spot and the detection light spot in the scanning direction can be known 1 The relationship of (1) is:
Figure BDA0003141802130000081
wherein θ is an incident angle of the projected light spot incident on the surface of the substrate 105; β is = the magnification of the probe spot from the substrate 105 to the probe slit assembly 109 (i.e., the magnification of the probe imaging assembly 107) the magnification of the probe imaging assembly 107.
The scanning process model of each of the reflecting surfaces of the mirror unit 104 can be described as:
Figure BDA0003141802130000082
wherein, the first and the second end of the pipe are connected with each other,
Figure BDA0003141802130000083
the angular displacement of the position of the projected light spot t on the reflecting surface relative to the position of the projected light spot t just entering the reflecting surface;
Figure BDA0003141802130000084
the maximum angular displacement of the plurality of projected light spots from just incidence on the reflecting surface to completely leaving the reflecting surface.
When the mirror unit 104 rotates, a displacement Δ Y before the projected light spot is incident on the surface of the substrate 105 2 And the displacement Δ L of the projection spot relative to the detection spot 2 Respectively as follows:
Figure BDA0003141802130000085
Figure BDA0003141802130000086
where f is the focal length of the mirror unit 104 to the substrate 105.
Since the rotation of each of the reflecting surfaces of the mirror unit 104 can be regarded as a small angle swing, equation (4) can be simplified as:
Figure BDA0003141802130000091
in summary, when the defocus of the substrate 105 is Δ Z, the displacement Δ L between the projection spot and the detection spot is:
Figure BDA0003141802130000092
wherein, the first and the second end of the pipe are connected with each other,
Figure BDA0003141802130000093
it can be seen that M, N, f are constants, and from equation (6), the displacement Δ L between the projection spot and the detection spot is equal to
Figure BDA0003141802130000094
And (4) correlating.
Fig. 3 is a graph of the displacement Δ L between the projection spot and the detection spot as a function of time. As shown in fig. 3, in the first scanning period T1, the substrate 105 is located at the correct position; during the second scan period T2 and during the third scan period T3, the substrate 105 is out of focus; wherein h is the width of the detection light spot along the scanning direction.
FIG. 4 is a graph of the electrical signal output by the detector assembly 120 over time during the three scan cycles of FIG. 3. As shown in fig. 4, when t =0, the amplitude of the electrical signal output by the detector assembly 120 when a plurality of projection light spots are just incident on one of the reflection surfaces is a; when T = T, the amplitude of the electrical signal output by the detector assembly 120 when the plurality of projected light spots completely leave the reflecting surface is B. A and B satisfy the following relationship:
Figure BDA0003141802130000095
Figure BDA0003141802130000096
where ρ is a conversion coefficient of the optical signal detected by the detector assembly 120 and the output electrical signal.
A. B and the defocus amount of the substrate 105 satisfy the following relationship:
Figure BDA0003141802130000101
wherein the content of the first and second substances,
Figure BDA0003141802130000102
can be derived through theoretical calculation and can also be calibrated through experiments. As shown in equation (9), the defocus Δ Z of the substrate 105 can be calculated according to the electrical signal output by the detector assembly 120.
Based on this, the embodiment further provides a lithography machine, which includes the focusing and leveling device.
Example two
Fig. 5 is a schematic diagram of the mirror unit 104 provided in this embodiment. As shown in fig. 1 and 5, the difference from the first embodiment is that in the present embodiment, the mirror unit 104 is a prism table, each side surface of the prism table is a reflection surface, and fig. 5 shows an eight-prism table, that is, the mirror unit 104 has eight reflection surfaces.
Further, the mirror unit 104 is a truncated pyramid, and the width of each side surface of the truncated pyramid in the scanning direction is equal, so that the width of each reflecting surface of the mirror unit 104 in the scanning direction is equal. The driving unit drives the mirror unit 104 to rotate at a constant speed, so that the scanning period T corresponding to each reflective surface is equal.
Of course, the mirror unit 104 is not limited to a regular prism, and may be another irregular prism. The prism table is not limited to an eight-prism table, and may be a three-prism table, a five-prism table, or a six-prism table, which are not illustrated herein.
EXAMPLE III
Fig. 6 is a schematic diagram of the mirror unit 104 provided in this embodiment. As shown in fig. 1 and 6, the difference from the first embodiment is that in the present embodiment, the mirror unit 104 is a pyramid, each side of the pyramid is a reflecting surface, and fig. 6 shows an eight-pyramid, that is, the mirror unit 104 has eight reflecting surfaces.
Further, the mirror unit 104 is a regular pyramid having each side face with an equal width in the scanning direction, so that each reflecting surface of the mirror unit 104 has an equal width in the scanning direction. The driving unit drives the mirror unit 104 to rotate at a constant speed, so that the scanning period T corresponding to each reflective surface is equal.
Of course, the mirror unit 104 is not limited to be a regular pyramid, and may be other irregular pyramids. The pyramid is not limited to an octagonal pyramid, and may be a triangular pyramid, a pentagonal pyramid, a hexagonal pyramid, or the like, which is not illustrated herein.
Example four
Fig. 7 is a schematic diagram of the mirror unit 104 according to this embodiment. As shown in fig. 1 and 7, the difference from the first embodiment is that, in the present embodiment, the mirror unit 104 has protrusions distributed along the circumferential direction, and each exposed surface of the protrusions is one of the reflection surfaces.
With reference to fig. 7, in the present embodiment, the protrusions are triangular pyramids, and the exposed surfaces of the triangular pyramids are two side surfaces of the pyramid. That is, each of the protrusions has two reflecting surfaces, and the mirror unit 104 has 8 protrusions, that is, 16 reflecting surfaces.
Further, the triangular pyramid is not a regular triangular pyramid but an irregular triangular pyramid, and the widths of the two side surfaces of the triangular pyramid in the scanning direction are not equal, so that the widths of the adjacent two reflecting surfaces of the mirror unit 104 in the scanning direction are not equal. The driving unit drives the mirror unit 104 to rotate at a non-uniform speed, so that the scanning period T corresponding to each reflective surface is equal.
Of course, the protrusions are not limited to irregular triangular pyramids, and may be regular pyramids. The protrusions are not limited to triangular pyramids, and may be 4 pyramids, hexagonal pyramids, 9 pyramids, and the like, which are not illustrated herein.
As an alternative embodiment, the protrusions may also be prisms or prisms, which are not further illustrated here.
It is to be understood that each exposed surface of the projection is not necessarily the reflection surface, and it suffices that at least one surface exposed by the projection is the reflection surface.
The above embodiments show only some structures of the mirror unit 104, and it should be understood that the mirror unit 104 in the present invention is not limited to the prism, pyramid, etc. described above, and may be any other possible structures, as long as it has a plurality of reflecting surfaces and can rotate, as the mirror unit 104.
In summary, in the focusing and leveling device and the lithography machine provided in the embodiments of the present invention, the scanning and reflecting assembly includes a driving unit and a driving unit, the mirror unit has one or at least two circumferentially distributed reflecting surfaces, the driving unit drives the mirror unit to rotate to scan and image the projection light spot on the surface of the substrate, inertia generated by the self-mass of the mirror unit does not need to be overcome, the modulation frequency can be increased by increasing the rotation speed, the detection signal-to-noise ratio of the focusing and leveling device is further increased, and the measurement error is reduced.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description.
It should be noted that, although the present invention has been described with reference to the preferred embodiments, the above embodiments are not intended to limit the present invention. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the protection scope of the technical solution of the present invention, unless the content of the technical solution of the present invention is departed from.
It should be further understood that the terms "first," "second," "third," and the like in the description are used for distinguishing between various components, elements, steps, and the like, and are not intended to imply a logical or sequential relationship between various components, elements, steps, or the like, unless otherwise indicated or indicated.
It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention. It must be noted that, as used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. For example, reference to "a step" or "an apparatus" means a reference to one or more steps or apparatuses and may include sub-steps as well as sub-apparatuses. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have the definition of a logical "or" rather than the definition of a logical "exclusive or" unless the context clearly dictates otherwise. Further, implementation of the methods and/or apparatus of embodiments of the present invention may include performing selected tasks manually, automatically, or in combination.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (12)

1. The utility model provides a focusing and leveling device which characterized in that includes and sets gradually along the light path:
an illumination assembly for emitting a detection beam;
the projection slit component is used for transmitting the detection light beam and forming a plurality of projection light spots;
the scanning reflection assembly comprises a driving unit and a reflection mirror unit, the reflection mirror unit is provided with one or at least two reflection surfaces which are distributed circumferentially, the driving unit drives the reflection mirror unit to rotate along a preset direction and projects and images the projection light spots on the surface of a substrate, and the projection light spots are reflected by the surface of the substrate to form detection light spots;
the detection slit component is used for transmitting the detection light spot and forming a marking light spot; and the number of the first and second groups,
a detector assembly for detecting the energy of the marker spot.
2. The focus and leveling apparatus of claim 1, wherein the energy of the marker spot detected by the detector assembly is maximized when a plurality of the projected spots are incident entirely on the center of the reflective surface.
3. The focusing and leveling device according to claim 1 or 2, wherein the time between the moment when a plurality of projection light spots are incident on the reflecting surface and completely leave the reflecting surface is one scanning period, and the scanning period corresponding to each reflecting surface is equal.
4. The focusing and leveling device according to claim 3 wherein each of the reflecting surfaces has an equal width in the scanning direction, and the driving unit drives the mirror unit to rotate at a constant speed.
5. A focusing and leveling device according to claim 3 wherein each of said reflecting surfaces has an unequal width in the scanning direction, and said driving unit drives said mirror unit to rotate at an unequal speed.
6. A focusing and leveling device according to claim 1 or 2 wherein the mirror unit is a prism, a frustum of a pyramid or a pyramid, at least one side of the prism, the frustum of a pyramid or the pyramid being the reflective surface.
7. The focus leveling apparatus according to claim 1 or 2, wherein the mirror unit has protrusions distributed in a circumferential direction, and at least one exposed surface of the protrusions is the reflection surface.
8. The focusing and leveling device of claim 7 wherein the protrusions are prisms, prismatic platforms or pyramids.
9. The focusing and leveling device according to claim 1 further comprising:
the projection imaging component is positioned between the projection slit component and the scanning reflection component and is used for carrying out relay amplification on the projection light spots and then enabling the projection light spots to be incident on the substrate;
the detection imaging component is positioned between the scanning reflection component and the detection slit component and is used for carrying out relay amplification on the detection light spot and then transmitting the detection light spot into the detection slit component; and (c) a second step of,
and the relay imaging component is positioned between the detection slit component and the detector component and is used for carrying out relay amplification on the marked light spots and then inputting the amplified marked light spots into the detector component.
10. The focus leveling apparatus of claim 9, further comprising:
the first reflecting mirror is positioned between the scanning reflecting assembly and the detection imaging assembly and is used for reflecting the detection light spot to the detection imaging assembly; and (c) a second step of,
and the second reflector is positioned between the detection imaging component and the detection slit component and is used for reflecting the detection light spots amplified by the detection imaging component in a relay manner into the detection slit component.
11. The focus leveling apparatus of claim 1 wherein the detector assembly outputs an electrical signal indicative of the energy of the marker spot and calculates the defocus Δ Z of the substrate using the formula:
Figure FDA0003141802120000021
Figure FDA0003141802120000022
Figure FDA0003141802120000023
wherein θ is an incident angle of the projection light spot incident on the surface of the substrate; β is the magnification of the probe spot from the substrate to the probe slit assembly; f is the focal length of the mirror unit to the substrate; a is the amplitude of an electric signal output by the detector assembly when a plurality of projection light spots just enter one reflecting surface; and B is the amplitude of the electric signal output by the detector assembly when a plurality of projection light spots completely leave the reflecting surface.
12. A lithography machine comprising the focusing and leveling device according to any one of claims 1 to 11.
CN202110736679.0A 2021-06-30 2021-06-30 Focusing and leveling device and photoetching machine Pending CN115542672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110736679.0A CN115542672A (en) 2021-06-30 2021-06-30 Focusing and leveling device and photoetching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110736679.0A CN115542672A (en) 2021-06-30 2021-06-30 Focusing and leveling device and photoetching machine

Publications (1)

Publication Number Publication Date
CN115542672A true CN115542672A (en) 2022-12-30

Family

ID=84705907

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110736679.0A Pending CN115542672A (en) 2021-06-30 2021-06-30 Focusing and leveling device and photoetching machine

Country Status (1)

Country Link
CN (1) CN115542672A (en)

Similar Documents

Publication Publication Date Title
US4815854A (en) Method of alignment between mask and semiconductor wafer
TWI464362B (en) Apparatus for measuring a height and obtaining a focused image of and object and method thereof
US7298468B2 (en) Method and measuring device for contactless measurement of angles or angle changes on objects
JP3204406B2 (en) Surface position detection method and apparatus, semiconductor exposure apparatus, and exposure method using the method
KR100471524B1 (en) Exposure method
US4230940A (en) Automatic focusing apparatus
JP2862311B2 (en) Surface position detection device
CN102043352B (en) Focusing and leveling detection device
EP0488798B1 (en) Position detecting method
JPH11257917A (en) Reflection type optical sensor
US5475490A (en) Method of measuring a leveling plane
CN104280851B (en) A kind of focusing and leveling itself zero plane adjusting apparatus and method
CN115542672A (en) Focusing and leveling device and photoetching machine
JPS5954908A (en) Surface position detecting method
JPH09304016A (en) Plane position detector and exposure system with the device
CN105807571A (en) Focusing and leveling system used for photo-etching machine and focusing and leveling method thereof
JPH06213635A (en) Examination device for mounted print substrate
JP3222214B2 (en) Target surface position detection device
JPH08261734A (en) Shape measuring apparatus
CN113433800B (en) Vertical measurement system and exposure device
JP2926777B2 (en) Shape measuring device
JP2009042128A (en) Height measuring device
JP2556559B2 (en) Interval measuring device
JP2513281B2 (en) Alignment device
JPS6174338A (en) Optical alignment device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination