CN115533245B - Wave soldering device for lighting circuit board - Google Patents
Wave soldering device for lighting circuit board Download PDFInfo
- Publication number
- CN115533245B CN115533245B CN202211545969.8A CN202211545969A CN115533245B CN 115533245 B CN115533245 B CN 115533245B CN 202211545969 A CN202211545969 A CN 202211545969A CN 115533245 B CN115533245 B CN 115533245B
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- electric
- plate
- solder paste
- defect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of circuit board processing devices, in particular to a wave soldering device for an illumination circuit board, which comprises a moving mechanism, an electric turntable, a tin connection processing system and the like; an electric turntable is arranged on the moving mechanism; the electric turntable is connected with a tin connecting treatment system for detecting the fixedly connected defect of the circuit board and treating the tin connecting problem. The invention utilizes the electric turntable to integrate the work, avoids unnecessary positioning operation, and simultaneously utilizes the electric soldering iron to treat the tin connection defect and avoid the problem of overflow of tin liquid; quick replacement processing operation utilizes to melt the ware and carries out partial discretization to the solder paste, melts and in time sucks away the solder paste, utilizes the rotation effect of melting the ware simultaneously to suck away the solder paste at defect edge fast, avoids the solder paste to remain, and the splashproof ring is collected the solder paste that flows down along melting the ware outer wall simultaneously, avoids the solder paste to splash in disorder, accomplishes the solder paste clearance to defect position, avoids remaining solder paste to influence subsequent welding process.
Description
Technical Field
The invention relates to the field of circuit board processing devices, in particular to a wave soldering device for an illumination circuit board.
Background
The lighting circuit board generally uses wave soldering to carry out welding operation, but current wave soldering equipment is because various problems such as live time is long, lead to the circuit board that welds out to appear welding defect, for example appear even tin, weld hole is not full even weld hole lacks tin scheduling problem, then need the manual work to carry out inspection and repair welding, but manual operation's mode is difficult to clear up the solder paste that originally exists, generally carry out the welding fluid on original basis and add, this leads to this welding position to have differential pressure, the welding quality on the circuit board is inconsistent with the primitive, lead to the operation of the component on the circuit board to fail the operation requirement, influence the quality of circuit board.
Disclosure of Invention
In order to overcome the defect that the subsequent operation of wave soldering of the circuit board has defects, and the circuit board has new quality problems, the invention provides a wave soldering device for illuminating the circuit board.
The technical proposal is as follows: a wave soldering device for lighting circuit board comprises a frame; the upper part of the frame is fixedly connected with a workbench; the left side of the upper surface of the workbench and the right side of the upper surface are fixedly connected with a mounting plate respectively; the mounting plate is connected with a moving mechanism; the device also comprises a clamping mechanism, a connector, an electric turntable, a tin connection processing system, a defect processing system and a repair welding system; the two mounting plates are provided with clamping mechanisms for clamping the circuit board; a plurality of acceptors are arranged on the clamping mechanism; an electric turntable is arranged on the moving mechanism; the electric turntable is connected with a tin connecting treatment system for detecting the fixedly connected defect of the circuit board and treating the tin connecting problem; the electric turntable is connected with a defect treatment system for performing defluxing treatment on the fixedly connected part with the defect; and a repair welding system for completing repair welding based on wave soldering is connected to the electric turntable.
Further, the receiver is L-shaped, and the inner bending part is provided with a cylindrical groove.
Further, the upper surface of the electric turntable is fixedly connected with a partition board, the partition board is Y-shaped, and the upper surface of the electric turntable is divided into three areas equally.
Further, the moving mechanism comprises a first guide rail, a first electric moving block, a second guide rail and a second electric moving block; a first guide rail is fixedly connected to each of the two mounting plates; each first guide rail is connected with a first electric moving block in a sliding way; the two first electric moving blocks are fixedly connected with the same second guide rail; the second guide rail is connected with a second electric moving block in a sliding way.
Further, the clamping mechanism comprises a fixed plate, a spring telescopic rod and a wedge plate; two fixing plates are fixedly connected between the two mounting plates, and the mounting positions of the two fixing plates can be changed on the mounting plates; two spring telescopic rods are fixedly connected to each fixing plate respectively, and each spring telescopic rod can be changed in installation position on the fixing plate; the telescopic part of each spring telescopic rod is fixedly connected with a receiver respectively; each receiver is fixedly connected with a wedge-shaped plate.
Further, the tin connection processing system comprises a detector, an illuminating lamp, a fixing frame, a first electric telescopic piece, a first supporting frame, a first power motor, a first flat gear, a rack, a constant temperature box, an electric soldering iron, a first liquid guide pipe and a collecting box; a detector is fixedly connected to the rotating part of the electric turntable; two illumination lamps are fixedly connected on the partition board, and the two illumination lamps and the detector are positioned in the same area; the outer surface of the electric turntable rotating part is fixedly connected with a fixing frame; the fixing frame is fixedly connected with a first electric telescopic piece; the telescopic part of the first electric telescopic part is fixedly connected with a first supporting frame; the first support frame is fixedly connected with a first power motor; the output shaft of the first power motor is fixedly connected with a first flat gear; the upper part of the first support frame is connected with a rack in a sliding way; the first flat gear engages the rack; the upper part of the rack is fixedly connected with a constant temperature box; an electric iron is fixedly connected in the middle of the upper end of the incubator; the bottom of the incubator is communicated with a first liquid guide tube; the first support frame is provided with a collecting box; the first liquid guide tube is communicated with the collecting box.
Further, two overflow preventing grooves are formed in the electric soldering iron.
Further, the defect treatment system comprises a second electric telescopic piece, a supporting plate, a supporting ring, a toothed ring, a melter, a converging ring, a splash-proof ring, a second liquid guide pipe, a second supporting frame, a second power motor and a second flat gear; the second electric telescopic piece is fixedly connected to the electric turntable rotating part; the telescopic part of the second electric telescopic part is fixedly connected with a supporting plate; a supporting ring is fixedly connected on the supporting plate; the support ring is rotationally connected with a melter; the melter is fixedly connected with a toothed ring; a confluence ring is fixedly connected in the melting device; the outside of the melter is fixedly connected with a splash-proof ring; the bottom of the melter is rotationally connected with the second liquid guide tube; the second liquid guide tube is fixedly connected to the supporting plate; the second supporting frame is fixedly connected on the supporting plate; the bottom of the second support frame is fixedly connected with a second power motor; the output shaft of the second power motor is fixedly connected with a second flat gear; the second flat gear engages the toothed ring.
Further, the top of the melter is of a heterotooth shape, and the upper part of the melter is provided with a liquid suction hole.
Further, the repair welding system comprises a third electric telescopic piece, a bearing plate and a welding liquid spray head mechanism; a third electric telescopic piece is fixedly connected to the electric turntable rotating part; the telescopic part of the third electric telescopic part is fixedly connected with a bearing plate; and a welding liquid spray head mechanism is arranged on the bearing plate.
The invention has the beneficial effects that:
1. the invention utilizes the electric turntable to integrate the work, avoids unnecessary positioning operation, and simultaneously utilizes the electric soldering iron to treat the tin connection defect and avoid the problem of overflow of tin liquid;
2. according to the invention, the quick replacement processing operation is carried out, the melting device is utilized to partially disperse the solder paste, the solder paste is melted and sucked away in time, meanwhile, the rotating effect of the melting device is utilized to quickly suck away the solder paste at the edge of the defect, so that the solder paste residue is avoided, meanwhile, the splash-proof ring is used for collecting the solder paste flowing down along the outer wall of the melting device, so that the solder paste is prevented from splashing, the cleaning of the solder paste at the defect position is completed, and the influence of the residual solder paste on the subsequent welding process is avoided;
3. the power of the welding liquid spray head mechanism is consistent with that of primary welding, and the fluctuation effect of the welding liquid is consistent, so that the welding effect of welding legs on two sides of a component at a defect part is kept consistent, the influence of primary welding paste on secondary welding is effectively avoided, and the welding quality is improved.
Drawings
FIG. 1 is a schematic perspective view of a first embodiment of the present invention;
FIG. 2 is a schematic view of a second perspective structure of the present invention;
FIG. 3 is a schematic perspective view of a clamping mechanism according to the present invention;
FIG. 4 is a schematic view of a first partial structure of the present invention;
FIG. 5 is a schematic view of a second partial structure of the present invention;
FIG. 6 is a schematic view of a third partial structure of the present invention;
FIG. 7 is a schematic diagram of a first perspective view of the tin-plating system of the present invention;
FIG. 8 is a schematic diagram of a second perspective view of the tin-plating system of the present invention;
FIG. 9 is a schematic perspective view of a defect handling system according to the present invention;
FIG. 10 is a partial cross-sectional view of a defect management system of the present invention.
Reference numerals: 1-rack, 2-workbench, 3-mounting plate, 41-fixed plate, 42-spring telescopic rod, 43-receiver, 44-wedge plate, 51-first guide rail, 52-first electric moving block, 53-second guide rail, 54-second electric moving block, 61-electric turntable, 62-partition, 71-detector, 72-illuminating lamp, 73-fixed mount, 74-first electric telescopic piece, 75-first support frame, 76-first power motor, 77-first flat gear, 78-rack, 79-thermostated container, 710-electric soldering iron, 711-first catheter, 712-collecting box, 81-second electric telescopic piece, 82-support plate, 83-support ring, 84-toothed ring, 851-melter, 852-converging ring, 853-splash-proof ring, 86-second catheter, 87-second support frame, 88-second power motor, 89-second flat gear, 91-third electric telescopic piece, 92-carrier plate, 93-liquid spray head mechanism, 10-circuit board.
Detailed Description
The invention is further described below with reference to the drawings and examples.
Referring to fig. 1 to 10, an embodiment of the present invention provides a wave soldering apparatus for lighting a circuit board, including a frame 1, a table 2, a mounting plate 3, and a moving mechanism; the upper part of the frame 1 is fixedly connected with a workbench 2; the left side of the upper surface and the right side of the upper surface of the workbench 2 are fixedly connected with a mounting plate 3 respectively; the mounting plate 3 is connected with a moving mechanism;
the device also comprises a clamping mechanism, a receiver 43, an electric turntable 61, a tin connection processing system, a defect processing system and a repair welding system; the two mounting plates 3 are provided with clamping mechanisms for clamping the circuit board 10; a plurality of acceptors 43 are arranged on the clamping mechanism; the moving mechanism is provided with an electric turntable 61; the electric turntable 61 is connected with a tin-connected treatment system; the electric turntable 61 is connected with a defect processing system; the electric turntable 61 is connected with a repair welding system.
The receptacle 43 is L-shaped and has a cylindrical groove formed in the inner bent portion.
The upper surface of the electric turntable 61 is fixedly connected with a partition plate 62, the partition plate 62 is Y-shaped, and the upper surface of the electric turntable 61 is divided into three areas equally.
The moving mechanism comprises a first guide rail 51, a first electric moving block 52, a second guide rail 53 and a second electric moving block 54; a first guide rail 51 is fixedly connected to each of the two mounting plates 3; each first guide rail 51 is slidably connected with a first electric moving block 52; the two first electric moving blocks 52 are fixedly connected with the same second guide rail 53; the second guide rail 53 is slidably connected to a second electric moving block 54.
The clamping mechanism comprises a fixed plate 41, a spring telescopic rod 42 and a wedge plate 44; two fixing plates 41 are fixedly connected between the two mounting plates 3, and the mounting positions of the two fixing plates 41 can be changed on the mounting plates 3; two spring telescopic rods 42 are fixedly connected to each fixed plate 41, and each spring telescopic rod 42 can be changed in installation position on the fixed plate 41; the telescopic part of each spring telescopic rod 42 is fixedly connected with a receiver 43; a wedge plate 44 is fixedly connected to each receptacle 43.
The tinning treatment system comprises a detector 71, an illuminating lamp 72, a fixing frame 73, a first electric telescopic piece 74, a first supporting frame 75, a first power motor 76, a first flat gear 77, a rack 78, a constant temperature box 79, an electric soldering iron 710, a first liquid guide pipe 711 and a collecting box 712; a detector 71 is fixedly connected to the rotating part of the electric turntable 61; two illumination lamps 72 are fixedly connected to the partition plate 62, and the two illumination lamps 72 and the detector 71 are positioned in the same area; the outer surface of the rotating part of the electric turntable 61 is fixedly connected with a fixing frame 73; the fixed frame 73 is fixedly connected with a first electric telescopic piece 74; the telescopic part of the first electric telescopic piece 74 is fixedly connected with a first supporting frame 75; the first supporting frame 75 is fixedly connected with a first power motor 76; the output shaft of the first power motor 76 is fixedly connected with a first flat gear 77; the upper part of the first supporting frame 75 is connected with a rack 78 in a sliding way; the first flat gear 77 engages the rack 78; the upper part of the rack 78 is fixedly connected with a constant temperature box 79; an electric iron 710 is fixedly connected in the middle of the upper end of the incubator 79; the bottom of the incubator 79 is communicated with a first liquid guide pipe 711; the first supporting frame 75 is provided with a collecting box 712; the first catheter 711 communicates with the collection box 712.
The detector 71 is a camera.
Two overflow preventing grooves are arranged on the electric soldering iron 710.
The defect treatment system comprises a second electric telescopic part 81, a supporting plate 82, a supporting ring 83, a toothed ring 84, a melter 851, a converging ring 852, a splash-proof ring 853, a second liquid guide tube 86, a second supporting frame 87, a second power motor 88 and a second flat gear 89; a second electric telescopic piece 81 is fixedly connected to the rotating part of the electric turntable 61; the telescopic part of the second electric telescopic piece 81 is fixedly connected with a supporting plate 82; a support ring 83 is fixedly connected to the support plate 82; the support ring 83 is rotatably connected with a melter 851; the melter 851 is fixedly connected with a toothed ring 84; a bus ring 852 is fixedly connected inside the melter 851; the outside of the melter 851 is fixedly connected with a splash-proof ring 853; the bottom of the melter 851 is rotationally connected with the second liquid guide tube 86; the second catheter 86 is fixedly connected to the support plate 82; a second supporting frame 87 is fixedly connected to the supporting plate 82; the bottom of the second supporting frame 87 is fixedly connected with a second power motor 88; the output shaft of the second power motor 88 is fixedly connected with a second flat gear 89; the second flat gear 89 engages the toothed ring 84.
The top of the melter 851 is of a heterotooth shape, and the upper part is provided with a liquid suction hole.
The repair welding system comprises a third electric telescopic piece 91, a bearing plate 92 and a welding liquid spray head mechanism 93; a third electric telescopic piece 91 is fixedly connected to the rotating part of the electric turntable 61; the telescopic part of the third electric telescopic piece 91 is fixedly connected with a bearing plate 92; the carrier plate 92 is provided with a welding liquid spray head mechanism 93.
The wave soldering device for the lighting circuit board is provided with an intelligent control system, before the wave soldering device for the lighting circuit board is used, the fixed position of the fixed plate 41 on the mounting plate 3 is adjusted according to the specification of the circuit board 10 which is required to be processed and detected, the mounting position of the spring telescopic rod 42 on the fixed plate 41 is adjusted, then the circuit board 10 is fed by a mechanical arm, a plate matched with the wedge plate 44 is arranged on a chuck on the mechanical arm, the circuit board 10 is fed, the corresponding wedge plate 44 is pushed by the matching plate on the mechanical arm, the corresponding spring telescopic rod 42 is compressed by the receiver 43, the circuit board 10 is borne at the inner bottom of the receiver 43 in the downward moving process, the spring telescopic rod 42 pushes the receiver 43 in the returning process of the mechanical arm, the circuit board 10 is fixed on the four receivers 43, and the spring telescopic rod 42 is in a micro-compressed state at the moment.
The circuit board 10 is thus fixed at the upper middle position of the table 2, and then the moving mechanism is controlled to operate, under the movement of the first electric moving block 52 and the second electric moving block 54, the detector 71 on the electric turntable 61 is aligned with the soldering position of the bottom of the circuit board 10, the two illumination lamps 72 are turned on, then the second electric moving block 54 is controlled to move laterally, when the detector 71 detects that the bottom of the circuit board 10 is defective, and when the defect is tin connection, the first electric moving block 52 is controlled to move on the first guide rail 51, the first electric moving block 52 drives the second electric moving block 54 and all parts thereon to move synchronously, and the electric turntable 61 is controlled to operate to adjust the positions of the first electric telescopic 74 and the related parts thereon, and then the first electric telescopic 74 is controlled to operate, the telescopic part of the first electric telescopic part 74 drives relevant parts on the electric telescopic part to move, the uppermost electric soldering iron 710 contacts the bottom surface on the circuit board 10, then the first power motor 76 is controlled to operate, the output shaft of the first power motor 76 drives the first flat gear 77 to rotate, the first flat gear 77 drives the rack 78, the rack 78 moves on the first supporting frame 75, at the moment, the electric soldering iron 710 is driven to move by the movable incubator 79 to melt a tin connection part, in order to avoid overflow of tin liquid, the annular holes on the electric soldering iron 710 timely isolate the tin liquid, so that the tin liquid drops into the incubator 79 more quickly, negative pressure equipment is carried on the collecting box 712, and the high temperature inside the first liquid guide tube 711 is kept, therefore, the tin liquid flows to the collecting box 712 more to realize convergence, the problem of tin connection is solved, and the stability and the plumpness of other welding positions are ensured.
When the defect is a welding hole defect, the electric turntable 61 is controlled to run, the electric turntable 61 rotates clockwise by 120 degrees from the top to the bottom, at this time, the defect processing system rotates to the position of the detector 71, the movement of the second electric moving block 54 is not required to be regulated again, the second electric telescopic part 81 is directly controlled to run, the telescopic part of the second electric telescopic part 81 drives the relevant parts on the second electric telescopic part to run, the melter 851 is electrified, the position of the welding hole is entered into by the melter 851 in the rising process, the upper part of the melter 851 carries out partial dispersion on solder paste, the element soldering feet are wrapped at the upper end of the top of the melter 851, negative pressure equipment is connected on the second liquid guide tube 86, the melter 851 melts solder paste in the defect, meanwhile under the action of the suction force, the solder paste is taken away rapidly, but the residual solder paste exists at the edge of the defect, the second power motor 88 is controlled to run, the second flat gear 89 is driven by the output shaft of the second power motor 88 to rotate, the second flat gear 89 drives the toothed ring 851 to rotate, the toothed ring 851 is driven by the toothed ring 84 to rotate, the toothed ring 851 is driven by the toothed ring 83 to rotate at the position of the welding hole, the solder paste is prevented from being scattered by the solder paste, and the residual solder paste is prevented from being scattered from being blown down by the solder paste, and the solder paste is prevented from being scattered by the position of the solder paste, and the solder paste is removed from the position of the solder paste, and the solder paste is avoided from being scattered.
And then spraying soldering flux into the holes, controlling the electric turntable 61 to rotate anticlockwise by 240 degrees at an angle from top to bottom, corresponding to the position of the defect hole of the circuit board 10, then controlling the third electric telescopic piece 91 to operate, driving the bearing plate 92 to move upwards by the telescopic part of the third electric telescopic piece 91, driving the welding liquid spray head mechanism 93 to move upwards by the bearing plate 92, and performing secondary repair welding on the hole of the circuit board 10 by the welding liquid spray head mechanism 93 in a wave soldering mode, wherein the power of the welding liquid spray head mechanism 93 is consistent with that of primary welding, and the fluctuation effect of the welding liquid is consistent, so that the welding effect of welding feet on two sides of an element at the defect is consistent, simultaneously, effectively avoiding the influence of original soldering paste on secondary welding, and improving the welding quality.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (7)
1. The wave soldering device for the lighting circuit board is characterized by comprising a frame (1), a workbench (2), a mounting plate (3) and a moving mechanism; the upper part of the frame (1) is fixedly connected with a workbench (2); the left side of the upper surface and the right side of the upper surface of the workbench (2) are fixedly connected with a mounting plate (3) respectively; the mounting plate (3) is connected with a moving mechanism; the device also comprises a clamping mechanism, a receiver (43), an electric turntable (61), a tin connection processing system, a defect processing system and a repair welding system; the two mounting plates (3) are provided with clamping mechanisms for clamping the circuit board (10); a plurality of acceptors (43) are arranged on the clamping mechanism; an electric turntable (61) is arranged on the moving mechanism; the electric turntable (61) is connected with a tin connection processing system for detecting the fixedly connected defect of the circuit board (10) and processing the tin connection problem; the electric turntable (61) is connected with a defect treatment system for performing defluxing treatment on the fixedly connected part with the defect; the electric turntable (61) is connected with a repair welding system for completing repair welding based on wave soldering;
the moving mechanism comprises a first guide rail (51), a first electric moving block (52), a second guide rail (53) and a second electric moving block (54); a first guide rail (51) is fixedly connected to each of the two mounting plates (3); each first guide rail (51) is connected with a first electric moving block (52) in a sliding way; the two first electric moving blocks (52) are fixedly connected with the same second guide rail (53); a second electric moving block (54) is connected to the second guide rail (53) in a sliding manner;
the clamping mechanism comprises a fixed plate (41), a spring telescopic rod (42) and a wedge plate (44); two fixing plates (41) are fixedly connected between the two mounting plates (3), and the mounting positions of the two fixing plates (41) can be changed on the mounting plates (3); two spring telescopic rods (42) are fixedly connected to each fixing plate (41), and each spring telescopic rod (42) can be changed in installation position on the fixing plate (41); the telescopic part of each spring telescopic rod (42) is fixedly connected with a receiver (43); each receiver (43) is fixedly connected with a wedge-shaped plate (44);
the tin connection treatment system comprises a detector (71), an illuminating lamp (72), a fixing frame (73), a first electric telescopic piece (74), a first supporting frame (75), a first power motor (76), a first flat gear (77), a rack (78), a constant temperature box (79), an electric soldering iron (710), a first liquid guide tube (711) and a collecting box (712); a detector (71) is fixedly connected to the rotating part of the electric turntable (61); two illuminating lamps (72) are fixedly connected to the partition plate (62), and the two illuminating lamps (72) and the detector (71) are positioned in the same area; the outer surface of the rotating part of the electric turntable (61) is fixedly connected with a fixing frame (73); a first electric telescopic piece (74) is fixedly connected to the fixing frame (73); the telescopic part of the first electric telescopic piece (74) is fixedly connected with a first supporting frame (75); a first power motor (76) is fixedly connected to the first support frame (75); the output shaft of the first power motor (76) is fixedly connected with a first flat gear (77); the upper part of the first supporting frame (75) is connected with a rack (78) in a sliding way; the first flat gear (77) engages the rack (78); an incubator (79) is fixedly connected to the upper part of the rack (78); an electric iron (710) is fixedly connected in the middle of the upper end of the incubator (79); the bottom of the incubator (79) is communicated with a first liquid guide pipe (711); the first supporting frame (75) is provided with a collecting box (712); the first catheter (711) communicates with the collection box (712).
2. A wave soldering apparatus for lighting circuit boards according to claim 1, characterized in that the receptacle (43) is L-shaped and the inner bend is provided with a cylindrical groove.
3. The wave soldering apparatus for lighting circuit boards according to claim 1, wherein a partition plate (62) is fixedly connected to the upper surface of the electric turntable (61), and the partition plate (62) is Y-shaped and equally divides the upper surface of the electric turntable (61) into three areas.
4. The wave soldering apparatus for lighting circuit boards of claim 1, wherein two anti-overflow grooves are formed in the electric iron (710).
5. A wave soldering apparatus for lighting circuit boards according to claim 2, characterized in that the defect handling system comprises a second electric telescopic member (81), a support plate (82), a support ring (83), a toothed ring (84), a melter (851), a confluence ring (852), a splash ring (853), a second catheter (86), a second support frame (87), a second power motor (88) and a second flat gear (89); a second electric telescopic piece (81) is fixedly connected to the rotating part of the electric turntable (61); a supporting plate (82) is fixedly connected to the telescopic part of the second electric telescopic piece (81); a supporting ring (83) is fixedly connected on the supporting plate (82); the support ring (83) is rotatably connected with a melter (851); a toothed ring (84) is fixedly connected on the melter (851); a confluence ring (852) is fixedly connected inside the melter (851); an anti-splash ring (853) is fixedly connected outside the melter (851); the bottom of the melter (851) is rotationally connected with the second liquid guide tube (86); the second liquid guide tube (86) is fixedly connected to the supporting plate (82); a second supporting frame (87) is fixedly connected on the supporting plate (82); the bottom of the second supporting frame (87) is fixedly connected with a second power motor (88); the output shaft of the second power motor (88) is fixedly connected with a second flat gear (89); the second flat gear (89) engages the toothed ring (84).
6. A wave soldering apparatus for lighting circuit boards according to claim 3, characterized in that the top of the melter (851) is of a heterodentate shape and the upper part is provided with a liquid suction hole.
7. The wave soldering apparatus for lighting circuit boards according to claim 4, wherein the repair soldering system comprises a third electric telescopic member (91), a carrier plate (92) and a soldering fluid spray head mechanism (93); a third electric telescopic piece (91) is fixedly connected to the rotating part of the electric turntable (61); the telescopic part of the third electric telescopic piece (91) is fixedly connected with a bearing plate (92); the bearing plate (92) is provided with a welding liquid spray head mechanism (93).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545969.8A CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545969.8A CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115533245A CN115533245A (en) | 2022-12-30 |
| CN115533245B true CN115533245B (en) | 2023-05-23 |
Family
ID=84721888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211545969.8A Active CN115533245B (en) | 2022-12-05 | 2022-12-05 | Wave soldering device for lighting circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115533245B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118023788B (en) * | 2024-04-11 | 2024-06-18 | 常州起帆工业智能科技有限公司 | Perforation baffle welding set |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB797020A (en) * | 1955-11-24 | 1958-06-25 | American Viscose Corp | Welding apparatus |
| CN104325207A (en) * | 2013-07-22 | 2015-02-04 | 珠海格力电器股份有限公司 | Tin carrier, welding machine and method for preventing connecting tin short circuit |
| CN107414232A (en) * | 2017-08-31 | 2017-12-01 | 阜阳扬宇充电设备有限公司 | A kind of power template manufacture automatic repair welding device |
| CN108480815A (en) * | 2018-05-04 | 2018-09-04 | 王大同 | A kind of printed circuit board is multidirectional to adjust furnace tool |
| CN111558548B (en) * | 2020-07-14 | 2020-11-03 | 潍坊智新电子股份有限公司 | High-speed two heart yearn wicking letter sorting outer hanging machine |
| CN217212291U (en) * | 2021-05-25 | 2022-08-16 | 广东华技达精密机械有限公司 | Detection turntable and antenna detection system |
| CN114535739A (en) * | 2022-02-28 | 2022-05-27 | 惠州市福佳电器科技有限公司 | Prevent medical power production of continuous tin and use smokeless formula wave soldering equipment |
-
2022
- 2022-12-05 CN CN202211545969.8A patent/CN115533245B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN115533245A (en) | 2022-12-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109759666B (en) | Laser soldering method for rectifier diode assembly parts | |
| CN108063359B (en) | Assembling process of data line and full-automatic production line thereof | |
| CN115533245B (en) | Wave soldering device for lighting circuit board | |
| CN107378170B (en) | Multifunctional intelligent welding machine with cover plate LCM | |
| CN108254383A (en) | A kind of high-precision optical fiber adapter visual detection equipment | |
| WO2023035483A1 (en) | Automatic cutting and soldering device for direct insertion-type crystal oscillator | |
| CN112170999A (en) | Table type soldering iron tin soldering equipment | |
| CN109561603A (en) | A kind of pasting method and device | |
| CN109802030B (en) | LED element and production method thereof | |
| CN210534018U (en) | Feeding jig for AOI full-automatic optical detection machine | |
| CN108754380B (en) | Tin plating method and automatic tin plating device | |
| CN112687550B (en) | Semiconductor wafer packaging equipment for power chip production and production process | |
| CN112191974A (en) | Soldering iron tin soldering equipment | |
| CN213847169U (en) | Automatic terminal inserting equipment with vision | |
| CN213706990U (en) | Novel punching capacitor pin welding equipment conveying jig | |
| CN110993551B (en) | Chip mounting system for ceramic flat package chip | |
| CN211331697U (en) | Automatic welding and function testing equipment for internal components of electric toothbrush | |
| CN215038146U (en) | PCB clamping device | |
| CN112894045A (en) | Accurate automatic welding device of conductive slip ring | |
| CN214375121U (en) | Detection apparatus for circuit board SMT | |
| CN213702112U (en) | Soldering iron tin soldering equipment | |
| CN221134632U (en) | Welding piece clamp | |
| CN215356720U (en) | Equipment for automatically welding crystal grains by laser | |
| CN215100438U (en) | Feeding device for SMT surface mounting equipment | |
| CN213764365U (en) | Novel punching capacitor pin welding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |