JP7819038B2 - パワー半導体モジュール - Google Patents

パワー半導体モジュール

Info

Publication number
JP7819038B2
JP7819038B2 JP2022093745A JP2022093745A JP7819038B2 JP 7819038 B2 JP7819038 B2 JP 7819038B2 JP 2022093745 A JP2022093745 A JP 2022093745A JP 2022093745 A JP2022093745 A JP 2022093745A JP 7819038 B2 JP7819038 B2 JP 7819038B2
Authority
JP
Japan
Prior art keywords
group
control
terminal
power semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022093745A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022189793A5 (https=
JP2022189793A (ja
Inventor
スラボ・キシン
アルネ・シュレーダー
ファルハード・ヤゴウビ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Energy Ltd
Original Assignee
Hitachi Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Energy Ltd filed Critical Hitachi Energy Ltd
Publication of JP2022189793A publication Critical patent/JP2022189793A/ja
Publication of JP2022189793A5 publication Critical patent/JP2022189793A5/ja
Application granted granted Critical
Publication of JP7819038B2 publication Critical patent/JP7819038B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Conversion In General (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2022093745A 2021-06-10 2022-06-09 パワー半導体モジュール Active JP7819038B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP21178802.1A EP4102559B1 (en) 2021-06-10 2021-06-10 Power semiconductor module
EP21178802 2021-06-10

Publications (3)

Publication Number Publication Date
JP2022189793A JP2022189793A (ja) 2022-12-22
JP2022189793A5 JP2022189793A5 (https=) 2025-06-12
JP7819038B2 true JP7819038B2 (ja) 2026-02-24

Family

ID=76421920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022093745A Active JP7819038B2 (ja) 2021-06-10 2022-06-09 パワー半導体モジュール

Country Status (4)

Country Link
US (1) US12293973B2 (https=)
EP (1) EP4102559B1 (https=)
JP (1) JP7819038B2 (https=)
CN (1) CN115472594A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025191974A1 (https=) * 2024-03-11 2025-09-18
CN119314974B (zh) * 2024-12-13 2025-04-11 北京怀柔实验室 功率半导体封装结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110233608A1 (en) 2008-10-29 2011-09-29 Abb Research Ltd Connection arrangement for semiconductor power modules
WO2014090685A1 (de) 2012-12-10 2014-06-19 Abb Technology Ag Leistungshalbleitermodul und kontaktierungsanordnung
US20180123478A1 (en) 2016-11-02 2018-05-03 Ford Global Technologies, Llc Inverter switching devices with common source inductance layout to avoid shoot-through
US20200185359A1 (en) 2017-09-04 2020-06-11 Mitsubishi Electric Corporation Semiconductor module and power conversion device
US20200373852A1 (en) 2019-05-20 2020-11-26 Ford Global Technologies, Llc Dc inverter/converter current balancing for paralleled phase leg switches

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1298802A1 (de) * 2001-09-28 2003-04-02 ABB Schweiz AG Verfahren zum Ansteuern eines Leistungshalbleiters
US6939743B2 (en) 2002-01-29 2005-09-06 Advanced Power Technology, Inc. Split-gate power module and method for suppressing oscillation therein
CN103199017B (zh) 2003-12-30 2016-08-03 飞兆半导体公司 形成掩埋导电层方法、材料厚度控制法、形成晶体管方法
US8154874B2 (en) 2006-06-21 2012-04-10 International Rectifier Corporation Use of flexible circuits in a power module for forming connections to power devices
US9355950B1 (en) * 2015-01-08 2016-05-31 Infineon Technologies Ag Power semiconductor module having low gate drive inductance flexible board connection
EP3113223A1 (en) 2015-07-02 2017-01-04 ABB Technology AG Power semiconductor module
EP3168873A1 (en) 2015-11-11 2017-05-17 ABB Technology AG Power semiconductor module
WO2017157486A1 (en) 2016-03-16 2017-09-21 Abb Schweiz Ag Semiconductor device
CN110867438A (zh) 2019-09-30 2020-03-06 臻驱科技（上海）有限公司 功率半导体模块衬底

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110233608A1 (en) 2008-10-29 2011-09-29 Abb Research Ltd Connection arrangement for semiconductor power modules
WO2014090685A1 (de) 2012-12-10 2014-06-19 Abb Technology Ag Leistungshalbleitermodul und kontaktierungsanordnung
US20180123478A1 (en) 2016-11-02 2018-05-03 Ford Global Technologies, Llc Inverter switching devices with common source inductance layout to avoid shoot-through
US20200185359A1 (en) 2017-09-04 2020-06-11 Mitsubishi Electric Corporation Semiconductor module and power conversion device
US20200373852A1 (en) 2019-05-20 2020-11-26 Ford Global Technologies, Llc Dc inverter/converter current balancing for paralleled phase leg switches

Also Published As

Publication number Publication date
JP2022189793A (ja) 2022-12-22
CN115472594A (zh) 2022-12-13
EP4102559A1 (en) 2022-12-14
EP4102559B1 (en) 2026-04-22
US12293973B2 (en) 2025-05-06
US20220399279A1 (en) 2022-12-15

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