CN115533245A - Wave soldering device for lighting circuit board - Google Patents
Wave soldering device for lighting circuit board Download PDFInfo
- Publication number
- CN115533245A CN115533245A CN202211545969.8A CN202211545969A CN115533245A CN 115533245 A CN115533245 A CN 115533245A CN 202211545969 A CN202211545969 A CN 202211545969A CN 115533245 A CN115533245 A CN 115533245A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- electric
- circuit board
- tin
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of circuit board processing devices, in particular to a wave soldering device for an illuminating circuit board, which comprises a moving mechanism, an electric turntable, a tin connection processing system and the like; the moving mechanism is provided with an electric turntable; the electric turntable is connected with a continuous tin processing system for detecting the fixed connection defect of the circuit board and processing the problem of continuous tin. The invention integrates the work by utilizing the electric turntable, avoids unnecessary positioning operation, simultaneously utilizes the electric soldering iron to treat the tin connection defect and avoids the problem of tin liquid overflow; quick replacement processing operation utilizes the melter to carry out partial dispersion to the tin cream, melts the tin cream and in time siphons away, utilizes the rotation effect of melter to siphon away the tin liquid at defect department edge fast simultaneously, avoids the tin liquid to remain, and the splashproof ring is collected to the tin liquid that flows down along the melter outer wall simultaneously, avoids the tin liquid to spatter in disorder, accomplishes the tin cream clearance to the defective position, avoids remaining the subsequent welding process of tin cream influence.
Description
Technical Field
The invention relates to the field of circuit board processing devices, in particular to a wave soldering device for an illuminating circuit board.
Background
The illuminating circuit board generally uses wave soldering to carry out welding operation, but current wave soldering equipment is because various problems such as live time is long, lead to the circuit board that the welding comes out to appear welding defect, for example, appear linking tin, the solder hole is not full even solder hole lacks tin scheduling problem, and follow-up then needs the manual work to inspect and repair welding, but the original solder paste that exists is difficult to clear up to manual operation's mode, generally add on original basis carrying out the soldering solution, this leads to this welding position to have differential pressure, welding quality and original nonconformity on the circuit board, lead to the operation of the component on the circuit board to reach the operation requirement, influence the quality of circuit board.
Disclosure of Invention
In order to overcome the defect of the subsequent operation of wave soldering of the circuit board, which causes the defect of new quality problem of the circuit board, the invention provides a wave soldering device for an illuminating circuit board.
The technical scheme is as follows: a wave soldering device for an illuminating circuit board comprises a frame; the upper part of the frame is fixedly connected with a workbench; the left side of the upper surface of the workbench and the right side of the upper surface are respectively fixedly connected with an installation plate; the mounting plate is connected with a moving mechanism; the device also comprises a clamping mechanism, a receiver, an electric turntable, a continuous tin processing system, a defect processing system and a repair welding system; the two mounting plates are provided with clamping mechanisms for clamping the circuit board; the clamping mechanism is provided with a plurality of adapters; the moving mechanism is provided with an electric turntable; the electric turntable is connected with a continuous tin treatment system for detecting the fixed connection defect of the circuit board and treating the problem of continuous tin; the electric turntable is connected with a defect treatment system for performing welding removal treatment on the fixed connection part with defects; the electric turntable is connected with a repair welding system for completing repair welding based on wave soldering.
Furthermore, the adaptor is L-shaped, and the inner bending part is provided with a cylindrical groove.
Furthermore, the upper surface of the electric turntable is fixedly connected with a partition plate which is Y-shaped and divides the upper surface of the electric turntable into three areas.
Furthermore, the moving mechanism comprises a first guide rail, a first electric moving block, a second guide rail and a second electric moving block; a first guide rail is fixedly connected to each of the two mounting plates; each first guide rail is connected with a first electric moving block in a sliding manner; the two first electric moving blocks are fixedly connected with the same second guide rail; and a second electric moving block is connected to the second guide rail in a sliding manner.
Furthermore, the clamping mechanism comprises a fixed plate, a spring telescopic rod and a wedge-shaped plate; two fixing plates are fixedly connected between the two mounting plates, and the mounting positions of the two fixing plates can be changed on the mounting plates; each fixed plate is fixedly connected with two spring telescopic rods, and the mounting position of each spring telescopic rod can be changed on the fixed plate; the telescopic part of each spring telescopic rod is fixedly connected with a bearing device; each adapter is fixedly connected with a wedge-shaped plate.
Furthermore, the tin connection processing system comprises a detector, a lighting lamp, a fixing frame, a first electric telescopic part, a first supporting frame, a first power motor, a first flat gear, a rack, a thermostat, an electric soldering iron, a first liquid guide pipe and a collecting box; the rotating part of the electric turntable is fixedly connected with a detector; two illuminating lamps are fixedly connected to the partition board, and the two illuminating lamps and the detector are positioned in the same area; the outer surface of the rotating part of the electric turntable is fixedly connected with a fixed frame; the fixed frame is fixedly connected with a first electric telescopic piece; the telescopic part of the first electric telescopic part is fixedly connected with a first support frame; a first power motor is fixedly connected to the first support frame; a first flat gear is fixedly connected with an output shaft of the first power motor; the upper part of the first support frame is connected with a rack in a sliding way; the first pinion is meshed with the rack; a constant temperature box is fixedly connected to the upper part of the rack; an electric soldering iron is fixedly connected to the middle of the upper end of the constant temperature box; the bottom of the constant temperature box is communicated with a first liquid guide pipe; the first support frame is provided with a collecting box; the first liquid guide pipe is communicated with the collecting box.
Furthermore, two anti-overflow grooves are formed in the electric soldering iron.
Further, the defect processing system comprises a second electric telescopic piece, a supporting plate, a supporting ring, a toothed ring, a melting device, a collecting ring, a splash-proof ring, a second liquid guide pipe, a second supporting frame, a second power motor and a second flat gear; a second electric telescopic piece is fixedly connected to the rotating part of the electric turntable; the telescopic part of the second electric telescopic part is fixedly connected with a supporting plate; a support ring is fixedly connected to the support plate; the support ring is rotatably connected with a melting device; a toothed ring is fixedly connected to the melting device; a collector ring is fixedly connected inside the melting device; an anti-splash ring is fixedly connected outside the melter; the bottom of the melting device is rotationally connected with a second liquid guide pipe; the second liquid guide pipe is fixedly connected to the support plate; a second support frame is fixedly connected to the support plate; the bottom of the second support frame is fixedly connected with a second power motor; a second flat gear is fixedly connected with an output shaft of the second power motor; the second spur gear engages the ring gear.
Furthermore, the top of the melting device is in a shape of different teeth, and the upper part of the melting device is provided with a liquid sucking hole.
Furthermore, the repair welding system comprises a third electric telescopic piece, a bearing plate and a welding liquid spray head mechanism; a rotating part of the electric turntable is fixedly connected with a third electric telescopic piece; the telescopic part of the third electric telescopic piece is fixedly connected with a bearing plate; and a welding liquid spray head mechanism is arranged on the bearing plate.
The invention has the beneficial effects that:
1. the invention integrates the work by utilizing the electric turntable, avoids unnecessary positioning operation, simultaneously utilizes the electric soldering iron to treat the tin connecting defect and avoids the problem of tin liquid overflow;
2. according to the invention, the processing operation is quickly changed, the melting device is used for partially dispersing the solder paste, the solder paste is melted and sucked away in time, meanwhile, the rotating effect of the melting device is used for quickly sucking away the solder liquid at the edge of the defect, so that the solder liquid is prevented from remaining, meanwhile, the splash-proof ring is used for collecting the solder liquid flowing down along the outer wall of the melting device, so that the solder liquid is prevented from splashing, the solder paste at the defect position is cleaned, and the influence of the residual solder paste on the subsequent welding process is avoided;
3. the power of the welding liquid spray head mechanism is consistent with the power of initial welding, and the fluctuation effect of the welding liquid is consistent, so that the welding effect of welding pins on two sides of a component at the defect is kept consistent, the influence of original welding paste on secondary welding is effectively avoided, and the welding quality is improved.
Drawings
FIG. 1 is a schematic perspective view of a first embodiment of the present invention;
FIG. 2 is a schematic perspective view of a second embodiment of the present invention;
FIG. 3 is a schematic perspective view of the clamping mechanism of the present invention;
FIG. 4 is a first partial structural view of the present invention;
FIG. 5 is a second partial structural view of the present invention;
FIG. 6 is a schematic view of a third partial structure of the present invention;
FIG. 7 is a schematic perspective view of a tin-connecting processing system according to a first embodiment of the present invention;
FIG. 8 is a schematic perspective view of a second embodiment of the continuous tin processing system of the present invention;
FIG. 9 is a schematic perspective view of a defect management system according to the present invention;
fig. 10 is a partial cross-sectional view of a defect management system of the present invention.
Reference numerals: 1-frame, 2-workbench, 3-mounting plate, 41-fixing plate, 42-spring telescopic rod, 43-adapter, 44-wedge plate, 51-first guide rail, 52-first electric moving block, 53-second guide rail, 54-second electric moving block, 61-electric rotating disc, 62-clapboard, 71-detector, 72-illuminating lamp, 73-fixing frame, 74-first electric telescopic piece, 75-first support frame, 76-first power motor, 77-first flat gear, 78-rack, 79-thermostat, 710-electric soldering iron, 711-first liquid guide pipe, 712-collection box, 81-second electric telescopic piece, 82-support plate, 83-support ring, 84-toothed ring, 851-thawing device, 852-confluence ring, 853-splash ring, 86-second liquid guide pipe, 87-second support frame, 88-second power motor, 89-second flat gear, 91-third electric telescopic piece, 92-welding liquid spray head mechanism, 93-welding liquid spray head mechanism and 10-circuit board.
Detailed Description
The invention is further described below with reference to the figures and examples.
Referring to fig. 1 to 10, an embodiment of the present invention provides a wave soldering apparatus for an illumination circuit board, including a frame 1, a worktable 2, a mounting plate 3 and a moving mechanism; the upper part of the frame 1 is fixedly connected with a workbench 2; the left side of the upper surface and the right side of the upper surface of the workbench 2 are respectively fixedly connected with an installation plate 3; the mounting plate 3 is connected with a moving mechanism;
the device also comprises a clamping mechanism, a receiver 43, an electric turntable 61, a continuous tin processing system, a defect processing system and a repair welding system; the two mounting plates 3 are provided with clamping mechanisms for clamping the circuit board 10; a plurality of receivers 43 are arranged on the clamping mechanism; the moving mechanism is provided with an electric turntable 61; the electric turntable 61 is connected with a continuous tin treatment system; the electric turntable 61 is connected with a defect processing system; the electric turntable 61 is connected with a repair welding system.
The receptacle 43 is L-shaped and the inner fold is provided with a cylindrical slot.
The partition plate 62 is fixedly connected to the upper surface of the electric turntable 61, the partition plate 62 is Y-shaped, and the upper surface of the electric turntable 61 is divided into three areas.
The moving mechanism comprises a first guide rail 51, a first electric moving block 52, a second guide rail 53 and a second electric moving block 54; a first guide rail 51 is fixedly connected to each of the two mounting plates 3; each first guide rail 51 is connected with a first electric moving block 52 in a sliding manner; the two first electric moving blocks 52 are fixedly connected with the same second guide rail 53; a second electric moving block 54 is slidably connected to the second rail 53.
The clamping mechanism comprises a fixed plate 41, a spring telescopic rod 42 and a wedge-shaped plate 44; two fixing plates 41 are fixedly connected between the two mounting plates 3, and the mounting positions of the two fixing plates 41 can be changed on the mounting plates 3; each fixing plate 41 is fixedly connected with two spring telescopic rods 42, and the mounting position of each spring telescopic rod 42 can be changed on the fixing plate 41; the expansion part of each spring expansion link 42 is fixedly connected with a bearing device 43; each receptacle 43 is secured to a wedge plate 44.
The tin connecting treatment system comprises a detector 71, an illuminating lamp 72, a fixing frame 73, a first electric telescopic part 74, a first supporting frame 75, a first power motor 76, a first flat gear 77, a rack 78, a constant temperature box 79, an electric soldering iron 710, a first liquid guide pipe 711 and a collection box 712; a detector 71 is fixedly connected to a rotating part of the electric turntable 61; two illuminating lamps 72 are fixedly connected to the partition plate 62, and the two illuminating lamps 72 and the detector 71 are positioned in the same area; the outer surface of the rotating part of the electric turntable 61 is fixedly connected with a fixed frame 73; the fixed frame 73 is fixedly connected with a first electric telescopic piece 74; the telescopic part of the first electric telescopic part 74 is fixedly connected with a first supporting frame 75; a first power motor 76 is fixedly connected to the first support frame 75; a first flat gear 77 is fixedly connected with an output shaft of the first power motor 76; the upper part of the first support frame 75 is connected with a rack 78 in a sliding way; the first pinion 77 engages the rack 78; a thermostat 79 is fixedly connected to the upper part of the rack 78; an electric iron 710 is fixedly connected to the middle of the upper end of the constant temperature box 79; the bottom of the constant temperature box 79 is communicated with a first liquid guide pipe 711; the first support frame 75 is provided with a collection box 712; the first liquid conduit 711 communicates with the collection tank 712.
The detector 71 is a camera.
The electric iron 710 is provided with two anti-overflow grooves.
The defect processing system comprises a second electric telescopic piece 81, a supporting plate 82, a supporting ring 83, a toothed ring 84, a melter 851, a confluence ring 852, a splash-proof ring 853, a second liquid guide pipe 86, a second supporting frame 87, a second power motor 88 and a second flat gear 89; a second electric telescopic part 81 is fixedly connected to the rotating part of the electric turntable 61; the telescopic part of the second electric telescopic element 81 is fixedly connected with a support plate 82; a support ring 83 is fixedly connected to the support plate 82; a melting device 851 is rotatably connected to the supporting ring 83; a toothed ring 84 is fixedly connected to the melter 851; a collector ring 852 is fixedly connected inside the melter 851; an anti-splash ring 853 is fixedly connected outside the melter 851; the bottom of the melter 851 is rotatably connected with the second liquid guide pipe 86; the second liquid guide pipe 86 is fixedly connected to the supporting plate 82; a second supporting frame 87 is fixedly connected to the supporting plate 82; a second power motor 88 is fixedly connected to the bottom of the second support frame 87; a second flat gear 89 is fixedly connected with an output shaft of the second power motor 88; the second spur gear 89 engages the toothed ring 84.
The top of the melter 851 is shaped like a different tooth, and the upper part is provided with a liquid sucking hole.
The repair welding system comprises a third electric telescopic piece 91, a bearing plate 92 and a welding liquid spray head mechanism 93; a third electric telescopic piece 91 is fixedly connected to a rotating part of the electric turntable 61; the telescopic part of the third electric telescopic piece 91 is fixedly connected with a bearing plate 92; the carrier plate 92 is provided with a welding liquid spray head mechanism 93.
Before the wave soldering device for the lighting circuit board is used, the fixing position of a fixing plate 41 on an installation plate 3 is adjusted according to the specification of the circuit board 10 to be processed and detected as required, the installation position of a telescopic spring rod 42 on the fixing plate 41 is adjusted, then the circuit board 10 is fed by a manipulator, a plate matched with a wedge-shaped plate 44 is loaded on a chuck on the manipulator, the corresponding wedge-shaped plate 44 is pushed by the matching plate on the manipulator in the feeding process of the circuit board 10, and a corresponding telescopic spring rod 42 is compressed by a receiver 43, so that the circuit board 10 is loaded at the inner bottom of the receiver 43 in the downward moving process, and then in the returning process of the manipulator, the telescopic spring rod 42 pushes the receiver 43, so that the circuit board 10 is fixed on four receivers 43, and the telescopic spring rod 42 is in a micro-compression state.
Therefore, the circuit board 10 is fixed at the upper middle position of the workbench 2, then the moving mechanism is controlled to operate, under the movement of the first electric moving block 52 and the second electric moving block 54, the detector 71 on the electric rotating disc 61 is aligned with the welding position at the bottom of the circuit board 10, two illuminating lamps 72 are turned on, then the second electric moving block 54 is controlled to move transversely, when the detector 71 detects that the bottom of the circuit board 10 is defective, and when the defect is continuous tin, the first electric moving block 52 is controlled to move on the first guide rail 51, the first electric moving block 52 drives the second electric moving block 54 and all parts thereon to move synchronously, and the electric rotating disc 61 is controlled to operate to adjust the positions of the first electric telescopic piece 74 and related parts thereon, and then the first electric telescopic piece 74 is controlled to operate, the telescopic part of the first electric telescopic part 74 drives related parts on the first electric telescopic part to move, the uppermost electric soldering iron 710 is contacted with the bottom surface of the circuit board 10, then the first power motor 76 is controlled to operate, the output shaft of the first power motor 76 drives the first flat gear 77 to rotate, the first flat gear 77 drives the rack 78, the rack 78 moves on the first support frame 75, the electric soldering iron 710 on the electric soldering iron is driven to move along with the moving thermostat 79 at the moment, the electric soldering iron 710 melts tin-connecting parts, in order to avoid overflow of tin liquid, a ring hole on the electric soldering iron 710 timely isolates the tin liquid, so that the tin liquid drops in the thermostat 79 more quickly, negative pressure equipment is carried on the collection box 712, and high temperature in the first liquid guide pipe 711 is kept, therefore, more tin liquid flows to the collection box 712 to be collected, the tin-connecting problem is treated, and stability and satisfiability of other welding positions are ensured.
When the defect is a welding hole defect, the electric rotating disc 61 is controlled to operate at the moment, the electric rotating disc 61 rotates 120 degrees clockwise from the top, at the moment, the defect processing system rotates to the position of the detector 71, the movement of the second electric moving block 54 does not need to be adjusted again, the operation of the second electric telescopic part 81 is directly controlled, the telescopic part of the second electric telescopic part 81 drives related parts on the telescopic part to operate, and the melter 851 is electrified, the melter 851 enters the position of a welding hole in the ascending process, the upper part of the melter 851 disperses the solder paste, meanwhile, a component welding pin is wrapped on the upper end of the top of the melter 851, a negative pressure device is connected to a second liquid guide pipe 86, the melter 851 melts the solder paste inside the defect, meanwhile, the solder liquid is quickly taken away under the action of suction force, but residual solder liquid exists at the edge of the defect, the operation of a second power motor 88 on a second support frame 87 is controlled, an output shaft 88 of the second flat gear 89 drives the second flat gear 89 to rotate, the toothed ring 84 drives the melter 851 to rotate, so that the splash-proof defect of the rotary support frame is prevented from influencing the subsequent solder paste collection of the molten solder liquid, and the residual solder paste in the molten solder paste in the splash-proof process is avoided, and the subsequent molten solder paste collection process is completed.
Flux is sprayed in the holes, the electric rotary table 61 is controlled to rotate 240 degrees anticlockwise from the angle seen from the top, the positions of the defective holes of the circuit board 10 are corresponded, the third electric telescopic piece 91 is controlled to operate, the telescopic part of the third electric telescopic piece 91 drives the bearing plate 92 to move upwards, the bearing plate 92 drives the soldering liquid spray head mechanism 93 to move upwards, the soldering liquid spray head mechanism 93 also adopts the wave soldering mode, secondary repair welding is carried out on the holes of the circuit board 10, the power of the soldering liquid spray head mechanism 93 is consistent with the power of primary welding, the effect of soldering liquid fluctuation is consistent, the welding effects of the welding feet on the two sides of the element at the defective part are kept consistent, meanwhile, the influence of original soldering paste on the secondary welding is effectively avoided, and the welding quality is improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A wave soldering device for an illuminating circuit board is characterized by comprising a rack (1), a workbench (2), a mounting plate (3) and a moving mechanism; the upper part of the frame (1) is fixedly connected with a workbench (2); the left side of the upper surface of the workbench (2) and the right side of the upper surface are respectively fixedly connected with a mounting plate (3); the mounting plate (3) is connected with a moving mechanism; the device also comprises a clamping mechanism, a receiver (43), an electric turntable (61), a tin connecting processing system, a defect processing system and a repair welding system; the two mounting plates (3) are provided with clamping mechanisms for clamping the circuit board (10); the clamping mechanism is provided with a plurality of adapters (43); an electric turntable (61) is arranged on the moving mechanism; the electric turntable (61) is connected with a tin connection processing system for detecting the fixed connection defect of the circuit board (10) and processing the problem of tin connection; the electric turntable (61) is connected with a defect treatment system for performing welding removal treatment on a fixed joint with defects; the electric turntable (61) is connected with a repair welding system for completing repair welding based on wave soldering.
2. A wave soldering apparatus for a lighting circuit board according to claim 1, wherein the receptacle (43) is L-shaped and the inner bend is provided with a cylindrical groove.
3. The wave soldering apparatus for an illumination circuit board according to claim 1, wherein the partition plate (62) is fixed to the upper surface of the electric turntable (61), and the partition plate (62) is Y-shaped and divides the upper surface of the electric turntable (61) into three areas.
4. The wave soldering device for the lighting circuit board as claimed in claim 3, wherein the moving mechanism comprises a first guide rail (51), a first electric moving block (52), a second guide rail (53) and a second electric moving block (54); a first guide rail (51) is fixedly connected to each of the two mounting plates (3); each first guide rail (51) is connected with a first electric moving block (52) in a sliding way; the two first electric moving blocks (52) are fixedly connected with the same second guide rail (53); the second guide rail (53) is connected with a second electric moving block (54) in a sliding way.
5. The wave soldering device for the illuminating circuit board as recited in claim 4, wherein the clamping mechanism comprises a fixing plate (41), a spring expansion link (42) and a wedge-shaped plate (44); two fixing plates (41) are fixedly connected between the two mounting plates (3), and the mounting positions of the two fixing plates (41) can be changed on the mounting plates (3); two spring telescopic rods (42) are fixedly connected to each fixing plate (41), and the mounting position of each spring telescopic rod (42) can be changed on each fixing plate (41); the telescopic part of each spring telescopic rod (42) is fixedly connected with a carrying device (43); each support (43) is fixedly connected with a wedge-shaped plate (44).
6. The wave soldering device for the illuminating circuit board as claimed in claim 5, wherein the tin connection processing system comprises a detector (71), an illuminating lamp (72), a fixed frame (73), a first electric telescopic piece (74), a first supporting frame (75), a first power motor (76), a first flat gear (77), a rack (78), a thermostat (79), an electric soldering iron (710), a first catheter (711) and a collection box (712); a detector (71) is fixedly connected to a rotating part of the electric turntable (61); two illuminating lamps (72) are fixedly connected to the partition board (62), and the two illuminating lamps (72) and the detector (71) are positioned in the same area; a fixed frame (73) is fixedly connected with the outer surface of the rotating part of the electric turntable (61); a first electric telescopic part (74) is fixedly connected to the fixed frame (73); the telescopic part of the first electric telescopic piece (74) is fixedly connected with a first support frame (75); a first power motor (76) is fixedly connected to the first support frame (75); a first flat gear (77) is fixedly connected with an output shaft of the first power motor (76); the upper part of the first support frame (75) is connected with a rack (78) in a sliding way; the first pinion (77) engages the rack (78); a thermostat (79) is fixedly connected to the upper part of the rack (78); an electric iron (710) is fixedly connected with the middle part of the upper end of the constant temperature box (79); the bottom of the constant temperature box (79) is communicated with a first liquid guide pipe (711); the first supporting frame (75) is provided with a collecting box (712); the first liquid guide pipe (711) is communicated with the collecting box (712).
7. The wave soldering apparatus for lighting circuit board as claimed in claim 6, wherein the electric soldering iron (710) is provided with two overflow preventing grooves.
8. The wave soldering apparatus for illuminated circuit boards according to claim 7, wherein the defect handling system comprises a second electric telescopic member (81), a support plate (82), a support ring (83), a toothed ring (84), a melter (851), a confluence ring (852), a splash guard ring (853), a second liquid guide tube (86), a second support frame (87), a second power motor (88) and a second flat gear (89); a second electric telescopic piece (81) is fixedly connected to the rotating part of the electric turntable (61); a support plate (82) is fixedly connected with the telescopic part of the second electric telescopic piece (81); a support ring (83) is fixedly connected to the support plate (82); a melting device (851) is rotatably connected to the support ring (83); a toothed ring (84) is fixedly connected to the melter (851); a collector ring (852) is fixedly connected inside the melter (851); an anti-splash ring (853) is fixedly connected to the outer part of the melter (851); the bottom of the melter (851) is rotatably connected with a second liquid guide pipe (86); the second liquid guide pipe (86) is fixedly connected to the support plate (82); a second support frame (87) is fixedly connected to the support plate (82); a second power motor (88) is fixedly connected to the bottom of the second support frame (87); a second flat gear (89) is fixedly connected with an output shaft of the second power motor (88); the second flat gear (89) engages the gear ring (84).
9. The wave soldering apparatus for an illumination circuit board as claimed in claim 8, wherein the top of the melter (851) is shaped like a different tooth and has a liquid sucking hole formed at the upper part.
10. The wave soldering apparatus for lighting circuit board as claimed in claim 9, wherein the repair soldering system comprises a third electric telescopic member (91), a carrier plate (92) and a soldering liquid spray head mechanism (93); a third electric telescopic piece (91) is fixedly connected to the rotating part of the electric turntable (61); the telescopic part of the third electric telescopic piece (91) is fixedly connected with a bearing plate (92); and a welding liquid spray head mechanism (93) is arranged on the bearing plate (92).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545969.8A CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545969.8A CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115533245A true CN115533245A (en) | 2022-12-30 |
| CN115533245B CN115533245B (en) | 2023-05-23 |
Family
ID=84721888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211545969.8A Active CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115533245B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118023788A (en) * | 2024-04-11 | 2024-05-14 | 常州起帆工业智能科技有限公司 | Perforation baffle welding set |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB797020A (en) * | 1955-11-24 | 1958-06-25 | American Viscose Corp | Welding apparatus |
| CN104325207A (en) * | 2013-07-22 | 2015-02-04 | 珠海格力电器股份有限公司 | Tin carrier, welding machine and method for preventing connecting tin short circuit |
| CN107414232A (en) * | 2017-08-31 | 2017-12-01 | 阜阳扬宇充电设备有限公司 | A kind of power template manufacture automatic repair welding device |
| CN108480815A (en) * | 2018-05-04 | 2018-09-04 | 王大同 | A kind of printed circuit board is multidirectional to adjust furnace tool |
| CN111558548A (en) * | 2020-07-14 | 2020-08-21 | 潍坊智新电子股份有限公司 | High-speed two heart yearn wicking letter sorting outer hanging machine |
| CN114535739A (en) * | 2022-02-28 | 2022-05-27 | 惠州市福佳电器科技有限公司 | Prevent medical power production of continuous tin and use smokeless formula wave soldering equipment |
| CN217212291U (en) * | 2021-05-25 | 2022-08-16 | 广东华技达精密机械有限公司 | Detection turntable and antenna detection system |
-
2022
- 2022-12-05 CN CN202211545969.8A patent/CN115533245B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB797020A (en) * | 1955-11-24 | 1958-06-25 | American Viscose Corp | Welding apparatus |
| CN104325207A (en) * | 2013-07-22 | 2015-02-04 | 珠海格力电器股份有限公司 | Tin carrier, welding machine and method for preventing connecting tin short circuit |
| CN107414232A (en) * | 2017-08-31 | 2017-12-01 | 阜阳扬宇充电设备有限公司 | A kind of power template manufacture automatic repair welding device |
| CN108480815A (en) * | 2018-05-04 | 2018-09-04 | 王大同 | A kind of printed circuit board is multidirectional to adjust furnace tool |
| CN111558548A (en) * | 2020-07-14 | 2020-08-21 | 潍坊智新电子股份有限公司 | High-speed two heart yearn wicking letter sorting outer hanging machine |
| CN217212291U (en) * | 2021-05-25 | 2022-08-16 | 广东华技达精密机械有限公司 | Detection turntable and antenna detection system |
| CN114535739A (en) * | 2022-02-28 | 2022-05-27 | 惠州市福佳电器科技有限公司 | Prevent medical power production of continuous tin and use smokeless formula wave soldering equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118023788A (en) * | 2024-04-11 | 2024-05-14 | 常州起帆工业智能科技有限公司 | Perforation baffle welding set |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115533245B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108063359B (en) | Assembling process of data line and full-automatic production line thereof | |
| CN115533245A (en) | Wave soldering device for lighting circuit board | |
| CN109048058A (en) | Battery laser welding and detection device | |
| CN116096065B (en) | Automatic solder paste printing machine of duplex position | |
| CN109561603A (en) | A kind of pasting method and device | |
| CN116519714B (en) | Metal surface defect detection device | |
| CN115201029A (en) | Circuit board distortion testing machine with detect structure | |
| CN112152402A (en) | Motor stator assembly detection device | |
| CN112687550B (en) | Semiconductor wafer packaging equipment for power chip production and production process | |
| CN206795189U (en) | One kind dress drain pan device | |
| CN115551341A (en) | Electronic component paster equipment | |
| CN213847169U (en) | Automatic terminal inserting equipment with vision | |
| CN113382558A (en) | High-end equipment is paintd equipment with circuit board tin thick liquid | |
| CN210546057U (en) | Glue spreader is used in circuit board processing | |
| CN209927737U (en) | SMD intelligent automatic visual detection packaging equipment | |
| CN208929525U (en) | Automatic feeding is used in a kind of welding of pcb board | |
| CN213275399U (en) | Solder paste inspection machine for SMT paster processing | |
| CN219432887U (en) | Inspection machine for SMT chip mounting processing | |
| CN205415214U (en) | Major axis product adds tool with collection bits function | |
| CN213411895U (en) | Automatic change optics counterpoint and reprocess support for platform | |
| CN216637934U (en) | Feed bin lifting component and feeding device | |
| CN217847888U (en) | Automatic continuous processing device for semiconductor module | |
| CN218274522U (en) | Full-automatic chip packaging whole-board ball mounting equipment | |
| CN211791163U (en) | Motor stator assembly detection machine | |
| CN105081896B (en) | Drill point grinder with collar compensation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |