CN115472654A - Display device and manufacturing method thereof - Google Patents
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- CN115472654A CN115472654A CN202211060321.1A CN202211060321A CN115472654A CN 115472654 A CN115472654 A CN 115472654A CN 202211060321 A CN202211060321 A CN 202211060321A CN 115472654 A CN115472654 A CN 115472654A
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Abstract
The present application relates to a display device and a method of manufacturing the same, the display device including: a display panel; the chip on film and the first binding gasket are arranged on one side of the display panel; the second binding gasket is arranged on one side of the chip on film, which is far away from the display panel; a connection structure connecting the first binding pad and the second binding pad; the planarization layer is arranged on one side, away from the display panel, of the first binding gasket and the second binding gasket, and covers the connecting structure and at least part of the chip on film; the supporting plate is arranged on one side, departing from the display panel, of the planarization layer. Therefore, the connecting structure for binding the first binding gasket and the second binding gasket can be covered by the supporting plate, and the binding reliability and the water and oxygen resistance of the display panel and the chip on film in the display device are improved.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of display, in particular to a display device and a manufacturing method thereof.
[ background of the invention ]
At present, in order to implement narrow-frame display, a backplane and a Chip On Film (COF) are generally attached to the back of a display panel, and then a Bonding Pad On the display panel is connected to a Bonding Pad On the COF by laser drilling, so as to reduce the frame of the display device.
However, the reliability and the anti-moisture capability of the bonding between the display panel and the flip-chip film in the conventional display device still need to be improved.
[ summary of the invention ]
The present disclosure is directed to a display device and a method for fabricating the same, so as to improve the bonding reliability and the anti-moisture capability between a display panel and a flip chip film in the display device.
In order to solve the above problem, an embodiment of the present application provides a display device, including: a display panel; the chip on film and the first binding gasket are arranged on one side of the display panel; the second binding gasket is arranged on one side of the chip on film, which is far away from the display panel; a connection structure connecting the first binding pad and the second binding pad; the planarization layer is arranged on one side, away from the display panel, of the first binding gasket and the second binding gasket, and covers the connecting structure and at least part of the chip on film; the supporting plate is arranged on one side, away from the display panel, of the planarization layer.
Wherein, display device still includes: and the back plate is positioned between the support plate and the planarization layer.
Wherein, display device still includes: the flexible circuit board and the integrated circuit chip are electrically connected with the chip on film.
The chip on film comprises a back bending area, the flexible circuit board and the integrated circuit chip are connected to the back bending area, and the flexible circuit board and the integrated circuit chip are arranged on one side of the supporting plate, which is far away from the planarization layer, through the back bending area.
The flexible circuit board and the integrated circuit chip are arranged on one side, away from the display panel, of the chip on film, and the supporting plate is provided with an opening which is used for exposing the integrated circuit chip.
Wherein, display device still includes: and the heat dissipation layer is arranged on one side of the support plate, which is deviated from the planarization layer, and is connected with the integrated circuit chip through the opening.
Wherein, display device still includes: the polaroid is arranged on one side of the display panel, which deviates from the chip on film; the cover plate is arranged on one side of the polaroid, which deviates from the display panel.
In order to solve the above problem, an embodiment of the present application further provides a manufacturing method of a display device, where the manufacturing method of the display device includes: providing a display panel and a chip on film, wherein one side of the display panel is provided with a first binding gasket, and one side of the chip on film is provided with a second binding gasket; fixedly arranging the chip on film on one side of the display panel, which is provided with the first binding gasket, and positioning the second binding gasket on one side of the chip on film, which is far away from the display panel; forming a connecting structure, wherein the connecting structure is connected with the first binding gasket and the second binding gasket; forming a planarization layer on one side of the first binding gasket and the second binding gasket, which is far away from the display panel, wherein the planarization layer covers the connecting structure and at least part of the chip on film; a support plate is formed on a side of the planarization layer facing away from the display panel.
Before the support plate is formed on one side of the planarization layer, which is far away from the display panel, the method further comprises the following steps: a back plate is formed on one side, away from the display panel, of the planarization layer, and the support plate is formed on one side, away from the planarization layer, of the back plate.
Wherein, display device still includes: providing a flexible circuit board and an integrated circuit chip; the flexible circuit board and the integrated circuit chip are electrically connected to the chip on film.
The beneficial effect of this application is: different from the prior art, the display device and the manufacturing method thereof provided by the application have the advantages that the first binding gasket on the display panel is connected with the second binding structure on the chip on film by using the connecting structure, and the connecting structure can be covered by the supporting plate, so that the reliability and the anti-water-oxygen capacity of the binding between the display panel and the chip on film in the display device are improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a display device according to another embodiment;
fig. 5 is a schematic flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure;
fig. 6 is a schematic cross-sectional view of the completed S12 according to the embodiment of the present application;
fig. 7 is a schematic cross-sectional view of a completed S13 according to an embodiment of the present disclosure;
fig. 8 is a schematic cross-sectional view of a completed S14 according to an embodiment of the present disclosure;
fig. 9 is a schematic cross-sectional structure diagram after S15 provided in this embodiment of the present application is completed.
[ detailed description ] A
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present disclosure. As shown in fig. 1, the display device 100 includes a display panel 101, a first bonding pad 102, a flip chip film 103, a second bonding pad 104, a connection structure 105, a planarization layer 106, and a support plate 107, wherein the flip chip film 103 and the first bonding pad 102 are disposed on one side of the display panel 101, the second bonding pad 104 is disposed on one side of the flip chip film 103 away from the display panel 101, the connection structure 105 is connected to the first bonding pad 102 and the second bonding pad 104, the planarization layer 106 is disposed on one side of the first bonding pad 102 and the second bonding pad 104 away from the display panel 101 and covers the connection structure 105 and at least a portion of the flip chip film 103, and the support plate 107 is disposed on one side of the planarization layer 106 away from the display panel 101.
Specifically, the first bonding pad 102 and the flip chip 103 may be disposed on the back surface of the display panel 101, and an orthographic projection of the first bonding pad 102 on the display panel 101 and an orthographic projection of the flip chip 103 on the display panel 101 may not overlap. Moreover, it can be understood that the back surface of the display panel 101 is opposite to the front surface of the display panel 101, and the front surface of the display panel 101 is a light emitting surface of the display panel 101 for displaying.
In one specific example, as shown in fig. 1, the first bonding pad 102 may be disposed on an edge region of the back surface of the display panel 101, and the flip chip 103 may be disposed on other regions of the back surface of the display panel 101 except the edge region. In addition, in a specific implementation, the second bonding pad 104 may be disposed at a side edge of the chip on film 103 close to the first bonding pad 102, and may correspond to the position of the first bonding pad 102, so as to reduce a distance between the first bonding pad 102 and the second bonding pad 104 in a direction parallel to the display panel 101, which is beneficial to reducing a routing length required for connecting the first bonding pad 102 and the second bonding pad 104.
In one embodiment, as shown in fig. 1, the display device 100 may further include a first adhesive layer 108, wherein the first adhesive layer 108 is located between the flip chip film 103 and the display panel 101 and can connect the flip chip film 103 and the display panel 101 together. In one example, the first adhesive layer 108 may be a double-sided adhesive tape.
In one embodiment, as shown in fig. 1, the display device 100 may further include a filling portion 109, and the filling portion 109 is filled between the edge region of the display panel 101 and the planarization layer 106 to fill up the height of the step region formed by the step difference between the display panel 101 and the flip chip 103. In addition, in a specific implementation, the filling portion 109 may further fill a region between the connection structure 105 and the display panel 101 to provide support for the connection structure 105, so as to improve the stability of the bonding between the display panel 101 and the chip on film 103 in the display device 100.
In one embodiment, the material of the first bonding pad 102, the material of the second bonding pad 104, and the material of the connecting structure 105 may be a conductive material such as metal, for example, aluminum.
In one embodiment, as shown in fig. 1, the orthographic projection of the planarization layer 106 on the display panel 101 may include the orthographic projection of the first bonding pad 102 on the display panel 101, the orthographic projection of the filling portion 109 on the display panel 101, the orthographic projection of the connection structure 105 on the display panel 101, the orthographic projection of the second bonding pad 104 on the display panel 101, and the orthographic projection of the flip-chip film 103 on the display panel 101. Specifically, the surface of the planarization layer 106 facing away from the display panel 101 may be a flat surface, and the material thereof may be a film material with two adhesive surfaces, and in a specific example, the planarization layer 106 may be a double-sided adhesive tape.
Accordingly, the orthographic projection of the supporting plate 107 on the display panel 101 may also include the orthographic projection of the first bonding pad 102 on the display panel 101, the orthographic projection of the filling part 109 on the display panel 101, the orthographic projection of the connecting structure 105 on the display panel 101, the orthographic projection of the second bonding pad 104 on the display panel 101, and the orthographic projection of the flip chip film 103 on the display panel 101. In a specific implementation, an orthogonal projection of the supporting plate 107 on the display panel 101 may completely overlap an orthogonal projection of the planarization layer 106 on the display panel 101. Therefore, the first bonding pad 102, the second bonding pad 104 and the connecting structure 105 for bonding the display panel 101 and the flip-chip film 103 in the display device 100 are ensured to be covered by at least the planarization layer 106 and/or the supporting plate 107, so that the problem of uneven display of the display device 100 can be avoided, and the reliability, the mechanical strength, the water and oxygen resistance, the shielding and the anti-interference capability of the display device 100 at the bonding position of the display panel 101 and the flip-chip film 103 can be improved.
In some embodiments, as shown in fig. 2 and 3, the display device 100 may further include a Flexible Printed Circuit (FPC) 110 and an Integrated Circuit (IC) chip 111 electrically connected to the flip chip film 103. The ic chip 111 is used for providing a display driving signal to the display panel 101 through the chip on film 103, and the flexible circuit board 110 and the display panel 101 can transmit signals through the chip on film 103.
In an embodiment, as shown in fig. 2, the flexible circuit board 110 and the integrated circuit chip 111 may be disposed on a side of the flip chip 103 away from the display panel 101, so that the display device 100 may have a narrow frame without bending the flip chip 103 and the display panel 101.
Specifically, in order to ensure a good heat dissipation effect on the integrated circuit chip 111, as shown in fig. 2, the planarization layer 106 and the support plate 107 may be provided with a first opening at a position corresponding to the integrated circuit chip 111, so that the integrated circuit chip 111 can be exposed from a side of the support plate 107 away from the display panel 101. In order to ensure a good heat dissipation effect on the flexible wiring board 110, the planarization layer 106 and the support plate 107 may further include a second opening at a position corresponding to the flexible wiring board 110, so that the flexible wiring board 110 is exposed from a side of the support plate 107 away from the display panel 101.
In addition, in a specific implementation, the display device 100 may further include a heat dissipation layer (not shown), which may be disposed on a side of the supporting plate 107 away from the planarization layer 106 and may be connected to the integrated circuit chip 111 through the first opening, so as to further improve a heat dissipation effect of the integrated circuit chip 111. In addition, the heat dissipation layer may be connected to the flexible printed circuit board 110 through the second opening, so as to further improve the heat dissipation effect of the flexible printed circuit board 110. The heat dissipation layer may be made of a heat conductive material such as copper, stainless steel, etc., and in a specific example, the heat dissipation layer may be a copper foil.
In another embodiment, as shown in fig. 3, the flip-chip film 103 may include a back bending region 103A, and the flexible printed circuit board 110 and the integrated circuit chip 111 may be disposed on a side of the supporting board 107 away from the planarization layer 106 through the back bending region 103A of the flip-chip film 103. Specifically, the back bending region 103A of the flip chip film 103 may be bent to a side of the supporting plate 107 away from the planarization layer 106 in a direction away from the display panel 101, so as to fixedly mount the flexible circuit board 110 and the integrated circuit chip 111 on the side of the supporting plate 107 away from the planarization layer 106, so that the display device 100 can have a narrow frame by bending the flip chip film 103.
In addition, in a specific implementation, as shown in fig. 3, the display device 100 may further include a wiring layer 113, the wiring layer 113 may connect the edge 103B of the flip chip film 103 on the side of the support plate 107 away from the planarization layer 106 to the integrated circuit chip 111, and the wiring layer 113 may also connect the edge of the flexible circuit board 110. Specifically, the wiring layer 113 may be located between the edge 103B of the flip-chip film 103 and the supporting plate 107, and the integrated circuit chip 111 may be located on a side of the wiring layer 113 away from the supporting plate 107.
Specifically, as shown in fig. 3, the display device 100 may further include a bonding protection glue layer 114, and the bonding protection glue layer 114 may cover a connection portion between the edge 103B of the flip chip film 103 and the wiring layer 113 to protect the connection portion.
Specifically, as shown in fig. 3, the display device 100 may further include a second adhesive layer 112, and the second adhesive layer 112 may adhere and fix the flexible circuit board 110 and the wiring layer 113 to a side of the supporting plate 107 away from the planarization layer 106.
In some embodiments, as shown in fig. 3, the display device 100 may further include a back plate 115, and the back plate 115 is disposed between the supporting plate 107 and the planarization layer 106 to improve the strength of the display device 100.
In the embodiment, as shown in fig. 2 and fig. 3, the display device 100 may further include a polarizer 116 and a cover plate 117, wherein the polarizer 116 may be disposed on a side of the display panel 101 away from the flip-chip film 103, and the cover plate 117 may be disposed on a side of the polarizer 116 away from the display panel 101.
In some embodiments, as shown in fig. 2 and 3, the display device 100 may further include a light shielding layer 118, and a front projection of the light shielding layer 118 on the display panel 101 may be disposed around an edge of the display panel 101 to define a boundary of a display area of the display device 100. The material of the light-shielding layer 118 may be a light-shielding material such as black ink.
In some embodiments, as shown in fig. 2 and 3, the display device 100 may further include a third adhesive layer 119, and the third adhesive layer 119 may be disposed between the polarizer 116 and the cover plate 117 to bond and fix the polarizer 116 and the cover plate 117 together. The third adhesive layer 119 may be an optical adhesive.
In the above embodiments, the Display panel 101 may be, but not limited to, an OLED (Organic Light-Emitting diode) Display panel, and the Display device 100 may be, but not limited to, any product or component having a Display function, such as a television, a notebook computer, a tablet computer, a wearable Display device (e.g., a smart band, a smart watch, etc.), a mobile phone, a virtual reality device, an augmented reality device, an in-vehicle Display, an advertisement Light box, etc.
It should be noted that, as shown in fig. 4, in the display device 200 provided in other embodiments, since the back plate 215 and the supporting plate 207 are attached to the back surface of the display panel 201, and the chip on film 203 is attached to a side of the supporting plate 207 away from the display panel 201 through the double-sided adhesive 206, after the display panel 201 and the chip on film 203 are bound by the first binding pad 202, the second binding pad 204 and the connecting structure 205, a step area formed by a step difference between the display panel 201 and the chip on film 203 is too large, and further the step difference required to be filled when the filling portion 209 is formed through a dispensing process is too large, which increases difficulty in dispensing and difficulty in manufacturing the binding traces. Moreover, it can be understood that, in the display device 100 provided in this embodiment, the planarization layer 106 and the support plate 107 are disposed on the side of the flip chip film 103 away from the display panel 101, and the planarization layer 106 and the support plate 107 cover the entire surface of the side of the display panel 101, so that the difficulty of dispensing and the difficulty of manufacturing the bonding wires can be reduced, the dispensing area and the dispensing amount can be greatly reduced, the cost can be reduced, the volume change caused by curing is small, the problem of quality or abnormal display can be avoided, in addition, the problem of uneven display of the display device 100 can be avoided, and the reliability, the mechanical strength, the anti-water-oxygen capacity, the shielding capability and the anti-interference capability of the display device 100 at the bonding position between the display panel 101 and the flip chip film 103 can be improved.
As can be seen from the above, the display device provided in this embodiment connects the first bonding pad on the display panel and the second bonding structure on the chip on film by using the connection structure, and the connection structure can be covered by the supporting plate, so that the reliability and the anti-oxyhydrogen capability of the bonding between the display panel and the chip on film in the display device are improved.
Please refer to fig. 5, fig. 5 is a schematic flow chart of a manufacturing method of a display device according to an embodiment of the present application, and please refer to fig. 1, fig. 2, and fig. 3 at the same time, fig. 1, fig. 2, and fig. 3 are schematic structural diagrams of a display device 100 manufactured by the manufacturing method of the display device according to the embodiment of the present application. As shown in fig. 1, fig. 2, fig. 3 and fig. 5, a specific flow of a manufacturing method of the display device 100 provided in this embodiment may be as follows:
s11: a display panel 101 and a chip on film 103 are provided, wherein one side of the display panel 101 is provided with a first bonding pad 102, and one side of the chip on film 103 is provided with a second bonding pad 104.
S12: the flip chip film 103 is fixedly disposed on a side of the display panel 101 where the first bonding pad 102 is disposed, and the second bonding pad 104 is disposed on a side of the flip chip film 103 away from the display panel 101.
Fig. 6 may show a schematic cross-sectional structure diagram after S12 is completed.
Specifically, the first bonding pad may be disposed on one side of the display panel 101, the second bonding pad 104 and the protective film 120 may be disposed on one side of the flip chip film 103, and then the flip chip film 103 is fixedly disposed on one side of the display panel 101, where the first bonding pad 102 is disposed, and the second bonding pad 104 is located on one side of the flip chip film 103, which is away from the display panel 101. In one embodiment, the flip chip film 103 may be attached to the display panel 101 on the side where the first bonding pad 102 is disposed by a first adhesive layer 108.
In some embodiments, the method for manufacturing the display device 100 may further include: a Flexible Printed Circuit (FPC) board (110) and an IC (integrated circuit) chip (111) are provided, and the FPC board (110) and the IC chip (111) and the chip on film (103) are provided.
S13: a connecting structure 105 is formed, the connecting structure 105 connecting the first bonding pad 102 and the second bonding pad 104.
Fig. 7 may show a schematic cross-sectional structure diagram after S13 is completed.
Specifically, the connection structure 105 may be formed through a bonding process, and the filling portion 109 may be formed through a dispensing process.
S14: a planarization layer 106 is formed on the first bonding pad 102 and the second bonding pad 104 facing away from the display panel 101, and the planarization layer 106 covers the connection structure 105 and at least a portion of the chip on film 103.
Fig. 8 may show a schematic cross-sectional structure diagram after S14 is completed.
Specifically, after the connection structure 105 and the filling portion 109 are formed, the protection film 120 may be removed from the flip chip film 103, and the planarization layer 106 may be formed on the first bonding pad 102 and the second bonding pad 104 on the side away from the display panel 101.
S15: a support plate 107 is formed on a side of the planarization layer 106 facing away from the display panel 101.
Fig. 9 may show a schematic cross-sectional structure diagram after S15 is completed.
Specifically, before forming the supporting plate 107, the method for manufacturing the display device may further include: a back plate 115 is formed on a side of the planarization layer 106 facing away from the display panel 101, and accordingly, the support plate 107 may be formed on a side of the back plate 115 facing away from the planarization layer 106.
In some embodiments, as shown in fig. 3, the flip-chip film 103 may include a back bend region 103A, and after the step S14, the method for manufacturing the display device 100 may further include: the flexible wiring board 110 and the integrated circuit chip 111 are disposed on a side of the supporting board 107 away from the planarization layer 106 through the back-bending region 103A of the chip on film 103.
In other embodiments, as shown in fig. 2, the flexible circuit board 110 and the integrated circuit chip 111 may be disposed on a side of the chip on film 103 away from the display panel 101. After S14, the method for manufacturing the display device 100 may further include: a first opening for exposing the integrated circuit chip 111 is formed in the support plate 107.
Specifically, after the first opening is formed, the method for manufacturing the display device 100 may further include: a heat sink layer is formed on the side of the support plate 107 facing away from the planarization layer, and is connected to the integrated circuit chip 111 through the first opening.
It should be noted that, for the specific structure of the display device in this embodiment, reference may be made to the specific implementation manner in the embodiment of the display device, and therefore, details are not described here again.
As can be seen from the above, in the manufacturing method of the display device provided in this embodiment, by providing the display panel and the chip on film, the first binding pad is disposed on one side of the display panel, the second binding pad is disposed on one side of the chip on film, the chip on film is fixedly disposed on one side of the display panel, where the first binding pad is disposed, and the second binding pad is disposed on one side of the chip on film away from the display panel, and then the connection structure is formed.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A display device, comprising:
a display panel;
the chip on film and the first binding gasket are arranged on one side of the display panel;
the second binding gasket is arranged on one side of the chip on film, which is far away from the display panel;
a connection structure connecting the first and second bonding pads;
the planarization layer is arranged on one side, away from the display panel, of the first binding gasket and the second binding gasket, and covers the connecting structure and at least part of the chip on film;
and the supporting plate is arranged on one side of the planarization layer, which deviates from the display panel.
2. The display device according to claim 1, characterized in that the display device further comprises:
a back plate between the support plate and the planarization layer.
3. The display device according to claim 1, characterized in that the display device further comprises:
the flexible circuit board and the integrated circuit chip are electrically connected with the chip on film.
4. The display device as claimed in claim 3, wherein the flip-chip film includes a back-bent region, and the flexible wiring board and the integrated circuit chip are disposed on a side of the supporting board away from the planarization layer through the back-bent region.
5. The display device according to claim 3, wherein the flexible printed circuit board and the ic chip are disposed on a side of the flip chip, which faces away from the display panel, and the supporting plate has an opening for exposing the ic chip.
6. The display device according to claim 5, further comprising:
and the heat dissipation layer is arranged on one side of the support plate, which is deviated from the planarization layer, and is connected with the integrated circuit chip through the opening.
7. The display device according to claim 1, further comprising:
the polaroid is arranged on one side of the display panel, which deviates from the chip on film;
the cover plate is arranged on one side, deviating from the display panel, of the polaroid.
8. A method for manufacturing a display device, comprising:
providing a display panel and a chip on film, wherein one side of the display panel is provided with a first binding gasket, and one side of the chip on film is provided with a second binding gasket;
fixedly arranging the chip on film on one side of the display panel, which is provided with the first binding gasket, and enabling the second binding gasket to be positioned on one side of the chip on film, which is far away from the display panel;
forming a connecting structure connecting the first and second binding pads;
forming a planarization layer on one side of the first binding gasket and the second binding gasket, which is far away from the display panel, wherein the planarization layer covers the connecting structure and at least part of the chip on film;
and forming a support plate on one side of the planarization layer, which is far away from the display panel.
9. The method according to claim 8, wherein before forming a support plate on a side of the planarization layer facing away from the display panel, the method further comprises:
and a back plate is formed on one side of the planarization layer, which is far away from the display panel, and the support plate is formed on one side of the back plate, which is far away from the planarization layer.
10. The method for manufacturing a display device according to claim 8, wherein the display device further comprises:
providing a flexible circuit board and an integrated circuit chip;
electrically connecting the flexible wiring board and the integrated circuit chip to the chip on film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211060321.1A CN115472654A (en) | 2022-08-31 | 2022-08-31 | Display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211060321.1A CN115472654A (en) | 2022-08-31 | 2022-08-31 | Display device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115472654A true CN115472654A (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211060321.1A Pending CN115472654A (en) | 2022-08-31 | 2022-08-31 | Display device and manufacturing method thereof |
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| CN (1) | CN115472654A (en) |
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- 2022-08-31 CN CN202211060321.1A patent/CN115472654A/en active Pending
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