CN115472594A - 功率半导体模块 - Google Patents

功率半导体模块 Download PDF

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Publication number
CN115472594A
CN115472594A CN202210647719.9A CN202210647719A CN115472594A CN 115472594 A CN115472594 A CN 115472594A CN 202210647719 A CN202210647719 A CN 202210647719A CN 115472594 A CN115472594 A CN 115472594A
Authority
CN
China
Prior art keywords
power semiconductor
semiconductor module
gate
group
bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210647719.9A
Other languages
English (en)
Chinese (zh)
Inventor
S·基辛
A·施罗德
F·雅古比
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Energy Co ltd
Original Assignee
Hitachi Energy Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Energy Switzerland AG filed Critical Hitachi Energy Switzerland AG
Publication of CN115472594A publication Critical patent/CN115472594A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Conversion In General (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202210647719.9A 2021-06-10 2022-06-08 功率半导体模块 Pending CN115472594A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP21178802.1 2021-06-10
EP21178802.1A EP4102559B1 (en) 2021-06-10 2021-06-10 Power semiconductor module

Publications (1)

Publication Number Publication Date
CN115472594A true CN115472594A (zh) 2022-12-13

Family

ID=76421920

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210647719.9A Pending CN115472594A (zh) 2021-06-10 2022-06-08 功率半导体模块

Country Status (4)

Country Link
US (1) US12293973B2 (https=)
EP (1) EP4102559B1 (https=)
JP (1) JP7819038B2 (https=)
CN (1) CN115472594A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025191974A1 (https=) * 2024-03-11 2025-09-18
CN119314974B (zh) * 2024-12-13 2025-04-11 北京怀柔实验室 功率半导体封装结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1298802A1 (de) * 2001-09-28 2003-04-02 ABB Schweiz AG Verfahren zum Ansteuern eines Leistungshalbleiters
US6939743B2 (en) 2002-01-29 2005-09-06 Advanced Power Technology, Inc. Split-gate power module and method for suppressing oscillation therein
CN103199017B (zh) 2003-12-30 2016-08-03 飞兆半导体公司 形成掩埋导电层方法、材料厚度控制法、形成晶体管方法
US8154874B2 (en) 2006-06-21 2012-04-10 International Rectifier Corporation Use of flexible circuits in a power module for forming connections to power devices
EP2182551A1 (en) * 2008-10-29 2010-05-05 ABB Research Ltd. Connection arrangement for semiconductor power modules
WO2014090685A1 (de) 2012-12-10 2014-06-19 Abb Technology Ag Leistungshalbleitermodul und kontaktierungsanordnung
US9355950B1 (en) * 2015-01-08 2016-05-31 Infineon Technologies Ag Power semiconductor module having low gate drive inductance flexible board connection
EP3113223A1 (en) 2015-07-02 2017-01-04 ABB Technology AG Power semiconductor module
EP3168873A1 (en) 2015-11-11 2017-05-17 ABB Technology AG Power semiconductor module
WO2017157486A1 (en) 2016-03-16 2017-09-21 Abb Schweiz Ag Semiconductor device
US10250115B2 (en) * 2016-11-02 2019-04-02 Ford Global Technologies, Llc Inverter switching devices with common source inductance layout to avoid shoot-through
JP6865838B2 (ja) * 2017-09-04 2021-04-28 三菱電機株式会社 半導体モジュール及び電力変換装置
US11075589B2 (en) * 2019-05-20 2021-07-27 Ford Global Technologies, Llc DC inverter/converter current balancing for paralleled phase leg switches
CN110867438A (zh) 2019-09-30 2020-03-06 臻驱科技（上海）有限公司 功率半导体模块衬底

Also Published As

Publication number Publication date
JP2022189793A (ja) 2022-12-22
EP4102559A1 (en) 2022-12-14
EP4102559B1 (en) 2026-04-22
JP7819038B2 (ja) 2026-02-24
US12293973B2 (en) 2025-05-06
US20220399279A1 (en) 2022-12-15

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PB01 Publication
PB01 Publication
TA01 Transfer of patent application right

Effective date of registration: 20231229

Address after: Zurich, SUI

Applicant after: Hitachi Energy Co.,Ltd.

Address before: Swiss Baden

Applicant before: Hitachi energy Switzerland AG

TA01 Transfer of patent application right
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination